Wafer anti-sticking and calibrating device

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer anti-sticking and calibrating device. Comprising a cavity; the carrying table is arranged in the cavity and used for lifting a wafer, and a pin penetrates through the carrying table and used for bearing the wafer; the calibration mechanism comprises a calibration part and a driving part for driving the calibration part to lift, the driving part is arranged outside the cavity, and the calibration part is arranged inside the cavity to calibrate the wafer; the base edge ring is arranged on the edge of the top face of the carrying table, an annular groove is formed in the surface of the base edge ring, a stripping piece is arranged in the annular groove, and an elastic piece is arranged on the bottom face of the stripping piece. Therefore, the wafer can be calibrated, and the adhesion of the wafer can be prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer anti-sticking and calibration device. Background Art

[0002] Physical vapor deposition technology refers to the technology of using physical methods under vacuum conditions to vaporize the surface of the material source (solid or liquid) into gaseous atoms or molecules, or partially ionize them into ions, and deposit a thin film with certain special functions on the surface of the substrate through a low-pressure gas (or plasma) process. Physical vapor deposition is one of the main surface treatment technologies.

[0003] After the wafer is sent into the reaction chamber, the pins on the stage hold the wafer, but the position of the wafer cannot be calibrated, which will affect the effect of wafer coating. During the wafer coating process, the target atoms fall to the position where the edge of the wafer contacts the stage. The target atoms accumulate for a long time, which will cause the wafer to stick to the stage and make it impossible to remove the wafer.

[0004] The above problems are urgent issues to be solved in this field. Summary of the invention

[0005] In view of the shortcomings of the above-mentioned existing production technology, the applicant provides a wafer anti-sticking and calibration device, so that the wafer can be calibrated and the wafer can be prevented from sticking.

[0006] In order to solve the above technical problems, the utility model provides a solution: a wafer anti-sticking and calibration device, comprising a cavity; a carrier is arranged inside the cavity, used to lift the wafer, and a pin is passed through the carrier, used to receive the wafer;

[0007] The calibration mechanism comprises a calibration part and a driving part for driving the calibration part to rise and fall, the driving part is arranged outside the cavity, and the calibration part is arranged inside the cavity to calibrate the wafer;

[0008] The base edge ring is arranged at the edge of the top surface of the carrier, the surface of the base edge ring is provided with an annular groove, a peeling sheet is arranged inside the annular groove, and an elastic member is arranged between the peeling sheet and the annular groove.

[0009] As a further improvement of the utility model, the driving part includes a driving cylinder, one end of which is fixed to the bottom surface of the cavity, and the other end of which is connected to an annular mounting member, on which a plurality of lifting rods are arranged at intervals, and one end of the lifting rods extends into the cavity and is arranged around the carrier;

[0010] The calibration part comprises a calibration plate arranged on the top of the lifting rod, and a side of the calibration plate close to the carrier is an inclined surface, and the inclined surface can hold up the wafer.

[0011] As a further improvement of the utility model, a motor for driving the lifting rod to rotate is arranged at the bottom of the annular mounting member.

[0012] As a further improvement of the present invention, a sealing member is provided at the cavity where the lifting rod passes through.

[0013] As a further improvement of the utility model, a connected give-way groove is provided on the base edge ring outside the annular groove, an extension block is provided on the outside of the peeling sheet corresponding to the give-way groove, the extension block extends to the outside of the give-way groove, and a placement groove for placing the elastic part is provided in the give-way groove.

[0014] As a further improvement of the present invention, a shielding member is arranged inside the cavity above the carrier, and a groove is arranged at the bottom of the shielding member corresponding to the extension block.

[0015] As a further improvement of the utility model, a fixing block is arranged at the bottom of the cavity, and the pin needle is arranged on the top of the fixing block and penetrates the carrier.

[0016] As a further improvement of the present invention, the inclined surface of the calibration sheet is smoothed.

[0017] Beneficial effects of the utility model:

[0018] The utility model has a reasonable and simple structure and is easy to operate. By setting a calibration mechanism, the wafer that has just entered the cavity can be calibrated to improve the effect of subsequent wafer coating. After the wafer is received by the pin needle, the carrier rises so that the wafer falls on the top surface of the carrier and the edge of the wafer falls on the stripping sheet. After the carrier raises the wafer to the specified position, the coating operation is performed. During the coating process, the carrier will rise a certain distance, and through the action of the elastic member, the stripping sheet will descend in the annular groove, and the wafer will be separated from the stripping sheet, thereby facilitating the subsequent movement of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0021] Figure 3 yes Figure 2 The enlarged schematic diagram of the middle A part;

[0022] Figure 4 It is a schematic diagram of the structure of the utility model with the cavity removed;

[0023] Figure 5 yes Figure 4 Enlarged schematic diagram of part B in the middle.

[0024] Figure numerals: 1. cavity; 2. carrier; 3. wafer; 4. pin; 5. calibration mechanism; 501. drive cylinder; 502. annular mounting member; 503. lifting rod; 504. calibration plate; 505. motor; 6. base edge ring; 7. annular groove; 8. peeling plate; 9. elastic member; 10. give way groove; 11. extension block; 12. shielding member; 13. groove; 14. fixing block. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0026] Reference Figure 2 and Figure 3As shown, it is an embodiment of the utility model, including a cavity 1, the cavity 1 is provided with a film inlet, a carrier 2 is installed inside the cavity 1, a part of the carrier 2 is located inside the cavity 1, this part can realize the function of lifting, and the other part is located outside the cavity 1, this part is a driving component, which can control the internal structure of the carrier 2 to lift, and the position where the carrier 2 is connected to the cavity 1 is sealed. It should be noted that in the prior art, the existing functions of the carrier 2 can all realize the above functions, so the structure does not need to be described in detail. The surface of the carrier 2 is provided with a plurality of through holes, and a pin needle 4 is provided in the through hole. One end of the pin needle 4 is fixed by a fixing block 14. By lifting the carrier 2, it can be controlled whether the top of the pin needle 4 is exposed to the surface of the carrier 2. In the initial state, the pin needle 4 is exposed to the surface of the carrier 2. The calibration mechanism 5 includes a calibration part and a driving part that drives the calibrated part to lift and lower. The driving part is arranged outside the cavity 1, and the calibration part is installed inside the cavity 1. The driving part includes a driving cylinder 501, one end of which is fixedly mounted on the bottom surface outside the cavity 1, and an annular mounting member 502 is mounted on the output end thereof. By setting the annular mounting member 502, the mounting position of the carrier 2 can be effectively avoided. A plurality of lifting rods 503 are installed at intervals on the annular mounting member 502, and the top of the lifting rods 503 is located inside the cavity 1 and is arranged around the carrier 2. The calibration part includes a calibration sheet 504, which is mounted on the top of the lifting rod 503. The side of the calibration sheet 504 close to the carrier 2 is arranged as an inclined surface, and the size of the inclined surface is arranged to be able to support the wafer 3. A base edge ring 6 is fixedly mounted on the edge of the top surface of the carrier 2 by bolts, and an annular groove 7 is arranged on the surface of the base edge ring 6, and a stripping sheet 8 is arranged inside the annular groove 7, so that the edge of the wafer 3 can be placed on the stripping sheet 8, and the stripping sheet 8 is supported by an elastic member 9, and the elastic member 9 is usually a spring.

[0027] In this embodiment, when in use, the wafer 3 enters the interior of the cavity 1 through the wafer inlet, and the wafer 3 is placed on the pin needle 4. At this time, the piston rod of the driving cylinder 501 contracts, driving the annular mounting member 502 to rise as a whole, thereby driving the lifting rod 503 on the annular mounting member 502 to rise, so that the edge of the wafer 3 falls on the inclined surface of the calibration piece 504, and the wafer 3 is lifted as a whole. For example, after the wafer 3 enters the cavity 1, it is offset to the left as a whole. When all the calibration pieces 504 rise, since one side of the calibration piece 504 is an inclined surface, the calibration piece 504 on the left will preferentially contact the left side of the wafer 3 and lift the wafer 3. Since only the left side of the wafer 3 is initially lifted, under the influence of the gravity of the wafer 3 itself, the left side of the wafer 3 will move downward, and then the wafer 3 as a whole will move to the right. At this time, the calibration piece 504 on the right will lift the right side of the wafer 3. Through its own gravity, after a period of time, the wafer 3 will no longer slide and remain in a horizontal position. At this time, the calibration of the wafer 3 is completed. On the contrary, when the wafer 3 is offset to the right as a whole, the calibration piece 504 on the right will first contact the wafer 3, and the wafer 3 will slide and offset to the left as a whole, and the calibration piece 504 on the left will contact the wafer 3, and finally the wafer 3 will remain horizontal, so that the center of the wafer 3 coincides with the center of the stage 2, and the calibration is completed. Therefore, the number of calibration pieces 504 is usually set to at least 4, so that various positions of the wafer 3 can be calibrated. After the calibration is completed, the piston rod of the driving cylinder 502 is extended, and the calibration piece 504 drives the wafer 3 to descend, and the wafer 3 can be placed on the pin needle 4, and finally the calibration of the wafer 3 is completed.

[0028] A communicating clearance groove 10 is provided on the outer side of the annular groove 7 on the base edge ring 6, and an extension block 11 is provided on the outer side of the stripping sheet 8 corresponding to the clearance groove 10. The extension block 11 extends to the outside of the clearance groove 10, and a placement groove is provided in the clearance groove 10, and a spring is installed in the placement groove. A shielding member 12 is also fixedly provided above the carrier 2 inside the cavity 1. The shielding member 12 is circular and has a middle annular aperture larger than the diameter of the wafer 3, so that the target atoms can fall on the surface of the wafer 3, avoiding the target atoms from bombarding the inner wall of the cavity 1. At the same time, a groove 13 is provided at the bottom of the shielding member 12 corresponding to the extension block 11.

[0029] When the wafer 3 is calibrated, the carrier 2 rises. Since the pin needle 4 is inserted into the carrier 2, the wafer 3 on the pin needle 4 can fall onto the carrier 2. The stripping sheet 8 is supported by the spring so that the stripping sheet 8 and the carrier 2 are at the same level, and the edge of the wafer 3 contacts the stripping sheet 8. The carrier 2 continues to rise and moves the wafer 3 to the position of the shielding member 12 for the coating process. In the coating process, in order to prevent the edge of the wafer 3 from sticking to the stripping sheet 8. The carrier 2 will control the wafer 3 to rise, and the extension block 11 will enter the groove 13 and rise to the top surface of the groove 13. Through the limit of the top surface of the groove 13, the stripping sheet 8 will move downward. Since the stripping sheet 8 moves downward and the wafer 3 does not move, the stripping sheet 8 and the wafer 3 can be separated. After separation, the carrier 2 moves downward to the height during the coating process, and the stripping sheet 8 is restored to its initial state through the elastic force of the spring.

[0030] It should be noted that the interval time and the order of the above-mentioned wafer anti-sticking work are not limited, and the specific needs need to be set according to the current process requirements.

[0031] In one embodiment, a motor 505 for driving the lifting rod 503 to rotate is provided at the bottom of the annular mounting member 502. The lifting rod 503 is movable among the cavity 1 and the annular mounting member 502. When the wafer 3 is calibrated and placed on the pin needle 4, the motor 505 drives the lifting rod 503 to rotate, so that the calibration plate 504 rotates to the other side, so that the wafer 3 can fall on the carrier 2, avoiding interference between components.

[0032] In one embodiment, the inclined surface of the calibration sheet 504 is smoothed to reduce the roughness of the inclined surface of the calibration sheet 504 so that the wafer 3 can slide downward more smoothly.

[0033] In one embodiment, in order to ensure the overall sealing of the cavity 1, a seal needs to be provided at the location where the lifting rod 503 penetrates the cavity 1. The seal is usually an oil seal, a shaft spring seal, or the like.

[0034] It should be understood that when the terms “include” and / or “comprise” are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or their combinations.

[0035] If the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0036] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0037] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A wafer anti-sticking and calibration device, characterized in that: It comprises a cavity (1); a carrier (2) is arranged inside the cavity (1) and is used to lift and lower a wafer (3); a pin (4) is passed through the carrier (2) and is used to receive the wafer (3); The calibration mechanism (5) comprises a calibration part and a driving part for driving the calibration part to rise and fall, the driving part being arranged outside the cavity (1), and the calibration part being arranged inside the cavity (1) to calibrate the wafer (3); A base edge ring (6) is arranged at the edge of the top surface of the carrier (2); an annular groove (7) is arranged on the surface of the base edge ring (6); a peeling sheet (8) is arranged inside the annular groove (7); and an elastic member (9) is arranged between the peeling sheet (8) and the annular groove (7).

2. A wafer anti-sticking and calibration device as claimed in claim 1, characterized in that: The driving part comprises a driving cylinder (501), one end of the driving cylinder (501) is fixed to the bottom surface of the cavity (1), and the other end is connected to an annular mounting member (502), a plurality of lifting rods (503) are arranged at intervals on the annular mounting member (502), one end of the lifting rods (503) extends into the cavity (1) and is arranged around the carrier (2); The calibration part comprises a calibration plate (504) arranged on the top of the lifting rod (503); a side surface of the calibration plate (504) close to the carrier (2) is an inclined surface, and the inclined surface can hold up the wafer (3).

3. A wafer anti-sticking and calibration device as claimed in claim 2, characterized in that: A motor (505) for driving the lifting rod (503) to rotate is arranged at the bottom of the annular mounting member (502).

4. A wafer anti-sticking and calibration device as claimed in claim 2, characterized in that: A sealing member is provided at the location where the lifting rod (503) passes through the cavity (1).

5. The wafer anti-sticking and calibration device according to claim 1, characterized in that: A communicating clearance groove (10) is provided on the base edge ring (6) outside the annular groove (7), an extension block (11) is provided on the outside of the peeling sheet (8) corresponding to the clearance groove (10), the extension block (11) extends to the outside of the clearance groove (10), and a placement groove for placing the elastic member (9) is provided inside the clearance groove (10).

6. A wafer anti-sticking and calibration device as claimed in claim 5, characterized in that: A shielding member (12) is provided inside the cavity (1) and above the carrier (2), and a groove (13) is provided at the bottom of the shielding member (12) corresponding to the extension block (11).

7. The wafer anti-sticking and calibration device according to claim 1, characterized in that: A fixing block (14) is arranged at the bottom of the cavity (1), and the pin needle (4) is arranged on the top of the fixing block (14) and penetrates the carrier (2).

8. A wafer anti-sticking and calibration device as claimed in claim 2, characterized in that: The inclined surface of the calibration sheet (504) is smoothed.

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