Semiconductor chip processing and testing device

Abstract

The utility model discloses a semiconductor chip processing testing device, relates to the technical field of semiconductor chip processing, and solves the problems that the working efficiency of the existing testing device is high, a hand needs to stretch into a groove when a semiconductor chip is taken down, the operation is inconvenient, a probe is fixedly mounted and cannot be replaced according to different semiconductor chips, and the cost is high. According to the scheme, the device comprises a base, a sliding groove is formed in the upper surface of the base, a double-station clamping mechanism used for clamping a semiconductor chip is slidably connected into the sliding groove, through the arranged double-station clamping mechanism, the other semiconductor chip can be directly detected after one semiconductor chip is detected, the working efficiency is improved, and the working efficiency is improved. Through the arrangement of the elastic lifting mechanism and the rapid clamping mechanism, probes of different specifications can be rapidly replaced according to semiconductor chips of different sizes, and through the arrangement of the ejection mechanism, the semiconductor chips can be automatically ejected out after detection is completed, so that the semiconductor chips are convenient to take.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip processing and testing device. Background Art

[0002] During the production and processing of semiconductor chips, it is generally necessary to perform testing operations on the semiconductor chips to detect the quality. During the testing, corresponding test irregularities need to be used. After searching, the Chinese patent authorization number CN217034046U discloses a semiconductor chip processing and testing device, including a mounting plate and a detector fixedly connected to the mounting plate, the upper end of the detector is fixedly connected to a placement plate, and the upper surface of the placement plate is provided with a plurality of grooves. The extrusion block is pushed upward under the limit of the chip and the second spring is compressed, so that the extrusion block is conducive to the extrusion of the chip in the groove. The core can be tightly attached to the upper end of the probe for detection. Since the extrusion block is conducive to the elastic force of the second spring to squeeze the chip, it can avoid damage to the probe or chip caused by excessive extrusion force.

[0003] Although the above technical solution realizes the protective clamping of the semiconductor chip, only one semiconductor chip can be tested at a time during use. After the test, the semiconductor chip needs to be removed and replaced with a new semiconductor chip for further testing, which reduces work efficiency. In addition, when removing the semiconductor chip, the hand needs to be inserted into the groove, which is inconvenient to operate. Moreover, the detection needle is fixedly installed and cannot be replaced according to different semiconductor chips, which reduces practicality. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a semiconductor chip processing and testing device, which solves the problem that the prior art device proposed in the background technology can only detect one semiconductor chip at a time when in use, and the semiconductor chip needs to be removed after detection and replaced with a new semiconductor chip for further detection, thereby reducing work efficiency, and when removing the semiconductor chip, it is necessary to put the hand into the groove, which is inconvenient to operate, and the detection needle is fixedly installed and cannot be replaced according to different semiconductor chips, thereby reducing the practicality.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a semiconductor chip processing and testing device, comprising a base, the upper surface of the base is provided with a slide groove, the interior of the slide groove is slidably connected with a double-station clamping mechanism for clamping the semiconductor chip, both ends of the double-station clamping mechanism are embedded with ejection mechanisms, an L-shaped plate is fixedly installed on one side of the upper surface of the base, an elastic lifting mechanism is installed through the top of the L-shaped plate, a quick clamping mechanism is embedded with the lower surface of the elastic lifting mechanism, a mounting plate is clamped inside the quick clamping mechanism, a plurality of detection needles are fixedly installed on the lower surface of the mounting plate, a detector for detecting semiconductor chips is fixedly installed on the top of the L-shaped plate, and the detector is connected to the detection needle through a wire.

[0006] The double-station clamping mechanism includes a slider slidably connected to the inside of the slide groove, and two placement plates are symmetrically fixedly connected to the upper surface of the slider. A placement groove is opened on the upper surface of the placement plate, and first through holes are symmetrically opened on both sides of the inner wall of the placement groove. A first electric push rod is embedded and fixedly installed inside the first through hole, and a first clamping plate is fixedly connected to the movable end of the first electric push rod. The operation of the first push rod can drive the first clamping plates on both sides to move relative to each other, thereby clamping the semiconductor chip. Two semiconductor chips can be placed respectively by the two placement plates, so that the next semiconductor chip can be directly tested.

[0007] The elastic lifting mechanism includes a fourth electric push rod that passes through and is fixedly installed on the top of the L-shaped plate, the bottom end of the movable end of the fourth electric push rod is fixedly connected to the top plate, the outer surface of the top plate is symmetrically passed through and slidably connected with two guide rods, the bottom ends of the two guide rods are commonly fixedly connected with a rectangular plate, the outer surface of the guide rod and the position between the top plate and the rectangular plate is sleeved with a spring, the outer surface of the guide rod is sleeved with a nut that is threadedly connected, when the fourth electric push rod drives the detection needle to descend, the spring can buffer the detection needle, thereby avoiding damage to the pins of the semiconductor chip.

[0008] Preferably, the double-station clamping mechanism also includes a second through hole opened on the other side of the inner wall of the placement groove, and a second electric push rod is embedded and fixedly installed inside the second through hole. The movable end of the second electric push rod is fixedly connected to a second clamping plate. The second electric push rod drives the second clamping plate to move, and cooperates with one side of the inner wall of the placement groove to achieve fixation of the semiconductor chip in the other two directions.

[0009] Preferably, the ejection mechanism includes a storage groove opened at the bottom of the placement groove, a third electric push rod is fixedly installed on the inner bottom of the storage groove, and the top of the movable end of the third electric push rod is fixedly connected to an ejection plate slidably connected to the inner wall of the storage groove. The third electric push rod drives the ejection plate to move upward, so that the semiconductor chip can be ejected without reaching into the placement groove to take it, which is convenient to use.

[0010] Preferably, the quick clamping mechanism includes travel grooves symmetrically opened on the lower surface of the rectangular plate, a bidirectional screw rod is rotatably connected through the two travel grooves, and the outer surfaces at both ends of the bidirectional screw rod are symmetrically threadedly connected with two clamping plates which are respectively slidably connected to the inner walls of the two travel grooves, and the mounting plate is located between the two clamping plates. The rotation of the second bidirectional screw rod drives the two clamping plates to move relative to each other, so that the mounting block can be quickly installed and replaced, and it is convenient to replace the detection needle according to different semiconductor chips.

[0011] Preferably, one end of the bidirectional screw rod extends to the outside of the rectangular plate, and one end of the bidirectional screw rod located outside the rectangular plate is fixedly connected to a knob, and the knob facilitates the rotation of the bidirectional screw rod.

[0012] Preferably, one side of the outer surface of each of the first clamping plate and the second clamping plate is fixedly connected with a protective pad, and the protective pad can protect the semiconductor chip.

[0013] The utility model provides a semiconductor chip processing and testing device, which has the following beneficial effects:

[0014] 1. This semiconductor chip processing and testing device, through the dual-station clamping mechanism, can not only clamp semiconductor chips of different sizes, but also directly detect another one after completing the detection of one, thereby improving work efficiency, thereby solving the problem of low work efficiency caused by the existing semiconductor chip detection device requiring the semiconductor chip after detection to be disassembled and then tested again after installing a new semiconductor chip.

[0015] 2. This semiconductor chip processing and testing device, through the elastic lifting mechanism and the quick clamping mechanism, can not only buffer the detection needle and protect the semiconductor chip pins, but also can quickly replace detection needles of different specifications according to semiconductor chips of different sizes, thereby improving practicality, thereby solving the problem that the detection needles of the existing device are fixedly installed and cannot be replaced according to different semiconductor chips, thereby reducing practicality.

[0016] 3. This semiconductor chip processing and testing device can automatically eject the semiconductor chip after the test is completed through the ejection mechanism, making it easy to take out, thereby solving the problem of the existing semiconductor chip testing device that requires people to reach into the slot to take out the chip after the test, which is inconvenient to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 A three-dimensional diagram of a placement plate of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the placement plate of the utility model;

[0020] Figure 4 It is a partial structural schematic diagram of the elastic lifting mechanism and the quick clamping mechanism of the utility model;

[0021] Figure 5 It is a schematic diagram of the internal structure of the elastic lifting mechanism and the quick clamping mechanism of the utility model.

[0022] In the figure, 1. base; 2. slide groove; 3. double-station clamping mechanism; 31. slider; 32. placement plate; 33. placement groove; 34. first through hole; 35. first electric push rod; 36. first clamping plate; 37. second electric push rod; 38. second clamping plate; 4. ejection mechanism; 41. storage groove; 42. third electric push rod; 43. ejection plate; 5. L-shaped plate; 6. elastic lifting mechanism; 61. fourth electric push rod; 62. top plate; 63. guide rod; 64. rectangular plate; 65. spring; 66. nut; 7. quick clamping mechanism; 71. travel groove; 72. two-way screw rod; 73. clamping plate; 74. knob; 8. mounting plate; 9. detection needle; 10. detector. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Embodiment 1:

[0025] like Figure 1 and Figure 3As shown, a semiconductor chip processing and testing device comprises a base 1, wherein a slide groove 2 is provided on the upper surface of the base 1, and a double-station clamping mechanism 3 for clamping a semiconductor chip is slidably connected inside the slide groove 2, and the double-station clamping mechanism 3 comprises a slider 31 slidably connected inside the slide groove 2, and two placement plates 32 are symmetrically fixedly connected to the upper surface of the slider 31, and a placement groove 33 is provided on the upper surface of the placement plate 32, and first through holes 34 are symmetrically provided on both sides of the inner wall of the placement groove 33, and a first electric push rod 35 is embedded and fixedly installed inside the first through hole 34, and a first clamping plate 36 is fixedly connected to the movable end of the first electric push rod 35, and the operation of the first electric push rod 35 drives the first clamping plate 36 to move, so that the semiconductor chip can be clamped, and two semiconductor chips can be placed respectively by setting two placement grooves 33, and the other can be tested immediately after one is tested, thereby improving the work efficiency, thereby solving the problem of low work efficiency caused by the existing semiconductor chip testing device that the tested semiconductor chip needs to be disassembled and then a new semiconductor chip is installed before testing.

[0026] The double-station clamping mechanism 3 also includes a second through hole opened on the other side of the inner wall of the placement groove 33, and a second electric push rod 37 is embedded and fixedly installed inside the second through hole. The movable end of the second electric push rod 37 is fixedly connected to a second clamping plate 38. The operation of the second electric push rod 37 drives the second clamping plate 38 to move, and cooperates with the inner wall of the placement groove 33 to limit the other two sides of the semiconductor chip.

[0027] One side of the outer surface of each of the first clamping plate 36 and the second clamping plate 38 is fixedly connected with a protective pad, and the protective pad can protect the semiconductor chip.

[0028] Embodiment 2:

[0029] like Figure 1 and Figure 3 As shown, both ends of the double-station clamping mechanism 3 are embedded with an ejection mechanism 4, and the ejection mechanism 4 includes a storage groove 41 opened at the bottom of the placement groove 33, and the inner bottom of the storage groove 41 is fixedly installed with a third electric push rod 42, and the top of the movable end of the third electric push rod 42 is fixedly connected to an ejection plate 43 that is slidably connected to the inner wall of the storage groove 41. The operation of the third electric push rod 42 drives the ejection plate 43 to move upward, so that the semiconductor chip can be ejected for easy removal, thereby solving the problem of the existing semiconductor chip detection device that a person needs to put his hand into the groove to take out the chip after detection, which is inconvenient to operate.

[0030] Embodiment 3:

[0031] like Figure 1 , Figure 4 and Figure 5As shown, an L-shaped plate 5 is fixedly installed on one side of the upper surface of the base 1, and an elastic lifting mechanism 6 is installed through the top of the L-shaped plate 5. The elastic lifting mechanism 6 includes a fourth electric push rod 61 that is fixedly installed through the top of the L-shaped plate 5, and the bottom end of the movable end of the fourth electric push rod 61 is fixedly connected to a top plate 62. The outer surface of the top plate 62 is symmetrically penetrated and slidably connected with two guide rods 63, and the bottom ends of the two guide rods 63 are commonly fixedly connected with a rectangular plate 64. The outer surface of the guide rod 63 and the position between the top plate 62 and the rectangular plate 64 are sleeved with a spring 65, and the outer surface of the guide rod 63 is sleeved with a nut 66 that is threadedly connected. The spring 65 can be provided to buffer the detection needle 9 during detection to avoid damaging the pins of the semiconductor chip.

[0032] Embodiment 4:

[0033] like Figure 1 , Figure 4 and Figure 5 As shown, a quick clamping mechanism 7 is embedded and installed on the lower surface of the elastic lifting mechanism 6, and a mounting plate 8 is clamped inside the quick clamping mechanism 7. The quick clamping mechanism 7 includes travel grooves 71 symmetrically opened on the lower surface of the rectangular plate 64, and a two-way screw rod 72 is rotatably connected between the two travel grooves 71. The outer surfaces of both ends of the two-way screw rod 72 are symmetrically threadedly connected with two clamping plates 73 that are respectively slidably connected to the inner walls of the two travel grooves 71. The mounting plate 8 is located between the two clamping plates 73. The rotation of the two-way screw rod 72 drives the two clamping plates 73 to move relative to each other, thereby realizing quick clamping of the mounting plate 8, and then facilitating the replacement of different detection needles, thereby solving the problem that the existing detection needles are fixedly installed and cannot be replaced according to different semiconductor chips, thereby reducing practicality.

[0034] One end of the bidirectional screw rod 72 extends to the outside of the rectangular plate 64 , and one end of the bidirectional screw rod 72 located outside the rectangular plate 64 is fixedly connected to a knob 74 , which facilitates the rotation of the bidirectional screw rod 72 .

[0035] A plurality of detection needles 9 are fixedly mounted on the lower surface of the mounting plate 8, a detector 10 for detecting semiconductor chips is fixedly mounted on the top of the L-shaped plate 5, and the detector 10 is connected to the detection needles 9 via wires, so as to facilitate the detection of semiconductor chips.

[0036] Working principle: Place the semiconductor chip into a placement slot 33, then start the first electric push rod 35 and the second electric push rod 37 respectively, thereby driving the first clamping plate 36 and the second clamping plate 38 to move, so as to fix the semiconductor chip around and prevent it from moving during detection, and then start the fourth electric push rod 61. The operation of the fourth electric push rod 61 can drive the upper detection needle 9 to move downward to detect the semiconductor chip. When the detection needle 9 contacts the pin of the semiconductor chip, at this time, the detection needle 9 can be buffered by the set spring 65 during the detection to avoid damaging the pin of the semiconductor chip. After the detection is completed, the semiconductor chip is released from fixation, and then start the third electric push rod 42. The operation of the third electric push rod 42 drives the ejection plate 43 to move upward, so that the semiconductor chip can be ejected for easy removal, thereby solving the existing semiconductor chip problem. The chip detection device needs a person to put his hand into the slot to take out the chip after detection, which is inconvenient to operate. During detection, another semiconductor chip to be detected can be placed in another placement slot 33 and fixed. After the detection is completed, it can be directly moved to the bottom of the detection needle 9 for detection, thereby solving the problem of low work efficiency caused by the existing semiconductor chip detection device that requires the semiconductor chip after detection to be disassembled and then a new semiconductor chip to be installed before detection. When detecting semiconductor chips of different sizes, the knob 74 and the two-way screw rod 72 can be rotated. The rotation of the two-way screw rod 72 drives the two clamping plates 73 to move relative to each other, so that the mounting plate 8 can be quickly clamped, and then different detection needles can be replaced easily, thereby solving the problem that the detection needles of the existing device are fixedly installed and cannot be replaced according to different semiconductor chips, thereby reducing practicality.

[0037] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0038] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor chip processing and testing device, comprising a base (1), characterized in that: The upper surface of the base (1) is provided with a slide groove (2), and a double-station clamping mechanism (3) for clamping semiconductor chips is slidably connected inside the slide groove (2), and ejection mechanisms (4) are embedded and installed inside both ends of the double-station clamping mechanism (3). An L-shaped plate (5) is fixedly installed on one side of the upper surface of the base (1), and an elastic lifting mechanism (6) is installed through the top of the L-shaped plate (5), and a quick clamping mechanism (7) is embedded and installed on the lower surface of the elastic lifting mechanism (6). A mounting plate (8) is clamped inside the quick clamping mechanism (7), and a plurality of detection needles (9) are fixedly installed on the lower surface of the mounting plate (8). A detector (10) for detecting semiconductor chips is fixedly installed on the top of the L-shaped plate (5), and the detector (10) is connected to the detection needle (9) through a wire. The double-station clamping mechanism (3) comprises a slider (31) slidably connected to the inside of the slide groove (2); two placement plates (32) are symmetrically fixedly connected to the upper surface of the slider (31); a placement groove (33) is provided on the upper surface of the placement plate (32); first through holes (34) are symmetrically provided on both sides of the inner wall of the placement groove (33); a first electric push rod (35) is embedded and fixedly installed inside the first through hole (34); and a first clamping plate (36) is fixedly connected to the movable end of the first electric push rod (35); The elastic lifting mechanism (6) comprises a fourth electric push rod (61) which is fixedly installed on the top of the L-shaped plate (5); the bottom end of the movable end of the fourth electric push rod (61) is fixedly connected to the top plate (62); the outer surface of the top plate (62) is symmetrically penetrated and slidably connected with two guide rods (63); the bottom ends of the two guide rods (63) are commonly fixedly connected with a rectangular plate (64); the outer surface of the guide rod (63) and the position between the top plate (62) and the rectangular plate (64) are sleeved with a spring (65); the outer surface of the guide rod (63) is sleeved with a nut (66) which is threadedly connected.

2. A semiconductor chip processing and testing device according to claim 1, characterized in that: The double-station clamping mechanism (3) also includes a second through hole opened on the other side of the inner wall of the placement groove (33), a second electric push rod (37) is embedded and fixedly installed inside the second through hole, and the movable end of the second electric push rod (37) is fixedly connected to a second clamping plate (38).

3. The semiconductor chip processing and testing device according to claim 1, characterized in that: The ejection mechanism (4) comprises a receiving groove (41) provided at the inner bottom of the placement groove (33); a third electric push rod (42) is fixedly mounted on the inner bottom of the receiving groove (41); and an ejection plate (43) slidably connected to the inner wall of the receiving groove (41) is fixedly connected to the top of the movable end of the third electric push rod (42).

4. The semiconductor chip processing and testing device according to claim 1, characterized in that: The quick clamping mechanism (7) comprises travel grooves (71) symmetrically arranged on the lower surface of the rectangular plate (64); a bidirectional screw rod (72) is rotatably connected between the two travel grooves (71); the outer surfaces of both ends of the bidirectional screw rod (72) are symmetrically threadedly connected to two clamping plates (73) respectively slidably connected to the inner walls of the two travel grooves (71); and the mounting plate (8) is located between the two clamping plates (73).

5. A semiconductor chip processing and testing device according to claim 4, characterized in that: One end of the bidirectional screw rod (72) extends to the outside of the rectangular plate (64), and one end of the bidirectional screw rod (72) located outside the rectangular plate (64) is fixedly connected to a knob (74).

6. The semiconductor chip processing and testing device according to claim 2, characterized in that: One side of the outer surface of the first clamping plate (36) and the second clamping plate (38) is fixedly connected with a protective pad.

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