Photovoltaic lossless cutting equipment

Abstract

The utility model discloses photovoltaic lossless cutting equipment, which belongs to the technical field of photovoltaic lossless cutting and comprises a feeding conveying device, an interactive processing module, a laser cutting device, a discharging conveying device, a positioning deviation correcting device and a feeding carrying device. By arranging the positioning deviation rectifying device and the feeding carrying device between the feeding conveying device and the interactive machining module, positioning deviation rectifying and carrying of a to-be-cut material are achieved before feeding and cutting, the position precision of the to-be-cut material during cutting is guaranteed, and then the cutting precision during lossless cutting is improved. The photovoltaic lossless cutting equipment is simple in structure, all the devices are reasonable in layout design, accurate positioning, detecting and drying of materials to be cut can be achieved, the quality of products cut by the equipment is effectively improved, and the photovoltaic lossless cutting equipment has good application prospects and popularization value.

Description

Technical Field

[0001] The utility model belongs to the technical field of photovoltaic lossless cutting, and specifically relates to photovoltaic lossless cutting equipment. Background Art

[0002] During the silicon wafer production and processing, a large cell or silicon wafer needs to be cut into two or more small cells or silicon wafers in the middle using photovoltaic cutting equipment.

[0003] With the rapid development of the semiconductor industry, the market demand for silicon wafers is increasing, and the quality requirements for silicon wafers are also getting higher and higher. Therefore, the photovoltaic cutting process requires high precision, and the cutting surface cannot be uneven. Among them, the optical non-destructive cutting process is currently the most widely used cutting method in the photovoltaic industry because of its small cutting damage.

[0004] However, in the actual production process, when using laser cutting technology to cut silicon wafers non-destructively, since there are no electrodes on the surface of the silicon wafer, it is difficult to position the silicon wafer before non-destructive cutting, it is difficult to ensure the accuracy during non-destructive cutting, and it is difficult to detect after non-destructive cutting. In addition, due to the material characteristics of the silicon wafer, water droplets are easily generated at the cutting point, and the CT time of the machine is very short, which makes it difficult to deal with water stains on the silicon wafer, which has a great impact on the normal production of subsequent processes. Utility Model Content

[0005] In response to one or more of the above defects or improvement needs of the prior art, the utility model provides a photovoltaic non-destructive cutting device, which can accurately locate the material to be cut and detect it after cutting, and effectively dry the cut material.

[0006] To achieve the above-mentioned purpose, the utility model provides a photovoltaic non-destructive cutting device, which includes a loading and conveying device, a loading and handling device, an interactive processing module, a laser cutting device, a unloading and conveying device, a unloading and handling device, and a positioning and deviation correction device;

[0007] The positioning and deviation correction device is arranged between the loading and conveying device and the interactive processing module, and the loading and conveying device can sequentially convey the material to be cut from the loading and conveying device to the positioning and deviation correction device and the interactive processing module;

[0008] The positioning and deviation correction device comprises a deviation correction platform structure and a visual positioning structure; after the visual positioning structure positions the material to be cut placed on the deviation correction platform structure, the deviation correction platform structure corrects the position of the material to be cut;

[0009] The laser cutting device is located above the interactive processing module and is used for laser cutting the material to be cut;

[0010] The material unloading and transporting device transports the cut material after laser cutting from the interactive processing module to the material unloading and transporting device.

[0011] As a further improvement of the present invention, the loading and handling device comprises a transverse movement module and a deviation correction suction cup module arranged on the transverse movement module;

[0012] The transverse shift module can reciprocate along a conveying direction perpendicular to the loading conveying device;

[0013] The correcting suction cup module is used to absorb the material to be cut, and includes a loading suction cup assembly and a unloading suction cup assembly that are arranged at intervals; the loading suction cup assembly can reciprocate between the loading conveying device and the positioning correcting device under the drive of the transverse movement module; the unloading suction cup assembly can reciprocate between the positioning correcting device and the interactive processing module under the drive of the transverse movement module.

[0014] As a further improvement of the utility model, the feeding suction cup assembly includes a feeding suction cup, and the feeding suction cup is cross-shaped; a light source is obliquely arranged above the cross angle area of ​​the feeding suction cup to illuminate the mark point of the material to be cut and avoid reflection of the material to be cut;

[0015] and / or,

[0016] The deviation correction platform structure is an XYθ motion platform.

[0017] As a further improvement of the present invention, a drying device is further provided above the material feeding and conveying device.

[0018] The drying device comprises a wind-heating component and an air knife component; a plurality of the wind-heating components are arranged at intervals along the material feeding direction to blow hot air to dry the cut materials during the material feeding process; the air knife component is arranged corresponding to the wind-heating component near the tail end of the drying device, and is arranged on both sides of the wind-heating component along the material feeding direction in an inclined manner toward the cutting position of the cut materials;

[0019] An adsorption conveying device is provided on the material unloading conveying device corresponding to the drying device to adsorb and convey the cut materials conveyed to the bottom of the drying device to avoid displacement of the cut materials.

[0020] As a further improvement of the present invention, a contour line detection module, a hidden crack detection module and an NG exclusion mechanism are further provided on the unloading conveying device; the contour line detection module and the hidden crack detection module are respectively arranged on both sides of the drying device along the unloading direction; the NG exclusion mechanism is arranged at the tail end of the unloading conveying device, and comprises a first mechanical arm and a first suction cup arranged on the first mechanical arm, and the first suction cup moves back and forth between the unloading conveying device and the NG position under the drive of the first mechanical arm, so as to transfer the NG pieces detected by the contour line detection module and the hidden crack detection module to the NG position;

[0021] and / or,

[0022] A reversing mechanism is also provided on the material unloading conveying device, and the reversing mechanism includes a lifting module, a rotating module provided on the lifting module, and a reversing suction cup module provided on the rotating module, so as to absorb and rotate the cut material transmitted on the material unloading conveying device, so as to reverse the cut material;

[0023] and / or,

[0024] The loading conveyor device is arranged in parallel and at intervals with the interactive processing module, the unloading conveyor device and the loading conveyor device are arranged on the same side of the interactive processing module, and the unloading conveyor device and the loading conveyor device are both belt conveyors with the same conveying direction.

[0025] As a further improvement of the present invention, a loading position, a cutting position and a unloading position are sequentially arranged on the interactive processing module, and the loading position is arranged at one end close to the loading and transporting device;

[0026] A movable supporting platform is also provided on the interactive processing module. The movable supporting platform is used to carry the material to be cut after positioning and deviation correction, and to reciprocate between the loading position, the cutting position and the unloading position.

[0027] As a further improvement of the utility model, at least one set of first adsorption area and second adsorption area is arranged on the movable carrying platform;

[0028] The first adsorption area is arranged in the middle of the movable carrier, and includes at least two first adsorption subareas arranged side by side and spaced apart from each other, each first adsorption subarea is provided with a plurality of first adsorption holes spaced apart from each other along the cutting direction, and a groove is formed between two adjacent first adsorption subareas;

[0029] The second adsorption area is arranged at intervals on both sides of the first adsorption area along the cutting direction, and includes a plurality of second adsorption holes arranged at intervals along the cutting direction.

[0030] As a further improvement of the present invention, the total area of ​​the first adsorption holes in the first adsorption zone is smaller than the total area of ​​the second adsorption holes in the second adsorption zone.

[0031] As a further improvement of the present invention, the unloading and handling device includes a second robotic arm and a unloading suction cup module arranged on the second robotic arm. The unloading suction cup module can move back and forth between the interactive processing module and the unloading conveying device under the drive of the second robotic arm.

[0032] As a further improvement of the present invention, the unloading suction cup module includes at least two second suction cups, and at least one of the second suction cups is connected to a driving device so that the corresponding second suction cup can be driven by the driving device to move relative to other second suction cups to change the distance between the second suction cups and other second suction cups.

[0033] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0034] In general, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0035] (1) The photovoltaic non-destructive cutting equipment of the present invention arranges a positioning and correcting device and a loading and transporting device between the loading and conveying device and the interactive processing module to realize positioning, correcting and transporting of the material to be cut before loading and cutting, thereby ensuring the position accuracy of the material to be cut during cutting, and then improving the cutting accuracy during non-destructive cutting.

[0036] (2) The photovoltaic lossless cutting equipment of the present invention is provided with a drying device on the material unloading and conveying device, and a wind heating component and an air knife component are simultaneously provided in the drying device, so as to ensure that the cut material can be completely dried during the material unloading and conveying process through a variety of drying methods, thereby avoiding certain influence on the normal operation of the subsequent process due to incomplete drying.

[0037] (3) The photovoltaic non-destructive cutting equipment of the utility model sequentially arranges a contour line detection module, a hidden crack detection module and an NG elimination mechanism along the unloading direction of the unloading conveying device to respectively detect the cutting surface and hidden cracks of the cut material, and removes the detected NG material through the NG elimination mechanism to avoid the outflow of residual products, thereby improving the quality of the products flowing into the next process. By arranging the unloading conveying device and the loading conveying device on the same side of the interactive processing module and further limiting the transmission directions of the two to be consistent, it is beneficial to save space in the photovoltaic non-destructive cutting equipment.

[0038] (4) The photovoltaic non-destructive cutting equipment of the present invention has a simple structure and a reasonable layout design between the various devices. It can realize the precise positioning, detection and drying of the material to be cut, effectively improve the quality of the product after cutting by the equipment, and has good application prospects and promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 It is a schematic diagram of the overall structure of the photovoltaic non-destructive cutting device in the embodiment of the utility model;

[0041] Figure 2 It is a schematic diagram of the overall structure of the positioning and deviation correction device in the embodiment of the utility model;

[0042] Figure 3 It is a schematic diagram of the overall structure of the loading and handling device in the embodiment of the utility model;

[0043] Figure 4 It is a schematic diagram of the overall structure of the movable carrying platform in the embodiment of the utility model;

[0044] Figure 5 It is a schematic diagram of the overall structure of the material feeding conveying device and the drying device in the embodiment of the utility model;

[0045] In all the drawings, the same reference numerals represent the same technical features, specifically: 100, interactive processing module; 110, movable carrier; 111, first adsorption area; 112, second adsorption area; 113, groove; 200, laser cutting device; 300, positioning and correction device; 310, correction platform structure; 320, visual positioning structure; 400, loading and handling device; 410, lateral movement module; 420, correction suction cup module; 421, unloading suction cup assembly; 422, loading suction cup assembly ; 430, light source; 500, loading and conveying device; 600, unloading and conveying device; 610, adsorption and conveying device; 700, unloading and handling device; 710, second robotic arm; 720, unloading suction cup module; 800, drying device; 810, wind heating component; 820, wind knife component; 910, contour line detection module; 920, hidden crack detection module; 930, NG elimination mechanism; 931, first robotic arm; 932, first suction cup; 940, reversing mechanism; 941, reversing suction cup module. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0051] Example:

[0052] See also Figure 1 to Figure 5 The photovoltaic lossless cutting equipment in the preferred embodiment of the utility model includes a loading and conveying device 500, a positioning and correcting device 300, a loading and transporting device 400, an interactive processing module 100, a laser cutting device 200 and a unloading and conveying device 600, so as to load and unload silicon wafers through the loading and conveying device 500 and the unloading and conveying device 600, and to position and correct the silicon wafers before loading through the positioning and correcting device 300 and the loading and transporting device 400, and to transport the corrected silicon wafers to the interactive processing module 100, so as to realize precise lossless cutting by the laser cutting device 200.

[0053] Specifically, if Figure 1 As shown in the figure, in a preferred embodiment, a loading and conveying device 500 is provided at the loading end of the photovoltaic non-destructive cutting equipment, including a loading belt for conveying the material to be cut to the photovoltaic non-destructive cutting equipment. In the specific embodiment, the material to be cut is a silicon wafer.

[0054] Furthermore, the positioning and correcting device 300 in the preferred embodiment is arranged between the loading and conveying device 500 and the interactive processing module 100, and a loading and transporting device 400 is mounted above it, so that the silicon wafers on the loading belt can be transported to the positioning and correcting device 300 for positioning and correction through the loading and transporting device 400, and then the silicon wafers can be transported to the interactive processing module 100 for subsequent processing.

[0055] Specifically, Figure 2 As shown in the figure, the positioning and correcting device 300 in the preferred embodiment includes a correcting platform structure 310 and a visual positioning structure 320 arranged above it; wherein, the correcting platform structure 310 can move and rotate horizontally and vertically in the horizontal direction, and the correcting platform structure 310 is preferably an XYθ motion platform, so that after the silicon wafer is placed on the correcting platform structure 310 by the loading and conveying device 400, the position of the silicon wafer is positioned by the visual positioning structure 320, and the correcting platform structure 310 performs XYθ three-axis correction positioning on the silicon wafer according to the positioning data given by the visual positioning structure 320.

[0056] Preferably, the visual positioning structure 320 includes multiple cameras, and further preferably includes an edge positioning camera and a MARK positioning camera, so as to perform precise positioning through two detection methods to ensure the subsequent cutting accuracy. Figure 2 In the preferred embodiment, two edge positioning cameras and a MARK positioning camera are sequentially arranged at the four corners above the deviation correction platform structure 310 .

[0057] Furthermore, the loading and transporting device 400 in the preferred embodiment is arranged between the loading and transporting device 500 and the interactive processing module 100, and is used to transport the material to be cut from the loading and transporting device 500 to the positioning and correcting device 300 and the interactive processing module 100 in sequence.

[0058] Specifically, the loading and conveying device 400 includes a transverse shifting module 410 and a correction sucker module 420 disposed on the transverse shifting module 410. The transverse shifting module 410 is disposed along a direction perpendicular to the conveying direction of the loading and conveying device 500, and can reciprocate along the direction perpendicular to the conveying direction of the loading and conveying device 500; the correction sucker module 420 preferably includes a loading sucker assembly 422 and a unloading sucker assembly 421 disposed at intervals; the loading sucker assembly 422 can reciprocate between the loading belt and the correction platform structure 310 under the drive of the transverse shifting module 410, so as to transfer the silicon wafers on the loading belt to the correction platform structure 310.

[0059] In a preferred embodiment, the loading suction cup assembly 422 includes a loading suction cup, and the loading suction cup is set to a cross shape, and a light source 430 is arranged above the cross angle area of ​​the loading suction cup to illuminate the mark point of the material to be cut adsorbed on the loading suction cup from the cross angle of the loading suction cup, and it is further preferred to set the light source 430 at an angle to avoid the problem of reflection caused by the silicon wafer being illuminated along the line, which may cause misjudgment in taking pictures.

[0060] Typically, the mark points on the silicon wafer are generally four mark points set at the four corner points thereof. Preferably, a light source 430 is respectively set corresponding to each mark point to illuminate the designated mark points of the silicon wafer one by one.

[0061] Accordingly, the unloading suction cup assembly 421 can be reciprocated between the deflection correction platform structure 310 and the interactive processing module 100 driven by the lateral movement module 410 to transfer the silicon wafer on the deflection correction platform structure 310 to the interactive processing module 100 .

[0062] like Figure 1In the preferred embodiment shown, the distance between the loading and conveying device 500 and the positioning and correcting device 300 is equal to the spacing between the positioning and correcting device 300 and the interactive processing module 100, and the spacing between the loading suction cup assembly 422 and the unloading suction cup assembly 421 is set to be equal to the spacing, thereby achieving synchronization of the correction and conveying of the loading and conveying device 400 and the loading and conveying, thereby improving the working efficiency of the equipment.

[0063] Furthermore, the interactive processing module 100 in the preferred embodiment is arranged in parallel and at intervals with the loading and conveying device 500, and its specific structure is the existing technology, including a frame and at least two interactive modules arranged on the frame that move back and forth and up and down interactively; wherein, the interactive processing module 100 is sequentially provided with a loading position a, a cutting position b and a unloading position c along the extension direction of the frame, and the loading position a is set on the side of the interactive processing module 100 close to the loading and conveying device 400.

[0064] At the same time, a movable carrier 110 is provided on the interactive processing module 100 , which can reciprocate between the loading position a, the cutting position b and the unloading position c, and the silicon wafers transported by the loading and transporting device 400 are transported to the movable carrier 110 .

[0065] Specifically, Figure 4 As shown in , in a preferred embodiment, at least one group of first adsorption areas 111 and second adsorption areas 112 are provided on the movable carrier 110; wherein, the first adsorption area 111 is provided in the middle of the movable carrier 110, including at least two first adsorption partitions spaced side by side, and each first adsorption partition includes a plurality of first adsorption holes spaced along the silicon wafer cutting direction, and a groove 113 is formed between two adjacent first adsorption partitions to facilitate subsequent laser cutting.

[0066] Correspondingly, the second adsorption area 112 is arranged at intervals on both sides of the first adsorption area 111 along the cutting direction, and includes a plurality of second adsorption holes arranged at intervals along the cutting direction.

[0067] Preferably, the total area of ​​the first adsorption holes in the first adsorption area 111 is set to be smaller than the total area of ​​the second adsorption holes in the second adsorption area 112, so as to ensure that the suction force of the first adsorption area 111 is smaller than that of the second adsorption area 112, and a slight movement to both sides can be produced, which is convenient for slicing after dicing. In actual production, it can be achieved by setting the same number of first adsorption holes and second adsorption holes, but the area of ​​each first adsorption hole is smaller than the area of ​​each second adsorption hole; it can also be achieved by setting the first adsorption holes and the second adsorption holes of the same size, but the number of first adsorption holes is less than the number of second adsorption holes, but it is not limited to this.

[0068] like Figure 4In the preferred embodiment shown, two groups of first adsorption areas 111 and second adsorption areas 112 are arranged at intervals along the cutting direction.

[0069] Furthermore, a laser cutting device 200 is provided at the cutting position b so as to perform non-destructive cutting of the silicon wafers by the laser cutting device 200. The cut silicon wafers are moved to the unloading position c for unloading via the movable carrier 110.

[0070] like Figure 1 The laser cutting device 200 in the preferred embodiment shown includes a slotting light module and a thermal cracking laser module to perform silicon wafer slotting and thermal cracking respectively. This is the prior art and its specific structure will not be described in detail here.

[0071] Preferably, a spraying module is further provided in the laser cutting device 200, and the output port is arranged toward the silicon wafer cutting position, for spraying cooling medium to the cutting position to improve the cutting accuracy of the silicon wafer.

[0072] Furthermore, a material unloading conveying device 600 is provided downstream of the unloading position c to output the silicon wafers after cutting; at the same time, a material unloading transport device 700 is provided between the unloading position c and the unloading conveying device 600 to transfer the silicon wafers after cutting from the unloading position c to the unloading conveying device 600.

[0073] Specifically, the unloading and handling device 700 includes a second robotic arm 710 and a unloading suction cup module 720 arranged on the second robotic arm 710; wherein the second robotic arm 710 is a rotating robotic arm or a transverse robotic arm, so as to drive the unloading suction cup module 720 to move back and forth between the unloading position c and the unloading conveying device 600; the unloading suction cup module 720 includes at least two second suction cups, and at least one second suction cup is connected to a driving device, so as to control the corresponding second suction cup through the driving device to expand or reduce the distance between it and other second suction cups, thereby separating the two silicon wafers after cutting.

[0074] Preferably, the unloading conveying device 600 and the loading conveying device 500 are arranged on the same side of the interactive processing module 100, and the unloading conveying device 600 and the loading conveying device 500 are both configured as belt conveyors with the same conveying direction, so as to save space for the photovoltaic non-destructive cutting equipment.

[0075] Preferably, a drying device 800 is further provided above the unloading conveying device 600. Figure 5 As shown in , it specifically includes a wind heating component 810, and a plurality of the wind heating components 810 are arranged at intervals along the unloading conveying direction of the unloading conveying device 600, so as to blow hot air to dry the silicon wafers during the unloading conveying process through the wind heating components 810.

[0076] Further preferably, the drying device 800 also includes a wind knife assembly 820, which is arranged corresponding to the wind heating assembly 810 near the rear end of the drying device 800, and is inclined toward the silicon wafer cutting position on both sides of the wind heating assembly 810 along the material unloading conveying direction to quickly blow away large water droplets at the silicon wafer cutting position, so that when the wind heating assembly 810 cannot quickly clean the water droplets on the silicon wafer, the wind knife assembly 820 can quickly clean the residual water on the silicon wafer in a short time.

[0077] At the same time, an adsorption conveying device 610 is also provided on the unloading conveying device 600 corresponding to the drying device 800 to adsorb and convey the cut materials conveyed to the bottom of the drying device 800 to avoid unnecessary displacement of the cut materials due to hot air or air knife.

[0078] Furthermore, a detection device for detecting the cutting quality of silicon wafers is also provided on the unloading conveying device 600, specifically including a contour line detection module 910, a hidden crack detection module 920 and an NG elimination mechanism 930 which are sequentially arranged along the unloading direction of the unloading conveying device 600. Among them, the contour line detection module 910 and the hidden crack detection module 920 are respectively arranged on both sides of the drying device 800 along the unloading direction. The contour line detection module 910 and the hidden crack detection module 920 in the preferred embodiment are cameras, so as to respectively perform contour line detection on the silicon wafer to observe the cutting smoothness of the cutting surface and detect whether the silicon wafer has hidden cracks; the NG elimination mechanism 930 is arranged at the tail end of the unloading conveying device 600, preferably a first mechanical arm 931 with a first suction cup 932, so as to drive the first suction cup 932 to reciprocate between the unloading conveying device 600 and the NG position, and transfer the NG wafers detected by the contour line detection module 910 and the hidden crack detection module 920 to the NG position.

[0079] Preferably, the first robotic arm 931 is a transverse robotic arm, and the first suction cup 932 is arranged at the driving end of the transverse robotic arm.

[0080] Preferably, a reversing mechanism 940 is also provided on the unloading conveying device 600, which includes a lifting module, a rotating module provided on the lifting module, and a reversing suction cup module 941 provided on the rotating module, so as to absorb and rotate the silicon wafers transmitted on the unloading conveying device 600 to complete the reversal of the silicon wafers. Figure 1 The reversing mechanism 940 in the preferred embodiment shown is disposed between the drying device 800 and the hidden crack detection module 920 .

[0081] During actual production, the lifting module may adopt a lifting cylinder, and the rotating module may be a rotating motor.

[0082] Furthermore, the operation process of the photovoltaic non-destructive cutting device in the utility model is as follows:

[0083] (1) The silicon wafer to be cut enters the photovoltaic non-destructive cutting equipment via the loading belt, and is transferred to the correction platform structure 310 via the loading suction cup assembly 422 on the loading and handling device 400. After being photographed and positioned by the visual positioning structure 320, the correction platform structure 310 corrects the position of the silicon wafer according to the positioning data, and then transfers the corrected silicon wafer to the movable carrier 110 via the unloading suction cup assembly 421.

[0084] (2) The movable support platform 110 carries the silicon wafer and moves it from the loading position a to the cutting position b. The laser cutting device 200 performs laser cutting on the silicon wafer. The movable support platform 110 carries the cut silicon wafer and moves it from the cutting position b to the unloading position c. The unloading and handling device 700 transfers the silicon wafer from the unloading position to the unloading and conveying device 600.

[0085] (3) The silicon wafers are moved in the downward direction through the unloading conveying device 600, and sequentially pass through the contour line detection module 910, the drying device 800, the reversing mechanism 940 and the hidden crack detection module 920. The qualified silicon wafers are detected and enter the subsequent process. The NG products are transferred to the NG position through the NG exclusion mechanism 930, completing the non-destructive cutting process of the silicon wafers.

[0086] The photovoltaic lossless cutting equipment in the utility model has a simple structure and a reasonable layout design between the devices. It can realize accurate positioning, detection and drying of the material to be cut, effectively improves the quality of the product after cutting by the equipment, and has good application prospects and promotion value.

[0087] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A photovoltaic non-destructive cutting device, characterized in that: It includes a loading conveying device, a loading handling device, an interactive processing module, a laser cutting device, a unloading conveying device, an unloading handling device and a positioning and correcting device; The positioning and deviation correction device is arranged between the loading and conveying device and the interactive processing module, and the loading and conveying device can sequentially convey the material to be cut from the loading and conveying device to the positioning and deviation correction device and the interactive processing module; The positioning and deviation correction device comprises a deviation correction platform structure and a visual positioning structure; after the visual positioning structure positions the material to be cut placed on the deviation correction platform structure, the deviation correction platform structure corrects the position of the material to be cut; The laser cutting device is located above the interactive processing module and is used for laser cutting the material to be cut; The material unloading and transporting device transports the cut material after laser cutting from the interactive processing module to the material unloading and transporting device.

2. The photovoltaic non-destructive cutting equipment according to claim 1, characterized in that: The loading and handling device comprises a transverse movement module and a deviation correction suction cup module arranged on the transverse movement module; The transverse shift module can reciprocate along a conveying direction perpendicular to the loading conveying device; The correcting suction cup module is used to absorb the material to be cut, and includes a loading suction cup assembly and a unloading suction cup assembly that are arranged at intervals; the loading suction cup assembly can reciprocate between the loading conveying device and the positioning correcting device under the drive of the transverse movement module; the unloading suction cup assembly can reciprocate between the positioning correcting device and the interactive processing module under the drive of the transverse movement module.

3. The photovoltaic non-destructive cutting equipment according to claim 2, characterized in that: The feeding suction cup assembly includes a feeding suction cup, which is in a cross shape; a light source is obliquely arranged above the cross angle area of ​​the feeding suction cup to illuminate the mark point of the material to be cut and avoid reflection of the material to be cut; and / or, The deviation correction platform structure is an XYθ motion platform.

4. The photovoltaic non-destructive cutting device according to any one of claims 1 to 3, characterized in that: A drying device is also provided above the unloading conveying device. The drying device comprises a wind-heating component and an air knife component; a plurality of the wind-heating components are arranged at intervals along the material feeding direction to blow hot air to dry the cut materials during the material feeding process; the air knife component is arranged corresponding to the wind-heating component near the tail end of the drying device, and is arranged on both sides of the wind-heating component along the material feeding direction in an inclined manner toward the cutting position of the cut materials; An adsorption conveying device is provided on the material unloading conveying device corresponding to the drying device to adsorb and convey the cut materials conveyed to the bottom of the drying device to avoid displacement of the cut materials.

5. The photovoltaic non-destructive cutting equipment according to claim 4, characterized in that: The unloading conveying device is also provided with a contour line detection module, a hidden crack detection module and an NG exclusion mechanism; the contour line detection module and the hidden crack detection module are respectively arranged on both sides of the drying device along the unloading direction; the NG exclusion mechanism is arranged at the tail end of the unloading conveying device, and comprises a first mechanical arm and a first suction cup arranged on the first mechanical arm, and the first suction cup moves back and forth between the unloading conveying device and the NG position under the drive of the first mechanical arm, so as to transfer the NG pieces detected by the contour line detection module and the hidden crack detection module to the NG position; and / or, A reversing mechanism is also provided on the material unloading conveying device, and the reversing mechanism includes a lifting module, a rotating module provided on the lifting module, and a reversing suction cup module provided on the rotating module, so as to absorb and rotate the cut material transmitted on the material unloading conveying device, so as to reverse the cut material; and / or, The loading conveyor device is arranged in parallel and at intervals with the interactive processing module, the unloading conveyor device and the loading conveyor device are arranged on the same side of the interactive processing module, and the unloading conveyor device and the loading conveyor device are both belt conveyors with the same conveying direction.

6. The photovoltaic non-destructive cutting device according to any one of claims 1 to 3 and 5, characterized in that: A loading position, a cutting position and a unloading position are sequentially arranged on the interactive processing module, and the loading position is arranged at one end close to the loading and transporting device; A movable supporting platform is also provided on the interactive processing module. The movable supporting platform is used to carry the material to be cut after positioning and deviation correction, and to reciprocate between the loading position, the cutting position and the unloading position.

7. The photovoltaic non-destructive cutting device according to claim 6, characterized in that: At least one set of first adsorption area and second adsorption area is arranged on the movable carrying platform; The first adsorption area is arranged in the middle of the movable carrier, and includes at least two first adsorption subareas arranged side by side and spaced apart from each other, each first adsorption subarea is provided with a plurality of first adsorption holes spaced apart from each other along the cutting direction, and a groove is formed between two adjacent first adsorption subareas; The second adsorption area is arranged at intervals on both sides of the first adsorption area along the cutting direction, and includes a plurality of second adsorption holes arranged at intervals along the cutting direction.

8. The photovoltaic non-destructive cutting device according to claim 7, characterized in that: A total area of ​​the first adsorption holes in the first adsorption region is smaller than a total area of ​​the second adsorption holes in the second adsorption region.

9. The photovoltaic non-destructive cutting device according to any one of claims 1 to 3, 5, 7 and 8, characterized in that: The material unloading and handling device includes a second robotic arm and a material unloading suction cup module arranged on the second robotic arm. The material unloading suction cup module can move back and forth between the interactive processing module and the material unloading and conveying device under the drive of the second robotic arm.

10. The photovoltaic non-destructive cutting device according to claim 9, characterized in that: The unloading suction cup module includes at least two second suction cups, and at least one of the second suction cups is connected to a driving device so that the corresponding second suction cup is driven by the driving device to move relative to other second suction cups to change the distance between the second suction cups and other second suction cups.

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