Water-cutting cold air knife for silicon wafer
By optimizing the design of the air knife structure, including the uniform flow plate and the air knife plate, three-level uniform flow is formed, the existing cold air knife structure poor stability and uneven air output are solved, and the water cutting effect and overall strength of the air knife are significantly improved. , achieve uniform removal of water on the surface of the silicon wafer.
Patent Information
- Application Number
- CN202323417689.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-14
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-14
AI Technical Summary
The existing silicon wafer water-cutting air knives have poor structural stability, are prone to bends, and the air output is uneven, resulting in poor water cutting effect.
A silicon wafer water-cut air knife including air knife cavity, uniform flow plate and air knife plate is designed to form first-level, second-level and third-level uniform flow through uniform air pipe joints and air blow holes, thereby enhancing the air knife's uniform flow. The overall strength is adjusted through the air guide plate, and the sliding installation and reinforcement plate are used to prevent bending.
It improves the uniformity of air discharge of the air knife, prevents the middle of bending, enhances the water cutting effect, and can simultaneously cut off moisture from the upper and lower surfaces of the silicon wafer.
Smart Images
Figure CN222143677U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaic cell wet process equipment, in particular to a water-cooled air knife for cutting silicon wafers. Background Art
[0002] In the process of preparing solar cells, efficient drying of silicon wafers is one of the important processes. There are currently two methods for drying silicon wafers in the industry: one is to set a hot air knife in the drying tank for drying silicon wafers. When the silicon wafers enter the drying tank in sequence and pass through the hot air knife, the hot air blown out by the hot air knife at high speed will quickly dry the silicon wafers; the other is to use a cold air knife to remove water from the silicon wafers before they enter the drying tank to remove most of the moisture on the surface of the silicon wafers in advance, and then dry them in the drying tank or blow dry them with a hot air knife.
[0003] The cold air knife used in the prior art is composed of an air knife tube, an air knife fixing seat, and an air pipe joint. The gas flows through the gas main pipe and branches into the air knife tube, and is blown out from the small holes on the air knife tube. The water cutting effect is improved by rotating the air knife tube to adjust the angle.
[0004] Structurally, the air knife of the above-mentioned prior art has an air inlet located in the middle of the air knife tube and blows directly onto the air knife tube, resulting in poor structural stability and easy bending and deformation, which may interfere with the silicon wafer. In addition, the air outlet is smaller at both ends and larger in the middle, resulting in uneven air outlet and poor water cutting effect. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides a silicon wafer cutting water-cooled air knife, which optimizes the air knife structure to facilitate later debugging, thereby solving the problems of uneven air output, deformation and bending of the air knife, and poor water cutting effect of the prior art cold air knife.
[0006] Through the above technical scheme, the utility model provides a water-cooled air knife for silicon wafer cutting, comprising an air knife cavity, a flow equalizer plate arranged on one side of the air outlet of the air knife cavity, and an air knife plate arranged on one side of the air outlet of the flow equalizer plate;
[0007] At least two air pipe joints are evenly arranged on the air inlet side of the air knife cavity, so that the air in the air knife cavity can evenly enter the flow plate and form a primary flow;
[0008] The outlet side of the flow equalizer plate is provided with a plurality of flow equalizer ports at equal intervals, so that the wind from the flow equalizer plate can enter the wind blade plate evenly and form a secondary flow;
[0009] The air outlet side of the wind blade plate is provided with a plurality of blowing holes at equal intervals to achieve uniform blowing of the wind from the wind blade plate and form a three-level uniform flow.
[0010] Furthermore, it also includes a wind knife reinforcement plate to further improve the overall strength of the wind knife, thereby more effectively preventing the wind knife from bending in the middle and interfering with the silicon wafer. The wind knife reinforcement plate is fitted on the outside of the wind knife cavity and is provided with an avoidance hole corresponding to the air pipe joint.
[0011] Wherein, the wind knife reinforcement plate is slidably installed with the wind knife cavity to achieve quick disassembly and assembly.
[0012] Furthermore, mutually symmetrical mounting protrusions are provided at both ends of the wind knife cavity, and adjustment holes are provided on the mounting protrusions to cooperate with the bolts for lifting and lowering installation on the equipment. The wind knife water cutting effect can be adjusted by adjusting the bolt height, and the bolt adjustment is convenient for on-site debugging, measurement and later maintenance and replacement.
[0013] Furthermore, it also includes an air guide plate, which is installed on the air outlet side of the wind knife plate to adjust the direction of the wind evenly blown out by the silicon wafer cutting water-cooling air knife through the blowing hole.
[0014] Through the above technical scheme, the silicon wafer cutting water-cooled air knife provided by the utility model, whose air knife cavity, flow equalizer plate and air knife plate are assembled as one, the gas flows into the air knife cavity through the evenly distributed air pipe joint and enters the flow equalizer plate to realize the first-level flow uniformity; the gas enters the air knife plate through the flow equalizer port evenly arranged on the air outlet side of the flow equalizer plate to realize the second-level flow uniformity, the blowing holes of the air knife plate are evenly distributed, and the gas is evenly exhausted to realize the third-level flow uniformity, thereby greatly improving the uniformity of the air outlet of the air knife, and the three-level flow uniformity structure avoids the disadvantages of large flow velocity at a single air inlet and deformation caused by direct blowing of the air knife plate to prevent the air knife from bending in the middle and interfering with the silicon wafer, and can synchronously remove water on the upper and lower surfaces of the silicon wafer by using the upper and lower air knives at the same time, thereby improving the water cutting effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for describing the embodiments.
[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the cold air knife disclosed in the embodiment of the utility model;
[0017] Figure 2 This is a schematic diagram of the main structure of the cold air knife disclosed in the embodiment of the utility model;
[0018] Figure 3 for Figure 1 Schematic diagram of the enlarged structure of part A in the middle.
[0019] In the figure: 10. air knife cavity; 11. mounting protrusion; 111. adjustment hole; 20. flow equalizer; 30. air knife plate; 40. air pipe joint; 50. air knife reinforcement plate. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0021] Embodiment 1:
[0022] refer to Figure 1-2 A silicon wafer cutting water-cooled air knife provided in this embodiment 1 includes an air knife cavity 10, a flow equalizer plate 20 arranged on one side of the air outlet of the air knife cavity 10, and a wind knife plate 30 arranged on one side of the air outlet of the flow equalizer plate 20; at least two air pipe joints 40 are evenly arranged on the air inlet side of the air knife cavity 10 to achieve uniform entry of the wind of the wind knife cavity 10 into the flow equalizer plate 20 and form a primary uniform flow; a plurality of flow equalizer ports are evenly arranged on the air outlet side of the flow equalizer plate 20 to achieve uniform entry of the wind of the flow equalizer plate 20 into the wind knife plate 30 and form a secondary uniform flow; a plurality of blowing holes are evenly arranged on the air outlet side of the wind knife plate 30 to achieve uniform blowing of the wind of the wind knife plate 30 and form a tertiary uniform flow.
[0023] In this embodiment 1, the wind knife chamber 10, the flow equalizer plate 20 and the wind knife plate 30 are assembled as one, and the gas flows into the wind knife chamber 10 through the evenly distributed air pipe joint 40 and enters the flow equalizer plate 20 to realize the first-level flow uniformity; the gas enters the wind knife plate 30 through the flow equalizer port evenly arranged on the air outlet side of the flow equalizer plate 20 to realize the second-level flow uniformity, and the blowing holes of the wind knife plate 30 are evenly distributed, and the gas is evenly exhausted to realize the third-level flow uniformity, thereby greatly improving the uniformity of the wind knife outlet, and the three-level flow uniformity structure avoids the disadvantages such as the large flow velocity of a single air inlet and the deformation caused by the direct blowing of the wind knife plate 30 to prevent the wind knife from bending in the middle and interfering with the silicon wafer, and can synchronously cut off the water on the upper and lower surfaces of the silicon wafer by using the upper and lower wind knives at the same time, thereby improving the water cutting effect.
[0024] Embodiment 2:
[0025] Based on Example 1, this Example 2 also includes a wind knife reinforcement plate 50 that is slidably installed with the wind knife cavity 10, that is, protrusions are formed on both sides of the upper end of the wind knife cavity 10, and the cross-section of the wind knife reinforcement plate 50 is C-shaped and fits the outer side surface of the protrusion of the wind knife cavity 10, so that the wind knife reinforcement plate 50 is slidably clamped on the upper surface of the wind knife cavity 10 from one end of the wind knife cavity 10 to cooperate with the protrusions on both sides, thereby further improving the overall strength of the wind knife through the setting of the wind knife reinforcement plate 50 and realizing rapid disassembly and assembly through a sliding installation method, thereby more effectively preventing the wind knife from bending in the middle and interfering with the silicon wafer, and the wind knife reinforcement plate 50 is fit-fitted on the outside of the wind knife cavity 10 and is provided with a avoidance hole corresponding to the air pipe joint 40.
[0026] Embodiment 3:
[0027] Based on Example 1 or 2 and with reference to Figure 3In this embodiment 3, symmetrical mounting protrusions 11 are provided at both ends of the wind knife cavity 10, and adjustment holes 111 are provided on the mounting protrusions 11 to cooperate with the bolts to be adjusted in height and installed on the equipment. The wind knife water cutting effect can be adjusted by adjusting the bolt height, and the bolt adjustment is convenient for on-site debugging, measurement, and later maintenance and replacement.
[0028] Embodiment 4:
[0029] Based on embodiments 1-3, this embodiment 4 also includes an air guide plate (not shown in the figure), and rotating shafts are provided at both ends of the air guide plate. Bearing seats corresponding to the rotating shafts are provided at both ends of the wind blade plate 30. The air guide plate is installed on the air outlet side of the wind blade plate 30 through the rotating shaft and the bearing seat, and a rotating motor connected to the rotating shaft is provided at one end of the corresponding air guide plate. During specific operation, the air guide plate is driven to rotate to a specified angle by the rotating motor, thereby adjusting the direction of the wind evenly blown out through the blowing hole of the silicon wafer cutting water-cooling air knife.
[0030] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to the above embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A water-cooled air knife for silicon wafer cutting, characterized in that: It comprises a wind knife cavity (10), a flow equalizer (20) arranged on one side of the wind knife cavity (10) at an air outlet, and a wind knife plate (30) arranged on one side of the wind knife cavity (10) at an air outlet; At least two air pipe joints (40) are evenly arranged on the air inlet side of the air knife cavity (10) to enable the air in the air knife cavity (10) to evenly enter the flow plate (20) and form a primary flow; The air outlet side of the flow equalizer plate (20) is provided with a plurality of flow equalizer ports at equal intervals, so as to enable the wind from the flow equalizer plate (20) to evenly enter the wind blade plate (30) and form a secondary flow equalizer; The air outlet side of the wind blade plate (30) is provided with a plurality of blowing holes at equal intervals, so as to achieve uniform blowing of the wind from the wind blade plate (30) and form a three-level uniform flow.
2. The water-cooled air knife for silicon wafer cutting according to claim 1, characterized in that: It also comprises a wind knife reinforcement plate (50), wherein the wind knife reinforcement plate (50) is arranged in close contact with the outside of the wind knife cavity (10) and is provided with a avoidance hole corresponding to the air pipe joint (40).
3. The water-cooled air knife for silicon wafer cutting according to claim 2, characterized in that: The wind knife reinforcement plate (50) is installed in a sliding manner with the wind knife cavity (10) to achieve rapid assembly and disassembly.
4. The water-cooled air knife for silicon wafer cutting according to claim 1, characterized in that: Both ends of the wind knife cavity (10) are provided with mutually symmetrical mounting protrusions (11), and the mounting protrusions (11) are each provided with an adjustment hole (111) to cooperate with an adjustment bolt for mounting on the equipment in a manner that allows for lifting and lowering adjustment.
5. The water-cooled air knife for silicon wafer cutting according to claim 1, characterized in that: It also includes an air guide plate, which is installed on the air outlet side of the wind knife plate (30) to adjust the direction of the air evenly blown out by the silicon wafer cutting water-cooling air knife through the air blowing hole.