Radio frequency matrix switch, configuration method and related device

Abstract

The invention provides a radio frequency matrix switch, a configuration method and a related device, and the radio frequency matrix switch comprises a housing which comprises a plurality of side plate assemblies, and the side plate assemblies form an accommodation space in a surrounding manner; the matrix module is arranged in the accommodating space and comprises an input part and an output part which are electrically connected with each other; wherein the input part comprises a plurality of transverse modules which are arranged in a stacked mode in the first direction, the output part comprises a plurality of longitudinal modules which are arranged in an array mode in the second direction, and the first direction is perpendicular to the second direction. According to the radio frequency matrix switch provided by the invention, the modular orthogonal layout structure is adopted, so that the internal topology has reusability, cross wiring is reduced, assembly consistency is improved, and rapid expansion of the radio frequency matrix under different order configurations is realized; therefore, the technical bottlenecks in the aspects of structural expandability, volume control, performance consistency and manufacturability in the prior art are overcome.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and in particular to a radio frequency matrix switch and its configuration method and related devices. Background Technology

[0002] In applications such as radio frequency (RF) communication, wireless system testing, antenna array calibration, and multi-channel instrument interconnection, RF matrix switches serve as a crucial foundational module for signal routing scheduling and link switching, enabling free path selection and dynamic switching of multi-channel RF signals. Through RF matrix switches, multiple input ports can be flexibly connected to different output ports according to application requirements and test configurations, achieving rapid switching of signal links, path multiplexing, and complex system reconfiguration. However, current RF matrix switches suffer from poor topology scalability, large size, high cost, and insufficient performance consistency.

[0003] Therefore, how to design RF matrix switches to achieve an effective balance between topology scalability, miniaturized structure design, performance consistency, reliability, and system manufacturing cost has become an urgent problem to be solved. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a radio frequency matrix switch and configuration method, and related devices, so as to solve or partially solve the above problems.

[0005] To achieve the above objectives, this application provides a radio frequency matrix switch, comprising: The housing includes a plurality of side panel assemblies, the plurality of side panel assemblies being arranged to form a receiving space; A matrix module, disposed within the accommodating space, includes an input section and an output section electrically connected to each other; The input section includes multiple horizontally stacked modules arranged along a first direction, and the output section includes multiple vertically arranged modules arranged in an array along a second direction, wherein the first direction and the second direction are perpendicular and orthogonal.

[0006] Optionally, the lateral module includes at least one lateral input port and multiple lateral output ports, and the longitudinal module includes multiple longitudinal input ports and at least one longitudinal output port; Each horizontal output port of the horizontal module is electrically connected to the vertical input port of the corresponding vertical module to form a matrix orthogonal connection path between the input and output sections.

[0007] Optionally, both the horizontal module and the vertical module include a module housing with module cavities, a drive control circuit board, and a switch circuit board; The drive control circuit board is disposed in a mounting groove on one side of the module housing, and the switch circuit board is disposed in the module cavity, and the drive control circuit board is electrically connected to the switch circuit board.

[0008] Optionally, the switch circuit board includes at least one of a single-pole multi-throw RF switch circuit, a multi-pole multi-throw RF switch circuit, an RF multiplexer circuit, an RF crosspoint matrix switch circuit, or an RF demultiplexer circuit.

[0009] Optionally, the horizontal module includes a primary submodule and multiple secondary submodules; the primary submodule includes multiple sub-output terminals, the secondary submodule has a sub-input terminal, and each sub-output terminal of the primary submodule is electrically connected to the corresponding sub-input terminal of the secondary submodule. The first-level submodule and the second-level submodule are arranged in parallel along the same horizontal plane.

[0010] Optionally, both the transverse and longitudinal modules are provided with electromagnetic shielding structures, which include isolation sheets, metal shielding cavities, or microwave absorbing material layers.

[0011] Based on the same inventive concept, this application also provides a radio frequency matrix switch configuration method, applied to the radio frequency matrix switch described above, comprising: Obtain the preset matrix order M×N; The number of horizontal and vertical modules and their corresponding port configurations are determined based on the preset matrix order M×N. The RF matrix switch is configured in an orthogonal topology based on the number of horizontal and vertical modules and their corresponding port configurations. The orthogonal topology configuration of the RF matrix switch refers to the horizontal and vertical modules being orthogonally arranged and connected in a matrix manner through ports.

[0012] Optionally, determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N further includes: Compare M and N with pathway thresholds; In response to determining that M is greater than the path threshold, the horizontal module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; In response to determining that N is greater than the path threshold, the vertical module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; The path threshold is the maximum number of paths that a single-pole multi-throw switch can connect.

[0013] Optionally, determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N includes: The number of horizontal modules and the number of vertical modules are determined based on the matrix order M×N; The number of output ports of the horizontal module is determined based on the number of vertical modules; The number of input ports for the vertical module is determined based on the number of horizontal modules.

[0014] Based on the same inventive concept, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0015] Based on the same inventive concept, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the method described above.

[0016] Based on the same inventive concept, this application also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to perform the method described above.

[0017] As can be seen from the above description, the radio frequency matrix switch and configuration method and related device provided in this application include: a housing including multiple side plate assemblies, the multiple side plate assemblies surrounding a receiving space; a matrix module disposed in the receiving space, including an input part and an output part electrically connected to each other; wherein, the input part includes multiple horizontal modules stacked along a first direction, and the output part includes multiple vertical modules arrayed along a second direction, and the first direction and the second direction are perpendicular and orthogonal. The RF matrix switch of this application adopts a modular orthogonal layout structure. By splitting the input path and output path into horizontal and vertical modules respectively, the internal topology has clear functional boundaries and multiplexing attributes. This transforms the originally complex cross-connections within existing matrix switches into a regular orthogonal interconnection network. The modules connect through standardized electrical and mechanical interfaces, eliminating the need for custom semi-steel cables or extensive manual wiring, thus significantly reducing structural complexity and improving assembly consistency. Simultaneously, the orthogonal stacking / array module design allows the matrix structure to be expanded to different orders as needed. Rapid expansion to an M×N configuration can be achieved simply by adding or replacing the corresponding number of horizontal or vertical modules, without redefining the overall wiring structure or modifying existing modules. Furthermore, thanks to the pluggable connections between modules and unified control logic, the system offers greater flexibility and replaceability during manufacturing, commissioning, installation, and subsequent maintenance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the internal structure of a matrix switch in related technologies; Figure 2 This is a schematic diagram of the radio frequency matrix switch structure according to an embodiment of this application; Figure 3 This is a schematic diagram of the matrix module structure according to an embodiment of this application; Figure 4A This is a schematic diagram of the horizontal / vertical module structure of an embodiment of this application; Figure 4B This is a schematic diagram of the horizontal / vertical module structure from another angle of an embodiment of this application; Figure 5 This is a schematic diagram of a horizontal module composed of first-level submodules and second-level submodules in an embodiment of this application; Figure 6 This is a schematic diagram of the RF matrix switch simulation architecture of a 4×4 matrix according to an embodiment of this application; Figure 7 This is a flowchart illustrating the radio frequency matrix switch configuration method according to an embodiment of this application; Figure 8 This is a schematic diagram of a radio frequency matrix switch configuration device according to an embodiment of this application; Figure 9 This is a schematic diagram of an electronic device according to an embodiment of this application.

[0020] Explanation of reference numerals in the attached figures: 1000, Outer shell; 1100, Side panel assembly; 1200, Accommodation space; 2000, Matrix module; 2100, Input section; 2110, Horizontal module; 2111, Horizontal input port; 2112, Horizontal output port; 2113, First-level submodule; 2114, Second-level submodule; 2200, Output section; 2210, Vertical module; 2211, Vertical input port; 2212, Vertical output port; 3000, Module housing; 3100, Module cavity; 3200, Mounting groove; 4000, Switching circuit board; 5000, Drive control circuit board; 101. Input terminal; 102. Output terminal; 103. Coaxial mechanical switch; 104. Semi-steel cable. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0022] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0023] As described in the background section, with the development of wireless communication technology, millimeter-wave system debugging, multi-channel signal link management, and automated testing equipment, RF signal routing architectures are trending towards higher frequencies, more ports, and dynamic reconfiguration. In scenarios such as RF communication system verification, UAV and radar antenna array calibration, and large-scale terminal parallel testing, systems typically require flexible scheduling of multiple signal sources and multiple test ports. Therefore, RF matrix switches have become a key foundational module for achieving multi-path signal switching, complex link multiplexing, and automated testing processes. As application requirements evolve towards large-scale, multi-port, and high isolation, RF matrix switches not only need to possess stable insertion loss, isolation, and consistency indicators, but also must consider size, topology scalability, and engineering assembly complexity; otherwise, they will struggle to meet the requirements of low-cost deployment, high-reliability operation, and adaptation to system architectures of different scales.

[0024] To address the aforementioned needs, current RF matrix switch technologies primarily employ two implementation methods: mechanical coaxial matrix architecture and PCB-integrated structures based on RF switch chips. Among these, reference... Figure 1Mechanical switching solutions typically employ a coaxial mechanical switch 103 as the switching core. The input terminals 101 and 102 are usually arranged in the same direction and cross-connected by custom semi-steel cables 104 to form a fully spectral topology. When the matrix order is small, this method can provide better insertion loss consistency and isolation performance. However, because the internal cables must be rearranged according to the matrix order, the topology lacks universal reuse capability, making structural expansion difficult. For example, when expanding from 2×2 to 8×8, all cable routing and connection levels need to be replanned, making the assembly process highly dependent on manual cable adjustment and soldering, and resulting in long cable processing cycles and high process costs. In addition, mechanical switches are large, heavy, and slow in switching speed, and have mechanical lifespan degradation issues, making this solution unsuitable for portable systems, miniaturized platforms, and high-speed switching applications.

[0025] To reduce costs and meet miniaturization requirements, some technical solutions employ RF switch chips and implement a matrix topology through a multi-layer PCB network. However, due to the inherent issues of uneven loss, phase drift, electromagnetic coupling, and parasitic parameters in high-frequency signal routing on PCBs, these solutions exhibit significant performance differences at high frequencies. For example, in the 6GHz band, channel amplitude inconsistencies can exceed 1dB, phase errors can reach over 10°, and isolation is easily affected by the routing structure, falling below 35dB. Furthermore, as the matrix order increases, the number of PCB layers increases, routing intersections become denser, and shielding requirements become more stringent, making the overall design complex and difficult to implement stably, thus limiting large-scale applications.

[0026] To address the aforementioned issues, this application proposes a radio frequency (RF) matrix switch. This RF matrix switch, by employing a modular orthogonal layout structure, enables reusability of the internal topology, reduces cross-wiring, improves assembly consistency, and allows for rapid expansion of the RF matrix under different order configurations, thereby overcoming the technical bottlenecks of existing technologies in terms of structural scalability, size control, performance consistency, and manufacturability.

[0027] The following is in conjunction with the appendix Figure 2-9 The embodiments of this application will be described in detail below.

[0028] In some embodiments, such as Figure 2 and Figure 3 As shown, a radio frequency matrix switch is proposed, comprising: The outer casing 1000 includes a plurality of side panel assemblies 1100, the plurality of side panel assemblies 1100 being arranged to form an accommodating space 1200; A matrix module 2000 is disposed within the accommodating space 1200 and includes an input section 2100 and an output section 2200 that are electrically connected to each other. The input section 2100 includes a plurality of horizontally stacked modules 2110 arranged along a first direction, and the output section 2200 includes a plurality of vertically arranged modules 2210 arranged in an array along a second direction. The first direction (referring to...) Figure 3 (Central X direction) and the second direction (reference) Figure 3 (in the Y direction) perpendicular and orthogonal.

[0029] For example, the RF matrix switch is composed of a housing 1000 and a matrix module 2000. The housing 1000 is enclosed by multiple connectable side panel assemblies 1100 to form a receiving space 1200, providing structural support, heat dissipation paths, and electromagnetic shielding. Positioning slots, fixing points, and guide rail mechanisms ensure precise assembly of the internal modules. The matrix module 2000 consists of an input section 2100 and an output section 2200. The input section 2100 consists of horizontally stacked modules 2110 arranged along a first direction, while the output section 2200 consists of vertically arrayed modules 2210 arranged along a second direction (or an orthogonal direction to the first direction), forming an orthogonal layout. This orthogonal layout independently separates the input and output paths into reusable units according to direction, forming cross-interconnections through standardized RF blind-plug interfaces or board-to-board connections between modules, thereby achieving a scalable N×N or M×N fully-selectable matrix architecture.

[0030] For example, the side panel assemblies 1100 can be connected by a combination of locating pins and screws and conductive pads to ensure processing tolerance and grounding continuity; the side panel assemblies 1100 can adopt an aluminum alloy or copper inner lining structure to balance weight and shielding performance, and can also serve as a heat dissipation path to guide the module heat to the housing.

[0031] For example, the horizontal module 2110 of the input section 2100 can integrate an RF switch (such as an SPnT / PIN / MEMS / relay), thus providing a basis for setting up an RF switch circuit on the switch circuit board 4000. Optionally, the horizontal modules 2110 can be stacked using a positioning post structure with reserved metal isolation cavities to improve the isolation between channels. The vertical module 2210 of the output section 2200 provides a connection port corresponding to the horizontal module 2110 and forms a signal intersection with the horizontal module 2110. The intersection can adopt an interface-separated solution (the switch is implemented in a separate unit) or an integrated solution (the switch is concentrated in the horizontal or vertical module 2210). Specifically, the signal intersection between the horizontal module 2110 and the vertical module 2210 achieves a low-loss connection through a blind-plug board-to-board RF interface, electroplated gold elastic contacts, or miniature coaxial connectors, for example, by directly connecting RF male and female connectors.

[0032] For example, both the horizontal module 2110 and the vertical module 2210 can be provided with metal isolation sheets, absorbing materials, or waveguide groove structures around their peripheries to reduce channel crosstalk and improve isolation. To ensure performance consistency, each module can be reserved with a fine-tuning matching network, calibration port, or sampling coupling structure for amplitude and phase calibration at the factory or in the field. For high-power or high-frequency applications, the side plate assembly 1100 can be provided with a heat dissipation structure, and thermal pads or thermal interface materials can be provided in key areas of the module to form a thermal path with the housing.

[0033] For example, this embodiment is described using a 4×4 matrix RF matrix switch. The device in this embodiment arranges the horizontal input modules and vertical output modules orthogonally, enabling any input signal to be switched to any output. Specifically, each horizontal module 2110 includes one horizontal input port 2111 and multiple horizontal output ports 2112, while each vertical module 2210 includes multiple vertical input ports 2211 and one vertical output port 2212. Each horizontal output port 2112 of the horizontal module 2110 is electrically connected to the corresponding vertical input port 2211 of the vertical module 2210, thereby forming a matrix-like orthogonal connection path between the horizontal and vertical directions. This structure ensures that any input signal has a potential path to any output port.

[0034] The signal transmission process follows the logic of "lateral input—matrix intersection point (i.e., the connection point between lateral module 2110 and vertical module 2210) selection—vertical output". For example, if a signal needs to be transmitted from the first lateral module 2110 to the third vertical module 2210, after the signal enters the first lateral module 2110, it will be transmitted along the internal RF switching circuit (e.g., a single-pole quad-throw circuit). The drive control circuit will, according to the target object, conduct the corresponding circuit path so that the signal enters the corresponding vertical module 2210 through the output port of the corresponding connection point. At this time, non-target branches remain closed, and only the target branch is open. After entering the vertical module 2210, the signal is transmitted along the switching circuit to the corresponding vertical output port 2212, realizing the complete link output. Optionally, each vertical module 2210 can be equipped with independent shielding, control paths, and matching networks to maintain low insertion loss and good isolation during signal transmission, and avoid crosstalk between lateral and vertical or between output paths.

[0035] In summary, this orthogonal structure not only achieves full gating capability from any input to any output, but also boasts advantages such as clear structure, well-defined module boundaries, and strong scalability, making it suitable for engineering applications of multi-port high-frequency matrix systems. It should also be noted that the aforementioned RF matrix switch device can be expanded in size by adding or removing horizontal or vertical modules 2210 as needed through modular topology, without requiring a redesign of the overall wiring. Simultaneously, the use of board-to-board RF blind mating (or direct male-female connector mating) and standardized installation structure reduces manual patching, improves assembly efficiency, and reduces size. Furthermore, through shielding isolation, impedance control, thermal management design, and modular firmware control, the system can ensure good isolation, insertion loss consistency, thermal reliability, and field maintainability.

[0036] This embodiment provides a radio frequency matrix switch, including: a housing 1000, including multiple side plate assemblies 1100, the multiple side plate assemblies 1100 surrounding a receiving space 1200; a matrix module 2000, disposed within the receiving space 1200, including an input section 2100 and an output section 2200 electrically connected to each other; wherein, the input section 2100 includes multiple horizontal modules 2110 stacked along a first direction, and the output section 2200 includes multiple vertical modules 2210 arrayed along a second direction, and the first direction and the second direction are perpendicular and orthogonal. The RF matrix switch in this embodiment adopts a modular orthogonal layout structure. By splitting the input path and output path into horizontal modules 2110 and vertical modules 2210 respectively, the internal topology has clear functional boundaries and multiplexing attributes. This transforms the originally complex cross-connections within the existing matrix switch into a regular orthogonal interconnection network. The modules are connected through standardized electrical and mechanical interfaces, eliminating the need for custom semi-steel cables 104 or extensive manual wiring, thus significantly reducing structural complexity and improving assembly consistency. At the same time, the orthogonal stacking / array module design allows the matrix structure to be expanded to different orders as needed. Simply adding or replacing the corresponding number of horizontal modules 2110 or vertical modules 2210 can achieve rapid expansion of the M×N configuration without redefining the overall wiring structure or changing existing modules. Moreover, thanks to the pluggable connections between modules and unified control logic, the system has greater flexibility and replaceability in the manufacturing, debugging, installation, and later maintenance stages.

[0037] Therefore, this embodiment achieves a balance between structural scalability, compact size, and consistent RF performance across all channels in the matrix switch, making the solution more suitable for application scenarios with multiple channel counts and evolvable RF systems.

[0038] In some embodiments, such as Figure 3As shown, the horizontal module 2110 includes at least one horizontal input port 2111 and multiple horizontal output ports 2112, and the vertical module 2210 includes multiple vertical input ports 2211 and at least one vertical output port 2212. In this configuration, each of the horizontal output ports 2112 of the horizontal module 2110 is electrically connected to the vertical input port 2211 of the corresponding vertical module 2210, so as to construct a matrix orthogonal connection path between the input section 2100 and the output section 2200.

[0039] Specifically, by designing the horizontal module 2110 corresponding to the input path as at least one horizontal input port 2111 and cooperating with multiple horizontal output ports 2112, a single horizontal module 2110 can form a scalable and expandable signal branching capability. Simultaneously, the vertical module 2210 corresponding to the output path is designed as multiple vertical input ports 2211 and cooperating with at least one vertical output port 2212, enabling the vertical module 2210 to converge signals from multiple horizontal modules 2110 and selectively output them. This distinction between the functional structures of input and output units modularizes the signal organization within the system, making the topology construction more standardized and easier to configure and manage.

[0040] Furthermore, the horizontal output ports 2112 of each horizontal module 2110 are electrically connected point-by-point to the vertical input ports 2211 of the corresponding vertical module 2210, forming a regular orthogonal matrix signal path. This cross-connection relationship essentially corresponds to the element-level path construction in matrix space, ensuring that each input signal has access to any output path. By utilizing the structured and numbered interface method between modules, the connection path can be clearly defined, the interconnection relationship can be unified, and the wiring structure can be transformed from the traditional complex free-form crossover into a describable and repeatable geometric matrix model.

[0041] During operation, the horizontal module 2110 is responsible for directional allocation of the input signals, while the vertical module 2210 is responsible for selecting and outputting signals from different horizontal paths. The two types of modules cooperate in an orthogonal manner to achieve a consistent mapping between the physical topology and the control logic. This approach not only ensures clear logical isolation between different signal paths but also enables dynamic switching and selection from any input port to any output port through path switching technology (such as relays, MEMS, or PIN arrays).

[0042] Through the structural design described above, this embodiment achieves standardized, regularized, and scalable signal routing for the RF matrix switch, avoiding problems such as uneven signal loss, reduced isolation, and complex maintenance caused by numerous cross cables, irregular wiring, or point-to-point customized connections in traditional matrix structures. Furthermore, the modular orthogonal connection method allows the system to be easily expanded to different orders; configuration upgrades can be completed simply by adding horizontal modules 2110 or vertical modules 2210 as needed, without redesigning the overall structure or wiring system. This results in higher efficiency and consistency in manufacturing, debugging, deployment, and subsequent maintenance.

[0043] In some embodiments, such as Figure 4A and Figure 4B As shown, both the horizontal module 2110 and the vertical module 2210 include a module housing 3000 with a module cavity 3100, a drive control circuit board 5000, and a switch circuit board 4000. The drive control circuit board 5000 is disposed in the mounting groove 3200 on one side of the module housing 3000, and the switch circuit board 4000 is disposed in the module cavity 3100, and the drive control circuit board 5000 is electrically connected to the switch circuit board 4000.

[0044] Specifically, both the horizontal module 2110 and the vertical module 2210 adopt similar structural designs, including a module housing 3000, a switching circuit board 4000, and a drive control circuit board 5000. The module housing 3000 contains a module cavity 3100 to house and shield the RF switching circuit, while the drive control circuit board 5000 is mounted in a mounting recess 3200 on one side of the module housing 3000, physically isolating it from the RF area. The switching circuit board 4000 is located inside the module cavity 3100 to ensure the RF signal path is as short and controlled as possible. Simultaneously, the drive control circuit board 5000 communicates with the switching circuit board 4000 via a standardized electrical connection structure, thereby realizing signal switching and control within the module.

[0045] The aforementioned partitioned layout is adopted because the RF switching circuit is highly sensitive to the electromagnetic environment. If the control circuit and RF path are mixed in the layout, crosstalk and parasitic coupling of the digital control signal to the RF link are likely to occur, leading to a decrease in insertion loss, isolation, and S-parameter performance. Therefore, by independently mounting the drive control circuit board 5000 in the housing recess and connecting it to the switching circuit board 4000 inside the module cavity 3100 through internal vias or short paths, the signal path length can be effectively shortened while maintaining physical isolation and hierarchical decoupling between the digital control and RF paths. In addition, the closed shielding structure provided by the module cavity 3100 can reduce interference from adjacent modules or external radiated signals, enabling the module to maintain good stability after array mounting.

[0046] For example, the drive control circuit board 5000 can adopt a standardized interface layout to achieve rapid interchange and unified debugging between modules; the switch circuit board 4000 focuses on RF link performance optimization, making the manufacturing and debugging processes more clearly defined. The module housing 3000 serves both as mechanical support and as an RF shield and thermal path carrier. Through hierarchical and collaborative structural design, the assembly process is standardized, avoiding the problems of complex cable layout and high debugging difficulty found in traditional RF switches.

[0047] This embodiment, by adopting the above design method, effectively isolates the internal control logic of the RF module from the RF signal path, significantly reduces digital noise coupling, and improves the isolation, return loss, and consistency performance of the RF switch.

[0048] In some embodiments, the switch circuit board 4000 includes at least one of a single-pole multi-throw RF switch circuit, a multi-pole multi-throw RF switch circuit, an RF multiplexer circuit, an RF crosspoint matrix switch circuit, or an RF demultiplexer circuit.

[0049] Specifically, the switch circuit board 4000 adopts an electrically controlled RF switch architecture. The switch circuit may include at least one of a single-pole multi-throw RF switch, a multi-pole multi-throw RF switch, an RF multiplexer, a cross-point matrix switch circuit, or an RF demultiplexer. Different structural types of RF switch circuits can be flexibly selected based on matrix order, port density, signal path topology, and isolation specifications, enabling the same module structure to be compatible with multiple RF channel configurations and achieving circuit-level multiplexing and functional expansion flexibility.

[0050] The core reason for adopting the aforementioned multiple types of RF switch structures is that RF matrix switch systems require cross-access to multiple signals and dynamic path switching. Relying solely on traditional fixed cable or mechanical relay switching schemes is not only complex in wiring and slow in response, but also fails to meet the requirements of high-speed switching, repeated service life, and dense channel deployment. In contrast, electrically controlled solid-state RF switches have significant advantages in response speed, channel density, controllability, and reliability. Especially in high-order matrix topologies, flexible path control is required through multi-level switch combinations, thus supporting multiple types of RF switch circuits is a necessary condition.

[0051] Meanwhile, to accommodate the different signal roles played by different modules within the matrix structure—for example, the horizontal module 2110 focuses on input direction expansion, while the vertical module 2210 focuses on output direction selection—different types of RF switching devices can be configured according to functional partitions, forming a "functional modular + topology evolvable" structural system. This approach not only reduces reliance on custom hardware but also elevates the matrix expansion capability from the structural layer to the functional layer, simplifying manufacturing, expansion, and subsequent upgrade processes.

[0052] This embodiment replaces mechanical relay switches with solid-state RF switch circuits, enabling the system to achieve a high-density port layout within a limited space, significantly reducing the overall size and improving structural compactness. Simultaneously, solid-state switches offer advantages such as high-speed switching, long lifespan, and maintenance-free operation, effectively improving the matrix system's response speed, reliability, and long-term consistency. Through the flexible combination design of selectable switch structures, the entire RF matrix can adapt to the bandwidth, isolation, gating logic, and channel count requirements of different application scenarios, achieving modular reuse, scalable architecture, and stable performance in engineered deployments.

[0053] In some embodiments, such as Figure 5 As shown, the horizontal module 2110 includes a primary submodule 2113 and multiple secondary submodules 2114; the primary submodule 2113 includes multiple sub-output terminals, the secondary submodule 2114 is provided with a sub-input terminal, and each sub-output terminal of the primary submodule 2113 is electrically connected to the corresponding sub-input terminal of the secondary submodule 2114. The first-level submodule 2113 and the second-level submodule 2114 are arranged in parallel along the same horizontal plane.

[0054] Specifically, the horizontal modules 2110 and vertical modules 2210 are arranged orthogonally. Each horizontal module 2110 includes a primary submodule 2113 and multiple secondary submodules 2114. The sub-output terminals of the primary submodule 2113 are electrically connected to the sub-input terminals of the corresponding secondary submodules 2114, realizing hierarchical signal transmission within the module. The primary submodules 2113 and secondary submodules 2114 are arranged parallel to each other along the same horizontal plane to facilitate stacking, shorten signal paths, reduce insertion loss, and facilitate shielding and impedance control. The primary submodules 2113 are responsible for initially distributing the input signals to each secondary submodule 2114. The secondary submodules 2114 further transmit the signals to the vertical module 2210 or the matrix intersection, thereby realizing controllable distribution and modular management of horizontal signals.

[0055] Furthermore, to accommodate matrix configurations of different orders, this embodiment is designed to flexibly combine smaller-order switches to replace larger-order switch chips. For example, in conventional designs, an m×n matrix typically requires m SPnT switch modules and n SPmT switch modules. However, when the order is too large and a single large-order switch chip is unavailable on the market, equivalent functionality can be achieved by combining smaller-order switches. For instance, a 4×32 fully selected matrix switch theoretically requires four SP32T switch modules and 32 SP4T switch modules. However, since SP32T chips (or SP32T switches) are unavailable, it can be replaced by combining one SP4T switch module with four SP8T switch modules. By orthogonal arrangement, a complete 128-port matrix connection can still be achieved.

[0056] This embodiment employs modularity, hierarchy, and combination to achieve high system flexibility and scalability. Even with limited single-chip resources, it can implement large-scale matrix functions through small-order switch combinations. Simultaneously, orthogonal arrangement ensures the clarity and consistency of signal paths, maintaining insertion loss, isolation, and channel consistency, enabling the engineering deployment of high-density RF matrices.

[0057] In some embodiments, both the transverse module 2110 and the longitudinal module 2210 are provided with electromagnetic shielding structures, which include isolation sheets, metal shielding cavities, or wave-absorbing material layers.

[0058] For example, both the horizontal module 2110 and the vertical module 2210 are provided with electromagnetic shielding structures, which may include isolation sheets, metal shielding cavities, or absorbing material layers. This design is mainly to control the propagation path of radio frequency signals inside and between modules, preventing signal leakage or crosstalk. Radio frequency matrix switches typically contain multiple channels and high-density crossover points. If there is a lack of effective shielding between modules, horizontal and vertical signals may couple outside the modules or between adjacent channels, thereby reducing port isolation and affecting the overall system performance.

[0059] Specifically, the isolation plate and metal shielding cavity can physically separate adjacent channels to form an independent electromagnetic environment, ensuring that radio frequency signals are transmitted strictly along the designed path; the absorbing material layer can absorb excess radiation energy, further reducing reflections and leakage between modules or around intersections.

[0060] Furthermore, the electromagnetic shielding structure, in conjunction with the module housing 3000 and the electrical grounding strategy, forms a complete electromagnetic shielding system. This ensures signal quality while also enhancing the system's anti-interference capability and reliability. The modular shielding design also facilitates expansion and maintenance under different matrix orders or application scenarios, without significantly increasing the risk of crosstalk due to increasing the number of modules.

[0061] This embodiment, through the rational design of the shielding structure, can not only improve the isolation of each channel, but also ensure the stable operation of the matrix switch in high-frequency or high-power environments.

[0062] Based on the same inventive concept, such as Figure 6 and Figure 7 As shown, this application also provides a radio frequency matrix switch configuration method, applied to the radio frequency matrix switch described above, including: S100, Obtain the preset matrix order M×N.

[0063] In this step, under simulation conditions, the controller can obtain the order M×N of the RF matrix switch through user input, host computer configuration, or system initialization parameters. This means the system needs to support full selection switching of signals with M input ports and N output ports. The matrix order information directly reflects the channel scale and switching capability that the system needs to support. For example, a 4×4 matrix indicates that the system needs to support full selection switching of 4 input ports and 4 output ports; an 8×8 matrix needs to support full selection switching of 8 input ports and 8 output ports.

[0064] S200. Determine the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N.

[0065] In this step, the number of horizontal modules is determined to be N and the number of vertical modules is M based on the matrix order M×N. The following is a simple explanation using an N×N matrix with M=N as an example.

[0066] The number of SPnT (single-pole n-throw) switch modules in the input and output sections is determined based on the matrix order n. Typically, each layer has 2n modules to ensure that the cross-connection between the input and output ends covers all n×n links. For example, in a 4×4 matrix switch, each horizontal module and each vertical module consists of 4 SP4T single-pole four-throw switches, for a total of 8 SP4T modules, which form a full selection path through the matrix intersections.

[0067] When determining the number of modules, each module needs to be assigned a specific port number and interface type. The input ports of the horizontal modules are numbered sequentially, and the output ports correspond one-to-one with the input ports of the vertical modules. Optionally, the interface type can be selected based on the system design, using standard RF connectors such as SMA, SMP, or board-to-board RF interfaces, with impedance matching performed at the interface to ensure consistent RF signal transmission and low reflection. The interfaces between modules are designed as pluggable or blind-mating structures for easy assembly and maintenance.

[0068] Optionally, the horizontal modules are responsible for distributing the input signal to the vertical modules. Each module should contain the necessary switching elements and matching networks to maintain channel amplitude and phase consistency. The vertical modules are responsible for aggregating and outputting the signal, and can also integrate isolation networks to reduce crosstalk between modules. Depending on the matrix order and operating frequency band, mechanical relays, MEMS, or semiconductor RF switches can be selected to balance insertion loss, isolation, switching speed, and lifespan.

[0069] In terms of physical arrangement, the horizontal modules are stacked along the first direction, and the vertical modules are arrayed along the second direction, with the two directions being perpendicular and orthogonal to each other.

[0070] By following the steps above, it can be ensured that each horizontal module and vertical module are accurately connected in the subsequent orthogonal topology assembly, realizing the full selection capability of the matrix switch, while taking into account modularity, scalability, maintainability and RF performance consistency.

[0071] S300. Configure the RF matrix switch in an orthogonal topology based on the number of the horizontal and vertical modules and their corresponding port configurations.

[0072] The orthogonal topology configuration of the RF matrix switch refers to the horizontal and vertical modules being orthogonally arranged and connected in a matrix manner through ports.

[0073] In this step, under simulation conditions, the controller stacks the horizontal modules along the first direction and arranges the vertical modules in an array along the second direction, with the two directions being perpendicular and orthogonal to each other, forming a matrix-like cross layout. The output of each horizontal module interfaces with the input of the vertical module through a standardized RF interface (such as a male-female connector or board-to-board RF adapter), forming an M×N or N×N fully-gated connection. Taking a 4×4 matrix as an example, refer to... Figure 6 Each number represents an SP4T switch assembly, and the small circle represents an RF connector. The horizontal and vertical modules directly interface to achieve full-path coverage without the need for traditional semi-steel cables, thereby reducing insertion loss, lowering design complexity, and supporting rapid assembly and modular maintenance.

[0074] Furthermore, after completing the orthogonal topology configuration, the ports of the horizontal and vertical modules can be switched one by one via the controller to verify the reliability of the full-selection path, ensuring that all input ports can be flexibly connected to any output port and meet the system switching performance requirements. If necessary, the amplitude / phase deviation between channels can be corrected through the on-board fine-tuning matching network or calibration software to ensure that the RF matrix switch still has good consistency and isolation in the high-frequency band.

[0075] This embodiment determines the number and port configuration of horizontal and vertical modules based on a preset matrix order, and assembles the matrix switch using an orthogonal topology. This achieves a modular and standardized internal topology, enabling rapid expansion of matrices of different orders without rewiring or custom semi-steel cables, thus reducing engineering modification and production complexity. The method simplifies the assembly process and reduces overall size through modular configuration and standard interface layout, facilitating mass production and automated manufacturing. Simultaneously, the cross-interconnection of orthogonal modules and standardized port design make it easy to calibrate the amplitude and phase of multi-channel signals, ensuring performance consistency and isolation at high frequencies. Furthermore, this method supports rapid replacement and maintenance of individual modules, improving system reliability and reducing system insertion loss and manufacturing costs, achieving an effective balance between performance, scalability, maintainability, and economy.

[0076] In some embodiments, step S200, determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N, further includes: Compare M and N with pathway thresholds; In response to determining that M is greater than the path threshold, the horizontal module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; In response to determining that N is greater than the path threshold, the vertical module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; The path threshold is the maximum number of paths that a single-pole multi-throw switch can connect.

[0077] For example, when determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N, it is also necessary to compare M and N with the path threshold of a single-pole multi-throw switch. Specifically, when M is greater than the path threshold, the horizontal module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; when N is greater than the path threshold, the vertical module is split into several first-level sub-modules and second-level sub-modules for combination and replacement, in order to meet the actual large-scale matrix switch design requirements.

[0078] For example, in the case of constructing a 4×32 order fully-selected matrix switch, if a separate SP32T switch module is not available, one SP4T switch module can be combined with four SP8T sub-modules to form a horizontal or vertical module, and the 128 ports can be fully selected through orthogonal arrangement. In this way, modular design of high-order matrices can be achieved without relying on custom or separate high-capacity switch chips.

[0079] During module splitting and assembly, the port number and interface type of each primary or secondary submodule must remain consistent with the original module to ensure accurate docking in subsequent orthogonal topology configurations. Modules are directly connected via standardized RF connectors or board-to-board interfaces, avoiding the signal insertion loss, poor compatibility, and long customization cycles associated with traditional semi-steel cable connections. Simultaneously, each submodule can be independently debugged and calibrated to ensure the consistency of amplitude and phase across multiple channels, meeting the performance requirements of high-frequency RF signal transmission.

[0080] Through the above steps, this method can achieve the generalization and scalability of horizontal and vertical modules under matrices of different orders while maintaining the orthogonal topology and full selection capability. It also allows large matrices to be flexibly constructed through module combination, thereby greatly improving the adaptability and engineering feasibility of matrix switch design.

[0081] This embodiment compares the matrix order with the path threshold and splits and combines the horizontal and vertical modules into first- and second-level sub-modules, achieving a generalized extension of the orthogonal topology. This allows for the rapid construction of matrices of different orders without relying on separate high-capacity switching chips or custom semi-steel cables, thereby reducing design complexity and engineering cycle. Modular combination and standardized interfaces ensure ease of assembly and calibration, improving the amplitude and phase consistency and isolation of multi-channel signals. At the same time, this method supports flexible expansion of high-order matrices, adapting to the design requirements of M×N order fully gating matrices, balancing performance, scalability, and economy, and improving the reliability and maintainability of the system.

[0082] In some embodiments, step S200, determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N, includes: The number of horizontal modules and the number of vertical modules are determined based on the matrix order M×N; The number of output ports of the horizontal module is determined based on the number of vertical modules; The number of input ports for the vertical module is determined based on the number of horizontal modules.

[0083] For example, the number of horizontal modules and the number of vertical modules are first determined according to the matrix order M×N. For instance, for a 4×4 matrix switch, there are 4 horizontal modules and 4 vertical modules; for an 8×8 matrix, there are 8 horizontal modules and 8 vertical modules, to ensure that the matrix switch can cover all input and output paths and achieve full selection function.

[0084] Secondly, the number of output ports for the horizontal modules is determined based on the number of vertical modules. Each output port of the horizontal module must correspond one-to-one with an input port of the vertical module, forming a matrix intersection to achieve complete distribution of input signals to the vertical modules. During port configuration, each port is labeled with a unique number, and an appropriate RF interface type (such as SMA, SMP, or board-to-board RF interface) is selected to ensure impedance matching and transmission consistency of the RF signals.

[0085] Then, the number of input ports for the vertical modules is determined based on the number of horizontal modules. Each input port of the vertical module corresponds to an output port of the horizontal module, and they are connected through an orthogonal topology to ensure that each input signal path can cover the output port of the vertical module, achieving full-path configuration of the matrix. The output ports of the vertical modules can also be numbered and matched with interface types according to system requirements to facilitate direct interface with subsequent RF systems or test instruments.

[0086] Through the above steps, the number and configuration of ports in the horizontal and vertical modules can be dynamically determined according to the matrix order, realizing the modular and standardized layout of the matrix switch and laying the foundation for subsequent orthogonal topology assembly and system expansion.

[0087] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.

[0088] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0089] Based on the same inventive concept, and corresponding to any of the above embodiments, this application also provides a radio frequency matrix switch configuration device.

[0090] refer to Figure 8 The radio frequency matrix switch configuration device includes: an acquisition module 401, an analysis module 402, and an execution module 403; The module 401 is configured to obtain the preset matrix order M×N.

[0091] The analysis module 402 is configured to determine the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N.

[0092] The execution module 403 is configured to configure the radio frequency matrix switch in an orthogonal topology based on the number of the horizontal and vertical modules and their corresponding port configurations.

[0093] Furthermore, the analysis module 402 is also configured to: Compare M and N with pathway thresholds; In response to determining that M is greater than the path threshold, the horizontal module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; In response to determining that N is greater than the path threshold, the vertical module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; The path threshold is the maximum number of paths that a single-pole multi-throw switch can connect.

[0094] Furthermore, the analysis module 402 is also configured to: The number of horizontal modules and the number of vertical modules are determined based on the matrix order M×N; The number of output ports of the horizontal module is determined based on the number of vertical modules; The number of input ports for the vertical module is determined based on the number of horizontal modules.

[0095] For ease of description, the above devices are described in terms of function, divided into various modules. Of course, in implementing this application, the functions of each module can be implemented in one or more software and / or hardware.

[0096] The apparatus of the above embodiments is used to implement the corresponding radio frequency matrix switch configuration method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0097] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the radio frequency matrix switch configuration method described in any of the above embodiments.

[0098] Figure 9 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0099] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0100] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0101] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0102] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0103] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0104] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0105] The electronic devices described above are used to implement the corresponding radio frequency matrix switch configuration methods in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0106] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing the computer to execute the radio frequency matrix switch configuration method as described in any of the above embodiments.

[0107] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0108] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the radio frequency matrix switch configuration method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0109] Based on the same concept, corresponding to any of the above embodiments, this application also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to perform the method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0110] It is understood that before using the technical solutions of the various embodiments in this application, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.

[0111] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations described in this application.

[0112] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0113] It is understood that the above notification and user authorization process is merely illustrative and does not limit the implementation of this application. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this application.

[0114] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0115] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0116] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0117] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A radio frequency matrix switch, characterized in that, include: The housing includes a plurality of side panel assemblies, the plurality of side panel assemblies being arranged to form a receiving space; A matrix module, disposed within the accommodating space, includes an input section and an output section electrically connected to each other; The input section includes multiple horizontally stacked modules arranged along a first direction, and the output section includes multiple vertically arranged modules arranged in an array along a second direction, wherein the first direction and the second direction are perpendicular and orthogonal.

2. The radio frequency matrix switch according to claim 1, characterized in that, The horizontal module includes at least one horizontal input port and multiple horizontal output ports, and the vertical module includes multiple vertical input ports and at least one vertical output port. Each horizontal output port of the horizontal module is electrically connected to the vertical input port of the corresponding vertical module to form a matrix orthogonal connection path between the input and output sections.

3. The radio frequency matrix switch according to claim 1, characterized in that, Both the horizontal module and the vertical module include a module shell with module cavities, a drive control circuit board, and a switch circuit board. The drive control circuit board is disposed in a mounting groove on one side of the module housing, and the switch circuit board is disposed in the module cavity, and the drive control circuit board is electrically connected to the switch circuit board.

4. The radio frequency matrix switch according to claim 3, characterized in that, The switch circuit board includes at least one of a single-pole multi-throw RF switch circuit, a multi-pole multi-throw RF switch circuit, an RF multiplexer circuit, an RF crosspoint matrix switch circuit, or an RF demultiplexer circuit.

5. The radio frequency matrix switch according to claim 1, characterized in that, The horizontal module includes a primary submodule and multiple secondary submodules; the primary submodule includes multiple sub-output terminals, the secondary submodule has a sub-input terminal, and each sub-output terminal of the primary submodule is electrically connected to the corresponding sub-input terminal of the secondary submodule. The first-level submodule and the second-level submodule are arranged in parallel along the same horizontal plane.

6. The radio frequency matrix switch according to claim 1, characterized in that, Both the horizontal and vertical modules are equipped with electromagnetic shielding structures, which include isolation sheets, metal shielding cavities, or wave-absorbing material layers.

7. A method for configuring a radio frequency matrix switch, characterized in that, The radio frequency matrix switch applied to any one of claims 1-6 comprises: Obtain the preset matrix order M×N; The number of horizontal and vertical modules and their corresponding port configurations are determined based on the preset matrix order M×N. The RF matrix switch is configured in an orthogonal topology based on the number of horizontal and vertical modules and their corresponding port configurations. The orthogonal topology configuration of the RF matrix switch refers to the horizontal and vertical modules being orthogonally arranged and connected in a matrix manner through ports.

8. The apparatus according to claim 7, characterized in that, The step of determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N further includes: Compare M and N with pathway thresholds; In response to determining that M is greater than the path threshold, the horizontal module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; In response to determining that N is greater than the path threshold, the vertical module is split into several first-level sub-modules and second-level sub-modules for combination and replacement; The path threshold is the maximum number of paths that a single-pole multi-throw switch can connect.

9. The apparatus according to claim 7, characterized in that, The step of determining the number of horizontal and vertical modules and their corresponding port configurations based on the preset matrix order M×N includes: The number of horizontal modules and the number of vertical modules are determined based on the matrix order M×N; The number of output ports of the horizontal module is determined based on the number of vertical modules; The number of input ports for the vertical module is determined based on the number of horizontal modules.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the method as described in any one of claims 7 to 9.

11. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method according to any one of claims 7 to 9.

12. A computer program product comprising computer program instructions, characterized in that, When the computer program instructions are executed on a computer, the computer causes the computer to perform the method as described in any one of claims 7-9.

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