Evaporation source and evaporation device
By designing the evaporation source and evaporation device with the nozzle facing the substrate, the support area and flip risk problems during evaporation of large-sized substrates are solved, stable downward evaporation and convenient maintenance are achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202420868883.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-24
AI Technical Summary
In the existing vacuum evaporation coating technology, as the substrate size increases, more support areas are required when the evaporated material forms from bottom to top, resulting in a decrease in effective area, and the substrate flip operation increases production risks and investment.
Design an evaporation source and evaporation device, with the nozzle facing the substrate, the evaporation uniform chamber is located above, the nozzle sprays the coating material downward from the material heating vaporization chamber through the steam conduit to achieve downward condensation into a film, and the material heating chamber can be independently disassembled. , easy to replace and maintain.
The film formation of stable downward evaporated materials is achieved, reducing the risk of substrate flip and production line investment, and improving production efficiency and equipment maintenance convenience.
Smart Images
Figure CN222139239U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vacuum evaporation coating, in particular to an evaporation source and an evaporation coating device. Background Art
[0002] Vacuum evaporation coating technology is a common physical vapor phase film forming technology, which refers to the film forming technology that uses an evaporator to heat the evaporated material under vacuum conditions, causing it to sublime and fly directly to the substrate, and then deposit on the substrate to form a solid film. It is often used in the preparation of display devices, perovskite photovoltaic cells and CdTe cadmium telluride photovoltaic cells.
[0003] Existing vacuum evaporation devices generally evaporate the molecules of the evaporation material from bottom to top to form a film, that is, the evaporation source is at the bottom and the substrate is at the top (with the coating facing downward). In pursuit of higher production efficiency, the size of the substrate is getting larger and larger, so there are some disadvantages in evaporation from bottom to top. For example, since the coating faces downward, when the substrate size becomes larger, more support area is required to reduce substrate deformation, thereby reducing the effective area of the product. In addition, for conventional perovskite photovoltaic cells, the upstream and downstream connection processes of the evaporation process generally have the coating surface of the substrate facing upward. In this way, when reaching the evaporation process, the substrate needs to be flipped 180° to meet the coating surface facing downward during evaporation. This not only increases the investment in the production line, but also increases the risk of flipping debris during the production process.
[0004] Therefore, there is an urgent need to develop a downward evaporation source and an evaporation device to meet the production needs of evaporation on large-size substrates.
[0005] The disclosure of the above background technology content is only used to assist in understanding the concept and technical solution of the utility model. It does not necessarily belong to the prior art of the present application, nor does it necessarily provide technical guidance. In the absence of clear evidence that the above content has been disclosed before the filing date of the present application, the above background technology should not be used to evaluate the novelty and creativity of the present application. Utility Model Content
[0006] The utility model aims to provide an evaporation source and an evaporation device.
[0007] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:
[0008] An evaporation source includes a material heating vaporization chamber for carrying a coating material;
[0009] An evaporation gas-homogenizing chamber, the evaporation gas-homogenizing chamber comprising a gas-homogenizing dispersion plate and a nozzle;
[0010] A steam conduit, used to connect the material heating vaporization chamber and the evaporation homogenization chamber;
[0011] Wherein, the nozzle faces the substrate to be evaporated, and the evaporation and uniform gas chamber is located above the substrate.
[0012] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, there are multiple material heating and vaporization chambers, and the material heating and vaporization chambers are evenly arranged on a horizontal plane.
[0013] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, heating wires are provided on the periphery of the material heating vaporization chamber, the evaporation and homogenizing chamber and the steam conduit.
[0014] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, the material heating vaporization chamber temperature T1 is less than the steam conduit temperature T2 and is less than the evaporation homogenization chamber temperature T3.
[0015] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, there are multiple nozzles, and they are symmetrically distributed at certain intervals.
[0016] Further, based on any one of the above-mentioned technical solutions or a combination of multiple technical solutions, the nozzle is arranged on the bottom wall of the evaporation and uniform gas chamber, and is connected with the cavity of the evaporation and uniform gas chamber;
[0017] The plurality of nozzles form an opening area, and the opening rate of the opening area is 20%-40%.
[0018] Furthermore, any one of the above-mentioned technical solutions or a combination of multiple technical solutions further comprises an outer shell, wherein the outer shell is located outside the evaporator, and the inner wall of the outer shell has a mirror reflection function for thermal radiation.
[0019] According to another aspect of the present invention, the present invention provides an evaporation device, including a chamber and an evaporation source disposed in the chamber, wherein the evaporation source is the above-mentioned evaporation source.
[0020] Further, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, a monitor is provided on one side of the evaporation source, and the monitor is used to monitor the film thickness of the film formed on the substrate.
[0021] Furthermore, based on any one of the technical solutions or a combination of multiple technical solutions mentioned above, the evaporation device also includes a roller device for driving the substrate to move.
[0022] The beneficial effects brought by the technical solution provided by the utility model are as follows:
[0023] a. The utility model sprays downwards through a nozzle and finally condenses to form a film on the upper surface of the substrate. This realizes the requirement of stably evaporating the material downwards to form a film without turning the substrate, thus reducing the risk of fragmentation;
[0024] b. The material heating chamber of the utility model can be disassembled independently from the top, which is convenient for replacing materials and makes the production line maintenance more efficient and convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0026] Figure 1 A schematic diagram of an evaporation source provided for an exemplary embodiment of the utility model;
[0027] Figure 2 A schematic diagram of an evaporation device provided for an exemplary embodiment of the present invention.
[0028] Figure markings: 0-evaporation device; 1-chamber; 2-evaporation material; 3-monitor; 4-substrate; 5-roller device; 200-material heating vaporization chamber; 201-coating material; 22-evaporation uniform gas chamber; 23-steam duct; 221-uniform gas dispersion plate; 222-nozzle; 24-heating wire; 21-first material heating vaporization chamber; 31-second material heating vaporization chamber; 210-first coating material; 310-second coating material; 20-outer shell. DETAILED DESCRIPTION
[0029] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0030] It should be noted that the terms "first", "second", etc. in the specification and drawings of the utility model are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, device, product or equipment that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.
[0031] In one embodiment of the present invention, an evaporation source is provided, such as Figure 1 As shown, it includes a material heating vaporization chamber 200 for carrying a coating material 201; an evaporation uniform gas chamber 22, wherein the evaporation uniform gas chamber 22 includes a uniform gas dispersion plate 221 and a nozzle 222, and a steam duct 23 for connecting the material heating vaporization chamber 200 and the evaporation uniform gas chamber 22; wherein the nozzle 222 faces the substrate to be evaporated, and the evaporation uniform gas chamber 22 is located above the substrate 4.
[0032] The coating material 201 is heated into molecular vapor in the material heating vaporization chamber 200, and then transported to the evaporation uniform gas chamber 22 by the steam conduit 23 due to the pressure difference. After being evenly dispersed in the evaporation uniform gas chamber 22, it is sprayed downward onto the substrate 4 through the nozzle 222, thereby achieving the effect of downward evaporation. The evaporation source sprays downward through the nozzle and finally condenses into a film on the upper surface of the substrate. The requirement of stably evaporating the material downward to form a film is achieved.
[0033] It should be noted that the evaporation source for downward evaporation provided by the utility model is designed with a material heating vaporization chamber 200, in which the material is loaded, which can be cylindrical or rectangular in shape, and its upper end is connected to the steam duct 23 by a flange clamp or a thread, which is easy to disassemble and is conducive to the production of filling materials.
[0034] In one embodiment of the present invention, the material heating and vaporization chamber 200 is one or more. If there are multiple material heating and vaporization chambers, the material heating and vaporization chambers are evenly arranged on a horizontal plane. Figure 2 Shown is a schematic diagram of an embodiment of two material heating vaporization chambers.
[0035] In one embodiment of the present invention, heating wires 24 are provided at the periphery of the first material heating vaporization chamber 21, the second material heating vaporization chamber 31, the evaporation uniform gas chamber 22 and the steam duct 23, and the first coating material 210 and the second coating material 310 are loaded in the first material heating vaporization chamber 21 and the second material heating vaporization chamber 31 respectively.
[0036] In one embodiment of the present invention, the temperature T1 of the material heating vaporization chamber 200 is less than the temperature T2 of the steam conduit 23 and less than the temperature T3 of the evaporation and homogenization chamber 22 .
[0037] It should be noted that the above arrangement of the heating wire 24 can ensure that the material vapor molecules will not solidify and accumulate in these parts. Rate control can be achieved by adjusting the temperature of the crucible heating wire 24 or by closed-loop control of the plating rate. Since the area of the crucible heating wire 24 is small, the system inertia is small and rate control is easy to achieve.
[0038] In an embodiment of the present invention, there are multiple nozzles 222, which are symmetrically distributed at certain intervals.
[0039] In one embodiment of the present utility model, the nozzle 222 is disposed on the bottom wall of the evaporation and uniform gas chamber 22 and is communicated with the chamber of the evaporation and uniform gas chamber 22;
[0040] The plurality of nozzles 222 form an opening area, and the opening rate of the opening area is 20%-40%.
[0041] It should be noted that the size and distribution position of the nozzles for downward spraying need to be set after simulation calculation based on the substrate size and film thickness uniformity, and must follow the principle of left-right symmetrical distribution.
[0042] In one embodiment of the present invention, an outer shell 20 is further included. The outer shell 20 is located outside the evaporation and uniform gas chamber 22. The inner wall surface of the outer shell 20 has a mirror reflection function for thermal radiation.
[0043] In one embodiment of the present invention, an evaporation material 2 is further provided between the outer shell 20 and the evaporation uniform gas chamber 22 .
[0044] In one embodiment of the present invention, a vapor deposition device 0 is provided, such as Figure 2 As shown, the evaporation device 0 includes: a chamber 1 and an evaporation source arranged in the chamber 1, and the evaporation source is the evaporation source mentioned above.
[0045] In one embodiment of the present invention, a monitor 3 is provided on one side of the evaporation source, and the monitor 3 is used to monitor the film thickness of the film formed on the substrate 4 .
[0046] In an embodiment of the present invention, the evaporation device 0 further includes a roller device 5 for driving the substrate 4 to move.
[0047] The evaporation device 0 of the embodiment of the utility model realizes downward evaporation, is convenient for material loading, and is better matched with upstream and downstream equipment of the production line, which is conducive to the construction of the production line.
[0048] The concept of the evaporation source embodiment included in the present evaporation device 0 is the same as the working process of the evaporation source in the above embodiment. The entire content of the above evaporation source embodiment is incorporated into the present evaporation device 0 embodiment by full reference and will not be repeated.
[0049] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0050] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. An evaporation source, characterized in that: include: A material heating vaporization chamber for carrying coating materials; An evaporation gas-homogenizing chamber, the evaporation gas-homogenizing chamber comprising a gas-homogenizing dispersion plate and a nozzle; A steam conduit, used to connect the material heating vaporization chamber and the evaporation homogenization chamber; Wherein, the nozzle faces the substrate to be evaporated, and the evaporation and uniform gas chamber is located above the substrate.
2. The evaporation source according to claim 1, characterized in that: There are multiple material heating and vaporization chambers, and the material heating and vaporization chambers are evenly arranged on a horizontal plane.
3. The evaporation source according to claim 1, characterized in that: Heating wires are arranged on the peripheries of the material heating vaporization chamber, the evaporation and homogenization chamber and the steam conduit.
4. The evaporation source according to claim 1, characterized in that: The temperature of the material heating vaporization chamber is less than the temperature of the steam conduit and less than the temperature of the evaporation homogenization chamber.
5. The evaporation source according to claim 1, characterized in that: There are multiple nozzles, which are symmetrically distributed at certain intervals.
6. The evaporation source according to claim 5, characterized in that: The nozzle is arranged on the bottom wall of the evaporation and uniform gas chamber and is communicated with the chamber of the evaporation and uniform gas chamber; Wherein, a plurality of the nozzles form an opening area, and the opening rate of the opening area is 20%-40%.
7. The evaporation source according to claim 1, characterized in that: It also includes an outer shell, the outer side of the evaporation and homogenization chamber, and the inner wall of the outer shell has a mirror reflection function for thermal radiation.
8. An evaporation device, comprising a chamber and an evaporation source arranged in the chamber, characterized in that: The evaporation source is the evaporation source according to any one of claims 1 to 7.
9. The evaporation device according to claim 8, characterized in that: A monitor is provided on one side of the evaporation source, and the monitor is used to monitor the film thickness of the film formed on the substrate.
10. The evaporation device according to claim 8, characterized in that: It also includes a roller device for driving the substrate to move.