Cross-medium temperature measuring device and kitchen cooking electric appliance

Abstract

The embodiment of the utility model provides a cross-medium temperature measuring device and a kitchen cooking electric appliance. The cross-medium temperature measuring device comprises a heat conductor, a temperature sensor and a heat insulator. The temperature sensor is arranged in the heat conductor, the heat conductor is embedded in the mounting cavity defined by the shell of the heat insulator, the heat insulating medium is filled in the accommodating cavity formed in the heat insulator, and the heat insulator wraps the heat conductor, so that the influence of the external environment on the heat conductor is reduced, and the influence of the external environment on the temperature sensor is further reduced; finally, the measurement precision of the cross-medium temperature measuring device provided by the embodiment of the utility model is higher, and the kitchen cooking electric appliance applied to the cross-medium temperature measuring device can measure the temperature of a cooking utensil placed on the kitchen cooking electric appliance more accurately.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of temperature measurement technology, and in particular, to a cross-medium temperature measurement device and a kitchen cooking appliance. Background Art

[0002] Cooking appliances generally need to monitor the temperature of the food or pots they heat in order to match the appropriate heating power and the control methods that affect the characteristics of the food. However, the current temperature measurement method in the field of home appliances is relatively simple. Generally, a temperature sensor is placed on the home appliance to achieve the purpose of monitoring the temperature. Usually, this temperature sensor cannot directly contact the food or pots. This temperature measurement method has major defects in many cases, especially when it is necessary to measure the temperature of another object across one object. It depends largely on the thermal conductivity of the object being crossed, resulting in poor structural stability of traditional temperature measurement devices and being easily affected by the external environment, which will lead to low measurement accuracy. Utility Model Content

[0003] The embodiment of the present application provides a cross-medium temperature measurement device to at least partially improve the above-mentioned problem.

[0004] In a first aspect, an embodiment of the present application provides a cross-medium temperature measurement device, comprising: a heat conductor, a temperature sensor, and a heat insulator. The temperature sensor is disposed in the heat conductor. The heat insulator comprises a shell and a heat insulating medium, the shell encloses a mounting cavity, the heat conductor is embedded in the mounting cavity and abuts against the heat insulator, a housing cavity is formed in the shell, and the heat insulating medium is filled in the housing cavity.

[0005] In one embodiment, the thermal conductivity of the thermal insulation medium is less than 1 W / (m·K).

[0006] In one embodiment, the shell includes an inner shell and an outer shell, the inner shell encloses the installation cavity, the outer shell is hermetically connected to the inner shell and encloses the accommodating cavity, and both the inner shell and the outer shell are elastic shells.

[0007] In one embodiment, the thickness of the outer shell and the inner shell are both greater than 1 mm.

[0008] In one embodiment, the distance between the inner shell and the outer shell is greater than 1 mm.

[0009] In one embodiment, the heat conductor includes a contact portion and a supporting portion, the supporting portion is connected to the contact portion, the cross-sectional area of ​​the contact portion is larger than the cross-sectional area of ​​the supporting portion, the temperature sensor is arranged on the supporting portion, the mounting cavity includes a first mounting cavity and a second mounting cavity that are connected, the contact portion is embedded in the first mounting cavity, and the supporting portion is embedded in the second mounting cavity.

[0010] In one embodiment, the temperature sensor includes a first temperature sensor and a second temperature sensor, and the first temperature sensor and the second temperature sensor are spaced apart from each other.

[0011] In one embodiment, the first temperature sensor and the second temperature sensor are both located on the central axis of the heat conductor and are spaced apart along the central axis of the heat conductor.

[0012] In one embodiment, a connecting hole is formed at one end of the shell, and the cross-medium temperature measuring device further comprises a wire, one end of which is electrically connected to the temperature sensor, and the other end of which is led out from the connecting hole.

[0013] In a second aspect, an embodiment of the present application provides a kitchen cooking appliance, which is provided with the cross-medium temperature measuring device as described above.

[0014] The cross-medium temperature measuring device provided in the embodiment of the present application is provided with a temperature sensor in a heat conductor, and the heat conductor is embedded in an installation cavity surrounded by a shell of an insulator, and an insulating medium is filled in a containing cavity formed inside the insulator. The insulator wraps the heat conductor to reduce the influence of the external environment on the heat conductor, thereby reducing the influence of the external environment on the temperature sensor, and finally making the measurement accuracy of the cross-medium temperature measuring device provided in the embodiment of the present application higher, and at the same time, the kitchen cooking appliance applied with the cross-medium temperature measuring device can more accurately measure the temperature of the cooking utensils placed on the kitchen cooking appliance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A structural block diagram of a kitchen cooking appliance provided by an embodiment of the present application is shown;

[0017] Figure 2 A schematic diagram showing a structure of a cross-medium temperature measuring device provided by an embodiment of the present application installed on an induction cooker;

[0018] Figure 3 A schematic structural diagram of a cross-medium temperature measurement device provided by an embodiment of the present application is shown;

[0019] Figure 4 A schematic structural diagram of a heat conductor, a temperature sensor, and a wire provided in one embodiment of the present application is shown.

[0020] Figure numerals: kitchen cooking appliance 1, cross-medium temperature measuring device 10, heat conductor 110, first surface 111, second surface 112, contact portion 113, support portion 114, temperature sensor 120, first temperature sensor 121, second temperature sensor 122, insulator 130, shell 131, installation cavity 1311, first installation cavity 1311a, second installation cavity 1311b, accommodating cavity 1312, inner shell 1313, outer shell 1314, insulation medium 132, connecting hole 133, wire 140, microcrystalline panel 20, substrate 30. DETAILED DESCRIPTION

[0021] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0022] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0023] Cooking appliances generally need to monitor the temperature of the food or pots they heat in order to match the appropriate heating power and control measures that affect the characteristics of the food. However, the current temperature measurement method in the field of home appliances is relatively simple. Generally, a temperature sensor is placed on the home appliance to achieve the purpose of monitoring the temperature. Usually, this temperature sensor cannot directly contact the food or pots. This temperature measurement method has major defects in many cases, especially when it is necessary to measure the temperature of another object across one object, which largely depends on the thermal conductivity of the object being crossed.

[0024] As a result, traditional temperature measuring devices usually have poor structural stability and are easily affected by the external environment. For example, when cooking appliances are in use, the heat generated by themselves is usually transferred to the temperature measuring device, which causes the temperature measuring device to measure both the heat generated by the cooking appliances themselves and the temperature of the food or pots heated by the cooking appliances. In this way, the above two temperatures are difficult to distinguish together, which results in low measurement accuracy of traditional temperature measuring devices. Based on the above problems, the embodiments of the present application provide a cross-medium temperature measuring device to at least partially improve the above problems.

[0025] See also Figure 1 , Figure 1A structural block diagram of a kitchen cooking appliance 1 provided in an embodiment of the present application is shown. The embodiment of the present application also provides a kitchen cooking appliance 1, which is provided with a cross-medium temperature measuring device 10 as described above. The kitchen cooking appliance 1 includes but is not limited to: an induction cooker, a microwave oven, an air fryer, etc.

[0026] For the sake of convenience, the present application embodiment takes the cross-medium temperature measuring device 10 applied to an induction cooker as an example for explanation. Figure 2-Figure 3 , Figure 2 A schematic structural diagram of a cross-medium temperature measuring device 10 provided in an embodiment of the present application installed on an induction cooker is shown. Figure 3 The schematic diagram of the structure of a cross-medium temperature measuring device 10 provided by an embodiment of the present application is shown. The induction cooker may include a microcrystalline panel 20 and a substrate 30, the microcrystalline panel 20 may hold a pot, and the cross-medium temperature measuring device 10 may be disposed between the microcrystalline panel 20 and the substrate 30, so as to facilitate the fixing of the cross-medium temperature measuring device 10 and facilitate the cross-medium temperature measuring device 10 to conduct the temperature of the microcrystalline panel 20.

[0027] See also Figure 3 In this embodiment, the cross-medium temperature measuring device 10 may include: a heat conductor 110 , a temperature sensor 120 and an insulator 130 .

[0028] The heat conductor 110 has a first surface 111 and a second surface 112 facing each other. The first surface 111 is used to contact a medium that contacts an object to be measured. In this embodiment, the microcrystalline panel 20 is the medium, and the pot is the object to be measured, which is in contact with the microcrystalline panel 20 and the substrate 30.

[0029] The embodiments of the present application do not limit the specific structure and material of the heat conductor 110. For example, in some embodiments, the heat conductor 110 can be made of a material with high thermal conductivity, such as metal, ceramic, graphite, etc. These materials have excellent thermal conductivity, can quickly transfer heat, reduce thermal resistance, and improve heat conduction efficiency. The specific thermal conductive material to be used can be selected according to actual conditions.

[0030] Specifically, metal material is a common heat conductor 110, such as copper, silver, etc., which have good thermal conductivity and high thermal stability. When the contact area between metals is large, the metal bonds between atoms can transfer heat and diffuse the heat rapidly. In addition, metal materials have strong tensile strength and compressive strength and can withstand large thermal stress. However, metal materials also have certain limitations, such as high density, high cost, poor oxidation resistance, etc.

[0031] Ceramic materials are also excellent thermal conductors 110, such as aluminum oxide, silicon nitride, etc. Ceramics have the advantages of high melting point, high hardness, low thermal expansion coefficient, etc., which make them have good stability in high temperature environments. In addition, the gaps between ceramic materials are small, which helps to quickly transfer heat. However, the thermal conductivity of ceramic materials is still slightly lower than that of metal materials, and the impact resistance is poor, and it is easy to break.

[0032] Graphite has excellent thermal conductivity and chemical stability as a heat conductor 110. The carbon atoms in the graphite crystal are arranged in a hexagonal plane layered structure, forming strong π bonds, which allows heat to be quickly transferred between graphite layers. Graphite also has a low thermal expansion coefficient and good oxidation resistance, making it stable in high temperature environments. However, the tensile strength and compressive strength of graphite materials are relatively low.

[0033] In this embodiment, the cross-section of the heat conductor 110 can be a T-shaped structure, and the heat conductor 110 can include a contact portion 113 and a support portion 114. The support portion 114 can be connected to the contact portion 113, and the first surface 111 can be located at the contact portion 113. The cross-sectional area of ​​the contact portion 113 can be greater than the cross-sectional area of ​​the support portion 114. It can be understood that the embodiment of the present application does not limit the specific structure of the support portion 114 and the contact portion 113. For example, the support portion 114 and the contact portion 113 can both be cylindrical structures. For another example, the support portion 114 and the contact portion 113 can both be rectangular structures. For another example, one of the support portion 114 and the contact portion 113 is a rectangular structure and the other is a cylindrical structure, etc.

[0034] The embodiment of the present application is explained by taking the example that both the support portion 114 and the contact portion 113 are cylindrical structures, the cross-sectional area of ​​the contact portion 113 is the diameter of the contact portion 113, and the cross-sectional area of ​​the support portion 114 is the diameter of the support portion 114. The cross-sectional area of ​​the contact portion 113 is larger than the cross-sectional area of ​​the contact portion 113, so that the contact area between the contact portion 113 and the microcrystalline panel 20 can be larger, which can facilitate the microcrystalline panel 20 to transfer heat to the heat conductor 110, so as to increase the speed at which the temperature sensor 120 senses the temperature of the heat conductor 110, thereby improving the temperature measurement efficiency of the cross-medium temperature measuring device 10.

[0035] In one embodiment, the temperature sensor 120 may be disposed in the heat conductor 110 , so that the temperature of the heat conductor 110 may be detected more intuitively and the influence of the external environment on the temperature sensor 120 may be reduced.

[0036] In another embodiment, the temperature sensor 120 may be directly printed on the outer surface of the heat conductor 110 through a printing process, so that the temperature sensor 120 and the heat conductor 110 can be more closely connected.

[0037] It should be noted that the embodiment of the present application does not limit the specific structure and type of the temperature sensor 120. For example, a negative temperature coefficient thermistor (NTC) sensor, an infrared temperature sensor 120 or a thermocouple sensor may be used. The embodiment of the present application preferably uses a negative temperature coefficient thermistor sensor.

[0038] Specifically, it can be a ceramic NTC thermistor, a thin film NTC thermistor, a glass NTC thermistor or a silicon carbide NTC thermistor, among which the ceramic NTC thermistor uses oxide ceramic as the main material, has a higher resistance temperature coefficient and stability, the thin film NTC thermistor uses metal oxide film as the main material, has higher sensitivity and stability, the glass NTC thermistor uses glass as the main material, has higher stability and reliability, and the silicon carbide NTC thermistor has higher sensitivity and stability. The specific temperature sensor 120 to be used can be selected according to actual conditions.

[0039] The insulator 130 can be disposed on the periphery of the heat conductor 110. The insulator 130 can be used to reduce the impact of the external environment on the heat conductor 110, and further can be used to reduce the impact of the external environment on the temperature sensor 120, and finally can improve the accuracy of the temperature measurement of the object to be measured. It should be noted that, in one embodiment, the insulator 130 can be a solid insulator 130, such as rubber, plastic or wood, etc. The molecular structure of these materials is relatively complex, and the interaction between molecules is weak, resulting in poor thermal conductivity.

[0040] In some other embodiments, gas may also be used as an insulator, such as nitrogen, helium, etc. The molecular distance between these gases is large and the thermal conductivity is poor. Specifically, the above-mentioned gas can be filled between the microcrystalline panel 20 and the substrate 30. However, this method has high requirements on the sealing of the induction cooker. The embodiment of the present application preferably sets a solid insulator 130, and the following description will be made using the insulator 130 as a solid material as an example.

[0041] Furthermore, in this embodiment, the thermal insulator 130 may include: a shell 131 and a thermal insulation medium 132. Specifically, the shell 131 may be made of the above-mentioned solid material.

[0042] The shell 131 can enclose an installation cavity 1311, and the heat conductor 110 can be embedded in the installation cavity 1311 and abut against the insulator 130. That is to say, in this embodiment, the shape and size of the installation cavity 1311 can match the shape and size of the heat conductor 110. As mentioned above, the cross-section of the heat conductor 110 is a T-shaped structure. Therefore, in this embodiment, the structure of the installation cavity 1311 can also be a T-shaped cavity, which can facilitate the installation of the heat conductor 110 and the shell 131.

[0043] Specifically, in one embodiment, the installation cavity 1311 may include a first installation cavity 1311a and a second installation cavity 1311b that are connected. The contact portion 113 may be embedded in the first installation cavity 1311a, and the support portion 114 may be embedded in the second installation cavity 1311b. In this embodiment, when the heat conductor 110 is embedded in the installation cavity 1311, the top surface of the second installation cavity 1311b may abut against the bottom surface of the contact portion 113, thereby playing a role in supporting the heat conductor 110.

[0044] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0045] A housing cavity 1312 is formed in the shell 131, and the insulating medium 132 can be filled in the housing cavity 1312. It should be noted that the embodiment of the present application does not limit the specific structure of the housing cavity 1312, for example, it can be a cylinder or a square cylinder, etc., and can be specifically set according to actual conditions. At the same time, the embodiment of the present application does not limit the specific material of the insulating medium 132. In this embodiment, the thermal conductivity of the insulating medium 132 is less than 1W / (m·k), for example, it can be rubber, plastic, wood, etc. The molecular structure of these materials is relatively complex, and the interaction between molecules is weak, resulting in poor thermal conductivity. Furthermore, the thermal conductivity of the insulating medium 132 may be less than 0.12W / (m·k), for example, foamed cement, rock wool or aluminum silicate wool may be used. The thermal conductivity of foamed cement is 0.08W / (m·k)-0.28W / (m·k). Specifically, the embodiment of the present application may use foamed cement with a thermal conductivity of 0.08W / (m·k)-0.12W / (m·k). The thermal conductivity of rock wool is 0.03W / (m·k)-0.047W / (m·k), and the thermal conductivity of aluminum silicate wool is less than 0.07W / (m·k). The use of the above materials can further reduce the impact of the external environment on the heat conductor 110, thereby reducing the impact of the external environment on the temperature sensor 120, which is beneficial to improving the accuracy of the temperature detection of the cross-medium temperature measuring device 10.

[0046] The cross-medium temperature measuring device 10 provided in the embodiment of the present application is configured with a temperature sensor 120 in a heat conductor 110, and the heat conductor 110 is embedded in an installation cavity 1311 surrounded by a shell 131 of an insulator 130, and an insulating medium 132 is filled in a receiving cavity 1312 formed inside the insulator 130. The insulator 130 wraps the heat conductor 110 to reduce the influence of the external environment on the heat conductor 110, thereby reducing the influence of the external environment on the temperature sensor 120. Ultimately, the cross-medium temperature measuring device 10 provided in the embodiment of the present application has a higher measurement accuracy, and the kitchen cooking appliance 1 applied with the cross-medium temperature measuring device 10 can more accurately measure the temperature of cooking utensils placed on the kitchen cooking appliance 1.

[0047] Furthermore, in one embodiment, the shell 131 may include an inner shell 1313 and an outer shell 1314. The inner shell 1313 may form an installation cavity 1311. The outer shell 1314 may be closed and connected to the inner shell 1313 to form a accommodating cavity 1312. The inner shell 1313 and the outer shell 1314 may both be elastic shells 131. To facilitate production and processing, in this embodiment, the inner shell 1313 and the outer shell 1314 may be made of the same material, such as rubber or silicone. These materials have good deformation capabilities and are generally not affected within 200°C, which is beneficial to improving the stability of the shell 131.

[0048] In a more specific embodiment, the heat insulating medium 132 may be made of butyl rubber, and the shell 131 may be made of rubber. The thermal conductivity of butyl rubber is 0.09W / (m·k), so it has a good heat insulating effect. At the same time, butyl rubber is a non-crystalline colloidal substance with good fluidity. Therefore, butyl rubber can be poured into the rubber shell 131, so that the heat insulating medium 132 and the shell 131 can be closely attached to each other, and the formation of a gap between the heat insulating medium 132 and the shell 131 can be avoided, resulting in a reduction in the heat insulating effect. In addition, since rubber has elasticity, during the process of pouring butyl rubber into the rubber shell 131, the rubber can produce a certain elastic deformation, so that the butyl rubber fills the entire rubber shell 131 after the pouring is completed, and the formation of a gap between the heat insulating medium 132 and the shell 131 can also be avoided, resulting in a reduction in the heat insulating effect.

[0049] Furthermore, in this embodiment, the thickness of the outer shell 1314 and the inner shell 1313 are both greater than 1 mm, which can prevent the outer shell 1314 and the inner shell 1313 from being too thin, thereby preventing damage during the filling and perfusion process of the insulating medium 132. At the same time, if the thickness of the outer shell 1314 and the inner shell 1313 is too thin, it may also cause the insulation effect of the insulation body to be poor.

[0050] It can be understood that the embodiment of the present application does not limit the specific thickness and maximum thickness of the outer shell 1314 and the inner shell 1313, and the specific thickness can be selected according to actual conditions. For example, when the cross-medium temperature measuring device 10 is installed in an induction cooker where the distance between the microcrystalline panel 20 and the substrate 30 is large, the thickness of the outer shell 1314 and the inner shell 1313 can be set to be larger so that the two ends of the insulator are in contact with the microcrystalline panel 20 and the substrate 30, ensuring the installation stability of the cross-medium temperature measuring device 10, and further ensuring the stability of the cross-medium temperature measuring device 10 when measuring temperature.

[0051] In one embodiment, the distance between the inner shell 1313 and the outer shell 1314 is greater than 1 mm, so that the space in the thin-surface installation cavity 1311 is too small, thereby avoiding too little insulation medium 132, which makes it difficult for the insulation body 130 to achieve insulation effect, or the insulation effect is poor.

[0052] It can be understood that the embodiment of the present application does not limit the specific spacing between the outer shell 1314 and the inner shell 1313, and the specific spacing can be selected according to actual conditions. In some embodiments, the distance between the outer shell 1314 and the inner shell 1313 can be set to be less than 10 mm, which can avoid the volume of the insulator 130 being too large and is conducive to cost saving.

[0053] Furthermore, in one embodiment, a plurality of temperature sensors 120 may be provided, and the plurality of temperature sensors 120 may be evenly arranged in the heat conductor 110 , which is beneficial to improving the accuracy of the temperature measurement by the cross-medium temperature measuring device 10 .

[0054] See also Figure 4 , Figure 4 A schematic diagram of the structure of a heat conductor, a temperature sensor and a wire provided in an embodiment of the present application is shown. Specifically, for example, in this embodiment, two temperature sensors 120 can be provided, namely a first temperature sensor 121 and a second temperature sensor 122, and the first temperature sensor 121 and the second temperature sensor 122 are provided at intervals. It should be noted that the embodiment of the present application does not limit the specific positions of the first temperature sensor 121 and the second temperature sensor 122. For example, the first temperature sensor 121 can be provided adjacent to the first surface 111, and the second temperature sensor 122 can be provided adjacent to the second surface 112. In this embodiment, two temperature sensors 120 are provided, and the temperature of the object to be measured can be measured by measuring the heat flow.

[0055] Furthermore, in one embodiment, the first temperature sensor 121 and the second temperature sensor 122 can be arranged on the central axis of the heat conductor 110. It can be understood that the closer to the edge of the heat conductor 110, the greater the possibility of being affected by the external temperature. Therefore, the above-mentioned setting of the first temperature sensor 121 and the second temperature sensor 122 can further reduce the influence of the external temperature on the first temperature sensor 121 and the second temperature sensor 122, which is beneficial to improve the measurement accuracy of the first temperature sensor 121 and the second temperature sensor 122.

[0056] In one embodiment, a connecting hole 133 is opened at one end of the shell 131 , and the cross-medium temperature measuring device 10 may further include a wire 140 , one end of which is electrically connected to the temperature sensor 120 , and the other end of which is led out from the connecting hole 133 .

[0057] It should be noted that the embodiment of the present application does not limit the specific position of the connecting hole 133. For example, the connecting hole 133 can be set at an end away from the first surface 111. Since the first surface 111 is in contact with the medium of the object to be measured, if the connecting hole 133 is opened on the first surface 111, it will affect the heat transferred from the medium received by the heat conductor 110. Therefore, the above-mentioned arrangement of the wire 140 can reduce the impact of the external environment on the temperature sensor 120 when the wire 140 is led out, which is beneficial to improve the measurement accuracy of the temperature sensor 120, and further improve the measurement accuracy of the cross-medium temperature measuring device 10.

[0058] It should be noted that in this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] The working principle of the cross-medium temperature measurement device 10 provided in the embodiment of the present application is as follows:

[0060] Since the first surface 111 of the heat conductor 110 is in contact with the medium in contact with the object to be measured, the object to be measured can transfer the temperature to the medium, and the medium can transfer the temperature to the heat conductor 110, and the heat insulator 130 disposed outside the heat conductor 110 can avoid the influence of the ambient temperature. Specifically, the outer shell 1314 of the heat insulator 130 can enclose the installation cavity 1311, and the heat conductor 110 is disposed in the installation cavity 1311. The outer shell 1314 of the heat insulator 130 can play a certain insulation effect. In addition, the interior of the shell 131 also forms a receiving cavity 1312, and the receiving cavity 1312 can also be filled with a heat insulating medium 132, which can further play a heat insulation effect.

[0061] The kitchen cooking appliance 1 provided in the embodiment of the present application, by arranging a temperature sensor 120 in the heat conductor 110, and embedding the heat conductor 110 in an installation cavity 1311 surrounded by a shell 131 of an insulator 130, and filling a heat insulating medium 132 in a accommodating cavity 1312 formed inside the insulator 130, the insulator 130 wraps the heat conductor 110 to reduce the influence of the external environment on the heat conductor 110, thereby reducing the influence of the external environment on the temperature sensor 120, and finally making the measurement accuracy of the cross-medium temperature measuring device 10 provided in the embodiment of the present application higher, and at the same time, the kitchen cooking appliance 1 applied with the cross-medium temperature measuring device 10 can more accurately measure the temperature of the cooking utensils placed on the kitchen cooking appliance 1.

[0062] The above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the present application, and should all be included in the protection scope of the present application.

Claims

1. A cross-medium temperature measuring device, characterized in that: include: Thermal conductor; A temperature sensor, wherein the temperature sensor is disposed on the heat conductor; as well as The thermal insulator comprises a shell and a thermal insulation medium. The shell forms a mounting cavity. The heat conductor is embedded in the mounting cavity and abuts against the thermal insulator. A receiving cavity is formed in the shell. The thermal insulation medium is filled in the receiving cavity.

2. The cross-medium temperature measuring device according to claim 1, characterized in that: The thermal conductivity of the thermal insulation medium is less than 1 W / (m·k).

3. The cross-medium temperature measuring device according to claim 1, characterized in that: The shell comprises an inner shell and an outer shell, the inner shell encloses the installation cavity, the outer shell is hermetically connected to the inner shell and encloses the accommodating cavity, and both the inner shell and the outer shell are elastic shells.

4. The cross-medium temperature measuring device according to claim 3, characterized in that: The thickness of the outer shell and the inner shell are both greater than 1 mm.

5. The cross-medium temperature measuring device according to claim 3, characterized in that: The distance between the inner shell and the outer shell is greater than 1 mm.

6. The cross-medium temperature measuring device according to claim 1, characterized in that: The heat conductor includes a contact portion and a supporting portion, the supporting portion is connected to the contact portion, the cross-sectional area of ​​the contact portion is larger than the cross-sectional area of ​​the supporting portion, the temperature sensor is arranged on the supporting portion, the mounting cavity includes a first mounting cavity and a second mounting cavity that are connected, the contact portion is embedded in the first mounting cavity, and the supporting portion is embedded in the second mounting cavity.

7. The cross-medium temperature measuring device according to claim 1, characterized in that: The temperature sensor includes a first temperature sensor and a second temperature sensor, and the first temperature sensor and the second temperature sensor are arranged at an interval.

8. The cross-medium temperature measuring device according to claim 7, characterized in that: The first temperature sensor and the second temperature sensor are both located on the central axis of the heat conductor and are spaced apart along the central axis of the heat conductor.

9. The cross-medium temperature measuring device according to claim 1, characterized in that: A connecting hole is formed at one end of the shell, and the cross-medium temperature measuring device further comprises a wire, one end of which is electrically connected to the temperature sensor, and the other end of which is led out from the connecting hole.

10. A kitchen cooking appliance, characterized in that: The kitchen cooking appliance is provided with a cross-medium temperature measuring device as described in any one of claims 1-9.

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