Device for uniformly cooling after electroplating

Abstract

The utility model relates to the field of electroplating, and discloses a device for uniformly cooling after electroplating, which comprises an electroplating box, a cooling mechanism and a cooling mechanism, the cooling mechanism comprises a cooling assembly and a separation assembly; the cooling assembly comprises a cooling box, a refrigerant inlet pipe, a refrigerant outlet pipe, a refrigerating pipe, a pump body, a first heat conduction pipe and a second heat conduction pipe, the cooling box is fixedly installed at the top of the electroplating box, the refrigerant inlet pipe and the refrigerant outlet pipe are both fixedly installed on the cooling box, the refrigerating pipe is installed between the refrigerant inlet pipe and the refrigerant outlet pipe, and the pump body is installed on the pump body. The pump body is fixedly installed on the electroplating box, and the first heat conduction pipe is fixedly installed between the second heat conduction pipe and the pump body. The separating assembly comprises a synchronous hydraulic cylinder, a connecting rod, a sealing separating plate, a vertical rod and a plug. The electroplating liquid cooling device has the advantages and effects that the electroplating liquid can be quickly and uniformly cooled, and the cooling efficiency of the electroplating liquid is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a uniform cooling device after electroplating. Background Art

[0002] Electroplating is the process of using the principle of electrolysis to plate a thin layer of other metals or alloys on certain metal surfaces. It can effectively prevent the oxidation of the metal surface, and can also provide various properties of the metal and enhance the beauty of the metal appearance. Electroplating is needed in the electroplating process.

[0003] In the electroplating production process, the temperature of the plating solution will gradually increase due to the long-term introduction of current into the plating solution. If the temperature of the plating solution is too high, the plating solution will be very unstable. Therefore, the plating solution needs to be cooled. The prior art announcement number CN217677883U discloses a plating liquid cooling device for electroplating, including a plating box, a cooling mechanism is installed on the plating box, and the cooling mechanism includes a cooling block fixedly connected to the side wall of the plating box by a fixed shaft, a liquid inlet groove is provided at the upper end of the cooling block, and the liquid inlet groove is arranged to penetrate the cooling block. A cooling groove is provided in the cooling block, and a water pump is fixedly connected to the side wall of the plating box, and the water pump is connected to the plating box through a liquid suction pipe, and the water pump is connected to the liquid inlet groove through a liquid outlet pipe, and the liquid inlet groove is connected to the plating box through a liquid return pipe. A liquid supply mechanism for supplying liquid to the cooling groove is installed on the plating box.

[0004] When it is in use, the plating liquid in the lower part of the plating box is extracted and then introduced into the upper part of the plating box. The cooled plating liquid is mixed with the high-temperature plating liquid again. This requires multiple cycles to cool the plating liquid. The plating liquid cannot be cooled quickly and evenly, which reduces the cooling efficiency. Therefore, it is necessary to design a post-electroplating cooling uniformity device to solve the above problem.

[0005] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0006] The utility model aims to provide a uniform cooling device after electroplating to solve the above problems.

[0007] The above technical purpose of the utility model is achieved through the following technical solutions: a uniform cooling device after electroplating, comprising:

[0008] An electroplating box, wherein the electroplating liquid is contained in the electroplating box and a cooling mechanism is provided on the electroplating box;

[0009] The cooling mechanism includes a cooling component and a partition component;

[0010] The cooling assembly comprises a cooling box, a refrigerant inlet pipe, a refrigerant outlet pipe, a refrigeration pipe, a pump body, a heat conduction pipe 1 and a heat conduction pipe 2. The cooling box is fixedly installed on the top of the electroplating box, the refrigerant inlet pipe and the refrigerant outlet pipe are both fixedly installed on the cooling box, the refrigeration pipe is installed between the refrigerant inlet pipe and the refrigerant outlet pipe, the pump body is fixedly installed on the electroplating box, and the heat conduction pipe 1 is fixedly installed between the heat conduction pipe 2 and the pump body;

[0011] The partition assembly includes a synchronous hydraulic cylinder, a connecting rod, a sealing partition, a vertical rod and a plug. The synchronous hydraulic cylinder is installed on a cooling box. The hydraulic rod of the synchronous hydraulic cylinder is fixedly connected to the connecting rod. The bottom end of the connecting rod is fixedly connected to the sealing partition. The sealing partition is slidingly and sealingly installed inside the electroplating box. The vertical rod is fixedly installed on the top inner wall of the electroplating box. The plug is fixedly installed at the bottom end of the vertical rod. A plugging hole is opened on the top of the sealing partition, and the plug is in sealing contact with the plugging hole.

[0012] The utility model is further configured as follows: fans are fixedly arranged on both sides of the electroplating box.

[0013] The utility model is further configured as follows: a sliding hole is provided on the top of the electroplating box, and the connecting rod is slidably installed in the sliding hole.

[0014] By adopting the above technical solution, the connecting rod can move stably in the vertical direction.

[0015] The utility model is further configured as follows: the electroplating liquid is located below the sealing partition.

[0016] The utility model is further configured as follows: the heat conducting pipe 1 is installed on the cooling box.

[0017] By adopting the above technical solution, the installation position of the heat pipe 1 is limited.

[0018] The utility model is further configured as follows: the second heat conducting pipe is installed on the cooling box and the electroplating box.

[0019] By adopting the above technical solution, the installation position of the second heat conduction pipe is limited.

[0020] The utility model is further configured as follows: sealing rubber pads are embedded around the sealing partition, and the sealing rubber pads are in sealing contact with the inside of the electroplating box.

[0021] The utility model is further configured as follows: a liquid extraction pipe is fixedly arranged on the pump body, and the liquid extraction pipe is fixedly installed on the electroplating box.

[0022] The beneficial effects of the utility model are:

[0023] 1. The utility model refrigerates the interior of the cooling box through the cooling pipe by means of the cooling assembly and the partition assembly, and the pump body extracts the electroplating liquid. When the electroplating liquid flows in the heat conducting pipe 1, the fan can perform preliminary uniform cooling treatment on the electroplating liquid flowing in the heat conducting pipe 1. When the electroplating liquid flows in the heat conducting pipe 2, the cold air in the cooling box can perform uniform cooling treatment on the electroplating liquid flowing in the heat conducting pipe 2, and the electroplating liquid can be cooled well.

[0024] 2. The utility model sets up a cooling component and a partition component, and the cooled electroplating liquid falls onto the sealed partition plate and will not mix with the uncooled electroplating liquid below until the uncooled electroplating liquid below is completely drawn out, and then starts the synchronous hydraulic cylinder to separate the blockage from the plugged hole. At this time, the cooled electroplating liquid flows into the lower position inside the electroplating box, so that the electroplating liquid can be cooled quickly and evenly, effectively improving the cooling efficiency of the electroplating liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 The utility model is a structural schematic diagram of a post-electroplating uniform cooling device.

[0027] Figure 2 The utility model discloses a cross-sectional structural diagram of a post-electroplating uniform cooling device.

[0028] Figure 3 yes Figure 1 Schematic diagram of the structure of part A in .

[0029] Figure 4 It is a schematic diagram of the structure of a uniform cooling device after electroplating in Example 2.

[0030] In the figure, 1. electroplating box; 2. cooling box; 3. refrigerant inlet pipe; 4. refrigerant outlet pipe; 5. refrigeration pipe; 6. pump body; 7. heat transfer pipe 1; 8. heat transfer pipe 2; 9. synchronous hydraulic cylinder; 10. connecting rod; 11. sealing partition; 12. vertical rod; 13. plugging; 14. plugging hole; 15. sliding hole; 16. fan. DETAILED DESCRIPTION

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0032] The technical solution of the utility model will be described clearly and completely below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Example 1

[0034] See also Figure 1 , Figure 2 and Figure 3 The utility model provides a uniform cooling device after electroplating, comprising:

[0035] The electroplating box 1 contains an electroplating solution, and a cooling mechanism is provided on the electroplating box 1. It should be noted that the electroplating solution is cooled by the cooling mechanism;

[0036] The cooling mechanism includes a cooling component and a separation component. It should be noted that the electroplating liquid is cooled by the cooling component, and the cooled electroplating liquid is separated from the uncooled electroplating liquid by the separation component.

[0037] The cooling assembly includes a cooling box 2, a refrigerant inlet pipe 3, a refrigerant outlet pipe 4, a refrigeration pipe 5, a pump body 6, a heat conduction pipe 1 7 and a heat conduction pipe 2 8. The cooling box 2 is fixedly installed on the top of the electroplating box 1, the refrigerant inlet pipe 3 and the refrigerant outlet pipe 4 are both fixedly installed on the cooling box 2, the refrigeration pipe 5 is installed between the refrigerant inlet pipe 3 and the refrigerant outlet pipe 4, the pump body 6 is fixedly installed on the electroplating box 1, and the heat conduction pipe 1 7 is fixedly installed between the heat conduction pipe 2 8 and the pump body 6;

[0038] Through the above-mentioned cooling assembly, the refrigerant inlet pipe 3 is connected to the output end of the refrigeration system in the compressor condensation recovery device, and the refrigerant outlet pipe 4 is connected to the input end of the refrigeration system, so that the low-temperature refrigerant can flow in the refrigeration pipe 5. The compressor in the refrigeration system drives the refrigerant to flow in the refrigeration pipe, so that the inside of the cooling box 2 can be cooled down. The pump body 6 can extract the plating liquid in the plating box 1, and then introduce it into the plating box 1 again through the heat conducting pipe 1 7 and the heat conducting pipe 2 8. When the plating liquid flows in the heat conducting pipe 2 8, the cold air inside the cooling box 2 can cool the plating liquid flowing in the heat conducting pipe 2 8 well.

[0039] The partition assembly includes a synchronous hydraulic cylinder 9, a connecting rod 10, a sealing partition 11, a vertical rod 12 and a plug 13. The synchronous hydraulic cylinder 9 is installed on the cooling box 2. The hydraulic rod of the synchronous hydraulic cylinder 9 is fixedly connected to the connecting rod 10. The bottom end of the connecting rod 10 is fixedly connected to the sealing partition 11. The sealing partition 11 is slidingly sealed and installed inside the electroplating box 1. The vertical rod 12 is fixedly installed on the top inner wall of the electroplating box 1. The plug 13 is fixedly installed at the bottom end of the vertical rod 12. A plugging hole 14 is opened on the top of the sealing partition 11, and the plug 13 is in sealing contact with the plugging hole 14.

[0040] Through the above-mentioned partition assembly, the cooled electroplating liquid falls onto the sealed partition 11 and will not mix with the uncooled electroplating liquid below until the uncooled electroplating liquid below is completely extracted, and then the synchronous hydraulic cylinder 9 is started to separate the plug 13 from the plugging hole 14. At this time, the cooled electroplating liquid flows from the plugging hole 14 to the lower position inside the electroplating box 1, so that the electroplating liquid can be cooled quickly and evenly, effectively improving the cooling efficiency of the electroplating liquid.

[0041] Specifically, a sliding hole 15 is opened on the top of the electroplating box 1, and the connecting rod 10 is slidably installed in the sliding hole 15. It should be noted that this facilitates the stable movement of the connecting rod 10 in the vertical direction.

[0042] Specifically, the electroplating liquid is located below the sealing partition 11. Sealing rubber gaskets are embedded around the sealing partition 11. The sealing rubber gaskets are in sealing contact with the inside of the electroplating box 1. It should be noted that the sealing performance between the sealing partition 11 and the inside of the electroplating box 1 can be guaranteed.

[0043] Specifically, heat pipe 1 7 is installed on cooling box 2, and heat pipe 2 8 is installed on cooling box 2 and electroplating box 1. It should be noted that the installation positions of heat pipe 1 7 and heat pipe 2 8 are limited.

[0044] Specifically, a liquid extraction pipe is fixedly provided on the pump body 6, and the liquid extraction pipe is fixedly installed on the electroplating box 1. It should be noted that it is convenient to extract the electroplating liquid.

[0045] Example 2

[0046] See also Figure 4 The difference between this embodiment and embodiment 1 is that:

[0047] Fans 16 are fixedly installed on both sides of the electroplating box 1. It should be noted that the installation of the fans 16 can improve the cooling efficiency of the electroplating liquid.

[0048] Working principle:

[0049] S1: The pump body 6 can pump out the plating liquid in the plating box 1, and then re-introduce it into the plating box 1 through the heat-conducting pipe 1 7 and the heat-conducting pipe 2 8. When the plating liquid flows in the heat-conducting pipe 1 7, the plating liquid flowing in the heat-conducting pipe 1 7 can be preliminarily cooled evenly. When the plating liquid flows in the heat-conducting pipe 2 8, the cold air inside the cooling box 2 can cool the plating liquid flowing in the heat-conducting pipe 2 8 well.

[0050] S2: The cooled electroplating liquid falls onto the sealing baffle 11 and will not mix with the uncooled electroplating liquid below until all the uncooled electroplating liquid below is extracted. Then the synchronous hydraulic cylinder 9 is started to enable the connecting rod 10 to drive the sealing baffle 11 to move downward, so that the plug 13 is separated from the plugging hole 14. At this time, the cooled electroplating liquid flows from the plugging hole 14 to the lower position inside the electroplating box 1. In this way, the electroplating liquid can be cooled quickly and evenly, effectively improving the cooling efficiency of the electroplating liquid.

[0051] The above is a detailed introduction to a uniform cooling device after electroplating provided by the utility model. This article uses specific embodiments to explain the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A uniform cooling device after electroplating, characterized in that: include: An electroplating box (1), wherein the electroplating box (1) contains electroplating liquid, and a cooling mechanism is provided on the electroplating box (1); The cooling mechanism includes a cooling component and a partition component; The cooling assembly comprises a cooling box (2), a refrigerant inlet pipe (3), a refrigerant outlet pipe (4), a refrigeration pipe (5), a pump body (6), a heat conduction pipe 1 (7) and a heat conduction pipe 2 (8); the cooling box (2) is fixedly mounted on the top of the electroplating box (1); the refrigerant inlet pipe (3) and the refrigerant outlet pipe (4) are both fixedly mounted on the cooling box (2); the refrigeration pipe (5) is mounted between the refrigerant inlet pipe (3) and the refrigerant outlet pipe (4); the pump body (6) is fixedly mounted on the electroplating box (1); and the heat conduction pipe 1 (7) is fixedly mounted between the heat conduction pipe 2 (8) and the pump body (6); The partition assembly comprises a synchronous hydraulic cylinder (9), a connecting rod (10), a sealing partition (11), a vertical rod (12) and a plug (13); the synchronous hydraulic cylinder (9) is mounted on a cooling box (2); the hydraulic rod of the synchronous hydraulic cylinder (9) is fixedly connected to the connecting rod (10); the bottom end of the connecting rod (10) is fixedly connected to the sealing partition (11); the sealing partition (11) is slidingly and sealingly mounted inside the electroplating box (1); the vertical rod (12) is fixedly mounted on the top inner wall of the electroplating box (1); the plug (13) is fixedly mounted on the bottom end of the vertical rod (12); a plugging hole (14) is opened at the top of the sealing partition (11); the plug (13) is in sealing contact with the plugging hole (14).

2. The uniform cooling device after electroplating according to claim 1, characterized in that: Fans (16) are fixedly arranged on both sides of the electroplating box (1).

3. The uniform cooling device after electroplating according to claim 1, characterized in that: The top of the electroplating box (1) is provided with a sliding hole (15), and the connecting rod (10) is slidably installed in the sliding hole (15).

4. The uniform cooling device after electroplating according to claim 1, characterized in that: The electroplating solution is located below the sealing partition (11).

5. The uniform cooling device after electroplating according to claim 1, characterized in that: The heat conducting pipe 1 (7) is installed on the cooling box (2).

6. The uniform cooling device after electroplating according to claim 1, characterized in that: The second heat conducting pipe (8) is installed on the cooling box (2) and the electroplating box (1).

7. The uniform cooling device after electroplating according to claim 1, characterized in that: The sealing partition (11) is embedded with sealing rubber pads on all sides, and the sealing rubber pads are in sealing contact with the inside of the electroplating box (1).

8. The uniform cooling device after electroplating according to claim 1, characterized in that: The pump body (6) is fixedly provided with a liquid extraction pipe, which is fixedly mounted on the electroplating box (1).

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