External wire arrangement device for wafer processing of wire bonder

Abstract

The utility model relates to the technical field of wafer processing, in particular to an external wire arrangement device for wafer processing of a wire bonder, which comprises a mounting plate and a monitoring component, wire arrangement wheels are arranged on two sides of one end of the mounting plate, a frame body is arranged in the middle of one end of the mounting plate, and the monitoring component is arranged at the upper end of the inner side of the frame body. Adjusting grooves are symmetrically formed in one side of the interior of the mounting plate; the monitoring assembly comprises a movable rod, an induction contact piece, an electric guide rod, a connecting wire harness and an electric signal sensor, the outer side of the movable rod is sleeved with the induction contact piece, and the electric guide rod is arranged on the inner side of the adjusting groove in the upper end; the device solves the problems that in the prior art, when an existing device arranges wires, wire harnesses are made to be straight and bent positions in the wire harnesses are processed mostly through rollers, but when the wire harnesses are conveyed, the wire harness states cannot be recognized in time due to the fact that the wire harnesses are broken, and particularly when multiple sets of wire harnesses are conveyed, each set of wire harnesses are inconvenient to monitor independently.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to an external wire management device for chip processing of a wire bonding machine. Background Art

[0002] In electronics, chips are a way of miniaturizing circuits and are often manufactured on the surface of semiconductor wafers. Wire bonding machines generally refer to ultrasonic wire bonding machines, which can be divided into gold wire bonding machines, aluminum wire bonding machines and copper wire bonding machines according to the wire materials. They use the mechanical vibration energy of ultrasonic frequencies to connect the same or different metals. When using crystal wires, wire bonding machines need to ensure the flatness of the wire bundles. Wire management devices are required to pre-process the wire bundles to avoid direct delivery into the wire bonding machine and affecting the machine.

[0003] When organizing wires, most existing devices use rollers to straighten the wire harnesses and process the bends in the wire harnesses. However, if the wire harnesses break during transmission, the wire harness status cannot be identified in time, especially for multiple groups of wire harnesses, as it is not convenient to monitor each group of wire harnesses individually.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and an external wire management device for wire bonding machine chip processing is proposed, in order to achieve a more practical purpose. Utility Model Content

[0005] The utility model aims to provide an external wire management device for wire bonding machine wafer processing to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an external wire management device for wire bonding machine wafer processing, comprising a mounting plate and a monitoring component, wherein both sides of one end of the mounting plate are provided with wire aligning wheels, a frame is provided in the middle of one end of the mounting plate, and a monitoring component is provided at the inner upper end of the frame, and an adjustment groove is symmetrically provided on one side of the inner side of the mounting plate;

[0007] The monitoring assembly includes a movable rod, a sensing contact piece, an electric conductive rod, a connecting wire harness and an electric signal sensor. The outer side of the movable rod is sleeved with a sensing contact piece, and the electric conductive rod is arranged on the inner side of the upper end of the adjusting slot. The electric signal sensor is mounted on one side of the inner side of the frame. The connecting ends of the sensing contact piece, the electric conductive rod and the electric signal sensor are provided with a connecting wire harness, and the guide roller is arranged on the inner side of the lower end of the adjusting slot.

[0008] The monitoring harness is arranged at the bottom of the sensing contact piece and at the upper position of the guide roller;

[0009] The unmonitored harness is disposed at a lower position of the guide roller.

[0010] Furthermore, reserved grooves are provided on both sides of the upper end of the mounting plate, and mounting rods are provided on both sides of the mounting plate and at the mounting position of the whole wire wheel.

[0011] Furthermore, a detachable structure is formed between the mounting rod and the plurality of sets of the whole-line wheels.

[0012] Furthermore, the wire straightening wheel comprises a wire straightening groove and an embedded protrusion, the wire straightening groove is provided inside the wire straightening wheel, and the embedded protrusion is provided on the outside of the wire straightening wheel.

[0013] Furthermore, the line-forming wheel is connected to another group of line-forming wheels by means of an embedded protrusion.

[0014] Furthermore, the movable rod and the sensing contact piece are connected by a movable shaft.

[0015] Furthermore, the sensing touch piece is arranged in an arc shape.

[0016] The utility model provides an external wire management device for wire bonding machine wafer processing, which has the following beneficial effects:

[0017] 1. In the utility model, a monitoring assembly is arranged on the inner side of the whole wire wheel at both ends. The monitoring assembly cooperates with the guide roller to separate a single group of monitoring wire harnesses from the bottom of the guide roller, so that the monitoring wire harnesses come into contact with the sensing contact piece. The characteristic that the monitoring wire harnesses will squeeze the sensing contact piece during transmission is utilized to make the sensing contact piece rotate and come into contact with the conductive rod to form a loop. When the monitoring wire harnesses are broken, the sensing contact piece is separated from the conductive rod, and the electrical signal sensor receives the electrical signal, thereby judging that the monitoring wire harnesses are broken.

[0018] 2. According to the utility model, each group of unmonitored wiring harnesses can select the next stage of monitored wiring harnesses from the unmonitored wiring harnesses in turn, install the monitoring components and guide rollers of the next group, and monitor the next stage of monitored wiring harnesses. In this way, the wiring management device can monitor each group of wiring harnesses individually while meeting the basic function of wiring management, which is convenient for timely troubleshooting and reducing maintenance time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only used to illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention. In the drawings:

[0020] Figure 1 It is a three-dimensional right-side structural schematic diagram of an external wire management device for wire bonding machine wafer processing according to the utility model;

[0021] Figure 2This is a three-dimensional structural diagram of a monitoring component of an external wire management device for wire bonding machine wafer processing according to the utility model;

[0022] Figure 3 This is a schematic diagram of the three-dimensional structure of the entire wire wheel of an external wire management device for wafer processing of a wire bonding machine according to the utility model;

[0023] Figure 4 The utility model is a three-dimensional left-side structural schematic diagram of an external wire management device for wire bonding machine wafer processing.

[0024] In the figure: 1. Mounting plate; 101. Reserved slot; 102. Mounting rod; 2. Frame; 3. Monitoring harness; 4. Unmonitored harness; 5. Wire-straightening wheel; 501. Wire-straightening slot; 502. Embedded protrusion; 6. Monitoring assembly; 601. Movable rod; 602. Inductive contact piece; 603. Conductive rod; 604. Connecting harness; 605. Electrical signal sensor; 7. Guide roller; 8. Adjustment slot. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-4 The utility model provides a technical solution: an external wire management device for wire bonding machine wafer processing, comprising a mounting plate 1 and a monitoring component 6, a wire aligning wheel 5 is arranged on both sides of one end of the mounting plate 1, a frame 2 is arranged in the middle of one end of the mounting plate 1, and a monitoring component 6 is arranged on the inner upper end of the frame 2, and an adjustment groove 8 is symmetrically opened on one side of the inner side of the mounting plate 1;

[0027] The monitoring assembly 6 includes a movable rod 601, a sensing contact piece 602, an electric conduction rod 603, a connecting wire harness 604 and an electric signal sensor 605. The outer side of the movable rod 601 is sleeved with a sensing contact piece 602, and the electric conduction rod 603 is arranged on the inner side of the upper end adjustment slot 8. The electric signal sensor 605 is mounted on one side of the inner side of the frame 2. The connecting end of the sensing contact piece 602, the electric conduction rod 603 and the electric signal sensor 605 is provided with a connecting wire harness 604, and the guide roller 7 is arranged on the inner side of the lower end adjustment slot 8.

[0028] The monitoring harness 3 is arranged at the bottom of the sensing contact piece 602 and at the upper position of the guide roller 7;

[0029] The unmonitored wire harness 4 is arranged at the lower position of the guide roller 7; reserved grooves 101 are provided on both sides of the upper end of the mounting plate 1, and mounting rods 102 are provided on both sides of the mounting plate 1 and at the mounting position of the line-straightening wheel 5; a detachable structure is formed between the mounting rods 102 and the plurality of sets of line-straightening wheels 5; the line-straightening wheel 5 comprises a line-straightening groove 501 and an embedded protrusion 502, the line-straightening wheel 5 is provided with a line-straightening groove 501 inside, and an embedded protrusion 502 is provided on the outer side of the line-straightening wheel 5; the line-straightening wheel 5 is connected with another set of line-straightening wheels 5 by the embedded protrusion 502; the movable shaft rod is connected between the movable rod 601 and the induction contact piece 602; the induction contact piece 602 is arranged in an arc shape;

[0030] The common wire-straightening wheel 5 is used in the wire-straightening device as the main structure for guiding the transmission of the wire harness. The wire-straightening groove 501 and the traction during transmission are used to pull and shape the wire harness during transmission. In addition, multiple sets of wire-straightening wheels 5 are installed in a mutually interlocking manner, and multiple sets of wire-straightening wheels 5 can be combined, which has strong adaptability and can meet the requirements of synchronous wire-straightening of multiple sets of wire harnesses.

[0031] A monitoring assembly 6 is provided on the inner side of the line-forming wheels 5 at both ends. The monitoring assembly 6 cooperates with the guide roller 7 to separate the single group of monitoring harness 3 from the bottom of the guide roller 7, so that the monitoring harness 3 contacts the sensing contact piece 602. The sensing contact piece 602 is rotated by utilizing the characteristic that the monitoring harness 3 squeezes the sensing contact piece 602 during transmission, and contacts the conductive rod 603 to form a loop. When the monitoring harness 3 is broken, the sensing contact piece 602 is separated from the conductive rod 603, and the electrical signal sensor 605 receives an electrical signal, thereby judging that the monitoring harness 3 is broken.

[0032] Furthermore, each group of unmonitored harnesses 4 can select the next stage of monitored harnesses 3 from the unmonitored harnesses 4 in turn, install the next group of monitoring components 6 and guide rollers 7, and monitor the next stage of monitored harnesses 3, so that the wiring arrangement device can monitor each group of harnesses separately while meeting the basic function of wiring arrangement, so as to facilitate timely troubleshooting and reduce maintenance time;

[0033] In addition, the entire conductive rod 603 and the guide roller 7 can be easily adjusted in longitudinal position using the adjustment slot 8 according to the traction force during wire harness transmission and the transmission speed, so as to better meet processing requirements.

[0034] Working principle: For this type of external wire management device for wire bonding machine chip processing, first rotate the number of wire wheels 5 according to the number of wire harnesses to be organized, and install multiple groups of wire wheels 5 together. When the number of wire harnesses to be organized is five groups, five groups of wire wheels 5 are required, and six columns are required to be arranged in parallel, and monitoring components 6 and guide rollers 7 are set between each column. Then, the wire harness is installed in the wire groove 501 of the wire wheel 5, and in the monitoring component 6 of each column, the monitoring wire harness 3 is selected from the wire harness, and the monitoring wire harness 3 is attached to the bottom of the sensing contact piece 602, so that the sensing contact piece 602 rotates and contacts with the conductive rod 603 to form a loop. The remaining unmonitored wire harnesses 4 are set at The lower part of the guide roller 7 is pulled by the guide roller 7 to the next stage for continuous line straightening operation. When it moves to the downward stage, the monitoring harness 3 of the previous stage is reset to the lower part of the guide roller 7, and continues to select a group from the unmonitored harness 4 and guide it to the bottom of the sensing contact piece 602 in this stage. Repeat the above operation until each group of harnesses becomes a monitoring harness 3. When one group of monitoring harnesses 3 is broken, the monitoring harness 3 of this group will be unable to squeeze the sensing contact piece 602 of this group, so that the sensing contact piece 602 is separated from the conductive rod 603, and the electrical signal sensor 605 will receive an electrical signal, thereby judging that the monitoring harness 3 is broken, so as to facilitate timely maintenance.

[0035] The above description is only a specific implementation method of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be thought of by any technician familiar with the field within the technical scope disclosed by the utility model without creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. An external wire management device for wire bonding machine wafer processing, comprising a mounting plate (1) and a monitoring component (6), characterized in that: Line-aligning wheels (5) are arranged on both sides of one end of the mounting plate (1), a frame (2) is arranged in the middle of one end of the mounting plate (1), and a monitoring component (6) is arranged at the inner upper end of the frame (2), and an adjustment groove (8) is symmetrically opened on one side of the interior of the mounting plate (1); The monitoring assembly (6) comprises a movable rod (601), a sensing contact piece (602), an electric conductive rod (603), a connecting wire harness (604) and an electric signal sensor (605); the outer side of the movable rod (601) is sleeved with a sensing contact piece (602), and the electric conductive rod (603) is arranged on the inner side of the upper end adjustment slot (8); the electric signal sensor (605) is mounted on one side of the inner side of the frame (2); the connecting end of the sensing contact piece (602), the electric conductive rod (603) and the electric signal sensor (605) is provided with a connecting wire harness (604); and the guide roller (7) is arranged on the inner side of the lower end adjustment slot (8); The monitoring harness (3) is arranged at the bottom of the sensing contact piece (602) and at the upper position of the guide roller (7); The unmonitored wire harness (4) is arranged at a lower position of the guide roller (7).

2. The external wire management device for wire bonding machine wafer processing according to claim 1, characterized in that: Reserved grooves (101) are provided on both sides of the upper end of the mounting plate (1), and mounting rods (102) are provided on both sides of the mounting plate (1) and at the mounting position of the line-forming wheel (5).

3. The external wire management device for wire bonding machine wafer processing according to claim 2, characterized in that: The installation rod (102) and the plurality of sets of line-forming wheels (5) form a detachable structure.

4. The external wire management device for wire bonding machine wafer processing according to claim 1, characterized in that: The wire straightening wheel (5) comprises a wire straightening groove (501) and an embedded protrusion (502); the wire straightening groove (501) is provided inside the wire straightening wheel (5), and the embedded protrusion (502) is provided on the outside of the wire straightening wheel (5).

5. The external wire management device for wire bonding machine wafer processing according to claim 4, characterized in that: The line-forming wheel (5) is connected to another group of line-forming wheels (5) by means of an embedded protrusion (502).

6. The external wire management device for wire bonding machine wafer processing according to claim 1, characterized in that: The movable rod (601) and the sensing contact piece (602) are connected by a movable shaft.

7. The external wire management device for wire bonding machine wafer processing according to claim 1, characterized in that: The sensing contact piece (602) is arranged in an arc shape.

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