Automatic sampling equipment and circuit board processing system

Abstract

The utility model provides automatic sampling equipment and a circuit board processing system, and the automatic sampling equipment comprises a working table top which is used for bearing a circuit board; the cutting assembly is used for cutting the circuit board; the dust suction assembly is used for sucking chips and pressing the slices to prevent the chips from being sucked by the chip suction assembly; and the transplanting device drives a dust collection assembly to move above the working table top, the dust collection assembly is used for collecting dust, and the cutting assembly presses and abuts against the slices when cutting the slices on the circuit board. According to the circuit board processing system and the automatic sampling equipment, automatic sampling of slices can be achieved, convenience and rapidness are achieved, and manpower is saved; the infrared positioning piece and the CCD positioning piece are arranged, and positioning is performed twice, so that the sampling precision is higher; and through the dust collection assembly and two times of cutting, dust collection can be achieved while cutting is conducted, and the slices are prevented from being sucked away.

Description

Technical Field

[0001] The utility model relates to automatic sampling equipment and a circuit board processing system. Background Art

[0002] In the production process of printed circuit boards, the general production line often needs to produce a large number of slices to monitor process variations or ensure quality at the time of shipment. The quality of circuit boards, the occurrence and resolution of problems, and the evaluation of process improvements all require slices as a basis for objective inspection, research, and judgment. The slice production process generally includes sampling, sealing, grinding, polishing, micro-etching, and photography. For the sampling step alone, there is currently no fully automatic sampling equipment, and the points to be sampled are manually moved to the sampling area of ​​the sampler, which is time-consuming and labor-intensive.

[0003] In view of this, it is necessary to improve the existing sampling device to solve the above problems. Utility Model Content

[0004] The utility model aims to provide an automatic sampling device to solve the problem that the existing slice sampling requires manual operation, which is time-consuming and labor-intensive.

[0005] To achieve the above object, the utility model provides an automatic sampling device for obtaining slices from a circuit board, the automatic sampling device comprising:

[0006] A work surface, the work surface is used to carry a circuit board;

[0007] A cutting component for cutting circuit boards;

[0008] A dust suction component is used to suck the chips and press against the slices to prevent them from being sucked by the dust suction component;

[0009] A transplanting device drives a dust collecting component to move above a work surface, wherein the dust collecting component is used to collect dust and a cutting component is used to press against the slice when cutting the slice on the circuit board.

[0010] As a further improvement of the utility model, the dust suction assembly includes a second chip suction cover and an auxiliary clamping jaw that can move in a vertical direction relative to the second chip suction cover, and the auxiliary clamping jaw is used to form a cutting groove on the circuit board and then protrude into the cutting groove to clamp the slice.

[0011] As a further improvement of the present invention, the dust suction assembly also includes a circuit board pressure plate arranged under the second chip suction cover, a spring arranged between the circuit board pressure plate and the second chip suction cover, a guide shaft arranged in the spring, and a chip suction head connected to the second chip suction cover.

[0012] As a further improvement of the present invention, the automatic sampling device further comprises a circuit board transport assembly, and the cutting assembly is arranged under the work surface to cut the circuit board clamped by the circuit board transport assembly through the work surface.

[0013] As a further improvement of the present invention, the dust suction assembly includes a first chip suction hood, a brush member arranged at the lower end of the first chip suction hood for dust suction during cutting, and a pressure foot member arranged at the lower end of the first chip suction hood for pressing the slice during cutting, and one of the brush member and the pressure foot member is installed below the first chip suction hood.

[0014] As a further improvement of the present invention, the cutting assembly is an electric spindle, the electric spindle is arranged on the first dust suction cover, the electric spindle and the dust suction assembly are coaxial, and move synchronously above the workbench.

[0015] As a further improvement of the utility model, the automatic sampling device also includes a sample suction nozzle for sucking slices and a suction nozzle vacuum for controlling the operation of the sample suction nozzle.

[0016] As a further improvement of the utility model, the transplanting device is provided with a positioning component which moves synchronously with the dust suction component, and the positioning component includes an infrared positioning component for achieving rough positioning and a CCD positioning component for achieving precise positioning.

[0017] As a further improvement of the present invention, the automatic sampling device further comprises a controller, the controller records the positioning coordinates of the CCD positioning member, and the cutting component cuts the slice according to the positioning coordinates.

[0018] As a further improvement of the present invention, the transplanting device is mounted above the work surface, and includes a first guide rail arranged on both sides of the work surface, a second guide rail connecting the first guide rails on both sides, and the positioning component and the dust collection component are arranged on the second guide rail.

[0019] As a further improvement of the present invention, the automatic sampling equipment also includes a circuit board limiting assembly for limiting the position of the circuit board, the circuit board limiting assembly includes a circuit board limiting plate arranged on the work surface, two clamping support blocks arranged under the work surface, a driving screw for driving the two clamping support blocks to move closer or farther away, a pressure plate cylinder arranged on the pressure support block, and a mushroom-shaped pressure plate driven up and down by the pressure plate cylinder, and the mushroom-shaped pressure plate passes through the work surface.

[0020] As a further improvement of the utility model, the automatic sampling device further comprises a slice angle adjustment component for adjusting the slice angle and a slice flipping component for flipping the slice.

[0021] The utility model also provides a circuit board processing system, which includes: an automatic sampling device, a glue pouring device and a grinding device connected in sequence, wherein the automatic sampling device is used to obtain slices from the circuit board; the glue pouring device is used to inject glue and solidify the slices to form glue blocks; and the grinding device is used to grind the glue blocks.

[0022] The beneficial effects of the utility model are as follows: the circuit board processing system and the automatic sampling device of the utility model can realize automatic sampling of slices, which is convenient, fast and saves manpower; by setting an infrared positioning part and a CCD positioning part and using two positionings, the sampling accuracy is higher; by using a dust suction component and using two cuttings, dust suction can be achieved while cutting, and the slices can be prevented from being sucked away. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the automatic sampling device of Example 1 of the utility model;

[0024] Figure 2 yes Figure 1 Schematic diagram of the structure of the positioning assembly, cutting assembly, chip suction cover, sample suction nozzle and suction nozzle vacuum;

[0025] Figure 3 yes Figure 1 Structural schematic diagram of the middle brush part, the presser foot part and the switching plate;

[0026] Figure 4 yes Figure 1 A schematic diagram of the structure of the slice angle adjustment component;

[0027] Figure 5 yes Figure 1 Schematic diagram of the structure of the slice flip component;

[0028] Figure 6 yes Figure 1 A schematic diagram of the structure of the work surface and the circuit board limit assembly;

[0029] Figure 7 It is a structural schematic diagram of a circuit board being cut once by the automatic sampling device of Example 1 of the utility model;

[0030] Figure 8 It is a structural schematic diagram of the automatic sampling device of Example 2 of the utility model;

[0031] Fig. 9 yes Figure 8 A schematic diagram of the structure of the automatic sampling device from another angle;

[0032] Fig.10 yes Figure 8 A schematic diagram of the structure of the circuit board handling assembly;

[0033] Fig.11 yes Figure 8 Schematic diagram of the structure of the cutting component;

[0034] Fig.12 yes Figure 8 A schematic diagram of the structure of the positioning component and the dust collection component;

[0035] Fig.13 It is a partial structural diagram of 12;

[0036] Fig.14 It is a structural schematic diagram of a circuit board being cut once by the automatic sampling device of Example 2 of the utility model;

[0037] Fig.15 It is a structural schematic diagram of the glue filling device of the second embodiment of the utility model;

[0038] Fig.16 It is a structural schematic diagram of a slice feeding assembly of the glue filling equipment of the utility model;

[0039] Fig.17 It is a structural schematic diagram of the glue injection assembly of the glue injection equipment of the utility model;

[0040] Fig.18 It is a structural schematic diagram of the vacuum pumping component of the glue filling equipment of the utility model;

[0041] Fig.19 It is a structural schematic diagram of a light-curing component of the glue-filling equipment of the utility model;

[0042] Fig. 20 This is a schematic structural diagram of the light-curing component of the glue-filling equipment of the utility model from another angle;

[0043] Fig.21 It is a structural schematic diagram of the handling and flipping components of the glue filling equipment of the utility model;

[0044] Fig. 22 It is a structural schematic diagram of the glue filling device of the first embodiment of the utility model;

[0045] Fig.23 yes Fig. 22 A schematic diagram of the enlarged structure of the middle area A;

[0046] Fig.24 yes Fig. 22 Schematic diagram of the structure of the clamping assembly and the injection mold;

[0047] Fig.25 yes Fig. 22 Schematic diagram of the structure of the punching assembly;

[0048] Fig.26 yes Fig.15 Structural diagram of the middle mold silo;

[0049] Fig. 27 yes Fig.15 Structural schematic diagram of the middle mold feeding assembly;

[0050] Fig.28 yes Fig.15 A schematic diagram of the structure of the middle clamping assembly;

[0051] Fig.29 yes Fig.28 Schematic diagram of the structure of the middle part;

[0052] Fig.30 It is a structural schematic diagram of the glue filling device of the third embodiment of the utility model;

[0053] Fig.31 yes Fig.30 Schematic diagram of the structure of the center injection mold, clamping assembly and ejector assembly;

[0054] Fig.32 yes Fig.30 Schematic diagram of part of the structure of the injection mold;

[0055] Fig.33 yes Fig.30 A schematic diagram of the structure of the middle top material assembly;

[0056] Fig.34 It is a structural schematic diagram of the glue filling device of the fourth embodiment of the utility model;

[0057] Fig.35 yes Fig.34 Schematic diagram of the structure of the clamping assembly and the injection mold;

[0058] Fig.36 It is a structural schematic diagram of the grinding equipment of the utility model;

[0059] Fig.37 yes Fig.36 A schematic diagram of the structure of the rubber block handling component;

[0060] Fig.38 yes Fig.36 A schematic diagram of the structure of the rubber block feeding assembly;

[0061] Fig.39 yes Fig.36 A schematic diagram of the structure of the grinding assembly;

[0062] Fig.40 yes Fig.39 Schematic diagram of the partial structure of the grinding component. DETAILED DESCRIPTION

[0063] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0064] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0065] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0066] In the circuit board processing process, slice analysis technology, also known as slice, metallographic slice, micro-slice, is an analytical method to check the internal condition of the circuit board by observing the cross-sectional structure of the sample. In the circuit board production process, slice analysis is a sample preparation method that first cuts the sample slice at a specific point on the circuit board, then wraps the slice with a transparent liquid resin and seals it, and finally grinds and polishes it. The slice analysis process includes sampling, sealing, grinding, polishing, micro-etching and observation. Among them, the sampling process is to cut slices on the circuit board, the sealing process is to inject glue and light-curing the slices, and the grinding process is to polish and grind the slices; finally, the slices are optically magnified for inspection. Through these steps, the internal structure or defects of the circuit board slices are exposed, so as to observe the morphology and structure of the cross section of the circuit board. By comparing and analyzing these microscopic morphology and structural information with product quality requirements, the quality of the circuit board product can be determined, providing an effective basis for the next step of parameter adjustment, defect avoidance, and quality improvement.

[0067] At present, the production of circuit board slices is all manual work. Sampling, sealing and grinding are all done offline on a single machine. Technicians are required to constantly load and unload materials for each slicing process, and multiple processes of a single machine (sampling, sealing and grinding) are manually operated by technicians. This manual operation is inefficient and costly, and is not suitable for the requirements of automated intelligent factories. Therefore, in the process of making metallographic slices of circuit boards, how to design efficient automated equipment is a technical problem that needs to be solved urgently.

[0068] like Figures 1 to 14 As shown, the circuit board processing system of the utility model includes an automatic sampling device 1 for obtaining slices 300 from a circuit board 200, a glue pouring device 3 for injecting glue into the slices 300 to form glue blocks, and a grinding device 7 for grinding the glue blocks; the automatic sampling device 1, the glue pouring device 3 and the grinding device 7 are connected in sequence.

[0069] The automatic sampling device 1 is used to obtain a slice 300 from a circuit board 200. The automatic sampling device 1 includes a work surface 11 for carrying the circuit board 200, a positioning component 12 for positioning the circuit board 200, a cutting component 13 for cutting the circuit board 200, a dust suction component 14, a transplanting device 15 for driving the dust suction component 14 to move, a slice angle adjustment component 16 for adjusting the angle of the slice 300, a slice flipping component 17 for flipping the slice 300, and a controller.

[0070] like Figure 2 As shown, the positioning assembly 12 includes an infrared positioning member 121 for achieving rough positioning, a CCD positioning member 122 for achieving precise positioning, and a display electrically connected to the CCD positioning member 122 .

[0071] The positioning component 12 is used as follows: first, the infrared positioning component 121 is used to align the sampling point to achieve rough positioning, and then the CCD positioning component 122 is used to take a picture to the display, and then the sampling point is found on the display for precise positioning. After precise positioning, the sampling accuracy of the slice 300 is higher.

[0072] The controller records the positioning coordinates of the CCD positioning member, and the cutting component cuts the slice according to the positioning coordinates.

[0073] like Figure 1 As shown, the transplanting device 15 includes a first guide rail 151 arranged on both sides of the work surface 11, and a second guide rail 152 connecting the first guide rails 151 on both sides. The positioning component 12 and the dust suction component 14 are arranged on the second guide rail 152, so that they can be moved to any position on the circuit board 200.

[0074] like Figure 4 As shown, the slicing angle adjustment assembly 16 includes a secondary positioning block 162 with a slicing groove 161 for placing the slice 300, a positioning shaft 163 for driving the secondary positioning block 162, a positioning driven wheel 164 connected to the positioning shaft 163, a positioning active wheel 165 for driving the positioning driven wheel 164 to rotate, a positioning motor 166 for driving the positioning active wheel 165 to rotate, a positioning bearing sleeved on the positioning shaft 163, a positioning bearing seat matched with the positioning bearing, a positioning guide rail 167 for driving the secondary positioning block 162 to move, and a positioning rodless cylinder 168 for driving the positioning guide rail 167 to move.

[0075] The transmission mode of the positioning driven wheel 164 and the positioning driving wheel 165 can be replaced by a synchronous belt or the like, and the rodless cylinder 168 can be switched to a screw rod or the like.

[0076] The method of using the slice angle adjustment component 16 is as follows: the secondary positioning block 162 is moved to the slice 300 placement end by the rodless cylinder 168, and the positioning motor 166 drives the positioning active wheel 165 and the positioning driven wheel 164 to adjust the secondary positioning block 162 so that the angle of the slice 300 positioning groove on it matches the slice 300 that has been cut; the slice 300 is placed in the slice 300 positioning groove for secondary positioning; the rodless cylinder 168 drives the slice 300 to the slice 300 position, adjusts the slice 300 to a suitable angle, and the slice flipping component 17 takes the slice 300 away; the rodless cylinder 168 returns to the slice 300 placement end, adjusts the angle of the slice 300 positioning groove, and performs the angle adjustment action for the next slice 300.

[0077] like Figure 5 As shown, the slice flip assembly 17 includes a flip support frame 171, a flip lifting cylinder 172 disposed on the flip support frame 171, a flip motor 173 driven up and down by the flip lifting cylinder 172, a coupling connected to the flip motor 173, a flip shaft 174 connected to the coupling, and a flip nozzle 175 disposed at one end of the flip shaft 174. The flip nozzle 175 is used to suck the slice 300, and the flip motor 173 is used to drive the flip shaft 174 and the flip nozzle 175 to rotate.

[0078] The method of using the slice flipping assembly 17 is as follows: the flipping suction nozzle 175 is rotated to a vertical position, and the flipping lifting cylinder 172 is lowered, so that the flipping suction nozzle 175 contacts and sucks the slice 300 in the slice groove 161; the flipping lifting cylinder 172 is raised to take out the slice 300, and the flipping motor 173 drives the flipping shaft 174 to flip the slice 300 90 degrees, waiting for the subsequent process to clamp the slice 300; after the sample is clamped away, the flipping motor 173 drives the flipping shaft 174 to flip 90 degrees in the opposite direction, and rotates the flipping suction nozzle 175 to a vertical position, waiting for the next sample to be sucked.

[0079] The dust suction component 14 is used to suck the chips and press against the slice 300 to prevent it from being sucked by the dust suction component 14. For different cutting components 13, dust suction components 14, etc., the utility model provides the following two embodiments.

[0080] Example 1

[0081] like Figures 1 to 7 As shown, in this embodiment, the automatic sampling device 1 also includes a circuit board limiting component 18 for limiting the position of the circuit board 200, a sample suction nozzle 19 for sucking the slice 300, and a suction nozzle vacuum 10 for controlling the operation of the sample suction nozzle 19.

[0082] like Figure 6 As shown, the circuit board limiting assembly 18 includes a circuit board limiting plate 181 arranged on the work surface 11, two clamping support blocks 182 arranged under the work surface 11, a driving screw 183 for driving the two clamping support blocks 182 to move closer or farther away, a pressure plate cylinder 184 arranged on the clamping support block 182, and a mushroom-shaped pressure plate 185 driven up and down by the pressure plate cylinder 184, and the mushroom-shaped pressure plate 185 passes through the work surface 11.

[0083] When it is necessary to limit the position of the circuit board 200, the circuit board 200 to be sampled is placed on the work surface 11, and one side is positioned close to the circuit board limiting plate 181; the screw rod 183 is driven to adjust the position of the clamping support block 182 so that the mushroom-shaped pressing plate 185 is close to both sides of the circuit board 200; the pressing plate cylinder 184 is controlled to work, and the circuit board 200 is clamped by the mushroom-shaped pressing plate 185.

[0084] like Figure 2 and Figure 3As shown, the dust suction assembly 14 includes a first chip suction hood 141, a chip suction member connected to the first chip suction hood 141 for generating suction force, a brush member 142 arranged at the lower end of the first chip suction hood 141 for dust suction during cutting, and a pressure foot member 143 arranged at the lower end of the first chip suction hood 141 for pressing against the slice 300 during cutting. Either the brush member 142 or the pressure foot member 143 is installed below the first chip suction hood 141.

[0085] The cutting assembly 13 is an electric spindle, and the electric spindle is arranged on the first dust suction cover 141. The electric spindle and the dust suction assembly 14 are coaxial and move synchronously above the workbench.

[0086] In this embodiment, the presser foot member 143 and the brush member 142 are placed on a switching plate 144. When vacuuming is required during cutting, the transplanting device 15 drives the chip hood to move above the switching plate 144. The chip hood and the brush member 142 are installed and fixed, and then moved above the circuit board 200. The cutting assembly 13 cuts the circuit board 200, and the first chip hood 141 and the chip hood perform chip suction processing to cut out the slice 300 during cutting, but retain the connection point 201 with the circuit board 200 to prevent the slice 300 from being sucked away by the first chip hood 141 and the chip hood after cutting. After the first cutting is completed, the brush member 142 is returned to the switching plate 144. In addition, the first chip suction cover 141 and the pressure foot member 143 are installed and fixed, and the pressure foot member 143 is used to press the slice 300. The cutting assembly 13 is used again to perform a second cut on the connection point of the slice 300. Since the connection point 201 is small, there will not be too much dust, and because the slice 300 is pressed by the pressure foot member 143, the slice 300 will not be sucked away.

[0087] After the cutting is completed, the nozzle vacuum 10 controls the sample nozzle 19 to absorb the sample and send it to the slicing angle adjustment component 16.

[0088] Example 2

[0089] like Figures 8 to 14 As shown, in this embodiment, the automatic sampling device 2 further includes a circuit board handling assembly 21 , and the cutting assembly 24 is disposed under the work surface 11 to cut the circuit board 200 clamped by the circuit board handling assembly 21 through the work surface 11 .

[0090] like Fig.10 As shown, the circuit board transport assembly 21 is used to fix and move the circuit board 200 until the positioning point is moved above the cutting assembly 24 for cutting by the cutting assembly 24 .

[0091] The circuit board handling assembly 21 may be a drivable suction cup assembly 22 or the like.

[0092] like Fig.11 As shown, the cutting assembly 24 includes a cutting drive member 241 and a cutting spindle 242 . The cutting spindle 242 protrudes upward from the work surface 11 to achieve the effect of cutting the circuit board 200 on the circuit board transport assembly 21 .

[0093] like Fig.12 and Fig.13 As shown, in this embodiment, the dust suction assembly 23 includes a second chip suction hood 231, an auxiliary clamp 232 that can move in a vertical direction relative to the second chip suction hood 231, a circuit board pressure plate 233 arranged below the second chip suction hood 231, a spring arranged between the circuit board pressure plate 233 and the second chip suction hood 231, a guide shaft 234 arranged in the spring, and a chip suction head 235 for connecting to the second chip suction hood 231.

[0094] like Figure 12 to Figure 14 As shown, the auxiliary clamping jaw 232 is used to form a cutting groove 202 on the circuit board 200 and then protrude into the cutting groove 202 to clamp the slice 300. In this embodiment, the circuit board 200 also needs to be cut twice. During the first cutting, the second chip suction cover 231 compresses the spring so that the circuit board pressure plate 233 presses against the circuit board 200, and the guide shaft 234 protrudes into the second chip suction cover 231; the cutting assembly 24 is used to cut the cutting grooves 202 on both sides of the slice 300, and then the auxiliary clamping jaw 232 is driven to descend, pass through the clearance hole 237 on the chip suction cover, protrude into the cutting groove 202 and clamp the slice 300, and then the cutting assembly 24 is used to cut again to cut the slice 300. During the first cutting, since the slice 300 is not broken, it will not be sucked away by the chip suction head 235 and the second chip suction cover 231. During the second cutting, since the slice 300 is clamped by the auxiliary clamp 232, it will not be sucked away by the chip suction head 235 and the second chip suction cover 231. After the cutting is completed, the slice 300 is clamped by the auxiliary clamp 232 and sent to the slice angle adjustment assembly 16.

[0095] like Figures 15 to 35As shown, the glue filling device 3 includes a slice loading component 31, a glue injection mold 32 for placing slices 300, a clamping component 33 for fixing slices 300 and placing them in the glue injection mold 32, a glue injection component 34 for injecting glue into the glue injection mold 32, a vacuuming component 35 for vacuuming the glue injection mold 32 before curing, a light curing component 36 for curing the glue in the glue injection mold 32 after injection, a conveying component 37 for driving the glue injection mold 32 and the clamping component 33 to move, and a supporting bottom plate 38. In some embodiments, the glue filling device 3 also includes a handling and flipping component 39 for flipping and moving the glue block 400, and a marking component 30 for marking the glue block 400.

[0096] In this embodiment, all structures of the glue filling device 3 are arranged on the supporting bottom plate 38 , but it is not limited thereto, and some structures may not be arranged on the supporting bottom plate 38 .

[0097] like Fig.16 As shown, the slice loading assembly 31 includes a first clamping jaw 311 for clamping the slice 300, a first driving member 312 for driving the first clamping jaw 311 to move in the horizontal and height directions, a clamping jaw cylinder 313 for driving the first clamping jaw 311 to loosen or clamp, and a loading support frame 314.

[0098] The first driving member 312 includes a first horizontal guide rail 315 fixed on the loading support frame 314, and a first vertical guide rail 316 arranged on the first horizontal guide rail 315. The clamping cylinder 313 and the first clamping jaw 311 are arranged on the first vertical guide rail 316 and can move up and down relative to the first vertical guide rail 316. The first vertical guide rail 316 can move in the horizontal direction on the first horizontal guide rail 315.

[0099] The first vertical guide rail 316 is driven to slide along the first horizontal guide rail 315 to the automatic sampling device 1 to take out the cut slice 300, and then moved to the injection mold 32, and the clamping cylinder 313 and the first clamping jaw 311 are driven to move on the vertical cylinder until the slice 300 is placed in the injection mold 32. After the clamping assembly 33 clamps the slice 300, the clamping cylinder 313 can be driven to release the first clamping jaw 311.

[0100] The movement of the first horizontal guide rail 315 and the first vertical guide rail 316 can be driven by a linear module or a cylinder, etc., without limitation.

[0101] like Fig.17As shown, the glue injection assembly 34 includes a glue injection fixing bracket 341, a glue injection guide rail 342 disposed on the glue injection fixing bracket 341, a glue injection head 343 that can move up and down along the glue injection guide rail 342, and a glue injection valve 344 for controlling the operation of the glue injection head 343. The glue injection head 343 can move up and down along the glue injection guide rail 342, and when injecting glue, it moves downward and is inserted into the glue injection mold 32 for glue injection.

[0102] like Fig.18 As shown, the vacuum assembly 35 includes a vacuum fixing bracket 351, a vacuum guide rail 352 arranged on the vacuum fixing bracket 351, a vacuum generator 353 that can move up and down along the vacuum guide rail 352, and a vacuum cavity 354 that protrudes into the injection mold 32. After the injection is completed, the vacuum assembly 35 is started to extract the air in the glue in the injection mold 32 to improve the molding effect.

[0103] like Fig.19 and Fig. 20 As shown, the light curing assembly 36 includes a light source bracket 361 and a UV light source 362. The glue injection mold 32 is moved under the UV light source 362, and the glue can be solidified to form a colloid as soon as possible through UV light.

[0104] The slice 300 injected with glue is solidified to form a glue block 400 .

[0105] The conveying assembly 37 is used to drive the glue injection mold 32 and the clamping assembly 33 to move to the glue injection assembly 34 or the curing assembly. The glue injection mold 32 and the clamping assembly 33 move on the conveying assembly 37, and the slicing loading assembly 31, the glue injection assembly 34, the vacuum assembly 35, and the light curing assembly 36 are arranged on both sides of the conveying assembly 37.

[0106] like Fig.21 As shown, the transport and flipping assembly 39 includes a mounting bracket 391, a horizontal module 392 arranged on the mounting bracket 391, a vertical module 393 arranged on the horizontal module 392 and movable in a horizontal direction, a rotating cylinder 394 arranged on the vertical module 393 and movable in a vertical direction, a rubber block cylinder 395 arranged on the rotating cylinder 394 and capable of being driven to rotate by the rotating cylinder 394, and a rubber block clamp 396 arranged on the rubber block cylinder 395 and capable of being driven by the rubber block cylinder 395 to clamp or release the rubber block 400.

[0107] The transport and flip assembly 39 enables the rubber block 400 to be transported and flipped, thereby facilitating marking and placing the surface to be polished facing downward, and can move the marked rubber block 400 to the next process.

[0108] The glue pouring device 3 of this embodiment can realize the automatic solidification of the slice 300 to form a glue block 400. By providing the clamping assembly 33, the automatic positioning of the slice 300 is realized, which reduces manual intervention and saves human resources.

[0109] Aiming at different injection molds 32 and clamping components 33 , the utility model provides the following four embodiments.

[0110] Embodiment 1:

[0111] like Figure 22 to Figure 25 As shown, in this embodiment, the glue-filling device 4 includes a transport component 41 and a punching component 42 for cutting off the clamping portion 304 of the slice 300 .

[0112] The slice 300 includes a curing portion 303 received in the injection mold 32 and a clamping portion 304 protruding outside the injection mold 32. That is, in this embodiment, a portion of the slice 300 protrudes outside the injection mold 32.

[0113] The injection mold 43 includes a first portion 431 and a second portion 432 , and the first portion 431 and the second portion 432 are combined together to form an injection space for injection of glue.

[0114] The clamping assembly 44 includes a clamping plate 441 for holding the clamping portion 304 from both sides, a first clamping cylinder 442 for driving the clamping plate 441 to move closer to or away from the clamping portion 304, clamping blocks 443 provided at both ends of the clamping portion 304, a second clamping cylinder 444 for driving the clamping blocks 443 to move closer to or away from the clamping portion 304, a combined slide rail 445 for placing the first part 431 and the second part 432, and a pulling and closing cylinder 446 for driving the first part 431 and the second part 432 to move closer to or away from each other on the combined slide rail 445.

[0115] The operation of the pulling and closing cylinder 446 can drive the first part 431 and the second part 432 to move closer or farther on the combined guide rail. When the first part 431 and the second part 432 are close to each other, an injection molding space is formed for injection of glue. The slice loading assembly 31 can clamp the slice 300 and place it in the injection molding space.

[0116] The second clamping cylinder 444 can drive the clamping block 443 to fix and limit the slice 300 from both ends, and after fixing, the slice loading assembly 31 can release the control of the slice 300. After the clamping block 443 fixes the slice 300, the first clamping cylinder 442 is started to drive the clamping plate 441 to clamp the slice 300 from both sides, and then the first clamping cylinder 442 can drive the clamping block 443 to move away from the slice 300.

[0117] The clamping plate 441 is made of a light-transmitting material, and is provided with at least one injection hole 447 for the injection assembly 34 to inject glue. The use of a light-transmitting material to make the clamping plate 441 will not affect the curing effect of the light-curing assembly 36. The provision of the injection hole 447 facilitates the injection head 343 of the injection assembly 34 to extend into the injection space for injection.

[0118] In this embodiment, the clamping plate 441 is in the shape of a flat plate and covers the upper opening of the injection space of the glue injection mold 43 to prevent glue from overflowing.

[0119] The transporting assembly 41 is used to take the glue block 400 out of the glue injection mold 43 and move it to the punching assembly 42 .

[0120] In this embodiment, since the slice 300 has a clamping portion 304 exposed outside the rubber block 400, a transport component 41 is provided to move the obtained rubber block 400 to a punching component 42, and the punching component 42 cuts off the clamping portion 304 exposed outside the rubber block 400.

[0121] like Fig.23 As shown, the transport component 41 includes a small transport jaw 411 for clamping the clamping portion 304, a large transport jaw 412 for clamping the rubber block 400, a first transport cylinder 413 for driving the small transport jaw 411 to work, a second transport cylinder 414 for driving the large transport jaw 412 to work, a transport vertical guide rail 415 for driving the first transport cylinder 413 and the second transport cylinder 414 to move in the vertical direction, a transport horizontal guide rail 416 for driving the transport vertical guide rail 415 to move in the horizontal direction, and a transport bracket 417 for supporting the transport horizontal guide rail 416.

[0122] like Fig.25 As shown, the punching assembly 42 includes a punching platform 421 for placing the rubber block 400, a punching limiter 422 arranged on the punching platform 421 for limiting the rubber block 400, a punching clamping cylinder 423 for holding the rubber block 400 against the punching limiter 422, and a punching cylinder 424 for removing the clamping portion 304.

[0123] In this embodiment, after the rubber block 400 is formed, the first part 431 and the second part 432 are controlled to move away from each other, the small transport clamp 411 is used to clamp the clamping portion 304, and then the clamping plate 441 is released. The transport vertical guide rail 415 and the transport horizontal guide rail 416 are started to place the rubber block 400 at the punching limiter 422, and then the small transport clamp 411 is released. The punching clamp cylinder 423 is started to hold the rubber block 400, and after it is fixed, the punching cylinder 424 is started to remove the clamping portion 304. The punching clamp cylinder 423 is released, and the remaining rubber block 400 can be grabbed using the large transport clamp 412.

[0124] The figures of this embodiment do not show the transport and flip assembly 39 and the marking assembly 30, but the transport and flip assembly 39 and the marking assembly 30 are optional structures and do not conflict with other structures of this embodiment.

[0125] The method for using the glue filling device 4 of this embodiment includes the following steps:

[0126] S1: placing the solidified portion 303 of the slice 300 in the injection mold 43, and starting the first clamping cylinder 442 to drive the clamping plate 441 to clamp and fix the clamping portion 304;

[0127] S2: Start the glue injection assembly 34 to inject glue into the glue injection mold 43;

[0128] S3: Start the light curing assembly 36 to cure the glue in the glue injection mold 43 to form a glue block 400;

[0129] S4: Start the transport component 41 to take the rubber block 400 out of the rubber injection mold 43;

[0130] S5: Start the punching assembly 42 to punch the clamping portion 304 off, and finally obtain a square rubber block 400.

[0131] Embodiment 2:

[0132] like Fig.15 , Figure 26 to Figure 28 As shown, in this embodiment, the injection mold 32 is made of transparent material to form a part of the glue block 400. Since the injection mold 32 is finally formed as a part of the glue block 400, the injection mold 32 is a consumable part.

[0133] In this embodiment, the glue pouring device 3 further includes a mold silo 301 for storing the glue injection mold 32 , and a mold loading component 302 for taking out the injection mold in the mold silo 301 and moving it to the clamping component 33 .

[0134] As shown in part 26, the mold silo 301 includes a silo bottom plate 3011, a silo side plate 3012 formed on the silo bottom plate 3011 to form an inclined slide, anti-slip side plates 3013 arranged on both sides of the upper end of the silo side plate 3012, a positioning block 333 and a silo positioning block 3333014 arranged at one end of the silo side plate 3012 and located at the bottom of the inclined slide, a silo counterweight block 3015 arranged on the inclined slide, and a rear baffle 3016 arranged at the other end of the silo side plate 3012 and located at the top of the inclined slide.

[0135] A plurality of the injection molds 32 can be neatly arranged in the inclined slide, with the anti-slip side plates 3013 limiting their positions on both sides, and slide downward under the gravity of the silo counterweight block 3015 until the lowest injection mold 32 abuts against the positioning block 333 and the silo positioning block 3333014. The anti-slip side plates 3013 and the positioning block 333 and the silo positioning block 3333014 are spaced a certain distance apart, so that both sides of the lowest injection mold 32 are exposed for easy clamping.

[0136] like Fig. 27 As shown, the mold loading assembly 302 includes a mold loading bracket 3021, a mold loading horizontal guide rail 3022 arranged on the mold loading bracket 3021, a mold upper and lower cylinders 3023 arranged on the mold loading horizontal guide rail 3022, a mold clamping cylinder 3024 arranged on the mold upper and lower cylinders 3023, and a mold clamping clamp 3025 whose operation is controlled by the mold clamping cylinder 3024.

[0137] The mold clamping jaw 3025 can clamp the injection mold 32 in the mold silo 301, the mold clamping jaw cylinder 3024 controls the opening and closing of the mold clamping jaw 3025, the mold loading horizontal guide rail 3022 and the mold upper and lower cylinders 3023 control the horizontal and vertical movement of the mold clamping jaw 3025, so as to move the injection mold 32 from the mold silo 301 to the clamping assembly 33.

[0138] like Fig.28 and 29 As shown, in this embodiment, the clamping assembly 33 includes a second clamping jaw 331 for clamping the slice 300, a second driving member 332 for driving the second clamping jaw 331 to move in the horizontal and height directions, a positioning block 333 for positioning the injection mold 32, a mold positioning plate 334 for clamping the injection mold 32 from both sides, and a mold cylinder 335 for driving the mold positioning plate 334 to clamp or release the injection mold 32.

[0139] The second clamping jaws 331 clamp the slice 300 from both sides thereof and extend into the injection mold 32 from top to bottom. When the second clamping jaws 331 clamp the slice 300 , the lower end of the second clamping jaws 331 is higher than the lower end of the slice 300 in height direction.

[0140] The second clamping jaw 331 can ensure the position of the slice 300 in the injection mold 32 to prevent it from tilting.

[0141] The glue pouring device 3 also includes a transmission component 37 for driving the glue injection mold 32 and the clamping component 33 to move. The transmission component 37 is a bidirectional transmission component 37, and the transmission component 37 is used to drive the glue injection mold 32 and the clamping component 33 to move back and forth between the glue injection component 34 and the curing component.

[0142] In this embodiment, two injections and two curings are required. The first injection and curing are for achieving relative fixation of the slice 300 and the injection mold 32 , and the second injection and curing are for forming a glue block 400 .

[0143] The method for using the glue filling device 3 of this embodiment includes the following steps:

[0144] S1: placing the slice 300 in the injection mold 32, and starting the second driving member 332 to drive the second clamping jaw 331 to clamp the slice 300;

[0145] S2: Start the glue injection assembly 34 to inject glue into the glue injection mold 32, and the glue injection height exceeds the bottom of the slice 300, but is not higher than the bottom of the second clamping jaw 331;

[0146] S3: Start the light curing component 36 to cure the glue in the glue injection mold 32;

[0147] S4: Release the second clamping jaw 331 and move away from the slice 300, and start the glue injection assembly 34 again to inject glue into the glue injection mold 32 until the glue injection mold 32 is filled;

[0148] S5: Start the light curing assembly 36 again to cure the glue in the glue injection mold 32 to obtain a glue block 400 .

[0149] Between each injection and curing, vacuum is drawn by the vacuum drawing component 35. The movement of the injection mold 32 is controlled by the conveying component 37.

[0150] The resulting rubber block 400 is transported and flipped by the transport and flip assembly 39, marked by the marking assembly 30, and finally moved to the next process.

[0151] The method of using the glue pouring device 3 of this embodiment realizes the formation of the glue block 400 through two times of glue injection and curing, so that the slice 300 is not easy to deviate in the glue injection mold 32, and the formed glue block 400 has a better shape. Only one side may have a certain degree of roughness that needs to be polished, and the other three sides are formed by the glue injection mold 32.

[0152] Embodiment three:

[0153] like Figure 28 to Figure 33 As shown, the structure of the clamping assembly 33 of this embodiment is basically the same as that of the clamping assembly 33 in the second embodiment, which will not be described here. The main difference lies in the different structure of the injection mold 52 and the addition of a ejecting assembly 51 to the injection equipment 5.

[0154] Although the structure of the injection mold 52 is different, the present embodiment can also be provided with a mold bin 301 and a mold loading assembly 302 for storing the injection mold 52 separately. However, the injection mold 52 of the present embodiment is a non-consumable item. If a mold bin 301 and a mold loading assembly 302 are provided, the structure should be different from that in the second embodiment.

[0155] In this embodiment, the injection mold 52 includes a first part 521 and a second part 522, a mold driving part 523 for driving the first part 521 and the second part 522 to move closer or farther away, and a cavity 524. The first part 521 and the second part 522 are abutted against the cavity 524 structure to form an injection cavity for injection molding, and the second clamp 331 clamps the slice 300 and places it in the injection cavity.

[0156] Since the injection mold 52 of this embodiment is not a part of the rubber block 400 , the finally formed rubber block 400 needs to be demoulded, so it is necessary to set up a ejecting assembly 51 to complete the demoulding.

[0157] like Fig.33 As shown, in this embodiment, the cavity 524 is located below the cavity 524, and the ejection assembly 51 includes an ejection rod 511 protruding from the bottom of the cavity 524 structure into the injection cavity, a ejection bottom plate 512 for supporting the ejection rod 511, an ejection top plate 513 arranged above the ejection bottom plate 512, a ejection cylinder 514 for driving the ejection rod 511 to move up and down relative to the cavity 524, a sleeve 515 arranged on the ejection top plate 513, and a guide shaft 516 arranged on the ejection bottom plate 512.

[0158] The ejection top plate 513 is provided with an ejection hole for the ejection rod 511 to pass through. The ejection cylinder 514 is arranged on the ejection top plate 513. When started, it can pull the ejection bottom plate 512 so that the ejection top plate 513 and the ejection bottom plate 512 are close to each other, thereby making the ejection rod 511 protrude from the ejection hole to eject the rubber block 400 from the cavity 524.

[0159] The method for using the glue filling device 3 of this embodiment includes the following steps:

[0160] S1: placing the slice 300 in the injection mold 52, and starting the second driving member 332 to drive the second clamping jaw 331 to clamp the slice 300;

[0161] S2: Start the glue injection assembly 34 to inject glue into the glue injection mold 52 , and the glue injection height exceeds the bottom of the slice 300 but is not higher than the bottom of the second clamping jaw 331 ;

[0162] S3: Start the light curing component 36 to cure the glue in the glue injection mold 52;

[0163] S4: Release the second clamping jaw 331 and move away from the slice 300, and start the glue injection assembly 34 again to inject glue into the glue injection mold 52 until the glue injection mold 52 is filled;

[0164] S5: Start the light curing assembly 36 again to cure the glue in the glue injection mold 52 to obtain a glue block 400;

[0165] S6: Start the ejection cylinder 514 to drive the ejection rod 511 to move relative to the cavity 524 , so that the rubber block 400 is separated from the injection mold 52 .

[0166] The method of using the glue pouring device 3 of this embodiment realizes the formation of the glue block 400 through two times of glue injection and curing, so that the slice 300 is not easy to produce deviation in the glue injection mold 52, and the formed glue block 400 has a better shape. In addition, in most embodiments, the mold silo 301 and the mold loading component 302 can be omitted, and the glue injection mold 52 can be recycled, which is more economical. After the glue block 400 is formed, the ejector component 51 ejects the glue block 400 from the glue injection mold 52.

[0167] Embodiment 4:

[0168] like Figures 34 to 35 As shown, similar to the second embodiment, in this embodiment, the mold is made of transparent material to form a part of the rubber block 400. Since the injection mold 61 is finally formed as a part of the rubber block 400, the injection mold 61 is a consumable part.

[0169] Different from the second embodiment, the injection mold 61 is a part of the clamping assembly 62 , and the injection mold 61 includes a first part 611 and a second part 612 .

[0170] Therefore, in this embodiment, the glue pouring device 3 further includes a mold bin 63 for storing the glue injection mold 61, and a mold loading assembly 64 for taking out the injection mold in the mold bin 63 and moving it to the clamping assembly 62. However, the number of the mold bins 301 is two, which are used to place the first part 611 and the second part 612 respectively, and the number of the mold loading assemblies 64 is two, which realize the transfer of the first part 611 and the second part 612 respectively.

[0171] The width of the first part 611 and the second part 612 is greater than or equal to the width of the slice 300, and the slice 300 is clamped from both sides. The cross-sections of the first part 611 and the second part 612 along the height direction are U-shaped to form a glue injection space when clamping the slice 300. The first part 611 and the second part 612 are both made of transparent material to form a part of the glue block 400.

[0172] The clamping assembly 62 includes a limit block 621 for limiting the first part 611, a third driving member 622 for driving the second part 612 to move toward the first part 611 to fix the slice 300, a stripping rod 623, and a stripping cylinder 624 for driving the stripping rod 623 to move.

[0173] A limiting channel is formed in the limiting block 621, one end of the limiting channel is exposed for movement of the second part 612, the first part 611 is accommodated in the other end of the limiting channel and abuts against the limiting block 621, and the heights of the first part 611 and the second part 612 are equal to the height of the limiting channel.

[0174] The limiting block 621 is provided with a disengagement hole connected to the limiting channel, the disengagement rod 623 is used to protrude into the disengagement hole, and the disengagement cylinder 624 drives the disengagement rod 623 to push the rubber block 400 to disengage the rubber block 400 from the limiting channel.

[0175] The method for using the glue filling device 3 comprises the following steps:

[0176] S1: placing the slice 300 in the injection mold 61, and starting the third driving member 622 to drive the second part 612 of the injection mold 61 to move toward the first part 611 until the slice 300 is clamped;

[0177] S2: Start the glue injection assembly 34 to inject glue into the glue injection mold 61;

[0178] S3: starting the light curing assembly 36 to cure the glue in the glue injection mold 61, so that the glue injection mold 61, the glue and the slice 300 together form a glue block 400;

[0179] S4: Start the ejection cylinder 624 to drive the ejection rod 623 to move relative to the limiting block 621 until the rubber block 400 is ejected from the limiting channel.

[0180] The glue pouring device 6 of this embodiment uses the first part 611 and the second part 612 of the glue injection mold 61 to fix the slice 300, so that the positioning effect of the slice 300 is better and the structure of the clamping component 62 is simpler.

[0181] like Figures 36 to 40 As shown, the grinding device 7 includes a rubber block transporting component 71 for clamping the rubber block 400 for loading and unloading, a grinding component 72 for grinding the rubber block 400 clamped by the rubber block transporting component 71, a rubber block loading component 73 for conveying the rubber block 400 to be ground, and a rubber block unloading component 74 for conveying the ground rubber block 400.

[0182] like Fig.37 As shown, the rubber block transport assembly 71 includes a clamping fixed bracket 711, a clamping horizontal guide rail 712 arranged on the clamping fixed bracket 711, a clamping vertical guide rail 713 arranged on the clamping horizontal guide rail 712, a rotating motor 714 arranged on the clamping vertical guide rail 713, a clamping air gripper 715 driven by the rotating motor 714 to clamp the rubber block 400, and a visual identification component 716 for photographing the rubber block 400.

[0183] The clamping fixed bracket 711 plays a supporting role, and the clamping vertical guide rail 713 can move in the horizontal direction along the clamping horizontal guide rail 712 to drive the clamping air claw 715 to move in the horizontal direction. At the same time, the rotating motor 714 can drive the clamping air claw 715 to move in the vertical direction along the clamping vertical guide rail 713.

[0184] The gripping air claw 715 is used to grip the rubber block 400 , and the visual identification component 716 can identify the grinding amount of the unground rubber block 400 to determine the subsequent operation of the grinding assembly 72 .

[0185] like Fig.38 As shown, the rubber block loading assembly 73 includes a rubber block loading bracket 731 and a rubber block loading conveyor belt 732 for conveying the rubber block 400 , and the rubber block unloading assembly 74 includes a rubber block unloading bracket 741 and a rubber block unloading conveyor belt 742 for conveying the rubber block 400 .

[0186] The discharge end of the rubber block loading conveyor belt 732 and the loading end of the rubber block unloading conveyor belt 742 are located on the moving track of the clamping vertical guide rail 713, so that the loading and unloading of the rubber block 400 can be realized by only moving horizontally in one direction. In this embodiment, the discharge end of the rubber block loading conveyor belt 732 and the loading end of the rubber block unloading conveyor belt 742 are adjacently arranged.

[0187] like Fig.39 and Fig.40 As shown, the grinding assembly 72 includes a rotating disk 721, a turntable driving member 722 for driving the rotating disk 721 to rotate, a turntable base plate 723 for placing the turntable driving member 722, a plurality of turntable supporting members 724 arranged between the rotating disk 721 and the turntable base plate 723 for supporting the rotating disk 721, at least two grinding disks 725 arranged on the rotating disk 721, at least two driven gears 726, a synchronous belt 727 connecting the driven gears 726 and the grinding disks 725, a driving gear 728 arranged on the rotating disk 721, a grinding motor 729 for driving the driving gear 728 to rotate, and a motor bracket 720 arranged on the turntable base plate 723 for supporting the grinding motor 729.

[0188] The number of the grinding discs 725 is multiple, and the grinding discs 725 have different mesh sizes, so as to realize multiple grinding of the rubber block 400 and improve the grinding effect.

[0189] In this embodiment, the number of the grinding discs 725, the driven gears 726 and the synchronous belts 727 are all four, and the four grinding discs 725 are divided into a coarse grinding disc, a fine grinding disc, a fine grinding disc and a polishing disc according to different mesh sizes.

[0190] At least two grinding discs 725 are arranged in a circular array around the axial direction of the rotating disc 721. In this embodiment, four grinding discs 725 with different mesh sizes are arranged in order from coarse to fine.

[0191] In this embodiment, the turntable driver 722 is a divider or a driving motor. The turntable driver 722 drives the rotating disk 721 to rotate so as to move different grinding disks 725 below the rubber block 400 clamped by the clamping air claw 715 .

[0192] The divider is used to control the rotating disk 721 to rotate a fixed angle each time. In this embodiment, the rotating disk 721 is controlled to rotate 90 degrees each time.

[0193] There are multiple turntable support members 724, which are supported below the rotating disk 721 along the circumferential direction. In this embodiment, the turntable support members 724 are fixed to the turntable bottom plate 723, but are not fixedly connected to the rotating disk 721. When the rotating disk 721 rotates, the turntable support members 724 will not be driven to rotate. The turntable support members 724 can prevent the rotating disk 721 from turning over when the rubber block 400 is grinding.

[0194] The turntable driving member 722 rotates to move one of the grinding discs 725 to below the rubber block transporting assembly 71 , and the grinding motor 729 is used to drive the driving gear 728 to rotate to drive at least two of the grinding discs 725 to rotate.

[0195] The driving gear 728 is coaxially arranged with the rotating disk 721. In this embodiment, the rotation of the driving gear 728 can drive the plurality of driven gears 726 to rotate together, and then drive the grinding disk 725 to rotate through the synchronous belt 727 to achieve the grinding function. In this embodiment, only one grinding motor 729 is provided to control the operation of the plurality of grinding disks 725.

[0196] The working method of the grinding device 7 of the utility model is as follows: the rubber block loading assembly 73 receives the rubber block 400 from the previous process, places it on the rubber block loading conveyor belt 732, and conveys it to the discharge end; the clamping vertical guide rail 713 drives the clamping air claw 715 to move along the clamping horizontal guide rail 712 to the discharge end of the rubber block loading conveyor belt 732, controls the clamping air claw 715 to grab the rubber block 400 to be ground, and then controls the clamping air claw 715 to move to the grinding position above the rotating disk 721, and at the same time, the visual identification component 716 can identify the grinding amount of the rubber block 400;

[0197] The turntable drive 722 rotates to move the coarse grinding disc to the bottom of the rubber block 400, and controls the clamping air claw 715 to move downward along the clamping vertical guide rail 713 until it contacts the coarse grinding disc to grind the rubber block 400. After grinding, the clamping air claw 715 is controlled to rise; the above grinding steps are repeated until the fine grinding, fine grinding and polishing of the rubber block 400 are completed, and finally the clamping air claw is controlled to place the ground rubber block 400 on the loading end of the rubber block unloading conveyor belt 742 to complete the grinding of one rubber block 400.

[0198] The circuit board processing system and automatic sampling device 1 of the utility model can realize automatic sampling of the slice 300, which is convenient, fast and saves manpower; by setting the infrared positioning member 121 and the CCD positioning member 122, two positionings are used to make the sampling accuracy higher; by the dust collection component 14 and two cuttings, dust collection can be realized while cutting, and the slice 300 can be prevented from being sucked away.

[0199] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0200] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An automatic sampling device for obtaining slices from a circuit board, characterized in that: The automatic sampling device comprises: A work surface, the work surface is used to carry a circuit board; A cutting component for cutting circuit boards; A dust suction component is used to suck the chips and press against the slices to prevent them from being sucked by the dust suction component; A transplanting device drives a dust collecting component to move above a work surface, wherein the dust collecting component is used to collect dust and a cutting component is used to press against the slice when cutting the slice on the circuit board.

2. The automatic sampling device according to claim 1, characterized in that: The dust suction assembly comprises a second chip suction cover and an auxiliary clamping jaw which can move in a vertical direction relative to the second chip suction cover. The auxiliary clamping jaw is used to form a cutting groove on the circuit board and then protrude into the cutting groove to clamp the slice.

3. The automatic sampling device according to claim 2, characterized in that: The dust suction assembly also includes a circuit board pressing plate arranged below the second chip suction cover, a spring arranged between the circuit board pressing plate and the second chip suction cover, a guide shaft arranged in the spring, and a chip suction head connected to the second chip suction cover.

4. The automatic sampling device according to claim 2, characterized in that: The automatic sampling device further comprises a circuit board transporting assembly, and the cutting assembly is arranged under the work surface to pass through the work surface to cut the circuit board clamped by the circuit board transporting assembly.

5. The automatic sampling device according to claim 1, characterized in that: The dust suction assembly includes a first chip suction hood, a brush member arranged at the lower end of the first chip suction hood for dust suction during cutting, and a pressure foot member arranged at the lower end of the first chip suction hood for pressing against the slice during cutting. Either the brush member or the pressure foot member is installed below the first chip suction hood.

6. The automatic sampling device according to claim 5, characterized in that: The cutting assembly is an electric spindle, which is arranged on the first dust suction cover. The electric spindle and the dust suction assembly are coaxial and move synchronously above the workbench.

7. The automatic sampling device according to claim 5, characterized in that: The automatic sampling device also includes a sample suction nozzle for sucking slices and a suction nozzle vacuum for controlling the operation of the sample suction nozzle.

8. The automatic sampling device according to any one of claims 1 to 7, characterized in that: The transplanting device is provided with a positioning component which moves synchronously with the dust suction component. The positioning component comprises an infrared positioning component for realizing rough positioning and a CCD positioning component for realizing precise positioning.

9. The automatic sampling device according to claim 8, characterized in that: The automatic sampling device also includes a controller, which records the positioning coordinates of the CCD positioning member, and the cutting component cuts the slice according to the positioning coordinates.

10. The automatic sampling device according to claim 8, characterized in that: The transplanting device is mounted above the work surface, and comprises first guide rails arranged on both sides of the work surface, and second guide rails connecting the first guide rails on both sides, and the positioning assembly and the dust collection assembly are arranged on the second guide rails.

11. The automatic sampling device according to claim 1, characterized in that: The automatic sampling device also includes a circuit board limiting assembly for limiting the position of the circuit board, and the circuit board limiting assembly includes a circuit board limiting plate arranged on the work surface, two clamping support blocks arranged under the work surface, a driving screw rod for driving the two clamping support blocks to move closer or farther away, a clamping plate cylinder arranged on the clamping support block, and a mushroom-shaped clamping plate driven up and down by the clamping plate cylinder, wherein the mushroom-shaped clamping plate passes through the work surface.

12. The automatic sampling device according to claim 1, characterized in that: The automatic sampling device also includes a slice angle adjustment component for adjusting the slice angle and a slice flipping component for flipping the slice.

13. A circuit board processing system, characterized in that: The circuit board processing system includes: an automatic sampling device, a glue pouring device and a grinding device connected in sequence, the automatic sampling device is used to obtain slices from the circuit board; the glue pouring device is used to inject glue and solidify the slices to form glue blocks; the grinding device is used to grind the glue blocks.

Images