Active wheel speed sensor

Abstract

The utility model discloses an active wheel speed sensor, which comprises a shell, a mounting hole is arranged on the shell, an integrated circuit module is arranged in the mounting hole, and the integrated circuit module is formed in the mounting hole in an injection molding manner; the integrated circuit module comprises a block-shaped framework and a chip welded on the framework, a connecting piece is arranged on the block-shaped framework, and the block-shaped framework is integrally formed on the connecting piece in an injection molding mode. According to the utility model, the problems of tedious assembly, high labor intensity, high labor cost, low assembly efficiency and instable and unreliable sealing performance due to the fact that the existing active wheel quick-wound pick-up is completed by assembly and needs to be sealed by a plurality of sealing rings can be solved.

Description

Technical Field

[0001] The utility model relates to the field of wheel speed sensor processing, in particular to an active wheel speed sensor. Background Art

[0002] Today's active wheel speed sensors are mainly manufactured by assembling a packaged chip, a frame, an O-ring, a pressure ring, and a housing to form a finished active wheel speed sensor.

[0003] As for the entire structure, multiple sealing rings are needed to improve the sealing performance. The assembly is troublesome, the labor intensity is high, the labor cost is high, and the sealing is not stable and reliable enough. Utility Model Content

[0004] The purpose of the utility model is to provide an active wheel speed sensor to solve the problems that the existing active wheel speed sensor is completed by assembly and needs to use multiple sealing rings for sealing, and has the problems of complicated assembly, high labor intensity, high labor cost, slow assembly efficiency, and insufficient stable and reliable sealing.

[0005] The technical solution adopted by the utility model to solve its technical problems is: an active wheel speed sensor, including a shell, a placement hole is arranged on the shell, an integrated circuit module is arranged in the placement hole, and the integrated circuit module is injection molded in the placement hole; the integrated circuit module includes a block frame and a chip welded on the frame, a connecting piece is arranged on the block frame, and the block frame is integrally injection molded on the connecting piece.

[0006] In order to form a high sealing effect with the shell, a group of arc-shaped positioning step surfaces are injection-molded between the outer wall of the integrated circuit module and the inner wall of the placement hole.

[0007] In order to prevent short circuit caused by soldering and tinning process, two chip positioning grooves corresponding to two pins on the chip are formed in the integrated circuit module; a set of riveted isolation plates are arranged between the two chip positioning grooves in the integrated circuit module.

[0008] In order to achieve soluble injection molding, a soluble plastic rivet sheet is arranged between the chip and the connecting sheet.

[0009] In order to improve the guiding and isolating effects, the integrated circuit module is provided with guiding blocks at the ends of the two pins of the chip, and the guiding blocks are formed with guiding grooves which correspond one to one with the positioning grooves of the two chips.

[0010] The beneficial effects of the utility model are as follows: by injection molding the integrated circuit module in the placement hole of the shell, there is no need for manual assembly; at the same time, injection molding does not require a sealing ring to achieve a stable and reliable sealing effect; it can solve the problem that the existing active wheel speed creator is completed by assembly, and requires multiple sealing rings for sealing, and has the problems of cumbersome assembly, high labor intensity, high labor cost, slow assembly efficiency, and insufficient and stable sealing.

[0011] The present invention will be described in more detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of the utility model.

[0013] Figure 2 This is a schematic diagram of the structure after the integrated circuit module is injection molded into the shell.

[0014] Figure 3 It is a structural diagram of an integrated circuit module.

[0015] Among them, 1. shell, 2. integrated circuit module, 3. frame, 4. chip, 5. connecting piece, 6. arc-shaped positioning step surface, 7. chip positioning groove, 8. riveted isolation plate, 9. guide block, 10. pin. DETAILED DESCRIPTION

[0016] Examples, such as Figures 1 to 3 An active wheel speed sensor is shown, comprising a housing 1, a placement hole is provided on the housing 1, an integrated circuit module 2 is provided in the placement hole, and the integrated circuit module 2 is injection molded in the placement hole; the integrated circuit module 2 comprises a block frame 3 and a chip 4 welded on the frame 3, a connecting piece 5 is provided on the block frame 3, and the block frame 3 is integrally injection molded on the connecting piece 5. A group of arc-shaped positioning step surfaces 6 are injection molded between the outer side wall of the integrated circuit module 2 and the inner wall of the placement hole.

[0017] Two chip positioning grooves 7 are formed in the integrated circuit module 2, which are matched with the two pins 10 on the chip 4 in a one-to-one correspondence; a set of riveted isolation plates 8 are arranged between the two chip positioning grooves 7 of the integrated circuit module 2. A soluble plastic rivet sheet is arranged between the chip 4 and the connecting sheet 5, and the soluble plastic rivet sheet will dissolve during welding. A guide block 9 is arranged at the end of the two pins 10 of the chip 4 of the integrated circuit module 2, and the guide block 9 is formed with a guide groove that is matched with the two chip positioning grooves 7 in a one-to-one correspondence.

[0018] In the description of the present invention, it should be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more. In addition, the term "including" and any variation thereof are intended to cover non-exclusive inclusions.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] The terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms "one", "one" and "one" used herein are also intended to include plural numbers. It should also be understood that the terms "include" and / or "comprise" used herein specify the existence of stated features, integers, steps, operations, units and / or components, without excluding the existence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0021] The above is an exemplary description of the utility model in conjunction with the accompanying drawings. Obviously, the specific implementation of the utility model is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the utility model; or the above concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. An active wheel speed sensor, characterized in that: It includes a shell, a placement hole is arranged on the shell, an integrated circuit module is arranged in the placement hole, and the integrated circuit module is injection molded in the placement hole; the integrated circuit module includes a block frame and a chip welded on the frame, a connecting piece is arranged on the block frame, and the block frame is integrally injection molded on the connecting piece.

2. The active wheel speed sensor according to claim 1, characterized in that: A group of arc-shaped positioning step surfaces are injection-molded between the outer wall of the integrated circuit module and the inner wall of the placement hole.

3. The active wheel speed sensor according to claim 1 or 2, characterized in that: Two chip positioning grooves corresponding to two pins on the chip are formed in the integrated circuit module; a group of riveted isolation plates are arranged between the two chip positioning grooves of the integrated circuit module.

4. The active wheel speed sensor according to claim 3, characterized in that: A soluble plastic rivet sheet is arranged between the chip and the connecting sheet.

5. The active wheel speed sensor according to claim 3, characterized in that: The integrated circuit module is provided with guide blocks at the ends of two pins of the chip, and the guide blocks are formed with guide grooves which are matched with the two chip positioning grooves in a one-to-one correspondence.

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