Semiconductor plastic package mold

Abstract

The utility model relates to the technical field of semiconductors, in particular to a semiconductor plastic package mold. Comprising a machine box, a machine frame is arranged on the upper surface of the machine box, a mold frame is slidably connected into the machine frame through a sliding assembly, a groove used for containing a mold cavity is formed in the upper surface of the mold frame, and fixing assemblies used for stabilizing the mold cavity are arranged on the two sides of the interior of the groove; a control assembly is arranged in one side of the mold frame, and the side, close to the rack, of the control assembly is in inserted fit with the inner wall of the rack through a positioning assembly, in the semiconductor plastic packaging mold, the sliding assembly assists the mold frame in position adjustment and limitation, the position of the mold frame is stabilized through the control assembly and the positioning assembly, and therefore the mold frame is more stable in position. According to the semiconductor plastic package mold, the working efficiency of demolding of the semiconductor plastic package mold is improved, the mold frame can be reset conveniently, time waste is avoided, the practicability of the semiconductor plastic package mold is improved, and therefore economic losses are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor plastic packaging mold. Background Art

[0002] At present, semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. In order to protect semiconductor components, they need to be plastic-sealed.

[0003] There are many existing technologies for semiconductor plastic packaging molds, such as:

[0004] Chinese patent publication number CN217494862U discloses a plastic packaging mold for semiconductor production, which includes a supporting chassis and a plastic packaging frame arranged at the upper end of the supporting chassis, a lifting frame is arranged at the upper end of the plastic packaging frame, a mold frame is movably installed at the upper end of the plastic packaging frame, fixed transmission rods are arranged on both sides of the mold frame, and transmission tooth grooves are opened at the lower end of the transmission rods. A rotating gear is arranged inside the plastic packaging frame, and one side of the rotating gear is connected to the output end of the driving device through a transmission belt. The utility model solves the technical problem of inconvenient discharge of the molded semiconductor finished product, and the rotating gear is driven to rotate by the driving device, and then the transmission rod with the transmission tooth groove is driven to move outward, and then the mold frame is moved out of the installation groove, which is convenient for unloading, and there is no need for operators to take it out from the mold cavity at the lower end of the lifting frame, which is safer to use.

[0005] It can be seen that in order to improve the safety of use, most semiconductor plastic packaging molds can separate the mold frame from the inside of the frame. However, during use, the internal structure of the semiconductor plastic packaging mold is complex, which easily increases the frequency of failure of the semiconductor plastic packaging mold. In addition, after the mold frame is separated from the frame, it is installed again, which reduces the work efficiency of the semiconductor plastic packaging mold, causes a waste of time, affects the output of semiconductor production, and thus causes economic losses.

[0006] In view of this, we propose a semiconductor plastic packaging mold. Utility Model Content

[0007] The utility model aims to solve the above disadvantages and provide a semiconductor plastic packaging mold with a control component and a positioning component to move the position of a mold frame.

[0008] The position of the mold frame is adjusted and limited by the sliding component, and the position of the mold frame is stabilized by the control component and the positioning component.

[0009] Therefore, the utility model provides a semiconductor plastic packaging mold, which includes a chassis, a frame is arranged on the upper surface of the chassis, a mold frame is slidably connected to the inside of the frame through a sliding component, a groove for placing a mold cavity is opened on the upper surface of the mold frame, handles are arranged on both sides of the mold cavity, and fixing components for stabilizing the mold cavity are arranged on both sides of the groove;

[0010] A control component is arranged inside one side of the mold frame, and a side of the control component close to the frame is plugged and matched with the inner wall of the frame through a positioning component.

[0011] As a further improvement of the technical solution, the sliding assembly includes at least a slide groove and a slider, a slider is provided at one end of both sides of the mold frame, and slide grooves for sliding connection with the slider are opened on both sides of the inner wall of the frame.

[0012] As a further improvement of the present technical solution, the control component at least includes a control groove, control grooves are provided on both sides of the inside of the mold frame, elastic parts are provided on both sides of one side of the control groove, a connecting plate is provided at the other end of the elastic part, connecting blocks are provided on both sides of the connecting plate close to the elastic part, a control rod is provided on the side of the connecting plate away from the elastic part, and the other end of the control rod extends to the outside of the mold frame.

[0013] As a further improvement of the present technical solution, the positioning assembly includes at least a positioning block and a positioning groove, a positioning block is provided on the side of the connecting block away from the connecting plate, and the inner walls on both sides of the frame opening are provided with positioning grooves for plugging and mating with the positioning block.

[0014] As a further improvement of the technical solution, the fixing assembly at least includes a mounting groove, mounting grooves are provided on both sides of the groove, a cylinder is provided inside the mounting groove, and a fixing plate is provided on the piston rod of the cylinder.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] In the semiconductor plastic encapsulation mold, the sliding component is used to assist the mold frame in adjusting and limiting the position, and the control component and the positioning component are used to stabilize the position of the mold frame, which not only improves the demolding efficiency of the semiconductor plastic encapsulation mold, but also facilitates the resetting of the mold frame, avoids wasting time, improves the practicability of the semiconductor plastic encapsulation mold, and thus avoids economic losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is described in more detail below by way of example with reference to the accompanying drawings, in which:

[0018] Figure 1This is a schematic diagram of the plastic sealing mold structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the layered structure of the plastic sealing mold of the utility model;

[0020] Figure 3 It is a schematic diagram of the cutaway structure of the mold frame of the present utility model.

[0021] The meaning of each number in the figure is:

[0022] 10. chassis; 11. rack; 12. sliding assembly; 121. slide slot; 122. slider;

[0023] 20. mold frame; 21. control assembly; 211. control groove; 212. elastic member; 213. connecting plate; 214. connecting block; 215. control rod; 22. positioning assembly; 221. positioning block; 222. positioning groove; 23. groove; 24. fixing assembly; 241. mounting groove; 242. cylinder; 243. fixing plate;

[0024] 30. Mold cavity; 31. Handle. DETAILED DESCRIPTION

[0025] In order to improve the safety of use, most semiconductor plastic encapsulation molds can separate the mold frame from the inside of the frame. However, during use, the internal structure of the semiconductor plastic encapsulation mold is complex, which easily increases the frequency of failure of the semiconductor plastic encapsulation mold. In addition, after the mold frame is separated from the frame, it is installed again, which reduces the work efficiency of the semiconductor plastic encapsulation mold, causes a waste of time, affects the output of semiconductor production, and thus causes economic losses.

[0026] See also Figure 1-Figure 3 The embodiment of the utility model shown in the figure comprises a chassis 10, a frame 11 is arranged on the upper surface of the chassis 10, a mold frame 20 is slidably connected to the inside of the frame 11 through a sliding component 12, a groove 23 for placing a mold cavity 30 is opened on the upper surface of the mold frame 20, handles 31 are arranged on both sides of the mold cavity 30, and fixing components 24 for stabilizing the mold cavity 30 are arranged on both sides of the groove 23; a control component 21 is arranged inside one side of the mold frame 20, and the side of the control component 21 close to the frame 11 is plugged into and matched with the inner wall of the frame 11 through a positioning component 22.

[0027] First, the specific structure of the sliding assembly 12 is disclosed. The sliding assembly 12 at least includes a slide groove 121 and a slider 122. A slider 122 is provided at one end of both sides of the mold frame 20, and slide grooves 121 for sliding connection with the slider 122 are opened on both sides of the inner wall of the frame 11.

[0028] The improvement lies in that: by slidingly connecting the slider 122 inside the slide groove 121, the position of the mold frame 20 can be moved and the moving position of the mold frame 20 can be restricted, which not only improves the demolding efficiency of the semiconductor plastic packaging mold, but also facilitates the resetting of the mold frame 20, avoiding time waste, thereby improving the practicability of the semiconductor plastic packaging mold.

[0029] Secondly, the specific structure of the control component 21 is disclosed. The control component 21 at least includes a control groove 211. The control groove 211 is opened on both sides of the inside of the mold frame 20. Elastic parts 212 are arranged on both sides of one side of the control groove 211. A connecting plate 213 is arranged at the other end of the elastic part 212. Connecting blocks 214 are arranged on both sides of the connecting plate 213 close to the elastic part 212. A control rod 215 is arranged on the side of the connecting plate 213 away from the elastic part 212. The other end of the control rod 215 extends to the outside of the mold frame 20.

[0030] The improvement lies in that: by holding the two control rods 215 tightly, the two control rods 215 are brought close to each other, and the elastic member 212 is deformed and elongated, so that the positioning component 22 is disconnected. At this time, the mold frame 20 can be separated from the frame 11, which is convenient for demolding the semiconductor. Similarly, by loosening the control rods 215, the elastic force of the elastic member 212 is used to assist the positioning component 22 to be plugged in and the mold frame 20 is stabilized inside the frame 11. This is not only simple to operate, but also improves the flexibility of using the semiconductor plastic encapsulation mold, and also improves the practicality of the semiconductor plastic encapsulation mold, reduces the frequency of errors, and thus improves the safety of using the semiconductor plastic encapsulation mold.

[0031] The specific structure of the positioning assembly 22 is disclosed again. The positioning assembly 22 at least includes a positioning block 221 and a positioning groove 222. The positioning block 221 is provided on the side of the connecting block 214 away from the connecting plate 213, and the inner walls on both sides of the opening of the frame 11 are provided with positioning grooves 222 for plugging with the positioning block 221.

[0032] The improvement lies in that: through the elastic reset work of the elastic member 212, the positioning block 221 enters the interior of the positioning groove 222 and is plugged in and matched, which can stabilize the position of the mold frame 20 and the frame 11, increase the safety of the use of the semiconductor plastic packaging mold, and thus avoid economic losses.

[0033] Then, the specific structure of the fixing component 24 is disclosed. The fixing component 24 at least includes a mounting groove 241. The mounting grooves 241 are opened on both sides of the groove 23. The cylinder 242 is arranged inside the mounting groove 241. The piston rod of the cylinder 242 is provided with a fixing plate 243.

[0034] The improvement lies in that: after the mold cavity 30 is placed into the mold frame 20, the cylinder 242 is powered on to make it work. The fixed plate 243 is moved out of the installation groove 241 through the pushing of the piston rod of the cylinder 242, and the upper part of the handle 31 is restricted to fix the position of the handle 31. This is not only simple to operate, but also improves the stability of the placement of the mold cavity 30, and also improves the accuracy of the use of semiconductor plastic packaging molds, reduces the frequency of errors, and thus avoids economic losses.

[0035] In summary, the working principle of the present solution is as follows: first, by tightly gripping the two control rods 215, the two control rods 215 are brought close together, and the elastic member 212 is deformed and stretched, so that the positioning block 221 is disconnected from the positioning groove 222. At the same time, the slider 122 slides inside the slide groove 121. At this time, the mold frame 20 can be moved to the outside of the frame 11. After that, the fixing plate 243 is moved to the inside of the installation groove 241 by resetting the piston rod of the cylinder 242. Then, the mold cavity 30 can be demolded by tightly gripping the handle 31. Then, the demolded mold cavity 30 is placed inside the groove 23. , connect the power supply to the cylinder 242 to make it work, and move the fixing plate 243 out of the installation groove 241 through the pushing work of the piston rod of the cylinder 242, and limit the upper part of the handle 31, fix the position of the handle 31, and then push the mold frame 20 into the inside of the frame 11, so that the slider 122 slides in the inside of the slide groove 121, and finally, release the control rod 215, and through the rebound force of the elastic member 212, the positioning block 221 and the positioning groove 222 are plugged and matched, so that the mold frame 20 is stabilized inside the frame 11, and then the mold cavity 30 is injected to complete the semiconductor production work.

[0036] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor plastic packaging mold, comprising a chassis (10), characterized in that: The upper surface of the chassis (10) is provided with a frame (11), the interior of the frame (11) is slidably connected with a mold frame (20) via a sliding assembly (12), the upper surface of the mold frame (20) is provided with a groove (23) for placing a mold cavity (30), both sides of the mold cavity (30) are provided with handles (31), and both sides of the interior of the groove (23) are provided with fixing assemblies (24) for stabilizing the mold cavity (30); A control component (21) is disposed inside one side of the mold frame (20), and a side of the control component (21) close to the frame (11) is plugged into and matched with an inner wall of the frame (11) via a positioning component (22).

2. The semiconductor plastic packaging mold according to claim 1, characterized in that: The sliding assembly (12) comprises at least a slide groove (121) and a slider (122); a slider (122) is provided at one end of both sides of the mold frame (20); and slide grooves (121) for sliding connection with the slider (122) are provided on both sides of the inner wall of the frame (11).

3. The semiconductor plastic packaging mold according to claim 1, characterized in that: The control assembly (21) at least comprises a control groove (211), and the control groove (211) is provided on both sides of the inside of the mold frame (20), and elastic members (212) are provided on both sides of one side of the control groove (211), and a connecting plate (213) is provided at the other end of the elastic member (212), and connecting blocks (214) are provided on both sides of the connecting plate (213) close to the elastic member (212), and a control rod (215) is provided on the side of the connecting plate (213) away from the elastic member (212), and the other end of the control rod (215) extends to the outside of the mold frame (20).

4. The semiconductor plastic packaging mold according to claim 3, characterized in that: The positioning assembly (22) comprises at least a positioning block (221) and a positioning groove (222); a positioning block (221) is provided on a side of the connecting block (214) away from the connecting plate (213); and inner walls on both sides of the opening of the frame (11) are provided with positioning grooves (222) for plugging and matching with the positioning block (221).

5. The semiconductor plastic packaging mold according to claim 1, characterized in that: The fixing assembly (24) comprises at least a mounting groove (241), mounting grooves (241) are provided on both sides of the groove (23), a cylinder (242) is provided inside the mounting groove (241), and a fixing plate (243) is provided on the piston rod of the cylinder (242).

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