Active heat dissipation system of audio amplifier

Abstract

The utility model discloses an active heat dissipation system of an audio amplifier, which relates to the technical field of radiators and comprises a radiator, a mounting plate is fixedly mounted on one side of the radiator, a bearing plate is fixedly mounted on one side, far away from the mounting plate, of the radiator, a mounting port is formed in the bearing plate, a PWM (pulse width modulation) fan is mounted in the mounting port, and the PWM fan is mounted in the mounting port. A temperature sensor used for detecting the overall temperature of the radiator is installed in the radiator, an MCU control core is installed in the installation plate, and the installation opening and the temperature sensor are both electrically connected with the MCU control core. The energy-saving radiator solves the problem that an existing radiator is poor in energy-saving effect.

Description

Technical Field

[0001] The utility model belongs to the technical field of radiators, and in particular relates to an active heat dissipation system of an audio amplifier. Background Art

[0002] An audio amplifier is a device that recreates the input audio signal at a sound-producing output element at an ideal volume and power level - faithfully, efficiently, and with low distortion.

[0003] In the process of using the existing audio power amplifier, since the electrical components inside it generate heat when working, people often open heat dissipation windows to allow the heat to be dissipated. However, when the device is not in use, if dust in the air cannot be prevented from entering the interior of the audio amplifier through the heat dissipation windows, the dust will enter the interior of the device and adhere to the outer surface of the electrical components inside it, which not only affects the heat dissipation of the electrical components when working, but also may cause the device to be damaged due to excessive temperature, which is not conducive to people's use.

[0004] The existing patent (application number: CN202222223354.5) proposes an audio power amplifier with good heat dissipation, including an audio power amplifier housing, the inner wall of the audio power amplifier housing is fixedly connected to a U-shaped frame, and a control mechanism is arranged inside the audio power amplifier housing, and the control mechanism includes two L-shaped connecting rods and two insulating gaskets, and the two L-shaped connecting rods are slidably connected to the inner wall of the U-shaped frame. It can effectively prevent dust in the air from entering the interior of the device when the device is not in use through the coordinated arrangement between the audio power amplifier housing, the U-shaped frame, the control mechanism, the heat dissipation window and the power block, thereby effectively avoiding the situation in which the heat dissipation of the electrical components is affected during operation due to dust in the air entering the interior of the device and adhering to the outer surface of the internal electrical components.

[0005] When the radiator is in use, when the audio power amplifier is running, the cooling fan forms an airflow to dissipate heat in time for the audio power amplifier. However, when the audio power amplifier is just started, the heat is not high, and starting the cooling fan at this time will cause energy waste.

[0006] In view of this, this application is hereby filed. Utility Model Content

[0007] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an active heat dissipation system for an audio amplifier to achieve the desired purpose.

[0008] In order to solve the above technical problems, the utility model provides an active cooling system for an audio amplifier, including a radiator, a mounting plate is fixedly installed on one side of the radiator, a supporting plate is fixedly installed on the side of the radiator away from the mounting plate, a mounting opening is opened on the supporting plate, and a PWM fan is installed inside the mounting opening.

[0009] Furthermore, straight slots are provided at four corners of the bearing plate, positioning bolts are slidably inserted inside the straight slots, and positioning holes for the positioning bolts to be screwed into are provided on the radiator.

[0010] Furthermore, an air duct is provided inside the radiator, the air duct runs through the front end surface of the radiator and is arranged corresponding to the installation port, and an exhaust port is provided on the bottom surface of the radiator away from the side of the supporting plate. The number of the exhaust ports is the same as the air duct, and the exhaust port and the air duct are interconnected.

[0011] Furthermore, the number of the radiators is two, and the two radiators are arranged in parallel and mirror-image relationship.

[0012] Furthermore, a heat dissipation groove is provided on the inner wall of the air duct, and the number of the heat dissipation grooves is multiple, and the multiple heat dissipation grooves are evenly distributed along the inner wall of the air duct.

[0013] Furthermore, a temperature sensor for detecting the overall temperature of the radiator is installed inside the radiator, an MCU control core is installed inside the mounting plate, and the mounting port and the temperature sensor are both electrically connected to the MCU control core.

[0014] After adopting the above technical scheme, the utility model has the following beneficial effects compared with the prior art.

[0015] 1. In the utility model, the temperature of the radiator is monitored by the temperature measuring probe of the temperature sensor, and multiple air ducts are designed inside the radiator. The MCU control core automatically controls the speed of the PWM fan in the installation port according to the temperature detected by the temperature sensor to achieve heat dissipation of the entire system. The heat dissipation can be performed according to the actual temperature, which is beneficial to energy saving and environmental protection.

[0016] 2. In the utility model, cold air can be transported to the inside of the air duct through the installation port and discharged through the exhaust port. The cold air flows inside the air duct to dissipate heat, so that the radiator as a whole has good heat dissipation performance, simple structure and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are part of the present invention and are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an improper limitation on the present invention. Obviously, the accompanying drawings described below are only some embodiments. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work. In the accompanying drawings:

[0018] Figure 1 This is a front view structural schematic diagram of the utility model;

[0019] Figure 2 It is a side view structural schematic diagram of the utility model;

[0020] Figure 3 It is a schematic diagram of the explosion structure of the utility model;

[0021] Figure 4 This is a system block diagram of the utility model.

[0022] Numbers in the figure: 1. Mounting plate; 2. Radiator; 3. Loading plate; 4. Mounting port; 5. PWM fan; 6. Straight slot; 7. Positioning bolt; 8. Positioning hole; 9. Air duct; 10. Exhaust port; 11. Heat sink.

[0023] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model.

[0025] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] like Figures 1 to 4 As shown, the utility model provides an active heat dissipation system for an audio amplifier.

[0028] Specifically, by Figure 1-4 The present invention comprises a radiator 2, a mounting plate 1 is fixedly mounted on one side of the radiator 2, a carrier plate 3 is fixedly mounted on the side of the radiator 2 away from the mounting plate 1, a mounting opening 4 is opened on the carrier plate 3, a PWM fan 5 is installed inside the mounting opening 4, a temperature sensor for detecting the overall temperature of the radiator 2 is installed inside, an MCU control core is installed inside the mounting plate 1, and the mounting opening 4 and the temperature sensor are both electrically connected to the MCU control core.

[0029] In the utility model, the temperature of the radiator 2 is monitored by the temperature measuring probe of the temperature sensor, a multi-channel air duct 9 is designed inside the radiator 2, and the MCU control core automatically controls the speed of the PWM fan 5 in the installation port 4 according to the temperature detected by the temperature sensor, so as to realize the heat dissipation of the whole system, and the heat dissipation can be carried out according to the actual temperature, which is beneficial to energy saving and environmental protection;

[0030] It should be noted that the MCU control core is the central processing unit. Controlling the temperature sensor and the PWM fan 5 by the central processing unit is a prior art and will not be described in detail in this application.

[0031] Furthermore, as a specific implementation of the present invention, the present invention provides an active heat dissipation system for an audio amplifier.

[0032] Specifically, Figure 3 As shown, straight slots 6 are provided at the four corners of the bearing plate 3 , positioning bolts 7 are slidably inserted into the straight slots 6 , and positioning holes 8 for the positioning bolts 7 to be screwed into are provided on the radiator 2 .

[0033] In the utility model, the support plate 3 is conveniently mounted on the radiator 2 by cooperating with the straight notch 6 , the positioning bolt 7 and the positioning hole 8 .

[0034] Furthermore, as another specific implementation of the present invention, the present invention provides an active heat dissipation system for an audio amplifier.

[0035] Specifically, Figure 3It is shown that an air duct 9 is opened inside the radiator 2, the air duct 9 runs through the front end surface of the radiator 2 and is arranged corresponding to the mounting port 4, and an exhaust port 10 is opened on the bottom surface of the radiator 2 away from the side of the supporting plate 3. The number of the exhaust ports 10 is the same as that of the air duct 9, and the exhaust ports 10 and the air duct 9 are interconnected.

[0036] In the utility model, cold air can be transported to the inside of the air duct 9 through the installation port 4 and discharged through the exhaust port 10. The cold air flows inside the air duct 9 to dissipate heat, so that the radiator 2 as a whole has good heat dissipation performance, simple structure and strong practicality.

[0037] Furthermore, as a specific implementation of the present invention, the present invention provides an active heat dissipation system for an audio amplifier.

[0038] Specifically, Figure 1 It is shown that there are two radiators 2, and the two radiators 2 are arranged in parallel and mirror-image relation.

[0039] In the utility model, the heat dissipation by setting two radiators 2 has a larger heat dissipation capacity under the same area, and can dissipate the heat faster. At the same time, the setting of the two radiators 2 can also more fully cover the heat dissipation area of ​​the audio amplifier, so that the heat is dissipated more evenly.

[0040] Furthermore, as a specific implementation of the present invention, the present invention provides an active heat dissipation system for an audio amplifier.

[0041] Specifically, Figure 3 It is shown that a heat dissipation groove 11 is opened on the inner wall of the air duct 9 , and the number of the heat dissipation grooves 11 is multiple, and the multiple heat dissipation grooves 11 are evenly distributed along the inner wall of the air duct 9 .

[0042] In the utility model, the heat dissipation surface area inside the air duct 9 is increased by providing the heat dissipation slots 11, thereby enhancing the heat dissipation performance.

[0043] Working principle: The temperature of the radiator 2 is monitored by the temperature sensor's temperature probe. A multi-channel air duct 9 is designed inside the radiator 2. The MCU control core automatically controls the speed of the PWM fan 5 in the installation port 4 according to the temperature detected by the temperature sensor to achieve heat dissipation of the entire system. Heat dissipation can be performed according to the actual temperature, which is beneficial to energy saving and environmental protection.

[0044] Cold air can be transported to the inside of the air duct 9 through the installation port 4 and discharged through the exhaust port 10. The cold air flows inside the air duct 9 to dissipate heat, so that the radiator 2 as a whole has good heat dissipation performance, simple structure and strong practicality.

[0045] The above is only a preferred embodiment of the present invention, and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with this patent can make some changes or modifications to equivalent embodiments of equivalent changes using the technical content suggested above without departing from the scope of the technical solution of the present invention. The implementation schemes in the above embodiments can also be further combined or replaced. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the present invention.

Claims

1. An active heat dissipation system for an audio amplifier, comprising a heat sink (2): characterized in that: A mounting plate (1) is fixedly mounted on one side of the radiator (2), a carrying plate (3) is fixedly mounted on a side of the radiator (2) away from the mounting plate (1), a mounting opening (4) is provided on the carrying plate (3), and a PWM fan (5) is mounted inside the mounting opening (4).

2. The active heat dissipation system of an audio amplifier according to claim 1, characterized in that: The four corners of the bearing plate (3) are all provided with straight slots (6), positioning bolts (7) are slidably inserted inside the straight slots (6), and the radiator (2) is provided with positioning holes (8) for the positioning bolts (7) to be screwed in.

3. The active heat dissipation system of an audio amplifier according to claim 1, characterized in that: An air duct (9) is provided inside the radiator (2), the air duct (9) passes through the front end surface of the radiator (2) and is arranged corresponding to the mounting opening (4), and an exhaust port (10) is provided on the bottom surface of the radiator (2) away from the supporting plate (3), the number of the exhaust ports (10) is the same as the air duct (9), and the exhaust ports (10) and the air duct (9) are interconnected.

4. The active heat dissipation system of an audio amplifier according to claim 1, characterized in that: The number of the radiators (2) is two, and the two radiators (2) are arranged in parallel and mirror-image relationship.

5. The active heat dissipation system of an audio amplifier according to claim 3, characterized in that: A heat dissipation groove (11) is provided on the inner wall of the air duct (9), and the number of the heat dissipation grooves (11) is multiple, and the multiple heat dissipation grooves (11) are evenly distributed along the inner wall of the air duct (9).

6. The active heat dissipation system of an audio amplifier according to claim 1, characterized in that: A temperature sensor for detecting the overall temperature of the radiator (2) is installed inside the radiator (2), an MCU control core is installed inside the mounting plate (1), and the mounting port (4) and the temperature sensor are both electrically connected to the MCU control core.

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