Sum difference network SMP sintering tool

Abstract

The utility model relates to the technical field of SMP connector sintering, in particular to a sum-difference network SMP sintering tool. According to the technical scheme, the sum-difference network SMP sintering tool comprises a substrate, an SMP connector, a positioning pin, a clamping groove and a protruding block, the clamping groove is formed in the SMP connector, the positioning pin is placed in the clamping groove, and the SMP connector is placed on the substrate in a limited mode through the positioning pin. According to the utility model, the perpendicularity and the height of six SMP connectors can be solved when the SMP connectors are sintered at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of SMP connector sintering, in particular to a sum-difference network SMP sintering tool. Background Art

[0002] When the SMP connector is sintered, it is mainly observed by naked eyes whether the 6 connectors are vertical and the heights are consistent. The problems are: it is not possible to simultaneously ensure that the verticality and height of the 6 SMP connectors are qualified after sintering. As a result, the tilt degree and tilt direction of each connector are inconsistent, and the height is also different, resulting in the SMP connector not being able to fit tightly and securely with the TR component. Sometimes the connector is broken and damaged. In this case, the damaged connector must be reheated and removed, and a new connector is sintered. This may cause other normal connectors to change their original normal state due to heating, resulting in tilting and other phenomena.

[0003] The main reasons for the above problems are: bubbles generated when the lead tin melts during sintering make the state of each connector inconsistent, and the sintering time cannot be too long. After more than 15 seconds, the lead tin will automatically cover the entire plug-in part of the connector as the heat increases, resulting in scrap. Therefore, the sintering personnel cannot ensure the verticality and height of the 6 connectors at the same time. Summary of the invention

[0004] The utility model provides a sum-difference network SMP sintering tool, which solves the above-mentioned technical problems.

[0005] The utility model solves the above-mentioned technical problems as follows:

[0006] A SMP sintering tool comprises a substrate, an SMP connector, a positioning pin, a slot and a bump. The SMP connector is provided with a slot in which a positioning pin is placed. The SMP connector is limitedly placed on the substrate by the positioning pin.

[0007] On the basis of the above technical solution, the present invention can also be improved as follows.

[0008] Furthermore, the SMP connector is provided with a protrusion, and the SMP connector is mounted on the substrate by the protrusion and the slot being engaged with each other and limited in position.

[0009] The beneficial effects of adopting the above further scheme are:

[0010] Strong connection: The design of the bump and slot provides a strong connection, ensuring that the SMP connector is firmly mounted on the substrate. This has good resistance to vibration and shock that may exist in the working environment.

[0011] Limit installation: Through the mutual engagement of the bump and the slot, the tooling achieves effective limit installation. This ensures the accurate position of the SMP connector on the substrate and prevents accidental displacement during use, especially in high-frequency or high-voltage applications that require precise positioning.

[0012] Convenient assembly process: The design of the bump and slot simplifies the assembly process of the tooling. The staff can install the SMP connector on the substrate relatively easily, which improves the efficiency of assembly.

[0013] Easy to disassemble and maintain: Compared with some complicated connection methods, the design of bumps and slots makes the SMP connector relatively easy to disassemble. This is very beneficial for maintenance and replacement of parts.

[0014] Suitable for high-density layout: Since the bumps and slots can be designed relatively compactly, the tooling can be suitable for high-density layout and effectively utilize space.

[0015] In general, this design achieves the advantages of firm connection, limited installation, convenient assembly and easy maintenance through a simple and effective bump and slot connection method, making the tooling more reliable and flexible in use.

[0016] Furthermore, a through hole is formed through the protrusion of the SMP connector, and the SMP connector is further limited in its installation position by plugging the through hole and the positioning pin into each other.

[0017] The beneficial effects of adopting the above further scheme are:

[0018] Precise installation position: By setting through holes on the SMP connector so that it can be plugged into the positioning pins, the accuracy of the tooling in determining the installation position of the SMP connector is further improved. This is very important for applications that require highly precise positioning.

[0019] Multi-level position limit system: This design is combined with the previously mentioned stopper system of the bump and the slot to form a multi-level position limit. This multiple limit system effectively prevents any possible position deviation of the SMP connector during use.

[0020] Enhanced system stability: By further limiting the mounting position, the system stability is enhanced. This is critical for signal transmission and device performance stability in high-frequency or high-voltage applications.

[0021] Improve the system's ability to resist vibration: The design of the positioning pin and through hole helps to improve the tooling system's ability to resist vibration. This is very important for some applications that need to work in harsh environments.

[0022] Simplified assembly process: Despite providing higher positioning accuracy, the design of through holes and locating pins does not add excessive complexity. Therefore, it can still maintain a relatively simple and easy-to-operate assembly process.

[0023] In general, by setting through holes on the SMP connector and plugging the through holes with the positioning pins, the tooling can further limit the installation position, improve the stability and accuracy of the system, and is suitable for high-performance applications with high positioning requirements.

[0024] Furthermore, the card slots are evenly distributed on the substrate.

[0025] The beneficial effects of adopting the above further scheme are:

[0026] Evenly distributed force: The even distribution of the card slots helps to evenly distribute the force of mounting on the substrate. This is critical to ensure the stability and reliability of the connector, especially in an environment subject to external forces or vibrations.

[0027] Reduce stress concentration: Uniformly distributed slots can effectively reduce stress concentration problems. In certain high-frequency, high-pressure or high-vibration applications, stress concentration may cause component fatigue and failure, and uniform distribution can reduce this risk.

[0028] Improve overall structural strength: The uniform distribution of the slots helps improve the overall structural strength. This is very important to ensure that the tooling can firmly support the SMP connector in various working environments and prevent deformation or cracking.

[0029] Enhanced fault tolerance: With uniform distribution, the tooling can more easily adapt to different shapes and sizes of SMP connectors, increasing the fault tolerance of the system. This is of great significance when facing different types or specifications of connectors in actual applications.

[0030] Simplify the manufacturing process: The evenly distributed slot design can be easier to implement during the manufacturing process. Relatively uniform structural design is usually easier to control and maintain, which helps to improve manufacturing efficiency.

[0031] Overall, the uniform distribution of the card slots on the substrate helps improve the stability, reliability and adaptability of the system, reduces the risk of stress concentration, and simplifies the manufacturing process. Such a design is suitable for various application scenarios that require high performance and stability.

[0032] Furthermore, the position and size of the protrusion correspond one-to-one to the slot.

[0033] The beneficial effects of adopting the above further scheme are:

[0034] Precise positioning: The position and size of the bumps correspond to the slots one by one, ensuring the precise positioning of the connector on the substrate. This is very important for applications that require high accuracy and reliability.

[0035] Stable connection: By ensuring that the protrusions match the slots one by one, the connector can be firmly installed in the correct position. This helps prevent position shifting under vibration, shock or other external forces, and improves the stability of the connection.

[0036] Avoid installation errors: The position and size of the bumps correspond to the slots one by one, reducing the possibility of installation errors. This is crucial to improving assembly efficiency, reducing adjustment time and avoiding unnecessary damage.

[0037] Simplified installation process: With the one-to-one correspondence between the bumps and the slots, installation becomes more intuitive and simplified. The staff does not need to make too many adjustments or checks, making the entire installation process more efficient.

[0038] Increase system stability: The precise alignment of the bumps ensures the stability of the connector, especially in industrial applications that need to resist external environmental interference. This is critical to maintaining consistency and stability of system performance.

[0039] Improve production consistency: By ensuring that the bumps correspond to the slots one by one, the consistency of production can be increased, ensuring that each component is installed in the same position, thereby improving the overall product quality.

[0040] In general, the design of one-to-one correspondence between the position and size of the bump and the slot helps to achieve highly accurate positioning and stable connection, improving the reliability, consistency and production efficiency of the system. This design is suitable for various tools and devices that require high connection accuracy and stability.

[0041] Furthermore, bosses are evenly arranged on the substrate, and gaps are left between the bosses, and the SMP connector is supported on the substrate via the bosses.

[0042] The beneficial effects of adopting the above further scheme are:

[0043] Effective heat dissipation design: The uniform distribution of the bosses and the gaps between the bosses help improve the heat dissipation effect of the system. This can prevent overheating and keep the device operating within the appropriate temperature range for components that may require heat dissipation, such as SMP connectors.

[0044] Increased air flow: The gaps between the bosses promote air flow, thereby improving heat dissipation. This is especially important for devices that require effective heat dissipation in high-load or high-frequency applications.

[0045] Reduced temperature gradient: Good heat dissipation design reduces the temperature gradient on the substrate. This helps avoid performance degradation or shortened device life due to excessively high temperatures in some areas.

[0046] Improve system stability: Effective heat dissipation design helps maintain a stable operating temperature of the SMP connector and other components, thereby improving the stability and reliability of the entire system.

[0047] Simplified maintenance process: The SMP connector is placed on the substrate through a boss, which makes the connector easier to access and maintain. When the connector needs to be replaced or maintained, the operator can operate more conveniently.

[0048] Improve mechanical strength: The evenly distributed boss design can improve the mechanical strength of the substrate, increase the system's resistance to external shock and vibration, and reduce the risk of mechanical damage.

[0049] Strong adaptability: The uniform distribution of bosses and the design with gaps make it easier for the tooling to adapt to SMP connectors of different sizes and shapes, increasing the flexibility and versatility of the system.

[0050] In general, the design of evenly arranged bosses and reserved gaps on the substrate provides good heat dissipation, improves the stability and reliability of the system, and also increases the convenience of operation and the adaptability of the system. This design is suitable for various application scenarios with high requirements for thermal management.

[0051] Furthermore, the positioning pin is fixed on the base plate through a thread or a nut.

[0052] The beneficial effects of adopting the above further scheme are:

[0053] Secure connection: The dowel pins are securely connected to the substrate by means of threads or nuts. This helps ensure that connectors and other components are not prone to loosening or falling off during use.

[0054] Precise positioning: The thread or nut fixing method provides a relatively accurate positioning method. This is very important for high-precision applications that have strict requirements on the connector position.

[0055] Easy to adjust: Due to the characteristics of the thread structure, the fixation of the locating pin can be achieved by adjusting the depth of the thread. This makes it easy to make fine adjustments during assembly to ensure the optimal positioning of the connector.

[0056] Convenient maintenance: The use of threaded or nut fixing methods makes the positioning pin relatively easy to remove. This helps maintenance personnel to operate more conveniently when replacement or repair is required.

[0057] Strong adaptability: The fixing method of thread or nut has certain flexibility in adapting to substrates of different thicknesses or materials, which increases the adaptability of the system.

[0058] Improve overall stability: The strong connection of the dowel pin helps improve the stability of the entire system. This is especially critical for equipment operating in vibration or shock environments.

[0059] Not susceptible to external interference: Compared with other simple fixing methods, the fixing method using threads or nuts is less susceptible to external forces, which increases the system's anti-interference ability.

[0060] In general, the design of the locating pin fixed to the substrate by threads or nuts provides the advantages of firm connection, precise positioning, easy adjustment and maintenance, and is suitable for various application scenarios that require high requirements on the connector position and strong connection.

[0061] The beneficial effects of the utility model are:

[0062] Reliable connection design: The SMP connector is combined with the card slot and bump of the substrate to ensure a secure connection. This is particularly important for high-frequency or high-voltage applications, as a stable connection can reduce signal attenuation and prevent system failure.

[0063] High precision: The use of dowel pins, especially when fixed by threads or nuts, allows the tooling to be installed with a high degree of precision. This is important for applications that require high-precision positioning, such as microelectronics manufacturing.

[0064] Convenient installation and maintenance: The tooling design of the slot and bump allows the SMP connector to be easily plugged in and out. This facilitates quick assembly and maintenance, reduces downtime, and improves production efficiency.

[0065] Multi-level position limiting system: The design of slots, bumps, positioning pins and through holes cooperates with each other to achieve multiple position limiting. Such a multi-level design ensures the high stability of the tooling during use and effectively prevents position deviation caused by vibration or external force.

[0066] Good heat dissipation effect: The base plate is evenly provided with bosses, which provide a certain heat dissipation surface. This helps maintain the appropriate operating temperature for electronic components in the tooling that need heat dissipation, and improves the stability and reliability of the system.

[0067] Strong adaptability: The design of leaving gaps between the bosses in the tooling makes it more adaptable and can adapt to SMP connectors of different sizes and shapes, improving the versatility of the tooling.

[0068] The accuracy of position definition is further improved: by plugging the through hole and the positioning pin into each other, the installation position is further defined, thereby increasing the accuracy and stability of the system.

[0069] In general, the advantages of this tooling design are reflected in many aspects such as stable connection, precise positioning, easy installation, multi-level position limitation, and good heat dissipation, which enable it to have excellent performance in the SMP sintering application of the sum and difference networks.

[0070] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiment of the utility model with the accompanying drawings. The specific implementation method of the utility model is given in detail by the following embodiments and their drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0072] In the attached picture:

[0073] Figure 1 This is a schematic diagram of the axial appearance of the utility model;

[0074] Figure 2 This is a schematic diagram of the axial appearance of the substrate of the utility model;

[0075] Figure 3 This is a schematic diagram of the axial appearance of the SMP connector of the utility model;

[0076] Figure 4 It is a schematic diagram of the axial half-section structure of the utility model.

[0077] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0078] 1. Substrate; 2. SMP connector; 3. Positioning pin; 4. Card slot; 5. Bump. Implementation

[0079] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0080] See also Figures 1 to 4As shown, the embodiment provided by the utility model.

[0081] Example 1

[0082] A SMP sintering tool for a sum-difference network includes a substrate 1, an SMP connector 2, a positioning pin 3, a slot 4 and a bump 5. The SMP connector 2 is provided with a slot 4, which is evenly distributed on the substrate 1. The even distribution of the slots 4 helps to evenly distribute the force installed on the substrate 1. This is crucial to ensure the stability and reliability of the connector, especially in an environment subject to external force or vibration. Evenly distributed slots 4 can effectively reduce the problem of stress concentration. In certain high-frequency, high-pressure or high-vibration applications, stress concentration may cause fatigue and failure of components, and even distribution can reduce this risk. Even distribution of the slots 4 helps to improve the strength of the overall structure. This is very important to ensure that the tool can firmly support the SMP connector 2 in various working environments to prevent deformation or cracking. In the case of even distribution, the tool is more easily adapted to different shapes and sizes of the SMP connector 2, increasing the fault tolerance of the system. This is of great significance when facing connectors of different models or specifications in practical applications. The design of evenly distributed slots 4 can be more easily implemented during the manufacturing process. Relatively even structural designs are usually easier to control and maintain, which helps to improve manufacturing efficiency. In general, the uniform distribution of the card slot 4 on the substrate 1 helps to improve the stability, reliability and adaptability of the system, reduce the risk of stress concentration, and simplify the manufacturing process. Such a design is suitable for various application scenarios requiring high performance and stability. The SMP connector 2 is provided with a bump 5, and the position and size of the bump 5 correspond to the card slot 4 one by one. The position and size of the bump 5 correspond to the card slot 4 one by one, ensuring the precise positioning of the connector on the substrate 1. This is very important for application scenarios that require high accuracy and reliability. By ensuring that the bump 5 corresponds to the card slot 4 one by one, the connector can be firmly installed in the correct position. This helps prevent position displacement under vibration, impact or other external forces, and improves the stability of the connection. The position and size of the bump 5 correspond to the card slot 4 one by one, reducing the possibility of installation errors. This is crucial to improving assembly efficiency, reducing adjustment time, and avoiding unnecessary damage. Through the one-to-one correspondence between the bump 5 and the card slot 4, the installation becomes more intuitive and simplified. The staff does not need to make too many adjustments or checks, making the entire installation process more efficient. The precise correspondence of the bump 5 ensures the stability of the connector, especially in industrial applications that need to resist external environmental interference. This is essential to maintaining the consistency and stability of system performance. By ensuring that the bumps 5 correspond one-to-one with the slots 4, the consistency of production can be increased, ensuring that each component is installed in the same position, thereby improving the overall product quality. In general, the design of the one-to-one correspondence between the position and size of the bumps 5 and the slots 4 helps to achieve highly accurate positioning and stable connection, improving the reliability, consistency and production efficiency of the system.This design is suitable for various tools and devices that require high connection accuracy and stability. The SMP connector 2 is installed on the substrate 1 by the mutual engagement of the protrusion 5 and the card slot 4. The engagement design of the protrusion 5 and the card slot 4 can provide a firm connection to ensure that the SMP connector 2 is firmly installed on the substrate 1. This has good resistance to vibration and impact that may exist in the working environment. Through the mutual engagement of the protrusion 5 and the card slot 4, the tooling achieves effective limited installation. This ensures the accurate position of the SMP connector 2 on the substrate 1 and prevents accidental displacement during use, especially in high-frequency or high-voltage applications that require precise positioning. The design of the protrusion 5 and the card slot 4 simplifies the assembly process of the tooling. The staff can relatively easily install the SMP connector 2 on the substrate 1, which improves the efficiency of assembly. Compared with some complex connection methods, the design of the protrusion 5 and the card slot 4 makes the SMP connector 2 relatively easy to disassemble. This is very beneficial for maintenance and replacement of components. Since the protrusion 5 and the card slot 4 can be designed relatively compactly, the tooling can be applied to high-density layouts and effectively utilize space. In general, this design scheme achieves the advantages of firm connection, limited installation, convenient assembly and easy maintenance through a simple and effective way of clamping the protrusion 5 with the slot 4, making the tooling more reliable and flexible in use. A positioning pin 3 is placed in the slot 4, and the positioning pin 3 is fixed to the substrate 1 by a thread or a nut. By adopting the fixing method of a thread or a nut, the positioning pin 3 can be firmly connected to the substrate 1. This helps to ensure that the connector and other components are not easy to loosen or fall off during use. The fixing method of a thread or a nut provides a more accurate positioning method. This is very important for high-precision applications with strict requirements on the position of the connector. Due to the characteristics of the thread structure, the fixing of the positioning pin 3 can be achieved by adjusting the depth of the thread. This makes it easy to make fine adjustments during the assembly process to ensure the optimal positioning of the connector. The fixing method of a thread or a nut makes the positioning pin 3 relatively easy to disassemble. This helps maintenance personnel to operate more conveniently when replacement or maintenance is required. The fixing method of a thread or a nut has a certain flexibility for adapting to substrates 1 of different thicknesses or materials, which increases the adaptability of the system. The firm connection of the positioning pin 3 helps to improve the stability of the entire system. This is especially critical for devices that work in vibration or shock environments. Compared with other simple fixing methods, the use of threaded or nut fixing methods is less susceptible to external forces, increasing the system's anti-interference ability.In general, the design of fixing the locating pin 3 on the substrate 1 by threads or nuts provides the advantages of firm connection, precise positioning, easy adjustment and maintenance, and is suitable for various application scenarios with high requirements for connector position and strong connection. The SMP connector 2 is placed on the substrate 1 by the locating pin 3. The SMP connector 2 is provided with a through hole at the protrusion 5. The SMP connector 2 is further limited in the installation position by plugging with the locating pin 3 through the through hole. By setting the through hole on the SMP connector 2, it can be plugged with the locating pin 3, which further improves the precision of the tooling to define the installation position of the SMP connector 2. This is very important for applications that require highly precise positioning. This design is combined with the aforementioned limit system of the protrusion 5 and the card slot 4 to form a multi-level position definition. This multiple definition system effectively prevents any possible position deviation of the SMP connector 2 during use. By further defining the installation position, the stability of the system is enhanced. This is crucial for signal transmission and stability of equipment performance in high-frequency or high-voltage applications. The plug-in design of the locating pin 3 and the through hole helps to improve the vibration resistance of the tooling system. This is very important for some applications that need to work in harsh environments. Although higher limiting accuracy is provided, the design of the through hole and the positioning pin 3 does not add too much complexity. Therefore, it can still maintain a relatively simple and easy-to-operate assembly process. In general, by setting a through hole on the SMP connector 2 and plugging the through hole and the positioning pin 3 into each other, the tooling realizes further limitation of the installation position, improves the stability and accuracy of the system, and is suitable for high-performance applications with high positioning requirements. The substrate 1 is evenly provided with bosses, and there are gaps between the bosses. The SMP connector 2 is placed on the substrate 1 through the bosses. The uniform distribution of the bosses and the gaps between the bosses help to improve the heat dissipation effect of the system. This can prevent overheating for components such as the SMP connector 2 that may need heat dissipation and keep the device working within an appropriate temperature range. The gaps between the bosses can promote air circulation, thereby improving the heat dissipation effect. This is particularly important for devices that require effective heat dissipation in high-load or high-frequency applications. Through good heat dissipation design, the temperature gradient on the substrate 1 is reduced. This helps to avoid the problem of performance degradation or shortened device life due to excessively high temperatures in some areas. Effective heat dissipation design helps maintain a stable operating temperature of the SMP connector 2 and other components, thereby improving the stability and reliability of the entire system. The SMP connector 2 is placed on the substrate 1 through a boss, which makes the connector easier to access and maintain. When the connector needs to be replaced or maintained, the operator can operate more conveniently. The evenly distributed boss design can improve the mechanical strength of the substrate 1, increase the system's resistance to external shock and vibration, and reduce the risk of mechanical damage.The uniform distribution of bosses and the design with gaps make it easier for the tooling to adapt to SMP connectors 2 of different sizes and shapes, increasing the flexibility and versatility of the system. In general, the design of evenly distributing bosses on the substrate 1 and retaining gaps provides a good heat dissipation effect, improves the stability and reliability of the system, and also increases the convenience of operation and the adaptability of the system. This design is suitable for various application scenarios with high requirements for thermal management.

[0083] When a sum-difference network SMP sintering tooling based on Example 1 is used:

[0084] Reliable connection design: The SMP connector 2 is combined with the slot 4 and the bump 5 of the substrate 1 to ensure a secure connection. This is particularly important for high-frequency or high-voltage applications, as a stable connection can reduce signal attenuation and prevent system failures.

[0085] High precision: The use of the locating pin 3, especially by fixing with a thread or a nut, allows the tooling to be installed with high precision, which is of great significance for applications requiring high-precision positioning, such as microelectronic device manufacturing.

[0086] Convenient installation and maintenance: The design of the tooling slot 4 and the bump 5 allows the SMP connector 2 to be easily plugged in and out. This facilitates quick assembly and maintenance, reduces downtime, and improves production efficiency.

[0087] Multi-level position limiting system: The design of the slot 4, the bump 5, the positioning pin 3 and the through hole cooperate with each other to achieve multiple position limiting. Such a multi-level design ensures the high stability of the tooling during use and effectively prevents position deviation caused by vibration or external force.

[0088] Good heat dissipation effect: convex platforms are evenly arranged on the substrate 1, providing a certain heat dissipation surface. This helps to maintain a proper operating temperature for parts such as electronic components in the tooling that need heat dissipation, thereby improving the stability and reliability of the system.

[0089] Strong adaptability: The design of leaving gaps between the bosses in the tooling makes it more adaptable and can adapt to SMP connectors 2 of different sizes and shapes, thereby improving the versatility of the tooling.

[0090] The accuracy of position definition is further improved: by plugging the through hole and the positioning pin 3 into each other, the installation position is further defined, thereby increasing the accuracy and stability of the system.

[0091] In general, the advantages of this tooling design are reflected in many aspects such as stable connection, precise positioning, easy installation, multi-level position limitation, and good heat dissipation, which enable it to have excellent performance in the SMP sintering application of the sum and difference networks.

[0092] The above description is only a preferred embodiment of the utility model and does not impose any form of limitation on the utility model. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. A SMP sintering tool with a sum-difference network, characterized by: The invention comprises a substrate (1), an SMP connector (2), a positioning pin (3), a slot (4) and a protrusion (5); the SMP connector (2) is provided with a slot (4), a positioning pin (3) is placed in the slot (4), and the SMP connector (2) is placed on the substrate (1) by means of the positioning pin (3).

2. According to claim 1, a SMP sintering tool is characterized by: The SMP connector (2) is provided with a protrusion (5), and the SMP connector (2) is mounted on the base plate (1) by means of the protrusion (5) and the card slot (4) being mutually engaged and limited.

3. According to claim 1, a SMP sintering tool is characterized by: The SMP connector (2) is provided with a through hole at the protrusion (5), and the SMP connector (2) is plugged into the positioning pin (3) through the through hole to further define the installation position.

4. According to claim 1, a SMP sintering tool is characterized by: The card slots (4) are evenly distributed on the base plate (1).

5. According to claim 2, a SMP sintering tool is characterized by: The position and size of the protrusion (5) correspond one-to-one to the slot (4).

6. The SMP sintering tool according to claim 1, characterized in that: Bosses are evenly arranged on the substrate (1), and gaps are left between the bosses. The SMP connector (2) is supported on the substrate (1) via the bosses.

7. The SMP sintering tool according to claim 1, characterized in that: The positioning pin (3) is fixed on the base plate (1) via a thread or a nut.

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