Wafer loading device and wafer transmission equipment

Abstract

The utility model discloses a wafer loading device and wafer transmission equipment, the wafer loading device comprises a butt joint plate, a carrier plate and a limiting assembly, and the butt joint plate is provided with a butt joint opening used for butt joint of the wafer transmission equipment; the carrier plate is vertically arranged on one side of the butt joint plate and is used for placing a wafer box; the limiting assembly is arranged on the carrier plate and comprises a front side limiting part and a rear side limiting part which are arranged in the front-back direction, and the front side limiting part is located between the butt joint plate and the rear side limiting part; the rear side limiting part comprises a rear limiting block, the rear limiting block is provided with step-shaped limiting surfaces in one-to-one correspondence with the specifications of the wafer cassettes, and the wafer cassettes of any specification are limited between the front side limiting part and the corresponding step-shaped limiting surfaces. The device can be compatible with wafer cassettes of various dimensions, so that the application range of the device is expanded, and the utilization rate of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer loading device and wafer transmission equipment. Background Art

[0002] With the rapid development of the intelligent industry, more and more products and equipment need to be equipped with chips to meet their intelligent needs. Since industrial products and equipment have different requirements for chip size and shipment scale, this determines that the wafer size used to produce chips is also different.

[0003] Currently, the commonly used wafer sizes are 6 inches, 8 inches, and 12 inches, and different wafer sizes require corresponding wafer boxes for storage and transportation. Among them, 6-inch and 8-inch wafers usually use open wafer boxes (Open Cassette) for wafer storage and transportation, and 12-inch wafers usually use front opening wafer boxes (FOUP: Front Opening United Pod) for wafer storage and transportation.

[0004] During the production and processing of wafers, the wafer box also needs to be equipped with a corresponding wafer loading device to transfer and process the wafers in the wafer box. Among them, the open wafer box usually uses an open wafer box loading platform (OCS: Open Cassette Stage) as a wafer loading device. However, the existing wafer loading device can usually only carry a single specification of wafer box, which undoubtedly reduces the utilization rate of the wafer loading device. Utility Model Content

[0005] In order to overcome the above-mentioned shortcomings, the purpose of the utility model is to provide a wafer loading device and wafer transfer equipment suitable for open wafer boxes, which can load wafer boxes of various sizes and specifications, thereby expanding the application range of the device and improving the utilization rate of the device.

[0006] In order to achieve the above objectives, one of the technical solutions adopted by the utility model is: a wafer loading device, comprising:

[0007] A docking plate having a docking opening for docking with a wafer transfer device;

[0008] A carrier plate is arranged vertically on one side of the docking plate and is used to place a wafer box;

[0009] The limiting assembly is arranged on the carrier plate, and includes a front limiting portion and a rear limiting portion arranged along the front-to-back direction, the front limiting portion is located between the docking plate and the rear limiting portion; the rear limiting portion includes a rear limiting block, and the rear limiting block is provided with a stepped limiting surface corresponding to the specifications of the wafer box one by one, and a wafer box of any specification is limited between the front limiting portion and the corresponding stepped limiting surface.

[0010] The beneficial effects of the wafer loading device of the utility model are:

[0011] In the limiting assembly, the placement position of the wafer box on the carrier can be limited by the cooperation of the front limiting part and the rear limiting part, and the side of the wafer boxes of different specifications close to the docking plate is limited by the front limiting part, and the other side is limited by the corresponding stepped limiting surface, so that the distance between the front limiting part and the stepped limiting surface is adapted to the corresponding specification size of the wafer box to ensure stable limiting of wafer boxes of different specifications, and the position of wafer boxes of different specifications close to the docking opening is the same, so as to ensure the consistency of the wafer taking position of wafer boxes of different specifications by the wafer transfer equipment from the docking opening.

[0012] Furthermore, there are two rear limit blocks and they are symmetrically arranged in the left-right direction. The stepped limit surface includes two groups of first limit surfaces and second limit surfaces that are arranged vertically in a stepped manner. The first limit surface and the second limit surface limit the two adjacent sides of the wafer box respectively. By limiting the two adjacent sides of the wafer box with the first limit surface and the second limit surface arranged vertically, the bidirectional limit of the wafer box in the vertical direction can be achieved to enhance the limit effect.

[0013] Further, the wafer box is respectively provided with a front opening and a rear opening along the front-to-back direction, and the front opening is located between the docking plate and the rear opening; the first limiting surface is arranged along the front-to-back direction, and the spacing between the first limiting surfaces of the two stepped limiting surfaces symmetrical along the left-to-right direction is not greater than the size of the rear opening, so that the two first limiting surfaces can limit the wafer box from the inside of the wafer box.

[0014] When placing the wafer box, the front opening of the wafer box is facing the docking opening, so that the wafer transfer equipment can enter the front opening from the docking opening to take the wafer. At this time, the rear limit block is located at the rear opening. Since the wafer box is an open wafer box (with a front opening and a rear opening in the front and rear directions respectively), the limitation of the left and right directions of the wafer box can be performed in the rear opening, that is, by setting the spacing between the first limit surfaces, the rear limit block can limit the left and right directions of the wafer box from the inside of the wafer box, thereby avoiding the rear limit block occupying the placement position of a larger wafer box when limiting the left and right directions from the outside of the wafer box.

[0015] Furthermore, the front limit portion includes two front limit blocks symmetrically arranged along the left-right direction, and each front limit block is provided with a third limit surface arranged parallel to the second limit surface. The front-back direction of the wafer box is limited by the cooperation between the third limit surface of the front limit block and the second limit surface of the rear limit block.

[0016] Furthermore, the rear limiting block includes limiting bodies arranged in one-to-one correspondence with the specifications of the wafer boxes, and each limiting body is provided with the stepped limiting surface that can abut against the wafer box of the corresponding specification.

[0017] In practical applications, the rear limit block can adopt an integrated structure, in which case a plurality of stepped limit surfaces corresponding to the specifications of the wafer box are arranged on the rear limit block. The rear limit block can also adopt a split structure, that is, the rear limit block is divided into a plurality of limit bodies corresponding to the specifications of the wafer box, and a stepped limit surface is arranged on each limit body.

[0018] Furthermore, it also includes a detection structure arranged in one-to-one correspondence with the stepped limiting surface, and the detection structure is used to detect whether there is a wafer box at the corresponding stepped limiting surface. The detection structure should be arranged close to the corresponding stepped limiting surface and located at the placement position of the corresponding wafer box. When the corresponding wafer box is placed at the specified position, the wafer box can press against the corresponding detection structure.

[0019] Furthermore, it also includes a protection component, which includes a protection cover rotatably arranged on the docking plate, and the protection cover can cover the wafer box located on the carrier. Since the wafer box is an open structure, the protection cover covering the wafer box can effectively prevent external dust from entering the wafer box from the rear opening to contaminate the wafers; and the protection cover can be easily opened by rotating the protection cover, so as to facilitate the removal or placement of the wafer box from the carrier.

[0020] Furthermore, the protection assembly also includes a locking member, which includes a locking block and a locking rod. The locking block is provided with a locking groove for the locking rod to be inserted into; and one of the locking block and the locking rod is located on the protection cover, and the other is located on the carrier. The protection cover can be locked in position by the cooperation of the locking block and the locking rod to ensure that the protection cover stably protects the wafer box during the wafer transfer device to take out the wafer.

[0021] Furthermore, a position sensor for detecting the position of the protective cover is provided on the carrier plate, and the setting of the position sensor is conducive to starting the locking action of the locking member.

[0022] Furthermore, it also includes a wafer scanning mechanism disposed near the docking opening, the wafer scanning mechanism including a scanning component that can be lifted and moved under the action of a lifting drive, the scanning component is used to detect the placement status of the wafers in the wafer box. Furthermore, the scanning component can use a reflective sensor to be suitable for scanning wafer boxes of different specifications.

[0023] Furthermore, the upper end height of the docking opening is higher than the upper end height of the wafer box, and when the scanning assembly is at the highest point, the scanning assembly is located above the wafer box. Furthermore, the distance that the upper end of the docking opening is higher than the upper end of the wafer box is used to accommodate the avoidance space when the scanning assembly moves to the highest point, so as to prevent the wafer from colliding with the scanning assembly when entering and exiting the docking opening.

[0024] The second technical solution adopted by the utility model is: a wafer transmission device, including any of the above-mentioned wafer loading devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of a wafer loading device according to an embodiment of the utility model;

[0026] Figure 2 for Figure 1 A partial enlarged view of the A part;

[0027] Figure 3 for Figure 1 A partial enlarged view of the B area;

[0028] Figure 4 This is a schematic diagram of the structure in which a wafer box is limited on a rear limit block of an integrated structure according to an embodiment of the utility model;

[0029] Figure 5 This is a schematic structural diagram of a rear limit block of an integrated structure according to an embodiment of the utility model;

[0030] Figure 6 It is a structural schematic diagram of a wafer box placed on a rear limit block of a split structure according to an embodiment of the utility model;

[0031] Figure 7 This is a schematic structural diagram of a wafer loading device according to an embodiment of the utility model from another perspective;

[0032] Figure 8 for Figure 7 A partial enlarged view of area C in the middle.

[0033] In the figure:

[0034] 1- docking plate; 11- docking opening;

[0035] 2- Wafer box;

[0036] 3-Carrier board;

[0037] 41-front limiting part; 411-front limiting block; 42-rear limiting part; 421-rear limiting block; 4211-limiting body; 422-step limiting surface; 4221-first limiting surface; 4222-second limiting surface;

[0038] 5-Detection structure;

[0039] 61-protective cover; 62-telescopic sleeve; 63-locking block; 631-locking groove; 64-locking rod; 65-in-place sensor;

[0040] 71 - lifting drive member; 72 - lifting plate; 73 - reflection sensor. DETAILED DESCRIPTION

[0041] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0042] Example

[0043] See also Figure 1 , Figure 2 and Figure 4 As shown, a wafer loading device of the utility model includes a docking plate 1, one side of the docking plate 1 is used to dock with a wafer transmission device (not shown in the figure), and the other side is vertically provided with a carrier plate 3 for placing a wafer box 2, and a docking opening 11 for connecting the wafer transmission device and the wafer box 2 is provided on the docking plate 1 located above the carrier plate 3.

[0044] It should be noted that, in this embodiment, the wafer box 2 is an open wafer box, that is, along the front-to-back direction (such as Figure 1 As shown in FIG. 1 , the wafer box 2 is provided with a front opening and a rear opening, and when the wafer box 2 is placed on the carrier plate 3, the front opening is located between the docking plate 1 and the rear opening, so as to communicate with the docking opening 11. The size of the docking opening 11 should be larger than that of the front opening, so as to prevent the wafer from colliding with the docking opening 11 when entering the docking opening 11 from the front opening.

[0045] In order to limit the placement position of the wafer box 2 on the carrier 3, in some embodiments, a limiting assembly is provided on the carrier 3, and the limiting assembly includes a front limiting portion 41 and a rear limiting portion 42 arranged along the front-to-back direction, and the front limiting portion 41 is located between the docking plate 1 and the rear limiting portion 42. Furthermore, the rear limiting portion 42 includes a rear limiting block 421, and a stepped limiting surface 422 corresponding to the specifications of the wafer box is provided on the rear limiting block 421, and any specification of the wafer box 2 is limited between the front limiting portion 41 and the corresponding stepped limiting surface 422.

[0046] In the limiting assembly, the side of the wafer boxes 2 of different specifications close to the docking plate 1 is limited by the front limiting portion 41, and the other side is limited by the corresponding stepped limiting surface 422, so that the distance between the front limiting portion 41 and the stepped limiting surface 422 is adapted to the corresponding specification size of the wafer boxes 2 to ensure stable limiting of the wafer boxes 2 of different specifications, and the positions of the wafer boxes 2 of different specifications close to the docking opening 11 are the same, so as to ensure the consistency of the wafer taking position of the wafer boxes 2 of different specifications from the docking opening 11 by the wafer transfer equipment.

[0047] For details, see the attached Figures 4 to 5 As shown, there are two rear limit blocks 421, and they are symmetrically arranged along the left-right direction. Each rear limit block is provided with a stepped limit surface 422, and the stepped limit surface 422 includes two groups of first limit surfaces 4221 and second limit surfaces 4222 that are stepped and vertically arranged. The first limit surface 4221 and the second limit surface 4222 respectively limit the two adjacent side surfaces of the wafer box 2 to achieve two-way limiting of the wafer box 2 in the vertical direction. Among them, the first limit surface 4221 is arranged along the front-to-back direction, and the second limit surface 4222 is arranged along the left-to-right direction. Correspondingly, the front side limit part 41 includes two front limit blocks 411 that are symmetrically arranged along the left-to-right direction, and each front limit block 411 is provided with a third limit surface that is arranged parallel to the second limit surface 4222. When the wafer box 2 is placed on the carrier 3, the wafer box 2 can be limited by the second limiting surface 4222 and the third limiting surface in the front-to-back direction, and can be limited by the first limiting surface 4221 of the two stepped limiting surfaces 422 in the left-to-right direction.

[0048] It should be noted that the front stopper 411 and the rear stopper 421 are both symmetrically centered on the center line of the docking opening 11, and the axis of the wafer box 2 (located in the vertical direction) is perpendicular to and intersects the symmetrical center line. This arrangement makes the limiting positions of the two front stopper blocks 411 and the two rear stopper blocks 421 on the wafer box 2 relatively uniform, ensuring uniform force on the wafer box 2.

[0049] In practical application, the rear limit block 421 can adopt an integrated structure. Figures 4 to 5 As shown, along the front-to-back direction, the rear limit block 421 is provided with a plurality of stepped limit surfaces 422 corresponding to the specifications of the wafer box. The rear limit block 421 can also adopt a split structure, and a stepped limit surface 422 is arranged on each split structure. Figure 6 As shown, the rear limiting block 421 includes a plurality of limiting bodies 4211 arranged along the front-to-back direction, the number of the limiting bodies 4211 is consistent with the number of specifications of the wafer box, and each limiting body 4211 is evenly provided with a stepped limiting surface 422 .

[0050] As the size of the wafer box 2 increases, the space occupied by the wafer box 2 on the carrier 3 will also increase. Therefore, the stepped limiting surface 422 corresponding to the large-sized wafer box 2 is farther away from the front limiting block 411 and the symmetry center line than the stepped limiting surface 422 corresponding to the small-sized wafer box 2. However, in actual application, it is found that when the specifications of the wafer boxes 2 are relatively small, the spacing between the wafer boxes 2 in the left and right directions is not enough to arrange the rear limiting block 421, which makes it difficult to limit the left and right directions from the outside of the wafer box 2. Since the wafer box 2 is open, a rear opening is provided on the side close to the rear limiting block 421, which provides convenience for limiting it from the inside of the wafer box 2. Based on this, the spacing between the first limiting surfaces 4221 of the two stepped limiting surfaces 422 symmetrically along the left and right directions is not greater than the size of the rear opening, so that the two first limiting surfaces 4221 can limit the wafer box 2 from the inside of the wafer box 2.

[0051] Take the split rear limit block 421 as an example, see the attached Figure 6 As shown, the limiting body 4211 includes a first plate body, and a second plate body forming an "L"-shaped structure therewith is provided on one side of the first plate body away from the other limiting body 4211. When the wafer box 2 is placed on the carrier 3, the limiting body 4211 is located at the corner of the rear opening, and the first plate body is located inside the rear opening and abuts against the inner wall of the corner of the rear opening, and the second plate body is located outside the rear opening and abuts against the outer wall of the corner of the rear opening. At this time, the side of the first plate body abutting against the inner wall of the corner of the rear opening is the first limiting surface 4221, and the side of the second plate body abutting against the outer wall of the corner of the rear opening is the second limiting surface 4222. By placing the first plate body inside the rear opening, the wafer box 2 can be limited in the left and right directions from the inner side thereof, thereby avoiding the limiting body 4211 occupying the placement position of a larger wafer box 2.

[0052] In some embodiments, in order to know whether the wafer box 2 is placed in place, see the attached Figure 5 As shown, a detection structure 5 is also provided on the carrier plate 3 in one-to-one correspondence with the stepped limiting surface 422. The detection structure 5 is arranged close to the corresponding stepped limiting surface 422 and is located at the placement position of the corresponding wafer box 2. When the corresponding wafer box 2 is placed in place, the wafer box 2 can press down the corresponding detection structure 5. Exemplarily, the detection structure 5 can adopt a pressure sensor.

[0053] During the process of the wafer transport device picking up the wafer, the rear opening of the wafer box 2 is always in an open state, which may easily cause dust to enter the wafer box 2 and then contaminate the wafers in the wafer box 2. Therefore, in some embodiments, see the attached Figure 1 , Figure 7As shown, a protective component that can cover the wafer box 2 is arranged on the docking plate 1. Specifically, the protective component includes a protective cover 61 that is rotatably arranged on the docking plate 1, and a side opening that is connected to the docking opening 11 is provided on the side of the protective cover 61 facing the docking plate 1, and a bottom opening is provided on the side of the protective cover 61 facing the carrier plate 3. The two sides of the protective cover 61 in the left and right directions are respectively hinged to the docking plate 1 through telescopic sleeves 62 to limit and guide the rotation of the protective cover 61.

[0054] When the protective cover 61 is rotated downward, the side of the protective cover 61 with the bottom opening can abut against the carrier 3 to cover the wafer box 2 on the carrier 3; when the protective cover 61 is rotated upward, the side of the protective cover 61 with the bottom opening can be flipped to be connected with the docking opening 11. At this time, the wafer box 2 can be taken out or put in from the bottom opening.

[0055] For further information, see Appendix Figures 2 to 3 As shown, the protection assembly also includes a locking member, which includes a locking block 63 and a locking rod 64. The locking block 63 is provided with a locking groove 631 for the locking rod 64 to be inserted; and one of the locking block 63 and the locking rod 64 is located on the protection cover 61, and the other is located on the carrier 3. The protection cover 61 can be locked in its cover position by the cooperation of the locking block 63 and the locking rod 64, so as to ensure that the protection cover stably protects the wafer box 2 during the wafer transfer device to take out the wafer.

[0056] Exemplarily, the locking block 63 is arranged on the inner wall of the protective cover 61, the locking rod 64 is arranged on the carrier 3, and the locking rod 64 is connected to the locking driving member (linear motor or cylinder) that drives it to move linearly. When it is necessary to take out or put in the wafer box 2, the control system gives the locking driving member an unlocking instruction, and the locking driving member drives the locking rod 64 to disengage from the locking groove, at which time the protective cover 61 can be flipped up and opened.

[0057] For further information, see Appendix Figure 2 As shown, a position sensor 65 for detecting the position of the protective cover 61 is provided on the carrier plate 3. When the protective cover 61 flips down and contacts the position sensor 65, the position sensor 65 senses a signal and feeds it back to the locking drive component through the control system. The locking drive component then drives the locking rod 64 to insert into the locking groove. At this time, the protective cover 61 is locked.

[0058] In some embodiments, see Appendix Figures 7 and 8As shown, a wafer scanning mechanism is provided near the docking opening 11 to detect the placement status of the wafers in the wafer box 2. Specifically, the wafer scanning mechanism includes a scanning component that can be lifted and moved under the action of a lifting drive 71, wherein the lifting drive 71 is arranged on the side of the docking opening 11, and the scanning component includes a lifting plate 72 and a reflection sensor 73 installed at the end of the lifting plate 72. When the lifting plate 72 is lifted and moved under the action of the lifting drive 71, the reflection sensor 73 can detect the wafers in the wafer box 2.

[0059] It should be noted that the lifting drive 71 can be a lead screw motor or other drive that can move linearly. The end of the lifting plate 72 extends to the center line of the docking opening 11 to improve the accuracy of the scanning position of the reflection sensor 73. The reflection sensor 73 can be used to scan wafer boxes of different specifications.

[0060] In some embodiments, in order to prevent the wafer from colliding with the scanning mechanism when being taken out of the wafer box 2, in some embodiments, the height of the upper end of the docking opening 11 is set to be higher than the height of the upper end of the wafer box 2, and when the scanning assembly is at the highest point, the scanning assembly is located above the wafer box 2. That is, the distance that the upper end of the docking opening 11 is higher than the upper end of the wafer box 2 is used to accommodate the avoidance space when the scanning assembly moves to the highest point.

[0061] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer loading device, characterized in that: include: A docking plate having a docking opening for docking with a wafer transfer device; A carrier plate, arranged vertically on one side of the docking plate, for placing a wafer box; A limiting assembly is arranged on the carrier plate, and includes a front limiting portion and a rear limiting portion arranged along the front-to-back direction, wherein the front limiting portion is located between the docking plate and the rear limiting portion; the rear limiting portion includes a rear limiting block, and the rear limiting block is provided with a stepped limiting surface corresponding to the specifications of the wafer box one by one, and the wafer box of any specification is limited between the front limiting portion and the corresponding stepped limiting surface.

2. The wafer loading device according to claim 1, characterized in that: There are two rear limit blocks and they are symmetrically arranged in the left-right direction. The stepped limit surface includes two groups of first limit surfaces and second limit surfaces which are vertically arranged in a stepped distribution. The first limit surfaces and the second limit surfaces respectively limit two adjacent side surfaces of the wafer box.

3. The wafer loading device according to claim 2, characterized in that: The wafer box is respectively provided with a front opening and a rear opening along the front-to-back direction, and the front opening is located between the docking plate and the rear opening; the first limiting surface is arranged along the front-to-back direction, and the distance between the first limiting surfaces of the two stepped limiting surfaces symmetrical along the left-to-right direction is not greater than the size of the rear opening, so that the two first limiting surfaces can limit the wafer box from the inside of the wafer box.

4. The wafer loading device according to claim 3, characterized in that: The front limiting portion includes two front limiting blocks symmetrically arranged along the left-right direction, and each of the front limiting blocks is provided with a third limiting surface arranged parallel to the second limiting surface.

5. The wafer loading device according to claim 1, characterized in that: The rear limiting block includes limiting bodies arranged in one-to-one correspondence with the specifications of the wafer boxes, and each of the limiting bodies is provided with the stepped limiting surface that can abut against the wafer box of the corresponding specification.

6. The wafer loading device according to claim 1, characterized in that: It also includes a detection structure arranged corresponding to the stepped limiting surface, and the detection structure is used to detect whether there is a wafer box at the corresponding stepped limiting surface.

7. The wafer loading device according to claim 1, characterized in that: It also includes a protection component, which includes a protection cover rotatably arranged on the docking plate, and the protection cover can cover the wafer box located on the carrier plate.

8. The wafer loading device according to claim 7, characterized in that: The protective assembly also includes a locking piece, which includes a locking block and a locking rod. The locking block is provided with a locking groove for the locking rod to be inserted into; and one of the locking block and the locking rod is located on the protective cover, and the other is located on the carrier; and an in-position sensor for detecting the position of the protective cover is provided on the carrier.

9. The wafer loading device according to claim 1, characterized in that: It also includes a wafer scanning mechanism arranged near the docking opening, the wafer scanning mechanism includes a scanning component that can be lifted and moved under the action of a lifting drive component, and the scanning component is used to detect the placement status of the wafer in the wafer box.

10. The wafer loading device according to claim 9, characterized in that: The height of the upper end of the docking opening is higher than the height of the upper end of the wafer box, and when the scanning component is located at the highest point, the scanning component is located above the wafer box.

11. A wafer transfer device, characterized in that: It comprises the wafer loading device described in any one of claims 1-10.

Images