Dustproof film for microphone hole of wireless earphone

Abstract

The utility model discloses a dustproof film for a microphone hole of a wireless earphone, which relates to the technical field of dustproof structures of earphones and comprises a dustproof structure layer used for preventing dust from falling into the film from the vertical direction; the sound guide structure layer is arranged in the middle of the bottom of the dustproof structure layer and attached to the bottom of the dustproof structure layer; the bonding structure layers are arranged on the two sides of the sound guide structure layer, and the bonding structure layers and the sound guide structure layer are located on the same level; and the release film structure layer is adhered to the bottoms of the sound guide structure layer and the adhesive structure layer. According to the wireless earphone microphone hole dustproof film of the utility model, the dustproof structure layer can prevent dust in the vertical direction from falling into the dustproof film, and the sound guiding structure layer is cooperated to balance the air pressure inside and outside the dustproof film, so that an acoustic test can be performed without tearing off the dustproof film, and the risk of foreign matter entry can be reduced. The equipment has a special specification, so that the film pasting consistency is ensured, the microphone hole opening time is shortened, and the film pasting quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of dustproof structures of earphones, in particular to a dustproof film for a microphone hole of a wireless earphone. Background Art

[0002] Headphones are acoustic devices that produce sound by pushing air through the vibration of the diaphragm inside the headphones. In order to ensure that the sound quality of the headphones is accurate and not affected, a breathable film needs to be pasted on the corresponding holes such as the microphone hole and the sound receiving hole to prevent external dust from entering while connecting the sound cavity to the outside world.

[0003] Chinese patent CN201721096514.7 discloses an acoustic Mic waterproof membrane, which is a stacked structure formed by bonding supporting foam a, double-sided adhesive a, waterproof membrane, double-sided adhesive b, supporting foam b, double-sided adhesive c and release paper from top to bottom. The cross-sectional structures of supporting foam a, double-sided adhesive a, double-sided adhesive b, supporting foam b and double-sided adhesive c are consistent and are all arranged as a column structure with a central hole along the central axis. The thickness of supporting foam a and supporting foam b is consistent and symmetrically distributed on both sides of the waterproof membrane. The thickness of double-sided adhesive a and double-sided adhesive b is consistent and symmetrically distributed on the two outer sides of supporting foam a and supporting foam b. The supporting foam and double-sided adhesive play a certain elastic buffering and supporting role.

[0004] With the continuous development of true wireless (TWS) headsets in recent years, the sensitivity of the microphone (MIC) of TWS headsets has become higher and higher, and the corresponding dust-proof requirements for the microphone holes have become more and more stringent.

[0005] The original dust-proof film adopts the manual film sticking solution, and the structure is compatible with manual film sticking and equipment film sticking. The film sticking time is long, which is easy to increase the risk of dust ingress. And it needs to be torn off during the subsequent acoustic test to avoid inaccurate testing caused by air pressure imbalance, and tearing it off increases the risk of foreign matter entering. Utility Model Content

[0006] The utility model aims to at least solve the technical problem existing in the prior art that "the existing structure is compatible with both manual film and device film, and the film application time is long, which easily increases the risk of dust ingress. In addition, it needs to be torn off during the subsequent acoustic test to avoid inaccurate testing caused by air pressure imbalance, and the risk of foreign matter entering is increased after tearing it off." To this end, the utility model proposes a dust-proof film for the microphone hole of a wireless headset, with an improved film layer structure, dedicated to device film application, effectively reducing the microphone hole opening time, effectively solving the air pressure balance problem, and being able to directly perform acoustic testing to avoid foreign matter from entering, with a better dust-proof effect.

[0007] According to some embodiments of the present invention, a dust-proof film for a wireless headset microphone hole includes:

[0008] The dust-proof structural layer is used to prevent dust from falling into the membrane from a vertical direction;

[0009] The sound-conducting structural layer is arranged in the middle of the bottom of the dust-proof structural layer and is in contact with the bottom of the dust-proof structural layer;

[0010] an adhesive structure layer, which is disposed on both sides of the sound guide structure layer, and the adhesive structure layer and the sound guide structure layer are located at the same level; and

[0011] The release film structure layer is adhered to the bottom of the sound guide structure layer and the adhesive structure layer.

[0012] According to some embodiments of the present invention, the ratio of the width of the sound-conducting structural layer to the diameter of the dust-proof structural layer is 0.3 to 0.35.

[0013] According to some embodiments of the present invention, the width of the sound-conducting structural layer is 0.9 mm to 1.0 mm, and the length of the sound-conducting structural layer is equal to the diameter of the dust-proof structural layer.

[0014] According to some embodiments of the present invention, the dustproof structural layer and the sound-conducting structural layer respectively adopt air-permeable structures.

[0015] According to some embodiments of the present invention, the front and rear ends of the sound-conducting structural layer extend to the side walls of the dust-proof structural layer. When the sound-conducting structural layer covers the microphone hole, air enters the microphone hole from both ends of the sound-conducting structural layer.

[0016] According to some embodiments of the present utility model, the dustproof structural layer is made of polyimide material, and the surface of the dustproof structural layer is white, which makes it easy for the sticking device to identify the dustproof structural layer.

[0017] According to some embodiments of the present invention, the thickness of the dustproof structural layer is 60 μm to 80 μm.

[0018] According to some embodiments of the present invention, the sound-conducting structure layer is made of polyimide material.

[0019] According to some embodiments of the present invention, the thickness of the sound guiding structure layer is 11 μm to 13 μm, and the thickness of the adhesive structure layer is not less than the thickness of the sound guiding structure layer.

[0020] According to some embodiments of the present invention, the thickness of the release film structure layer is between 90 μm and 110 μm.

[0021] According to some embodiments of the utility model, the dust-proof film for the microphone hole of the wireless headset has at least the following beneficial effects: the dust-proof structural layer can prevent dust from falling in the vertical direction, and cooperate with the sound-conducting effect of the sound-conducting structural layer to balance the air pressure inside and outside the dust-proof film, so that acoustic testing can be performed without tearing off the dust-proof film, reducing the risk of foreign matter entering. Equipment-specific specifications ensure the consistency of film application, reduce the microphone hole opening time, and improve the quality of film application.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the structural layers of the dust-proof film for the microphone hole of a wireless headset according to an embodiment of the utility model;

[0025] Figure 2 This is a schematic diagram of the sound guide structure layer and the bonding structure layer of an embodiment of the utility model;

[0026] Figure 3 It is a schematic diagram of the release film structure layer of the dust-proof film for the microphone hole of a wireless headset according to an embodiment of the utility model.

[0027] Reference numerals:

[0028] The dustproof structural layer 100 , the sound guiding structural layer 210 , the adhesive structural layer 220 , and the release film structural layer 300 . DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, top, bottom, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0033] Reference below Figure 1-Figure 3 A dust-proof film for a microphone hole of a wireless headset according to an embodiment of the utility model is described.

[0034] like Figure 1-Figure 3 As shown, the dustproof film for the microphone hole of a wireless headset includes a dustproof structural layer 100 , a sound guide structural layer 210 , an adhesive structural layer 220 and a release film structural layer 300 .

[0035] Specifically, the dustproof structural layer 100 is the top layer of the dustproof film, which is used to prevent dust from falling into the film from the vertical direction, that is, to prevent dust from falling into the microphone hole through the dustproof film. The sound-conducting structural layer 210 is arranged in the middle area of ​​the bottom of the dustproof structural layer 100, and is bonded to the bottom of the dustproof structural layer 100. The adhesive structural layer 220 is arranged on both sides of the sound-conducting structural layer 210, and the adhesive structural layer 220 and the sound-conducting structural layer 210 are at the same level. When the dustproof film is bonded to the surface of the microphone hole, the glue of the adhesive structural layer 220 is bonded to the periphery of the microphone hole. At this time, the sound-conducting structural layer 210 and the dustproof structural layer 100 cover the top of the microphone hole, and the dust is blocked by the dustproof structural layer 100, while the air can enter the inside of the microphone hole through the sound-conducting structural layer 210, which does not affect the subsequent acoustic test.

[0036] The release film structure layer 300 is attached to the bottom of the sound guide structure layer 210 and the adhesive structure layer 220. Specifically, the release film structure layer 300 is a carrier tape, which is rolled up on a reel. The release film structure layer 300 is used to carry the dustproof film. In actual production, the dustproof film on the carrier tape is sucked by a machine and then attached to the surface of the microphone hole of the earphone.

[0037] In some embodiments of the present invention, Figure 1 and Figure 2As shown, the ratio of the width of the sound guide structure layer 210 to the diameter of the dustproof structure layer 100 is 0.3 to 0.35. Specifically, the ratio of the width of the sound guide structure layer 210 to the diameter of the dustproof structure layer 100 is selected to be 0.33, which can ensure the bonding force of the adhesive structure layer 220 while maintaining the internal and external air pressure balance effect of the sound guide structure layer 210.

[0038] In a further embodiment, Figure 2 As shown, the width of the sound-conducting structural layer 210 is 0.9 mm to 1.0 mm, and the length of the sound-conducting structural layer 210 is equal to the diameter of the dust-proof structural layer 100. Since the dust-proof film of this embodiment is specially used for automatic machine bonding, it is used in conjunction with a patch machine and a nozzle. In this embodiment, the diameter of the dust-proof film adopts a 3 mm specification, which can completely cover the microphone hole. The appropriate diameter can control the length of the sound-conducting structural layer 210, thereby improving the internal and external air pressure balance effect of the sound-conducting structural layer 210.

[0039] In some embodiments of the utility model, the dustproof structure layer 100 and the sound-conducting structure layer 210 respectively adopt a breathable structure. Specifically, a plurality of breathable micropores are provided in the dustproof structure layer 100 and the sound-conducting structure layer 210, which can prevent dust with a diameter of more than 5 μm from passing through the dustproof film and entering the microphone hole. The microporous structure of the sound-conducting structure layer 210 can pass air to connect the internal cavity of the earphone with the outside world. The use of the dustproof structure layer 100 and the sound-conducting structure layer 210 in combination can not only effectively reduce the probability of dust entering the microphone hole, but also maintain the acoustic test in the film-applied state, further preventing foreign matter from falling into the microphone hole.

[0040] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the front and rear ends of the sound-conducting structural layer 210 extend to the side wall of the dust-proof structural layer 100. When the sound-conducting structural layer 210 covers the microphone hole, air enters the microphone hole from both ends of the sound-conducting structural layer 210. Specifically, air enters the microphone hole through the horizontal front and rear ends of the sound-conducting structural layer 210, effectively preventing dust from entering in the vertical direction.

[0041] In some embodiments of the present invention, the dustproof structural layer 100 is made of polyimide material, and the surface of the dustproof structural layer 100 is white, which is convenient for the pasting device to identify the dustproof structural layer 100. The polyimide material has a high temperature resistance of more than 400°C and has high insulation performance, which can meet the needs of the patch machine and the use of dustproof film.

[0042] In some embodiments of the present invention, Figure 1 and Figure 3 As shown, the dustproof structural layer 100 has a thickness of 60 μm to 80 μm. Specifically, in this embodiment, the thickness is 68 μm.

[0043] In some embodiments of the present invention, the sound guide structure layer 210 is made of polyimide material. The polyimide material has a high temperature resistance of more than 400°C and has high insulation performance, which can meet the needs of chip placement machines and the use of dustproof films.

[0044] In some embodiments of the present invention, Figure 1 and Figure 3 As shown, the thickness of the sound guide structure layer 210 is 11 μm to 13 μm, and the thickness of the adhesive structure layer 220 is not less than the thickness of the sound guide structure layer 210. Specifically, in this embodiment, a thickness of 12.5 μm is used to better fit the surface contour of the microphone hole.

[0045] In some embodiments of the present invention, Figure 1 and Figure 3 As shown, the thickness of the release film structure layer 300 is between 90 μm and 110 μm. Specifically, in this embodiment, the thickness is 100 μm.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0047] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A dust-proof film for a wireless headset microphone hole, characterized in that: include: A dustproof structural layer (100) is used to prevent dust from falling into the membrane from a vertical direction; The sound-conducting structural layer (210) is arranged in the middle of the bottom of the dust-proof structural layer (100) and is in contact with the bottom of the dust-proof structural layer (100); an adhesive structure layer (220) disposed on both sides of the sound guide structure layer (210), the adhesive structure layer (220) and the sound guide structure layer (210) being located at the same level; and The release film structure layer (300) is adhered to the bottom of the sound guide structure layer (210) and the adhesive structure layer (220).

2. The wireless headset microphone hole dust-proof film according to claim 1, characterized in that: The ratio of the width of the sound-conducting structural layer (210) to the diameter of the dust-proof structural layer (100) is 0.3 to 0.

35.

3. The wireless headset microphone hole dust-proof film according to claim 2, characterized in that: The width of the sound-conducting structural layer (210) is 0.9 mm to 1.0 mm, and the length of the sound-conducting structural layer (210) is equal to the diameter of the dust-proof structural layer (100).

4. The wireless headset microphone hole dust-proof film according to claim 1, characterized in that: The dustproof structural layer (100) and the sound-conducting structural layer (210) respectively adopt air-permeable structures.

5. The wireless headset microphone hole dust-proof film according to claim 4, characterized in that: The front and rear ends of the sound-conducting structural layer (210) extend to the side walls of the dust-proof structural layer (100); when the sound-conducting structural layer (210) covers the microphone hole, air enters the microphone hole from the two ends of the sound-conducting structural layer (210).

6. The wireless headset microphone hole dust-proof film according to claim 1, characterized in that: The dustproof structural layer (100) is made of polyimide material, and the surface of the dustproof structural layer (100) is white, which facilitates the sticking device to identify the dustproof structural layer (100).

7. The wireless headset microphone hole dust-proof film according to claim 6, characterized in that: The dustproof structural layer (100) has a thickness of 60 μm to 80 μm.

8. The wireless headset microphone hole dust-proof film according to claim 1, characterized in that: The sound-conducting structural layer (210) is made of polyimide material.

9. The wireless headset microphone hole dust-proof film according to claim 8, characterized in that: The thickness of the sound guide structure layer (210) is 11 μm to 13 μm, and the thickness of the adhesive structure layer (220) is not less than the thickness of the sound guide structure layer (210).

10. The wireless headset microphone hole dust-proof film according to claim 1, characterized in that: The thickness of the release film structure layer (300) is between 90 μm and 110 μm.

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