Mask device

By designing a mask device with a convex structure and a heating mechanism, the shift problem caused by steam shock in the vapor deposition process is solved, and the deposition uniformity and battery performance of perovskite/silicon solar cells are improved.

CN222160324UActive Publication Date: 2024-12-13TRINA SOLAR CO LTD
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Patent Information

Application Number
CN202420235068.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-31
Publication Date
2024-12-13
Estimated Expiration
2034-01-31

AI Technical Summary

Technical Problem

In the process of preparing perovskite/silicon stacked solar cells, the thickness of the silicon wafer is thin, and the traditional mask device cannot effectively resist the back of the silicon wafer, resulting in the silicon wafer being easily displaced by steam in the vapor deposition process. Uneven deposition.

Method used

A mask device is designed, including a mask plate and a cover plate. The cover plate is provided with a protruding structure in the hollow area, including an elastic component and a touch component, which can stabilize the pressure of the substrate and prevent displacement caused by steam impact. The substrate is heated evenly through a heating mechanism.

Benefits of technology

It effectively prevents the substrate from shifting due to steam impact during vapor deposition, improves the deposition effect, and ensures the quality of the perovskite layer film and the performance of solar cells.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a mask device. The mask device comprises a mask plate and a cover plate capable of covering the mask plate, the mask plate is provided with at least one hollow area, and each hollow area is used for placing a substrate; a first protruding structure protruding out of the cover plate is arranged on the side, close to the hollowed-out areas, of the cover plate and corresponds to each hollowed-out area, and after the cover plate and the mask plate are closed in a covering mode, the first protruding structures abut against the substrate. In the vapor deposition process, the mask device can effectively prevent the substrate from being impacted by steam to cause displacement, and the vapor deposition effect can be improved.
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