Chip aging test board and chip test seat

Abstract

The utility model discloses a chip aging test board and a chip test seat, which can change the mode that a spring needle is directly contacted with a golden finger of the aging test board in the prior art into the mode that the spring needle is indirectly contacted with the aging test board through a conductive structure of the adapter board by arranging the adapter board. The circuit (golden finger) corrosion or electromigration of the aging test board can be prevented from influencing the spring needle and further influencing the chip test.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing equipment, and in particular relates to a chip aging testing board and a chip testing seat. Background Art

[0002] In the process of chip reliability verification, an aging test socket is usually required to perform reliability verification. Considering the good contact between the chip pin and the aging test socket, the contact design of the spring pin is currently widely used. The contact method in the prior art is as follows: the upper end of the spring pin contacts the chip pin, and the lower end of the spring pin contacts the gold finger on the aging test board.

[0003] The cross section of the gold finger on the aging test board is as follows Figure 1 As shown. Due to the influence of the electroplating process and the polluting elements in the test environment, the copper ions at the bottom of the gold finger are prone to precipitation and electromigration in a high-voltage, high-humidity and polluted environment (such as an environment containing sulfur and chlorine), resulting in leakage between two adjacent gold fingers; in severe cases, the experimental test chip may be burned.

[0004] Therefore, when the board manufacturing process of the aging test board is unstable or there is slight contamination in the high temperature and high humidity chamber, the circuit (gold finger) of the aging test board designed with this aging test socket is prone to corrosion or electromigration, causing the aging test board to leak and become unusable; at the same time, the corrosion of the aging test board will also cause the spring pins in the aging test socket to be corroded and unable to bounce up normally.

[0005] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0006] The purpose of the utility model is to provide a chip aging test board and a chip test seat, which can solve the problem that the spring pin type chip test seat is prone to aging test board circuit corrosion or electromigration in a high temperature and high humidity environment, thereby affecting the spring pins in the aging test seat being corroded and unable to bounce normally.

[0007] In order to achieve the above-mentioned purpose, a specific embodiment of the utility model provides a chip aging test board, comprising:

[0008] an aging board body having metallized through holes formed thereon; and

[0009] The adapter plate comprises a substrate and a conductive structure arranged through the substrate. The substrate and the aging board body are stacked and arranged. The conductive structure is fixed in the metallized through hole by welding.

[0010] In one or more embodiments of the present invention, the conductive structure includes a first conductive portion formed on a surface of the substrate facing away from the aging board body, a second conductive portion located inside the substrate, and a third conductive portion protruding from a surface of the substrate close to the aging board body, the first conductive portion, the second conductive portion and the third conductive portion are electrically connected, and the third conductive portion is fixed in the metallized through hole by welding.

[0011] In one or more embodiments of the present invention, the first conductive part, the second conductive part and the third conductive part are integrally formed.

[0012] In one or more embodiments of the present invention, the first conductive portion has a sheet-shaped contact surface, and the sheet-shaped contact surface is used to contact the spring pins in the external chip test seat.

[0013] In one or more embodiments of the present invention, the third conductive portion is configured as a columnar structure or a strip-shaped structure, and the third conductive portion is penetrated into the metallized through hole and fixed to the metal in the metallized through hole by welding.

[0014] In one or more embodiments of the present invention, the space between the metallized through hole and the conductive structure is filled with solder, and the solder completely covers the outer metal layer of the metallized through hole.

[0015] In one or more embodiments of the present invention, a protective layer is coated on the surface of the aging board body facing away from the adapter board, at least at the location of the metallized through hole.

[0016] In one or more embodiments of the utility model, a plurality of groups of metallized through holes are formed on the aging board body, and each group of metallized through holes is staggeredly distributed in a Z-shape;

[0017] A plurality of groups of the conductive structures are formed on the substrate of the adapter board, one group of the conductive structures corresponds to one group of the metallized through holes, and the conductive structures and the metallized through holes are arranged in a one-to-one correspondence.

[0018] In one or more embodiments of the present invention, the material of the substrate is selected from high temperature resistant plastic; the material of the conductive structure is selected from copper-gold plated material.

[0019] A specific embodiment of the utility model further provides a chip test socket, comprising:

[0020] A chip test socket body, in which spring pins are arranged for electrically connecting to the pins of the chip to be tested; and

[0021] The adapter plate is detachably or non-detachably arranged with the chip test seat body, and the adapter plate includes a substrate and a conductive structure arranged through the substrate, and the conductive structure is electrically connected to the spring pin.

[0022] In one or more embodiments of the present invention, the substrate is fixedly connected to the chip test seat body via a fastener, and the conductive structure is in abutment with the spring pin.

[0023] In one or more embodiments of the present invention, the conductive structure and the spring pin are welded.

[0024] In one or more embodiments of the present invention, the conductive structure includes a first conductive portion formed on a surface of a side of the substrate close to the chip test seat body, a second conductive portion located inside the substrate, and a third conductive portion protruding from a surface of a side of the substrate away from the chip test seat body, the first conductive portion, the second conductive portion and the third conductive portion are electrically connected, and the spring pin is electrically connected to the first conductive portion.

[0025] In one or more embodiments of the present invention, the first conductive part, the second conductive part and the third conductive part are integrally formed.

[0026] In one or more embodiments of the present invention, the first conductive portion has a sheet-shaped contact surface, and the spring pin is in contact with or welded to the sheet-shaped contact surface.

[0027] In one or more embodiments of the present invention, the chip test socket further includes an aging board body, a metallized through hole is formed on the aging board body, and the conductive structure of the adapter board is fixed in the metallized through hole by welding.

[0028] In one or more embodiments of the present invention, the space between the metallized through hole and the conductive structure is filled with solder, and the solder completely covers the outer metal layer of the metallized through hole.

[0029] In one or more embodiments of the present invention, a protective layer is coated on the surface of the aging board body facing away from the adapter board, at least at the location of the metallized through hole.

[0030] In one or more embodiments of the utility model, a plurality of groups of metallized through holes are formed on the aging board body, and each group of metallized through holes is staggeredly distributed in a Z-shape;

[0031] A plurality of groups of the conductive structures are formed on the substrate of the adapter board, one group of the conductive structures corresponds to one group of the metallized through holes, and the conductive structures and the metallized through holes are arranged in a one-to-one correspondence;

[0032] A plurality of groups of spring pins are arranged in the chip test seat body, one group of the spring pins corresponds to one group of the conductive structures, and the spring pins and the conductive structures are arranged in a one-to-one correspondence.

[0033] In one or more embodiments of the present invention, the material of the substrate is the same as that of the chip test seat body, which is selected from high temperature resistant plastic; the material of the conductive structure is the same as that of the spring pin, which is selected from copper-plated gold material.

[0034] Compared with the prior art, the chip aging test board and chip test socket of the utility model, through the setting of the adapter board, change the way in which the spring pin directly contacts the gold finger of the aging test board in the prior art to an indirect contact between the spring pin and the aging test board through the conductive structure of the adapter board, which can prevent the circuit (gold finger) of the aging test board from being corroded or electromigrated to affect the spring pin, thereby affecting the chip test.

[0035] The chip aging test board and chip test seat of the utility model are provided with solder filling between the metallized through hole and the conductive structure, and the solder completely covers the outer metal of the metallized through hole, thereby preventing circuit corrosion or electromigration from occurring on the aging test board.

[0036] The chip aging test board and chip test seat of the utility model can avoid the migration of soldering tin and the influence of chip testing by increasing the spacing of soldering through holes on the aging test board or by specially arranging the soldering through holes on the aging test board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 This is an aging test board structure in the prior art.

[0039] Figure 2 This is a schematic diagram of the structure of a chip aging test board in one embodiment of the utility model;

[0040] Figure 3 This is a schematic diagram of the main structure of the aging board of the chip aging test board in one embodiment of the utility model;

[0041] Figure 4 It is a cross-sectional schematic diagram of a chip aging test board in one embodiment of the utility model;

[0042] Figure 5This is a schematic cross-sectional view of the structure of a chip test socket in one embodiment of the utility model;

[0043] Figure 6 This is a partial cross-sectional detail diagram of a chip test socket in one embodiment of the present invention. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0045] As mentioned in the background technology, in the process of chip live reliability verification, an aging test socket is usually required to perform reliability verification. Considering the good contact between the chip pin and the aging test socket, the contact design of the spring pin is currently widely used, and the contact method is as follows: the upper end of the spring pin contacts the chip pin, and the lower end of the spring pin contacts the gold finger on the aging test board. Therefore, when the board making process of the aging test board is unstable or there is slight contamination in the high temperature and high humidity box, the circuit (gold finger) of the aging test board designed with this aging test socket is prone to corrosion or electromigration, resulting in leakage of the aging test board and inability to use; at the same time, the corrosion of the aging test board will also cause the spring pins in the aging test socket to be corroded and unable to bounce normally.

[0046] In order to solve the above technical problems, the utility model of the present application can change the way in which the spring pin directly contacts the gold finger of the aging test board in the prior art into indirect contact between the spring pin and the aging test board through the conductive structure of the adapter board by setting an adapter board, thereby preventing the circuit (gold finger) of the aging test board from being corroded or electromigrated and affecting the spring pin, thereby affecting the chip test.

[0047] like Figure 2 As shown, a chip aging test board is provided in the first embodiment of the utility model, including an aging board body 10 and an adapter board 20. A metallized through hole 11 is formed on the aging board body 10. The adapter board 20 includes a substrate 21 and a conductive structure 22 arranged through the substrate 21. The substrate 21 is stacked with the aging board body 10, and the conductive structure 22 is fixed in the metallized through hole 11 by welding.

[0048] refer to Figure 3As shown, illustratively, a metallized through hole 11 is set through the aging board body 10, and a metal layer is formed on the inner surface of the metallized through hole 11, and the metal layer extends from the inner surface of the metallized through hole 11 to the two side surfaces of the aging board body 10. In a preferred embodiment, a plurality of groups of metallized through holes 11 are formed on the aging board body 10, and each group of metallized through holes 11 is staggered in a Z shape, and there is a certain gap between adjacent metallized through holes 11. This setting increases the spacing between the soldering through holes (metallized through holes 11) on the aging board body 10, which can prevent the migration of solder tin from causing leakage and affecting the test chip.

[0049] like Figure 2 As shown, a plurality of groups of conductive structures 22 are also formed on the substrate 21 of the adapter board 20 . One group of conductive structures 22 is arranged corresponding to one group of metallized through holes 11 , and the conductive structures 22 and the metallized through holes 11 are arranged in a one-to-one correspondence.

[0050] like Figure 4 As shown, the conductive structure 22 includes a first conductive portion 221 formed on a surface of a side of the substrate 21 away from the aging board body 10, a second conductive portion 222 located inside the substrate 21, and a third conductive portion 223 protruding from a surface of a side of the substrate 21 close to the aging board body 10. The first conductive portion 221, the second conductive portion 222 and the third conductive portion 223 are electrically connected, and the first conductive portion 221, the second conductive portion 222 and the third conductive portion 223 are integrally formed.

[0051] The first conductive portion 221 is configured as a plate-like structure having a sheet-like contact surface, and the sheet-like contact surface is used to contact the spring pins in the external chip test socket.

[0052] The second conductive portion 222 is in fixed contact with an edge of the first conductive portion 221 .

[0053] The third conductive portion 223 is configured as a columnar structure or a long strip structure, and the third conductive portion 223 is fixed in the metallized through hole 11 by welding.

[0054] Exemplarily, the third conductive portion 223 may be formed by further extending the second conductive portion 222, and the third conductive portion 223 is disposed in the metallized through hole 11 and is welded and fixed to the metal layer in the metallized through hole 11. Exemplarily, the conductive structure 22 may be formed by bending a whole rectangular metal plate-like structure.

[0055] The third conductive portions 223 are also arranged in multiple groups. The third conductive portions 223 in each group are staggered in a Z-shape, and there is a certain gap between adjacent third conductive portions 223 . Each third conductive portion 223 corresponds to a metallized through hole 11 .

[0056] In this embodiment, the material of the substrate 21 is selected from high temperature resistant plastics, and the material of the conductive structure 22 is selected from copper-plated gold materials.

[0057] In order to prevent the metal layer on the metallized through hole 11 on the aging test board 10 from being corroded, the space between the metallized through hole 11 and the third conductive portion 223 is filled with solder, and the solder further completely covers the outer metal of the metallized through hole 11. Furthermore, a protective layer is coated on the surface of the aging board body 10 facing away from the adapter board 20, at least where the metallized through hole 11 is located, and the material of the protective layer can preferably be a three-proof paint.

[0058] Compared with the prior art, the chip aging test board of the utility model can avoid the migration of solder tin and affect chip testing by increasing the spacing between soldering through holes (metallized through holes) on the aging test board or by special arrangement of soldering through holes (metallized through holes) on the aging test board.

[0059] The chip aging test board of the utility model has the metallized through hole and the conductive structure filled with solder, and the solder completely covers the outer metal of the metallized through hole, which can prevent circuit corrosion or electromigration from occurring on the aging test board.

[0060] like Figure 5 and Figure 6 As shown, a chip test socket is provided in the second embodiment of the utility model, including a chip test socket body 30 and an adapter plate 20. A spring pin 31 for electrically connecting to the pin of the chip to be tested is arranged in the chip test socket body 30. The adapter plate 20 and the chip test socket body 30 are detachable or non-detachable, and the adapter plate 20 includes a substrate 21 and a conductive structure 22 arranged through the substrate 21, and the conductive structure 22 is electrically connected to the spring pin 31.

[0061] The chip test seat body 30 can adopt the structure in the prior art, for example, it is provided with a chip placement groove for placing the chip to be tested, and a spring pin 31 is arranged in the chip test seat body 30, one end of the spring pin 31 emerges from the bottom of the chip placement groove to contact the pin of the chip to be tested therein, and the other end of the spring pin 31 emerges from the bottom of the chip test seat body 30 to contact the aging test board or adapter board. The present application lists the necessary components required for the chip test seat body 30 in the prior art. Other structures are not the innovation of the present application and have no connection with the innovation of the present application, so they are not elaborated in detail here.

[0062] In one embodiment, the substrate 21 of the adapter board 20 is fixedly connected to the chip test seat body 30 via a fastener A, so that the adapter board 20 and the chip test seat body 30 are detachably connected. In this state, the conductive structure 22 on the substrate 21 and the spring pin 31 are in abutment state.

[0063] In another embodiment, the conductive structure 22 on the substrate 21 and the spring pins 31 are fixed by welding, so that the adapter board 20 and the chip test seat body 30 are non-detachably connected.

[0064] The conductive structure 22 includes a first conductive portion 221 formed on a surface of a side of the substrate 21 close to the chip test seat body 30, a second conductive portion 222 located inside the substrate 21, and a third conductive portion 223 protruding from a surface of a side of the substrate 21 away from the chip test seat body 30. The first conductive portion 221, the second conductive portion 222, and the third conductive portion 223 are electrically connected, and the first conductive portion 221, the second conductive portion 222, and the third conductive portion 223 are integrally formed.

[0065] The first conductive part 221 is configured as a plate-like structure, which has a sheet-like contact surface. The spring pin 31 abuts against or is welded to the sheet-like contact surface.

[0066] The second conductive portion 222 is in fixed contact with an edge of the first conductive portion 221 .

[0067] The third conductive portion 223 is configured as a columnar structure or a strip-shaped structure, and the third conductive portion 223 may be formed by further extending the second conductive portion 222 outward.

[0068] Exemplarily, the conductive structure 22 may be formed by bending a whole rectangular metal plate structure.

[0069] A plurality of groups of spring pins 31 are disposed in the chip test socket body 30 . One group of spring pins 31 is disposed corresponding to one group of conductive structures 22 , and the spring pins 31 and the conductive structures 22 are disposed in a one-to-one correspondence.

[0070] In this embodiment, the chip test socket further includes an aging board body 10 , on which a metallized through hole 11 is formed, and a conductive structure 22 of the adapter board 20 is fixed in the metallized through hole 11 by welding.

[0071] Exemplarily, a metallized through hole 11 is provided through the aging board body 10, and a metal layer is formed on the inner surface of the metallized through hole 11, and the metal layer extends from the inner surface of the metallized through hole 11 to the two side surfaces of the aging board body 10. In a preferred embodiment, a plurality of groups of metallized through holes 11 are formed on the aging board body 10, and each group of metallized through holes 11 is staggered in a Z shape, and there is a certain gap between adjacent metallized through holes 11. This arrangement increases the spacing between the soldering through holes (metallized through holes 11) on the aging board body 10, which can prevent the migration of solder tin from causing leakage and affecting the test chip.

[0072] The third conductive portion 223 of the conductive structure 22 on the adapter board 20 is disposed in the metallized through hole 11 and is fixed to the metal layer in the metallized through hole 11 by welding.

[0073] It is understandable that the conductive structure 22 is provided with multiple groups, and thus the third conductive parts 223 are arranged in multiple groups, each group of third conductive parts 223 is distributed in a Z-shaped staggered manner, and there is a certain gap between adjacent third conductive parts 223, and each third conductive part 223 corresponds to a metallized through hole 11.

[0074] In this embodiment, the material of the substrate 21 is the same as that of the chip test seat body 30, which is selected from high temperature resistant plastic. The material of the conductive structure 22 is the same as that of the spring pin 31, which is selected from copper-plated gold material. The material of the wire structure 22 has stronger corrosion resistance than the metal layer on the aging board body 10.

[0075] In order to prevent the metal layer on the metallized through hole 11 on the aging test board 10 from being corroded, the space between the metallized through hole 11 and the third conductive portion 223 is filled with solder, and the solder further completely covers the outer metal of the metallized through hole 11. Furthermore, a protective layer is coated on the surface of the aging board body 10 facing away from the adapter board 20, at least where the metallized through hole 11 is located, and the material of the protective layer can preferably be a three-proof paint.

[0076] Compared with the prior art, the chip aging test board and chip test socket of the utility model, through the setting of the adapter board, change the way in which the spring pin directly contacts the gold finger of the aging test board in the prior art to an indirect contact between the spring pin and the aging test board through the conductive structure of the adapter board, which can prevent the circuit (gold finger) of the aging test board from being corroded or electromigrated to affect the spring pin, thereby affecting the chip test.

[0077] The chip aging test board and chip test seat of the utility model are provided with solder filling between the metallized through hole and the conductive structure, and the solder completely covers the outer metal of the metallized through hole, thereby preventing circuit corrosion or electromigration from occurring on the aging test board.

[0078] The chip aging test board and chip test seat of the utility model can avoid the migration of soldering tin and the influence of chip testing by increasing the spacing of soldering through holes on the aging test board or by specially arranging the soldering through holes on the aging test board.

[0079] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0080] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip aging test board, characterized in that: include: An aging board body having metallized through holes formed thereon; as well as The adapter plate comprises a substrate and a conductive structure arranged through the substrate. The substrate and the aging board body are stacked and arranged. The conductive structure is fixed in the metallized through hole by welding.

2. The chip aging test board according to claim 1, characterized in that: The conductive structure includes a first conductive portion formed on a surface of the substrate facing away from the aging board body, a second conductive portion located inside the substrate, and a third conductive portion protruding from a surface of the substrate close to the aging board body. The first conductive portion, the second conductive portion and the third conductive portion are electrically connected, and the third conductive portion is fixed in the metallized through hole by welding.

3. The chip aging test board according to claim 2, characterized in that: The first conductive portion has a sheet-shaped contact surface, and the sheet-shaped contact surface is used to contact the spring pin in the external chip test seat; and / or, The third conductive part is configured as a columnar structure or a long strip structure. The third conductive part is penetrated in the metallized through hole and is fixed to the metal in the metallized through hole by welding.

4. The chip aging test board according to claim 1, characterized in that: A plurality of groups of metallized through holes are formed on the aging board body, and each group of metallized through holes is staggeredly distributed in a Z-shape; A plurality of groups of the conductive structures are formed on the substrate of the adapter board, one group of the conductive structures corresponds to one group of the metallized through holes, and the conductive structures and the metallized through holes are arranged in a one-to-one correspondence.

5. A chip test socket, characterized in that: include: The chip test socket body is provided with spring pins for electrically connecting with the pins of the chip to be tested; as well as An adapter plate, which is detachably or non-detachably arranged with the chip test seat body, wherein the adapter plate comprises a substrate and a conductive structure arranged through the substrate, and the conductive structure is electrically connected to the spring pin; It also includes an aging board body, on which a metallized through hole is formed, and the conductive structure of the adapter board is fixed in the metallized through hole by welding.

6. The chip test socket according to claim 5, characterized in that: The substrate is fixedly connected to the chip test seat body through a fastener, and the conductive structure is in contact with the spring pin; or, The conductive structure is welded to the spring pin.

7. The chip test socket according to claim 5, characterized in that: The conductive structure includes a first conductive portion formed on a surface of the substrate close to a side of the chip test seat body, a second conductive portion located inside the substrate, and a third conductive portion protruding from a surface of the substrate away from a side of the chip test seat body, the first conductive portion, the second conductive portion and the third conductive portion are electrically connected, and the spring pin is electrically connected to the first conductive portion.

8. The chip test socket according to claim 7, characterized in that: The first conductive part has a sheet-shaped contact surface, and the spring pin is in contact with or welded to the sheet-shaped contact surface.

9. The chip test socket according to claim 5, characterized in that: A plurality of groups of metallized through holes are formed on the aging board body, and each group of metallized through holes is staggeredly distributed in a Z-shape; A plurality of groups of the conductive structures are formed on the substrate of the adapter board, one group of the conductive structures corresponds to one group of the metallized through holes, and the conductive structures and the metallized through holes are arranged in a one-to-one correspondence; A plurality of groups of spring pins are arranged in the chip test seat body, one group of the spring pins corresponds to one group of the conductive structures, and the spring pins and the conductive structures are arranged in a one-to-one correspondence.

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