Wafer splitting mechanism

Abstract

The utility model discloses a wafer splitting mechanism which comprises a workbench, a manipulator for grabbing a workpiece is arranged on the workbench, a rotatable circular ring for placing the workpiece is arranged on the workbench, a bottom bearing platform capable of moving in the Y direction is arranged in the circular ring, and a chopper capable of moving in the Z direction is arranged above the bottom bearing platform. According to the invention, the special-shaped chopper is manufactured, and the shape of the blade is designed according to the arrangement of chips. And two or more choppers are arranged on the same splitting machine, so that the whole piece of product can be split at one time without damaging the cutting edges of the choppers. The splitting in the first direction is adopted for the first time, the splitting in the second direction is adopted for the second time, manual contact with a wafer is not needed in the process, the working efficiency and the product quality can be greatly improved, and the problems that a traditional chopper can only split a straight line, cannot automatically work a similar chip special-shaped structure shown in the figure, can only split the chip manually, and can not work automatically are solved. The manual steps are too many in the operation process, and automation cannot be achieved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a wafer splitting mechanism. Background Art

[0002] The wafer splitting machine is used to split the wafer into individual grains for subsequent packaging operations. Before the wafer is split, the back of the wafer will be attached to a cutting film, and then the horizontal and vertical laser cutting lines will be cut by laser to form countless discontinuous pores on the surface of the wafer. After a protective film is covered on the top of the wafer for protection, it is sent to a wafer splitting machine for splitting operation.

[0003] However, during the early stage of wafer proofing and testing, wafers are usually made into multi-item wafer structures, that is, chips of different sizes appear on the same wafer. At this time, laser cutting will perform special-shaped cutting, but the splitting knife is always a straight line, so when splitting, the uncut area will damage the splitting knife. Or the wafers are split in advance, and then split in blocks after splitting, which will greatly reduce the operating efficiency. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a wafer splitting mechanism, which realizes the automatic splitting of special-shaped structures by splitting in steps, and solves the problem that the traditional splitting knife can only split a straight line and cannot perform automatic operations. Figure 1 The chip with special-shaped structure shown in the figure can only be processed by manual splitting and slicing. There are too many manual steps in the operation process and automation cannot be achieved.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a wafer splitting mechanism, including a workbench, on which is a manipulator for grabbing workpieces, the workbench has a rotatable ring for placing workpieces, the ring has a bottom support that can move in the Y direction, and above the bottom support is a splitting knife that can move in the Z direction.

[0006] It is further defined that, in the above-mentioned wafer splitting mechanism, the number of the rings on the workbench is not less than two.

[0007] It is further defined that in the above-mentioned wafer splitting mechanism, the outer side of the circular ring is a gear structure and meshes with the gear on the output shaft of the driving motor on the workbench to realize transmission.

[0008] It is further defined that, in the above-mentioned wafer splitting mechanism, the bottom support platform is moved by the cooperation of a servo motor at its bottom and a guide rail on the workbench.

[0009] It is further defined that in the above-mentioned wafer splitting mechanism, the circular ring has positioning needles and a vacuum adsorption structure distributed around it.

[0010] It is further defined that, in the above-mentioned wafer splitting mechanism, the distance between the two seats of the bottom support platform is 1 / 4 of the width of the cutting path.

[0011] The utility model has the following beneficial effects: the application manufactures a special-shaped splitting knife, the shape of the blade is designed according to the chip arrangement. Two or more splitting knives are configured on the same splitting machine, so that the whole product can be split at one time without damaging the blade of the splitting knife. That is, the first splitting direction is used, and the second splitting direction is used. During the process, there is no need to manually touch the wafer, which can greatly improve the operation efficiency and product quality, and solve the problem that the traditional splitting knife can only split a straight line and cannot be automated. Figure 1 The chip with special-shaped structure shown in the figure can only be processed by manual splitting and slicing. There are too many manual steps in the operation process and automation cannot be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the chip layout;

[0013] Figure 2 A schematic diagram of the structure of the special-shaped splitting knife of the utility model;

[0014] Figure 3 Another structural schematic diagram of the special-shaped splitting knife of the utility model;

[0015] Figure 4 This is a schematic diagram of the application work.

[0016] In the figure: 1. lifting mechanism; 2. cylinder; 3. manipulator; 4. iron ring; 5. wafer; 6. splitting knife; 61. blade; 7. positioning pin; 8. guide rail; 9. ring; 10. driving motor; 11. telescopic mechanism; 12. bottom support platform. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-4The utility model provides a technical solution: a wafer splitting mechanism, including a workbench, on which a manipulator 3 for grabbing a workpiece is arranged, the manipulator 3 realizes movement in the X direction through a telescopic mechanism 11, and realizes lifting in the Z direction through a cylinder 2 at the end of the telescopic mechanism 11, and the workbench has no less than two rings 9 for placing the workpiece, the outer side of the ring 9 is a gear structure, and the gear structure is meshed with the gear on the output shaft of the driving motor 10 of the workbench to realize transmission, so that the ring 9 can rotate, and the ring 9 has surrounding positioning pins 7 and a vacuum adsorption structure.

[0019] A guide rail 8 is provided inside the circular ring 9, and a bottom support 12 is connected to the guide rail 8 through a servo motor drive to realize Y-direction movement. A riving knife 6 that can move along the Z direction is provided above the bottom support 12. The lifting and lowering of the riving knife 6 is driven by a lifting mechanism 1. The lifting mechanism 1 can use a servo motor to drive the lead screw to rotate and drive the bracket mounted on the slide bar to realize Z-direction movement. The distance between the two seats of the bottom support 12 is 1 / 4 of the cutting path width.

[0020] The specific operation process is as follows: first, the robot 3 grabs the iron ring 4 and places it on the first ring 9 of the workbench. The middle of the iron ring 4 is a film, on which there is a wafer 5. There are four positioning pins 7 on the ring 9. The positioning pins 7 fall down after sensing the iron ring 4, and absorb vacuum for positioning. The bottom support 12 moves with the splitter 6 to the position where the splitting is required, so as to Figure 2 Taking the splitting knife 6 as an example, the splitting knife 6 moves to the cutting path position of the bottom support platform 12 and presses down to split the product that needs to be split. The splitting knife 6 splits from the top of the wafer 5 to the bottom and then rises, and then the ring 9 rotates 90°, and the splitting knife 6 splits from the top of the wafer 5 to the bottom. During the whole process, the splitting knife 6 can only move up and down in the Z direction, and the splitting knife 6 and the bottom support platform 12 can only move in the X direction.

[0021] After completion, the four positioning pins 7 on the disc rise, lift up the iron ring 4, and the arm grabs the iron ring 4 and moves it to the second ring 9. The structure of the second ring 9 is the same, except that the structure and size of the blades 61 of the two choppers 6 are changed to Figure 3 As shown, the operation method is the same as that of the first circular ring 9, and the step distance in the process is different, which varies with the product design. After the operation is completed, the arm grabs the iron ring 4 to cut the material.

[0022] First Figure 2 The cleaver has 6 lobes, and then Figure 3 The splitting knife 6 is then used for splitting. The stepping amplitudes of the two splitting knives are different. The Y-direction cutting paths are all completed before the rotation of 90° is performed. The blades of the two splitting knives 6 are complementary, so the splitting in another direction will not be affected.

[0023] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer splitting mechanism, comprising a workbench, on which is disposed a manipulator (3) for grasping a workpiece, characterized in that: The workbench is provided with a rotatable ring (9) for placing workpieces, the ring (9) is provided with a bottom support (12) movable in the Y direction, and a splitting knife (6) movable in the Z direction is provided above the bottom support (12).

2. A wafer splitting mechanism according to claim 1, characterized in that: The number of the circular rings (9) on the workbench is not less than two.

3. A wafer splitting mechanism according to claim 1, characterized in that: The outer side of the circular ring (9) is a gear structure and meshes with the gear on the output shaft of the driving motor (10) on the workbench to realize transmission.

4. A wafer splitting mechanism according to claim 1, characterized in that: The bottom support platform (12) is moved by the cooperation of a servo motor at the bottom thereof and a guide rail (8) on the workbench.

5. The wafer splitting mechanism according to claim 1, characterized in that: The circular ring (9) is provided with positioning needles (7) distributed around it and a vacuum adsorption structure.

6. The wafer splitting mechanism according to claim 1, characterized in that: The distance between the two seats of the bottom support platform (12) is 1 / 4 of the width of the cutting path.

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