Turret type rotary mounting head with multiple suction nozzles

Abstract

The embodiment of the utility model provides a turret type rotary mounting head with multiple suction nozzles. The turret type rotary mounting head comprises a mounting seat, a direct drive motor, an adsorption part, a vacuum logic part and a rotary joint. The adsorption component comprises a suction nozzle mounting seat, at least two suction nozzles, a flexible air pipe and a rigid air pipe. The suction nozzle mounting seat comprises an air pipe mounting part, and the flexible air pipe is positioned in the air pipe mounting part; the base mounting part is fixedly connected with the direct-drive motor, so that the direct-drive motor drives the suction nozzle mounting seat as well as the suction nozzle and the flexible air pipe which are fixed on the suction nozzle mounting seat to rotate; the direct drive motor is arranged on the outer side of the air pipe protection part, and the rigid air pipe is located in the air pipe protection part. The vacuum logic component is used for vacuum logic control of the suction nozzle and is also connected with the rotary joint, so that each gas path has an independent vacuum switch logic function, and the problem that the vacuum degree is reduced and a device cannot be sucked or the suction is unstable due to the opening of a vacuum channel when no device is sucked in other paths is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of optoelectronic device micro-assembly, and in particular to a turret-type rotary placement head with multi-channel suction nozzles. Background Art

[0002] Semiconductor devices are usually found on tape, in wafers, or in waffle trays. In order to mount semiconductor devices on circuit boards, they need to be transported to various workstations. In order to improve the transport efficiency of semiconductor devices, the mounting head mechanism used is equipped with multiple suction nozzles to vacuum absorb semiconductor devices. However, during the transportation process of the current suction nozzle mechanism, when the vacuum of one of the suction nozzles is not established, the suction action between different suction nozzles is not performed at the same time, that is, when the first suction nozzle absorbs the semiconductor device, the second suction nozzle may not absorb the semiconductor device; at this time, the air path corresponding to the first suction nozzle is vacuum, and the air path corresponding to the second suction nozzle is non-vacuum. The vacuum of the suction nozzle that fails to absorb the semiconductor device falls into a state of leakage and negative pressure, and the vacuum state of other suction nozzles in the same module will also fail. Utility Model Content

[0003] The present application provides a turret type rotary placement head with multi-channel suction nozzles to achieve multi-channel adsorption while avoiding the inability to absorb components or unstable absorption due to the decrease in vacuum degree caused by the opening of the gas channels.

[0004] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0005] The embodiment of the present application discloses a turret type rotary placement head with a multi-way suction nozzle, comprising:

[0006] Mounting seat,

[0007] A direct drive motor is fixed on the mounting seat;

[0008] An adsorption component, fixedly connected to the direct drive motor;

[0009] A vacuum logic component is connected to the direct drive motor, and the direct drive motor drives the adsorption component and the vacuum logic component to rotate;

[0010] Wherein, the adsorption component comprises: a nozzle mounting seat, at least two nozzles, a flexible air pipe and a rigid air pipe;

[0011] The nozzle mounting seat comprises:

[0012] An air pipe installation portion, wherein the flexible air pipe is located in the air pipe installation portion;

[0013] A base mounting portion, fixedly connected to the direct drive motor, so that the direct drive motor drives the nozzle mounting seat and the nozzle and the flexible air pipe fixed on the nozzle mounting seat to rotate;

[0014] A trachea protection part, wherein the direct drive motor is arranged outside the trachea protection part, and the rigid trachea is located inside the trachea protection part;

[0015] The vacuum logic component is used for vacuum logic control of the suction nozzle, and the vacuum logic component is also connected to the rotary joint.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] The embodiment of the present application provides a turret-type rotary placement head with multiple suction nozzles, including: a mounting seat, a direct-drive motor, an adsorption component, a vacuum logic component and a rotary joint. Among them, the adsorption component includes: a suction nozzle mounting seat, at least two suction nozzles, a flexible air pipe and a rigid air pipe. The suction nozzle mounting seat includes: an air pipe mounting part, in which the flexible air pipe is located; a base mounting part is fixedly connected to the direct-drive motor, so that the direct-drive motor drives the suction nozzle mounting seat and the suction nozzle and the flexible air pipe fixed on the suction nozzle mounting seat to rotate; an air pipe protection part, in which the direct-drive motor is arranged on the outside of the air pipe protection part, and the rigid air pipe is located inside the air pipe protection part. The vacuum logic component is used for vacuum logic control of the suction nozzle, and the vacuum logic component is also connected to the rotary joint. Each air path has an independent vacuum switch logic function to avoid the problem that when there is no device adsorption in other paths, the vacuum degree drops due to the opening of the vacuum channel, and the device cannot be adsorbed or the adsorption is unstable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0019] Figure 1 A schematic diagram of the structure of a turret-type rotary placement head with multiple nozzles provided in accordance with an embodiment at a first angle;

[0020] Figure 2 A schematic diagram of the second angle structure of a turret type rotary placement head with multi-channel suction nozzles provided according to an embodiment;

[0021] Figure 3 It is a disassembled schematic diagram of a turret type rotary placement head with multi-channel suction nozzles provided according to an embodiment;

[0022] Figure 4 A cross-sectional view of a turret type rotary placement head with a multi-channel suction nozzle provided according to an embodiment Figure 1 ;

[0023] Figure 5 A partial schematic diagram of a turret type rotary placement head with a multi-way suction nozzle provided according to an embodiment Figure 1 ;

[0024] Figure 6 It is a structural schematic diagram of a nozzle mounting seat provided according to an embodiment;

[0025] Figure 7 It is a structural schematic diagram of a multi-gas path adapter block provided according to an embodiment;

[0026] Figure 8 A schematic diagram of the structure of a vacuum logic component provided according to an embodiment;

[0027] Fig. 9 is a cross-sectional schematic diagram of a vacuum logic component provided according to an embodiment;

[0028] Fig.10 A cross-sectional view of a turret type rotary placement head with a multi-channel suction nozzle provided according to an embodiment Figure 2 . DETAILED DESCRIPTION

[0029] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0030] Unless the context requires otherwise, throughout the specification and claims, the term "including" is interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" cannot be understood to indicate or imply relative importance or indicate an upper limit of quantity; the term "plurality" means two or more; the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "level" and other descriptions are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the circuit structure, article or device including the elements.

[0031] In the field of optoelectronic communications, semiconductor devices need to be transported to various workstations during manufacturing. In order to improve the transport efficiency of semiconductor devices, the nozzle mechanism used is equipped with multiple nozzles to vacuum absorb semiconductor devices. However, during the transport process of the current nozzle mechanism, when the vacuum of one of the nozzles is not established, that is, the vacuum of the nozzle that fails to absorb the semiconductor device falls into a state of leakage and negative pressure, the vacuum state of other nozzles in the same module will also fail. In this way, when the robot is in a moving state, the semiconductor devices that have been absorbed by other nozzles will fall and be damaged during the movement process.

[0032] Semiconductor devices are usually found on tape, in wafers or in waffle trays. In order to mount semiconductor devices on circuit boards, a small vacuum suction tool picks up the target semiconductor device from the waffle tray or wafer package, and then precisely aligns the target semiconductor device with the substrate or circuit board and mounts it at the preset position.

[0033] Optical devices, semiconductor devices and module micro-assembly in specific application scenarios include horizontal, vertical, flip-chip and other mounting methods. Due to the size characteristics of the device, the top adsorption surface of the vertical side-mounted device is very small, which is insufficient to provide stable vacuum adsorption conditions. In this case, the device needs to be placed horizontally, and after the front is adsorbed, it is transferred to a rotary mounting head for flipping, and then the vertical side-mounted mounting is completed through side suction. In order to improve work efficiency, the rotary mounting head is equipped with multiple nozzles, such as Figure 1 As shown in , the rotary mounting head is provided with a first suction nozzle, a second suction nozzle, a third suction nozzle and a fourth suction nozzle. For the convenience of rotary mounting, adjacent suction nozzles are arranged at 90°.

[0034] Figure 1 It is a schematic diagram of the first angle structure of a turret type rotary placement head with multi-channel suction nozzles provided according to an embodiment. Figure 2 It is a schematic diagram of the second angle structure of a turret type rotary placement head with multi-channel suction nozzles provided according to an embodiment. Figure 3 FIG. 1 is a schematic diagram of a disassembled turret type rotary placement head with a multi-way suction nozzle according to an embodiment. Figure 1 , Figure 2 and Figure 3 As shown, the rotary placement head includes: a mounting base 100 , a direct drive motor 200 , a vacuum logic component 300 , an adsorption component 400 , and a rotary joint 500 .

[0035] The direct drive motor 200 is fixed to one end of the mounting base 100, and the mounting base 100 provides support for the direct drive motor 200. The direct drive motor 200 drives the vacuum logic component 300 and the adsorption component 400 to rotate along the axial direction of the direct drive motor 200. The rotary joint 500 is rotatably connected to the vacuum logic component 300, and the rotary joint 500 remains stationary during the rotation of the vacuum logic component 300.

[0036] When the semiconductor device is sucked, the first suction nozzle 411 faces downward. After the first suction nozzle 411 sucks the semiconductor device, the placement head can be turned over to make the first suction nozzle 411 carry the semiconductor device sideways or upside down; when rotated 90 degrees, the second suction nozzle 412 faces downward, and the second suction nozzle 412 can complete the suction action.

[0037] Because the adsorption action between different suction nozzles is not performed at the same time, that is, when the first suction nozzle adsorbs the semiconductor device, the second suction nozzle may not adsorb the semiconductor device; at this time, the air path corresponding to the first suction nozzle is vacuum, and the air path corresponding to the second suction nozzle is non-vacuum. In order to achieve multi-air path adsorption while avoiding the inability to adsorb devices or unstable adsorption due to the opening of the air path causing the vacuum degree to drop, the turret type rotary placement head provided in the present application has a vacuum logic component. The vacuum logic component is located between the suction nozzle and the rotary joint, so that each air path has an independent vacuum switch logic function, avoiding the problem of being unable to adsorb devices or unstable adsorption due to the opening of the vacuum channel when there is no device adsorbed in other paths.

[0038] In some examples, the mounting base 100 includes a supporting component 110 and a mounting component 120, wherein one end of the supporting component is fixedly connected to the direct drive motor 200, and the other end is connected to the mounting component 120. The mounting component can be used to fix the rotary mounting head to other transport or moving devices, which is not specifically limited here.

[0039] Figure 4 A cross-sectional view of a turret type rotary placement head with a multi-channel suction nozzle provided according to an embodiment Figure 1.like Figure 4 As shown, the vacuum logic component merges multiple gas paths into one and connects the rotary joint 500 with the gas path in the adsorption component 400. The rotary joint 500 is connected to a vacuum adsorption pipeline, and the vacuum logic component merges multiple gas paths into one and connects the suction pipeline with each gas path in the adsorption component 740.

[0040] The direct drive motor 200 is fixed to one end of the mounting base 100, and the mounting base provides support for the direct drive motor 200. The direct drive motor 200 drives the vacuum logic component and the adsorption component to rotate along the axial direction of the direct drive motor 200. The rotary joint is rotatably connected to the vacuum logic component, and the rotary joint remains stationary during the rotation of the vacuum logic component.

[0041] The vacuum logic component 300 is provided with a plurality of vacuum logic valves, and the number of the vacuum logic valves is consistent with the number of the suction nozzles. For example, the first suction nozzle is connected to the first vacuum logic valve, and when the first suction nozzle sucks an object, the first vacuum logic valve is turned on to connect the first suction nozzle to the rotary joint 750.

[0042] In some embodiments, the number of suction nozzles and their relative positions can be set according to actual needs. For example, the number of suction nozzles can be 8, 6, or 12, etc.; the angle between adjacent suction nozzles can be set accordingly according to the number of suction nozzles.

[0043] Figure 5 A partial schematic diagram of a turret type rotary placement head with a multi-way suction nozzle provided according to an embodiment Figure 1 .like Figure 4 and Figure 5 As shown, the adsorption component 400 includes: a nozzle mounting seat 420, a multi-channel rigid air pipe 430 and a sealing end cap 440. The sealing end cap 440 is covered at one end of the nozzle mounting seat, and the sealing end cap 440 seals the flexible air pipe 421 and the like in the nozzle mounting seat 420 to protect the flexible air pipe and the like from being damaged by external forces. One end of the multi-channel rigid air pipe is connected to the nozzle mounting seat, and the other end is connected to the vacuum logic component. The flexible air pipe is located in the cavity formed by the sealing end cap and the nozzle mounting seat.

[0044] The first suction nozzle 411, the second suction nozzle 412, the third suction nozzle 413 and the fourth suction nozzle 414 are located on the side wall surface of the suction nozzle mounting seat, and the suction nozzle mounting seat is used to fix the first suction nozzle 411, the second suction nozzle 412, the third suction nozzle 413 and the fourth suction nozzle 414, and make the adjacent suction nozzles form 90 degrees. The suction nozzles are connected to the suction nozzle mounting seat 420 through a flexible air pipe 421.

[0045] The nozzle mounting seat is connected to the direct drive motor 200, and the direct drive motor 200 can drive the nozzle mounting seat to rotate along the axial direction. The rigid air pipe passes through the direct drive motor 200, one end of which is connected to the flexible air pipe, and the other end is connected to the vacuum logic component.

[0046] In order to facilitate the connection between the flexible air pipe and the rigid air pipe, a multi-air path adapter block is also provided. One end of the multi-air path adapter block is connected to the flexible air pipe, and the other end of the multi-air path adapter block is connected to the rigid air pipe, so that the multi-air path adapter block realizes the connection between the flexible air pipe and the rigid air pipe.

[0047] Figure 6 Schematic diagram of the structure of a nozzle mounting base provided according to an embodiment. Figure 6 As shown, a plurality of suction nozzles are fixed on a suction nozzle mounting seat, one end of a flexible air tube is connected to the suction nozzle, and the other end of the flexible air tube is connected to a rigid air tube.

[0048] In order to fix the suction nozzle, the suction nozzle mounting seat 420 is provided with an air pipe mounting portion 423. The air pipe mounting portion 423 is arranged in an annular shape, and a plurality of through holes are arranged on its side wall, and the flexible air pipe 421 passes through the through holes and is connected to the suction nozzle.

[0049] The nozzle mounting base 420 is further provided with a fixing member 422, and the fixing member 422 fixes the flexible air tube 421 in the through hole to prevent the flexible air tube 421 from shaking in the through hole during rotation, thereby improving stability.

[0050] In some embodiments, an elastic member 4211 is further provided in the flexible air tube 421. The elastic member 4211 is located in the flexible air tube, and the end of the elastic member 4211 is connected to the suction nozzle, which is used to deform when the suction nozzle contacts the target semiconductor device, thereby reducing the stress of the suction nozzle on the target semiconductor device and preventing the target semiconductor device from being damaged due to excessive force.

[0051] In some embodiments, the nozzle mounting seat 420 is also provided with a base mounting portion 424, which is used to be fixedly connected to the direct drive motor 200 so that the direct drive motor 200 drives the nozzle mounting seat 420 and the nozzle and flexible air tube 421 fixed on the nozzle mounting seat to rotate.

[0052] The nozzle mounting seat is also provided with an air pipe protection portion 425, and the direct drive motor 200 is sleeved on the outer side of the air pipe protection portion. The rotating component of the direct drive motor 200 is fixedly connected to the base mounting portion 424 to rotate the nozzle mounting seat 420.

[0053] In some embodiments, the trachea protection part 425 is a hollow tubular structure, and the rigid trachea 430 is disposed inside the trachea protection part. One end of the rigid trachea is connected to the flexible trachea, and the other end is connected to the vacuum logic component.

[0054] The air pipe protection portion 425 penetrates the direct drive motor 200 and the mounting seat 100 so that the rigid air pipe 430 is connected to the flexible air pipe 421 and the vacuum logic component 300 .

[0055] In some embodiments, the diameter of the flexible air pipe is small and the adjacent distance is small, which makes it inconvenient to operate when connecting with the rigid air pipe. In order to achieve the connection between the flexible air pipe and the rigid air pipe, the present application also provides a multi-air path adapter block 600 for achieving the connection between the flexible air pipe and the rigid air pipe. Figure 7 FIG. 1 is a schematic diagram of the structure of a multi-gas path adapter block provided according to an embodiment. Figure 7 As shown, the multi-gas circuit adapter block 600 includes: an adapter component 610, a first gas circuit group 620 and a second gas circuit group 630. The first gas circuit group 620 and the second gas circuit group 630 are respectively located on both sides of the adapter component 610, wherein the first gas circuit group 620 is connected to the flexible air pipe 421, and the second gas circuit group 630 is connected to the rigid air pipe, and the gas circuit in the first gas circuit group is connected to the gas circuit in the second gas circuit group one-to-one. The multi-gas circuit adapter block increases the distance between the gas circuits and facilitates installation.

[0056] Figure 8 The figure is a schematic diagram of the structure of a vacuum logic component provided according to an embodiment. Fig. 9 FIG. 1 is a cross-sectional schematic diagram of a vacuum logic component provided according to an embodiment. Figure 8 and Fig. 9 As shown, the vacuum logic component 300 includes a first logic adapter board 310 , a second logic adapter board 320 and a plurality of vacuum logic valves 330 .

[0057] One end of the first logic adapter board 310 is connected to a rigid air pipe to increase the distance between adjacent air paths. For example, the input end of the first logic adapter board is connected to a rigid air pipe, which is provided with a ventilation pipe, so that the distance between the output end and the center of the rotating shaft is increased, and the distance between adjacent air paths is increased. The output end is provided with a plurality of valve holes, and the vacuum logic valve is provided in the valve hole of the first logic adapter board.

[0058] The other end of the first logic adapter board 310 is connected to the vacuum logic valve 330 so that the vacuum logic valve 330 is connected to its corresponding rigid air pipe, flexible air pipe, and suction nozzle.

[0059] The vacuum logic valve 330 is a device that can suppress the decrease in vacuum degree when there is no workpiece. Its working principle is as follows: in the initial state, due to the absence of air flow, the spring force opens the valve core, that is, the air path of the vacuum logic valve is in a closed state. When a workpiece is adsorbed, the suction flow rate decreases, the spring force opens the valve core, and the suction flow path between the valve core and the main body is open, that is, the air path of the vacuum logic valve is in an open state, so as to achieve the purpose of adsorbing the workpiece. When there is no workpiece adsorbed, the larger suction airflow closes the valve core, and the suction flow path inhales the corresponding air through the fixed throttle hole, thereby avoiding a significant decrease in vacuum degree.

[0060] In some embodiments, the number of vacuum logic valves 330 is consistent with the number of rigid air pipes, that is, the vacuum logic valves, rigid air pipes, flexible air pipes, and suction nozzles correspond to each other. One suction nozzle corresponds to one flexible air pipe, and the flexible air pipe changes the airflow direction so that different suction nozzles face different directions.

[0061] In some embodiments, a first side of the second logic adapter board 320 is provided with a plurality of logic valve connection holes for communicating with the vacuum logic valve. A tracheal through hole 321 is provided on the second side of the second logic adapter board 320, and the rotary joint 500 is connected to the second logic adapter board 320 through a tracheal through hole 321. An air groove 322 is provided inside the second logic adapter board 320, and the air groove 322 is communicated with the logic valve connection hole and the tracheal through hole, so that the rotary joint 500 is connected with the plurality of vacuum logic valves, and a vacuum adsorption pipeline is used to evacuate the plurality of air paths.

[0062] In some embodiments, the axial distance between the first suction nozzle and the rotating shaft is equal to the axial distance between the first suction nozzle and the rotating shaft, which facilitates positioning and adsorption after rotation.

[0063] Fig.10 A cross-sectional view of a turret type rotary placement head with a multi-channel suction nozzle provided according to an embodiment Figure 2 . Fig.10 The arrow in the middle indicates the direction of gas flow. Fig.10 As shown, the first suction nozzle 411, the first flexible air tube 4211, the first rigid air tube 431, and the first vacuum logic valve 331 constitute the first air circuit, and the gas flow direction therein is as shown in the figure. The second suction nozzle, the second flexible air tube, the second rigid air tube, and the second vacuum logic valve constitute the second air circuit. The third suction nozzle 413, the third flexible air tube 4213, the third rigid air tube 4331, and the third vacuum logic valve 333 constitute the third air circuit, and the gas flow direction therein is as shown in the figure. The fourth suction nozzle, the fourth flexible air tube, the fourth rigid air tube, and the fourth vacuum logic valve constitute the fourth air circuit. The first air circuit, the second air circuit, the third air circuit, and the fourth air circuit converge at the air groove 322 of the second logic adapter plate 320 to form an adsorption air circuit, and then the rotary joint 500 is used to realize the vacuumization of multiple air circuits using one vacuum adsorption pipeline.

[0064] The vacuum logic valve 330 is a device that can suppress the decrease in vacuum degree when there is no workpiece, and its working principle is: in the initial state, due to the absence of air flow, the spring force opens the valve core, that is, the air path of the vacuum logic valve is in a closed state. When a workpiece is adsorbed, the suction flow rate decreases, the spring force opens the valve core, and the suction flow path between the valve core and the main body is open, that is, the air path of the vacuum logic valve is in an open state, so as to achieve the purpose of adsorbing the workpiece. When there is no workpiece adsorbed, the larger suction airflow closes the valve core, and the suction flow path sucks in the corresponding air through the fixed throttle hole, thereby avoiding a significant decrease in vacuum degree. Therefore, the turret-type rotary mounting head with multi-channel suction nozzles provided in the present application, the vacuum logic component is located between the suction nozzle and the rotary joint, and each channel has an independent vacuum switch logic function, so as to avoid the problem that when there is no device adsorbed in other channels, the vacuum degree decreases and the device cannot be adsorbed or the absorption is unstable due to the opening of the vacuum channel.

[0065] The embodiment of the present application provides a turret-type rotary placement head with multiple suction nozzles, including: a mounting seat, a direct-drive motor, an adsorption component, a vacuum logic component and a rotary joint. Among them, the adsorption component includes: a suction nozzle mounting seat, at least two suction nozzles, a flexible air pipe and a rigid air pipe. The suction nozzle mounting seat includes: an air pipe mounting part, in which the flexible air pipe is located; a base mounting part is fixedly connected to the direct-drive motor so that the direct-drive motor drives the suction nozzle mounting seat and the suction nozzle and the flexible air pipe fixed on the suction nozzle mounting seat to rotate; an air pipe protection part, in which the direct-drive motor is arranged on the outside of the air pipe protection part, and the rigid air pipe is located inside the air pipe protection part. The vacuum logic component is used for vacuum logic control of the suction nozzle. The vacuum logic component is also connected to the rotary joint so that each air path has an independent vacuum switch logic function to avoid the problem that when there is no device adsorption in other paths, the vacuum degree drops and the device cannot be adsorbed or the adsorption is unstable due to the opening of the vacuum channel. The direct-drive motor makes the suction nozzle rotate in a direction to achieve sideways or inverted.

[0066] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other, and will not be elaborated in detail here.

Claims

1. A turret type rotary placement head with multiple nozzles, characterized in that: include: Mounting seat, A direct drive motor is fixed on the mounting seat; An adsorption component, fixedly connected to the direct drive motor; A vacuum logic component is connected to the direct drive motor, and the direct drive motor drives the adsorption component and the vacuum logic component to rotate; Wherein, the adsorption component comprises: a nozzle mounting seat, at least two nozzles, a flexible air pipe and a rigid air pipe; The nozzle mounting seat comprises: An air pipe installation portion, wherein the flexible air pipe is located in the air pipe installation portion; A base mounting portion, fixedly connected to the direct drive motor, so that the direct drive motor drives the nozzle mounting seat and the nozzle fixed on the nozzle mounting seat and the flexible air pipe to rotate; A trachea protection part, wherein the direct drive motor is arranged outside the trachea protection part, and the rigid trachea is located inside the trachea protection part; The vacuum logic component is used for vacuum logic control of the suction nozzle, and the vacuum logic component is also connected to the rotary joint.

2. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: The vacuum logic component comprises: A first logic adapter board, whose input end is connected to the rigid air pipe, and a ventilation duct is provided inside the first logic adapter board to increase the distance between adjacent air paths; a first vacuum logic valve, the first vacuum logic valve being in communication with a first rigid air pipe; a second vacuum logic valve, the second vacuum logic valve being in communication with a second rigid air pipe; And, a second logic adapter plate, a first side of which is provided with a plurality of logic valve connection holes for communicating with the vacuum logic valve; a second side of which is provided with an air pipe through hole, and the rotary joint is connected to the second logic adapter plate through the air pipe through hole; An air groove is provided inside the second logic adapter plate, and the air groove is communicated with the logic valve connecting hole and the air pipe through hole, so as to connect the rotary joint with the plurality of vacuum logic valves.

3. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: The adsorption component further comprises: a sealing end cover, which is covered on one end of the suction nozzle mounting seat, and the flexible air pipe is located in a cavity formed by the sealing end cover and the suction nozzle mounting seat.

4. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: The nozzle comprises: a first suction nozzle, a second suction nozzle, a third suction nozzle and a fourth suction nozzle; and an angle between adjacent suction nozzles is 90°.

5. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: Also includes: A multi-gas-path adapter block is located between the flexible gas pipe and the rigid gas pipe, and the multi-gas-path adapter block comprises: an adapter component, a first gas path group and a second gas path group; The first gas circuit group and the second gas circuit group are respectively located on both sides of the adapter component, wherein the first gas circuit group is connected to the flexible air pipe, and the second gas circuit group is connected to the rigid air pipe.

6. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: The mounting seat comprises a supporting component and a mounting component, wherein one end of the supporting component is fixedly connected to the direct drive motor, and the other end is connected to the mounting component.

7. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: The air pipe mounting portion is arranged in an annular shape, and a plurality of through holes are arranged on its side wall, and the flexible air pipe passes through the through holes and is connected to the suction nozzle; The nozzle mounting seat is also provided with a fixing piece, and the fixing piece fixes the flexible air pipe in the through hole.

8. The turret type rotary placement head with multi-way suction nozzles according to claim 1, characterized in that: An elastic member is provided at one end of the suction nozzle, which is used to deform when the suction nozzle contacts the target semiconductor device.

Images