Detection mechanism

Abstract

The utility model discloses a detection mechanism which comprises a detection plate and a mounting frame, a plurality of sensors are arranged on one side of the detection plate through a mounting seat, detection probes are arranged at one ends of the sensors, the sensors and the detection probes are arranged in four groups in pairs, the four groups of detection probes are distributed in four directions of one side of the detection plate, and the mounting frame comprises a lifting plate. According to the utility model, the plurality of sensors and the plurality of detection probes are arranged on one side of the detection plate through the mounting seats, and the four groups of sensors and the four groups of detection probes are arranged in pairs and are distributed in four directions of one side of the detection plate, so that the IGBT high-power module clamped on a mold through a cooling fin can be detected; when the IGBT high-power module inclines, the IGBT high-power module touches the detection probe in one direction, the detection probe transmits a signal to the processor through the sensor, and the processor controls the alarm to give out an alarm sound for warning, so that the situation can be detected in time to prevent the die from being damaged when the cavity is clamped by the radiating fins.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a detection mechanism. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips (Die) through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame island, and then the ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resins are used to connect the bonding pads (Bond Pad) of the chip to the corresponding pins (Lead) of the substrate to form the required circuit; then the independent chips are packaged and protected with a plastic shell, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested and finally shipped. In order to ensure that the IGBT high-power module is heated evenly before the mold is plastic-sealed, the gap between the heat sink and the mold cavity is required to be as small as possible, so a detection fixture is required.

[0003] A semiconductor packaging structure with application number 202223450169.6 in the prior art belongs to the field of semiconductor packaging technology, and includes: a first chip, wherein the first chip includes a stacked active layer and a bulk silicon layer, and a groove is opened on the side of the bulk silicon layer away from the active layer; a second chip. The above-mentioned semiconductor packaging structure saves space of the semiconductor packaging structure in the stacking direction and improves the integration of the semiconductor packaging structure. However, it is difficult to detect whether the product is poorly placed in the mold cavity. When the package is not accurately placed in the groove, the mold or the detected product is easily damaged. Utility Model Content

[0004] The utility model aims to provide a detection mechanism to solve the problem in the prior art that it is difficult to detect whether a product is poorly placed in a mold cavity, and the mold or the detected product is easily damaged when the package is not accurately placed in the groove.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a detection mechanism, including a detection plate and a mounting frame, a plurality of sensors are provided on one side of the detection plate through a mounting seat, a detection probe is provided at one end of the sensor, and the sensor and the detection probe are provided in four groups in pairs, and the four groups of detection probes are distributed in four directions on one side of the detection plate, the mounting frame includes a lifting plate, the mounting seat is elastically slidably arranged on the lower side of the lifting plate through a mounting rod, a spring and a limit nut, and a cylinder is provided in the middle of the upper side of the lifting plate.

[0006] Furthermore, the mounting seat is fixedly mounted on the detection plate by screws, and the detection probe is slidably arranged through one end of the mounting seat.

[0007] Furthermore, a linear bushing is provided at one end of the mounting seat, and the detection probe slides through the linear bushing.

[0008] Furthermore, one end of the mounting rod slides through the through holes at both ends of the detection plate, and one end of the mounting rod is provided with an external thread matching the thread of the limit nut.

[0009] Furthermore, the spring sleeve is arranged on the outside of the mounting rod away from one end of the limiting nut, and a limiting gasket is also arranged on the inner side of the limiting nut.

[0010] Furthermore, a processor and an alarm are provided on one side of the detection board, the signal output end of the sensor is electrically connected to the signal input end of the processor, and the signal output end of the processor is electrically connected to the signal input end of the alarm.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model has a plurality of sensors and detection probes on one side of the detection plate through a mounting seat, and the sensors and detection probes are arranged in four groups in pairs and distributed in four directions on one side of the detection plate, so that the IGBT high-power module fixed on the mold through the heat sink can be detected and processed, so as to judge whether the heat sink is completely placed in the mold cavity. When the IGBT high-power module is tilted, it will touch the detection probe in one direction. The detection probe transmits the signal to the processor through the sensor, and the processor will control the alarm to sound an alarm for warning, so that it can be detected in time when the heat sink is stuck in the cavity to prevent damage to the mold.

[0013] 2. The utility model includes a lifting plate through a mounting frame, and a mounting seat is elastically slidably arranged on the lower side of the lifting plate through a mounting rod, a spring and a limit nut. A cylinder is arranged in the middle of the upper side of the lifting plate, and the spring sleeve is arranged on the outside of the mounting rod away from one end of the limit nut, which is convenient for elastically mounting the detection plate on the upper side of the mold to prevent the detection plate from squeezing the heat sink when the detection plate is rigidly moved down for detection, thereby further improving the safety of detection use.

[0014] 3. The utility model is fixedly installed on the detection board through a mounting seat by screws. The detection probe slides through one end of the mounting seat. A linear bushing is provided at one end of the mounting seat, and the detection probe slides through the linear bushing, which is convenient for improving the stability of the sensor installed on the detection board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 This is a schematic diagram of the structure of the detection board of the utility model from the first perspective;

[0017] Figure 2 This is a schematic diagram of the structure of the detection board of the utility model from the first perspective;

[0018] Figure 3 This is the overall structural front view of the utility model;

[0019] Figure 4 It is a schematic diagram of the detection structure of the utility model.

[0020] In the figure: 1. Detection board; 2. Sensor; 3. Mounting seat; 4. Detection probe; 5. Linear bushing; 6. Through hole; 7. Mold; 8. Heat sink; 9. IGBT high-power module; 10. Lifting plate; 11. Cylinder; 12. Mounting rod; 13. Spring; 14. Limiting gasket; 15. Limiting nut. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 In the embodiment of the utility model, a detection mechanism includes a detection plate 1 and a mounting frame. A plurality of sensors 2 are provided on one side of the detection plate 1 through a mounting seat 3. A detection probe 4 is provided at one end of the sensor 2. The sensors 2 and the detection probes 4 are provided in four groups in pairs, and the four groups of detection probes 4 are distributed in four directions on one side of the detection plate 1. A processor and an alarm are also provided on one side of the detection plate 1. The signal output end of the sensor 2 is electrically connected to the signal input end of the processor, and the signal output end of the processor is electrically connected to the signal input end of the alarm, so that the IGBT high-power module 9 clamped on the mold 7 through the heat sink 8 can be detected and processed, so as to judge whether the heat sink is completely placed in the cavity of the mold 7. When the IGBT high-power module 9 is tilted, it will touch the detection probe 4 in one direction. The detection probe 4 transmits the signal to the processor through the sensor 2, and the processor will control the alarm to sound an alarm for warning, so that it can detect in time when the heat sink 8 is stuck in the cavity to prevent damage to the mold.

[0023] like Figure 3As shown, in order to prevent the detection plate 1 from being squeezed and damaged during the hard downward movement detection, the mounting frame includes a lifting plate 10, and the mounting seat 3 is elastically slidably arranged on the lower side of the lifting plate 10 through a mounting rod 12, a spring 13 and a limit nut 15. A cylinder 11 is arranged in the middle of the upper side of the lifting plate 10, which is used to drive the lifting plate 10 and the detection plate 1 to lift and adjust the detection and use processing. A linear bushing 5 is arranged at one end of the mounting seat 3, and the detection probe 4 slides through the linear bushing 5. One end of the mounting rod 12 slides through the through holes 6 at both ends of the detection plate 1. One end of the mounting rod 12 is provided with an external thread matching the thread of the limit nut 15. The spring 13 is sleeved on the outside of the mounting rod 12 away from one end of the limit nut 15. A limit gasket 14 is also arranged on the inner side of the limit nut 15, which is convenient for elastically mounting the detection plate 1 on the upper side of the mold 7 to prevent the detection plate 1 from being squeezed and damaged during the hard downward movement detection, thereby further improving the safety of detection and use.

[0024] like Figure 1 and Figure 2 As shown, in order to improve the installation stability of the sensor 2, the mounting base 3 is fixedly mounted on the detection board 1 by screws, and the detection probe 4 is slidably arranged through one end of the mounting base 3, so as to improve the stability of the sensor 2 installed on the detection board 1.

[0025] The working principle and use process of the utility model are as follows: when in use, the detection plate 1 is installed on the middle part of the upper side of the mold 7 through the mounting frame. Since a plurality of sensors 2 and detection probes 4 are provided on one side of the detection plate 1 through the mounting seat 3, and the sensors 2 and detection probes 4 are provided in four groups in pairs and distributed in four directions on one side of the detection plate 1, the IGBT high-power module 9 clamped on the mold 7 through the heat sink 8 can be detected and processed, so as to determine whether the heat sink is completely placed in the cavity of the mold 7. When the IGBT high-power module 9 is tilted, it will touch the detection probe 4 in one direction. The detection probe 4 transmits the signal to the processor through the sensor 2, and the processor will control the alarm to sound an alarm to warn, so that it can detect in time when the heat sink 8 is stuck in the cavity to prevent damage to the mold.

[0026] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A detection mechanism, comprising a detection plate (1) and a mounting frame, characterized in that: A plurality of sensors (2) are provided on one side of the detection plate (1) through a mounting seat (3); a detection probe (4) is provided on one end of the sensor (2); and the sensors (2) and the detection probe (4) are provided in four groups in pairs, and the four groups of detection probes (4) are distributed in four directions on one side of the detection plate (1); the mounting frame includes a lifting plate (10); the mounting seat (3) is elastically slidably arranged on the lower side of the lifting plate (10) through a mounting rod (12), a spring (13) and a limit nut (15); and a cylinder (11) is provided in the middle of the upper side of the lifting plate (10).

2. A detection mechanism according to claim 1, characterized in that: The mounting seat (3) is fixedly mounted on the detection plate (1) by means of screws, and the detection probe (4) is arranged to slide through one end of the mounting seat (3).

3. A detection mechanism according to claim 2, characterized in that: A linear bushing (5) is provided at one end of the mounting seat (3), and the detection probe (4) slides through the linear bushing (5).

4. A detection mechanism according to claim 1, characterized in that: One end of the mounting rod (12) slides through the through holes (6) at both ends of the detection plate (1), and one end of the mounting rod (12) is provided with an external thread matching the thread of the limit nut (15).

5. A detection mechanism according to claim 4, characterized in that: The spring (13) is sleeved on the outside of the mounting rod (12) at one end away from the limiting nut (15), and a limiting gasket (14) is also provided inside the limiting nut (15).

6. A detection mechanism according to claim 1, characterized in that: A processor and an alarm are also provided on one side of the detection board (1); the signal output end of the sensor (2) is electrically connected to the signal input end of the processor, and the signal output end of the processor is electrically connected to the signal input end of the alarm.

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