Handheld splitting cooling head for splitting glass

Abstract

The utility model discloses a handheld splitting cooling head for splitting glass, which comprises a cooling head main body, a temperature sensor is mounted in the cooling head main body, a control panel is mounted on one side of a shell, and a telescopic structure is mounted at the top end of the shell. According to the cooling head, the mounting block is mounted on one side of the cooling head body, the mounting block on one side of the cooling head body can be clamped into the connecting block, so that the cooling head body can be mounted, when the spring drives the baffle to move, the baffle moves to drive the buckle to move, and after the cooling head body is inserted into the connecting block, the buckle moves to drive the buckle to move. When the cooling head body needs to be replaced, the buckle can be inserted into the connecting block and the mounting block, the connecting block and the mounting block can be fixed together through the buckle, when the cooling head body needs to be replaced, the buckle can be pulled open, the buckle is not clamped to the connecting block and the mounting block any more, and the cooling head body can be detached; in this way, the purpose that the hand-held splinter cooling head for glass splinter is convenient to replace is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of glass cutting and processing, in particular to a handheld splinter cooling head for glass splinters. Background Art

[0002] With the advancement of various technologies and the continuous improvement of people's quality of life, various specifications of glass are used in more and more places. At the same time, new requirements are constantly put forward for the precision, production efficiency and processed shape of glass manufacturing. With the development of laser technology, the technology of laser cutting and processing glass has gradually been widely used. After using laser to cut the glass into a closed shape (such as a hole), the cut part needs to be split and separated.

[0003] There is a technology that uses the principle of thermal expansion and contraction to break glass after laser cutting, which requires a cooling head for cooling. How to provide a device for breaking glass that is suitable for manual operation, low cost and easy to operate has become a problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] The utility model aims to provide a handheld glass splinter cooling head, which is used to solve the existing splinter cooling head that is connected to a refrigerator through an inlet and outlet pipe for continuous cooling. We will temporarily call it a common splinter cooling head. The common splinter cooling head has the disadvantages of complex structure, difficulty in replacing the cooling head, and inability to be carried out for separate use.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a handheld glass splinter cooling head for splintering, comprising a cooling head body;

[0006] A temperature sensor is installed inside the cooling head body, a semiconductor cooling sheet is arranged on one side of the cooling head body, a mounting block is installed on one side of the cooling head body, a connecting block matching the mounting block is installed on one side of the semiconductor cooling sheet, and disassembly structures are installed at both ends of one side of the cooling head body;

[0007] The disassembly and assembly structure comprises a mounting plate, a buckle, a spring and a baffle, wherein the mounting plate is mounted on one side of the cooling head body, a spring is mounted on the bottom end of the mounting plate, and a baffle is mounted on the bottom end of the spring, and a buckle is mounted on one side of the baffle;

[0008] The semiconductor refrigeration plate includes a shell, a fixed block, a heat dissipation fin and a heat pipe, the heat pipe is installed on one side of the connecting block, the fixed block is installed on one side of the heat pipe, the shell is installed on one side of the fixed block, the control board is installed on one side of the shell, and the top of the shell is installed with a telescopic structure.

[0009] When in use, first, the cooling head body is pressed tightly against the surface of the semiconductor refrigeration chip through the structural device. The cooling head, mounting block, connecting block, heat pipe and heat dissipation fins can all be made of materials with strong thermal conductivity. The cooling head body can transfer heat through the semiconductor refrigeration chip through the mounting block, connecting block and heat pipe, and then transfer the heat to the heat dissipation fins. The heat dissipation fins have a large surface area and can quickly dissipate heat. The temperature sensor inside the cooling head body can sense the temperature of the semiconductor, and then the value can be displayed on the display screen on the control panel.

[0010] Preferably, a protective structure is installed on one side of the shell, and the protective structure includes a connecting plate, a rotating shaft, a connecting rod and a protective plate. The connecting plate is installed on one side of the shell, a rotating shaft is installed on the inner side of the connecting plate, and a connecting rod is installed on the top of the rotating shaft. The top of the connecting rod is installed with a protective plate. The rotating shaft on the inner side of the connecting plate can rotate, and the rotation of the rotating shaft can drive the protective plate to rotate through the connecting rod. The rotation of the protective plate can cover the surface of the control panel, so as to protect the control panel and prevent the control panel from being damaged when the device is carried.

[0011] Preferably, a clamping block is provided on one side of the protective plate, and a clamping slot is installed on one side of the shell. The protective plate and the shell form a clamping structure, and the clamping structure can make the protective plate more stably fixed.

[0012] Preferably, heat dissipation fins are installed at the top and bottom of the fixed block, and the heat dissipation fins are arranged at equal intervals at the top and bottom of the fixed block, so that the heat dissipation fins can dissipate heat quickly.

[0013] Preferably, the connecting block and the mounting block form a snap-fit ​​structure, the inner diameter of the connecting block is larger than the outer diameter of the mounting block, and the snap-fit ​​structure is easy to disassemble.

[0014] Preferably, the telescopic structure includes a telescopic rod, a handle, an anti-skid pad, a fixing screw and a telescopic slot, the telescopic rod is installed on one side of the shell, the telescopic slot is arranged on one side of the shell, a handle is installed on one side of the telescopic rod, an anti-skid pad is arranged on the outside of the handle, a fixing screw is installed on one end of the telescopic rod, the telescopic rod and the handle form a sliding structure, the handle can be inserted into the telescopic rod and the telescopic slot for storage, and does not need to occupy too much space when not in use, and the handle can be pulled out for use when needed, the anti-skid pad can enhance the friction of the handle, the anti-skid pad can be made of rubber material, and the anti-skid pad can also be heat-insulating to prevent users from getting burned.

[0015] Preferably, external threads are evenly arranged on the outer side wall of the fixing screw, internal threads cooperating with the external threads are evenly arranged on the inner side wall of the telescopic rod, the fixing screw is threadedly connected to the telescopic rod, and the handle can be fixed by tightening the fixing screw.

[0016] The utility model provides a handheld splinter cooling head for glass splinters, which has the advantages that: a mounting block is installed on one side of the cooling head body, and the mounting block and the connecting block form a snap-fit ​​structure, so that the mounting block on one side of the cooling head body can be snapped into the inside of the connecting block, so that the cooling head body can be installed, and the spring between the mounting plate and the baffle is elastic. When the spring drives the baffle to move, the movement of the baffle will drive the buckle to move. After the cooling head body is inserted into the inside of the connecting block, the buckle can be inserted into the inside of the connecting block and the mounting block, and the buckle can fix the connecting block and the mounting block together. When the cooling head body needs to be replaced, the buckle can be pulled open so that the buckle is no longer stuck in the connecting block and the mounting block, and the cooling head body can be disassembled, thereby achieving the purpose of facilitating the replacement of the cooling head by a handheld splinter cooling head for glass splinters;

[0017] A telescopic rod is installed at the top of one side of the shell, and the telescopic rod and the handle form a sliding structure. The handle can be inserted into the telescopic rod and the telescopic groove for storage. It does not need to occupy too much space when not in use. When needed, the handle can be pulled out for use. The handle can be fixed by tightening the fixing screws. The anti-skid pad can enhance the friction of the handle. The anti-skid pad can be made of rubber material. The anti-skid pad can also be heat-insulating to prevent users from scalding their hands. In this way, the handheld fragment cooling head for glass fragments can be easy to carry. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2 It is a front view cross-sectional structural schematic diagram of the utility model;

[0020] Figure 3 For the utility model Figure 2 A schematic diagram of the enlarged structure of the local section at point A in the middle;

[0021] Figure 4 It is a three-dimensional structural schematic diagram of the protective structure of the utility model;

[0022] Figure 5 It is a schematic diagram of a partial cross-section structure of the disassembly and assembly structure of the utility model.

[0023] Explanation of the reference numerals in the figure: 1. semiconductor refrigeration chip; 101. housing; 102. fixing block; 103. heat dissipation fin; 104. heat pipe; 2. connecting block; 3. mounting block; 4. cooling head body; 5. disassembly and assembly structure; 501. mounting plate; 502. buckle; 503. spring; 504. baffle; 6. temperature sensor; 7. telescopic structure; 701. telescopic rod; 702. handle; 703. anti-skid pad; 704. fixing screw; 705. telescopic slot; 8. protective structure; 801. connecting plate; 802. rotating shaft; 803. connecting rod; 804. protective plate; 9. control board. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-Figure 5 The utility model provides an embodiment: a handheld glass fragmentation cooling head for glass fragmentation, including a cooling head body 4.

[0026] A temperature sensor 6 is installed inside the cooling head body 4, a semiconductor refrigeration plate 1 is arranged on one side of the cooling head body 4, a mounting block 3 is installed on one side of the cooling head body 4, a connecting block 2 that cooperates with the mounting block 3 is installed on one side of the semiconductor refrigeration plate 1, the connecting block 2 and the mounting block 3 form a snap-fit ​​structure, and the inner diameter of the connecting block 2 is larger than the outer diameter of the mounting block 3.

[0027] Both ends of one side of the cooling head body 4 are installed with a disassembly structure 5, the disassembly structure 5 includes a mounting plate 501, a buckle 502, a spring 503 and a baffle 504, the mounting plate 501 is installed on one side of the cooling head body 4, the bottom end of the mounting plate 501 is installed with a spring 503, and the bottom end of the spring 503 is installed with a baffle 504, and a buckle 502 is installed on one side of the baffle 504.

[0028] Refer to the attached Figure 1-Figure 2 and attached Figure 5As shown, the mounting block 3 and the connecting block 2 form a snap-fit ​​structure, and the mounting block 3 on one side of the cooling head body 4 can be snapped into the inside of the connecting block 2, so that the cooling head body 4 can be installed. The spring 503 between the mounting plate 501 and the baffle 504 is elastic. When the spring 503 drives the baffle 504 to move, the movement of the baffle 504 will drive the buckle 502 to move. After the cooling head body 4 is inserted into the connecting block 2, the buckle 502 can be inserted into the connecting block 2 and the mounting block 3. The buckle 502 can fix the connecting block 2 and the mounting block 3 together. When the cooling head body 4 needs to be replaced, the buckle 502 can be pulled open so that the buckle 502 is no longer stuck in the connecting block 2 and the mounting block 3, and the cooling head body 4 can be disassembled.

[0029] The semiconductor refrigeration chip 1 includes a shell 101, a fixed block 102, heat dissipation fins 103 and a heat pipe 104. The heat pipe 104 is installed on one side of the connecting block 2. The fixed block 102 is installed on one side of the heat pipe 104. The top and bottom ends of the fixed block 102 are both installed with heat dissipation fins 103, and the heat dissipation fins 103 are arranged at equal intervals at the top and bottom ends of the fixed block 102.

[0030] A shell 101 is installed on one side of the fixed block 102, a protective structure 8 is installed on one side of the shell 101, and the protective structure 8 includes a connecting plate 801, a rotating shaft 802, a connecting rod 803 and a protective plate 804, the connecting plate 801 is installed on one side of the shell 101, the rotating shaft 802 is installed on the inner side of the connecting plate 801, and a connecting rod 803 is installed on the top of the rotating shaft 802, and a protective plate 804 is installed on the top of the connecting rod 803, a clamping block is provided on one side of the protective plate 804, a clamping slot is installed on one side of the shell 101, and the protective plate 804 and the shell 101 constitute a clamping structure.

[0031] Refer to the attached Figure 1-Figure 2 and attached Figure 4 As shown, the semiconductor refrigeration plate is composed of devices such as a heat pipe 104 and a heat dissipation fin 103. The rotating shaft 802 on the inner side of the connecting plate 801 can rotate. The rotation of the rotating shaft 802 can drive the protective plate 804 to rotate through the connecting rod 803. The protective plate 804 can rotate to cover the surface of the control board 9, which can protect the control board 9 and prevent the control board 9 from being damaged when the device is carried. When the cooling head body 4 is tightly pressed against the surface of the semiconductor refrigeration plate through the structural device, the cooling head, the mounting block 3, the connecting block 2, the heat pipe 104 and the heat dissipation fin 103 can all be made of materials with strong thermal conductivity. The cooling head body 4 can conduct heat through the semiconductor refrigeration plate through the mounting block 3, the connecting block 2 and the heat pipe 104, and introduce the heat into the heat dissipation fin 103. The heat dissipation fin 103 has a large surface area and can quickly dissipate heat. The temperature sensor 6 inside the cooling head body 4 can sense the temperature of the semiconductor, and then the value can be displayed on the display screen on the control board 9.

[0032] A control panel 9 is installed on one side of the shell 101, and a telescopic structure 7 is installed on the top of the shell 101. The telescopic structure 7 includes a telescopic rod 701, a handle 702, an anti-slip pad 703, a fixing screw 704 and a telescopic slot 705. The telescopic rod 701 is installed on one side of the shell 101, and the telescopic slot 705 is arranged on one side of the shell 101. A handle 702 is installed on one side of the telescopic rod 701, and an anti-slip pad 703 is arranged on the outside of the handle 702. A fixing screw 704 is installed on one end of the telescopic rod 701, and external threads are evenly arranged on the outer wall of the fixing screw 704, and internal threads matching the external threads are evenly arranged on the inner wall of the telescopic rod 701. The fixing screw 704 is threadedly connected to the telescopic rod 701.

[0033] Refer to the attached Figure 1-Figure 3 As shown, the telescopic rod 701 and the handle 702 form a sliding structure, and the handle 702 can be inserted into the telescopic rod 701 and the telescopic slot 705 for storage. It does not need to occupy too much space when not in use. When needed, the handle 702 can be pulled out for use. Tightening the fixing screw 704 can fix the handle 702. The anti-skid pad 703 can enhance the friction of the handle 702. The anti-skid pad 703 can be made of rubber material, and the anti-skid pad 703 can also be heat-insulated to prevent users from getting burned.

[0034] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A handheld glass splinter cooling head for splintering, comprising a cooling head body (4); Features: A temperature sensor (6) is installed inside the cooling head body (4); a semiconductor cooling sheet (1) is provided on one side of the cooling head body (4); a mounting block (3) is installed on one side of the cooling head body (4); a connecting block (2) that cooperates with the mounting block (3) is installed on one side of the semiconductor cooling sheet (1); and disassembly structures (5) are installed at both ends of one side of the cooling head body (4); The disassembly and assembly structure (5) comprises a mounting plate (501), a buckle (502), a spring (503) and a baffle (504); the mounting plate (501) is mounted on one side of the cooling head body (4); the spring (503) is mounted on the bottom end of the mounting plate (501); the baffle (504) is mounted on the bottom end of the spring (503); and the buckle (502) is mounted on one side of the baffle (504); The semiconductor refrigeration chip (1) comprises a shell (101), a fixing block (102), a heat dissipation fin (103) and a heat pipe (104); the heat pipe (104) is installed on one side of the connection block (2); the fixing block (102) is installed on one side of the heat pipe (104); the shell (101) is installed on one side of the fixing block (102); the control board (9) is installed on one side of the shell (101); and the top of the shell (101) is installed with a telescopic structure (7).

2. A handheld glass splinter cooling head according to claim 1, characterized in that: A protective structure (8) is installed on one side of the housing (101), and the protective structure (8) comprises a connecting plate (801), a rotating shaft (802), a connecting rod (803) and a protective plate (804); the connecting plate (801) is installed on one side of the housing (101), a rotating shaft (802) is installed on the inner side of the connecting plate (801), a connecting rod (803) is installed on the top end of the rotating shaft (802), and a protective plate (804) is installed on the top end of the connecting rod (803).

3. A handheld glass breaking cooling head according to claim 2, characterized in that: A clamping block is provided on one side of the protective plate (804), a clamping slot is installed on one side of the housing (101), and the protective plate (804) and the housing (101) form a clamping structure.

4. A handheld glass breaking cooling head according to claim 1, characterized in that: Heat dissipation fins (103) are installed at the top and bottom of the fixed block (102), and the heat dissipation fins (103) are arranged at equal intervals at the top and bottom of the fixed block (102).

5. The handheld glass breaking cooling head according to claim 1, characterized in that: The connecting block (2) and the mounting block (3) form a snap-fit ​​structure, and the inner diameter of the connecting block (2) is greater than the outer diameter of the mounting block (3).

6. A handheld glass breaking cooling head according to claim 1, characterized in that: The telescopic structure (7) comprises a telescopic rod (701), a handle (702), an anti-skid pad (703), a fixing screw (704) and a telescopic slot (705); the telescopic rod (701) is mounted on one side of the housing (101); the telescopic slot (705) is arranged on one side of the housing (101); a handle (702) is mounted on one side of the telescopic rod (701); an anti-skid pad (703) is arranged on the outer side of the handle (702); and a fixing screw (704) is mounted on one end of the telescopic rod (701).

7. A handheld glass breaking cooling head according to claim 6, characterized in that: External threads are evenly arranged on the outer wall of the fixing screw (704), and internal threads matching the external threads are evenly arranged on the inner wall of the telescopic rod (701). The fixing screw (704) and the telescopic rod (701) are threadedly connected.

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