Heat dissipation device for manufacturing photovoltaic equipment and components

Abstract

The utility model relates to the field of heat dissipation devices, and discloses a heat dissipation device for manufacturing photovoltaic equipment and components, which comprises a bearing main board and movable supporting assemblies arranged on the bearing main board, a heat dissipation assembly is arranged between the movable supporting assemblies, a carrying box is arranged above the heat dissipation assembly, and the carrying box is arranged on the bearing main board. A carrying substrate is arranged in the carrying box, and a heat dissipation assembly is arranged above the carrying box; the heat dissipation assembly is fixed through the combination of a heat dissipation inserting plate and a heat dissipation inserting groove in the object carrying box, so that the heat dissipation assembly is convenient to disassemble, and therefore when the heat dissipation assembly is used, maintenance personnel can conveniently take down the heat dissipation assembly for maintenance, the work progress of a user is accelerated, and the economic benefits of the user are improved; meanwhile, due to the hollowed-out design of the heat dissipation assembly, heat dissipation fan blades are convenient to clean, the durability of parts of the heat dissipation assembly is improved, the service life of the heat dissipation assembly is prolonged, and therefore the practicability of the heat dissipation device for manufacturing the photovoltaic equipment and the components is improved.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation devices, in particular to a heat dissipation device used for manufacturing photovoltaic equipment and components. Background Art

[0002] Photovoltaic is the abbreviation of solar photovoltaic power generation system. It is a new type of power generation system that uses the photovoltaic effect of solar cell semiconductor materials to directly convert solar radiation energy into electrical energy. It has two modes of independent operation and grid-connected operation. At the same time, solar photovoltaic power generation systems are classified into two types: centralized, such as large-scale northwest ground photovoltaic power generation systems; and distributed (with a boundary of more than 6MW), such as photovoltaic power generation systems on the roofs of industrial and commercial factories and photovoltaic power generation systems on the roofs of residential buildings. Electronic components are components of electronic components, small machines and instruments. They are often composed of several parts and can be used in similar products. They often refer to certain parts of industries such as electrical appliances, radios and instruments. They are the general term for electronic devices such as capacitors, transistors, hairsprings and springs. Common ones include diodes, etc.; the heat dissipation devices currently used in the market for photovoltaic equipment and component manufacturing cannot be easily disassembled, which makes it inconvenient for maintenance personnel to repair the heat dissipation devices when in use, thereby delaying the user's work progress and affecting the user's economic benefits. At the same time, the heat dissipation devices are not easy to clean, which reduces the durability of the internal parts of the heat dissipation devices and shortens the service life of the heat dissipation devices, thereby reducing the practicality of heat dissipation devices for photovoltaic equipment and component manufacturing.

[0003] To this end, a heat dissipation device for photovoltaic equipment and component manufacturing is proposed. Utility Model Content

[0004] A heat dissipation device for photovoltaic equipment and component manufacturing, comprising a carrier mainboard 1 and a movable support assembly arranged on the carrier mainboard, a heat dissipation assembly is arranged between the movable support assemblies, a carrier box is arranged above the heat dissipation assembly, a carrier substrate is arranged in the carrier box, and a heat dissipation assembly is arranged above the carrier box.

[0005] Preferably, a supporting through hole is provided on the supporting main board, the supporting through hole is rectangular, a rotating shaft is provided in the supporting through hole, and the rotating shaft is embedded in the shaft sleeve.

[0006] Preferably, the movable support assembly comprises a plurality of support rods, one end of each support rod is connected to a rotating shaft, and the other end is connected to a grounded bottom rod, and bottom rod connecting ropes are connected between the grounded bottom rods.

[0007] Preferably, the carrier mainboard is connected to a loading box, the loading box is provided with a loading bottom plate, the loading bottom plate is provided with a heat dissipation slot, and a heat dissipation hole is provided in the middle of the loading bottom plate.

[0008] Preferably, the cargo box is provided with a box body supporting side panel, the box body supporting side panel is provided with a locking hole, the locking hole is embedded with a locking pull plate, and the locking pull plate.

[0009] Preferably, a pull plate handle is provided on the positioning pull plate, the box body supporting side plates are connected to the positioning pull plates via positioning springs, and a loading base plate is embedded between the positioning pull plates.

[0010] Preferably, a hollow mesh is provided on the carrier substrate, the heat dissipation assembly includes a heat dissipation plug plate, the heat dissipation plug plate includes a plug plate hole, and a heat dissipation fan fixing plate is provided on one side of the heat dissipation plug plate.

[0011] Preferably, a heat dissipation fan blade is provided in the plug plate hole, the heat dissipation fan blade is connected to the motor, the motor is fixed on the heat dissipation fan fixing plate, a loading top plate is provided above the loading base plate, and a heat dissipation component is embedded in the loading top plate. Beneficial Effects

[0012] The new method fixes the heat dissipation component by combining the heat dissipation plug plate and the heat dissipation slot on the loading box, making the heat dissipation component easy to disassemble, so that the heat dissipation component is easy to remove for maintenance by maintenance personnel when in use, thereby improving the work progress of the user and improving the economic benefits of the user. At the same time, the hollow design of the heat dissipation component is convenient for cleaning the heat dissipation fan blades, improving the durability of the heat dissipation component parts, and increasing the service life of the heat dissipation component, thereby improving the practicality of the heat dissipation device for photovoltaic equipment and component manufacturing; the trapezoidal structure adopted by the new support component has high stability, so that when the heat dissipation device for photovoltaic equipment and component manufacturing is operated, the operating errors caused by the shaking of the device are reduced, the economic losses of the users are reduced, the occurrence of safety accidents is reduced, and the life and health of the users are guaranteed, thereby further improving the practicality of the heat dissipation device for photovoltaic equipment and component manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings described below are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a partial structural diagram of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the heat dissipation component of the utility model;

[0017] Legend:

[0018] 1. Load-bearing motherboard; 2. Movable support assembly; 3. Heat dissipation assembly; 4. Loading box; 5. Loading base plate; 11. Support through hole; 12. Rotating shaft; 13. Bushing; 21. Support rod; 22. Grounding bottom rod; 23. Bottom rod connecting rope; 41. Heat dissipation slot; 42. Loading bottom plate; 43. Heat dissipation hole; 44. Box body supporting side plate; 441. Positioning hole; 442. Positioning pull plate; 443. Pull plate handle; 45. Positioning spring; 51. Hollow net; 31. Heat dissipation plug plate; 32. Plug plate hole; 33. Cooling fan fixing plate; 321. Cooling fan blade; 322. Motor; 46. Loading top plate. DETAILED DESCRIPTION

[0019] The utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] It should be noted that if the utility model embodiments involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0021] In addition, "multiple" means more than two. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0022] Please refer to the instruction manual Figure 1-Figure 3 A heat dissipation device for photovoltaic equipment and component manufacturing includes a carrier mainboard 1 and a movable support assembly 2 arranged on the carrier mainboard 1, a heat dissipation assembly 3 is arranged between the movable support assemblies 2, a carrier box 4 is arranged above the heat dissipation assembly 3, a carrier substrate 5 is arranged in the carrier box 4, and a heat dissipation assembly 3 is arranged above the carrier box 4.

[0023] Furthermore, a supporting through hole 11 is provided on the supporting main board 1 . The supporting through hole 11 is rectangular. A rotating shaft 12 is provided in the supporting through hole 11 . The rotating shaft 12 is embedded in a shaft sleeve 13 .

[0024] Furthermore, the movable support assembly 2 includes a plurality of support rods 21, one end of the support rod 21 is connected to the rotating shaft 12, and the other end is connected to the grounded bottom rod 22, and a bottom rod connecting rope 23 is connected between the grounded bottom rods 22. By pulling the support rod 21, the support rod 21 can rotate with the rotating shaft 12, driving the grounded bottom rod 22 to open the bottom rod connecting rope 23 to form a supporting structure. This structure and the supporting main board 1 form a trapezoidal structure, which has a better stabilizing effect.

[0025] Furthermore, the carrier mainboard 1 is connected to a loading box 4 , and the loading box 4 is provided with a loading bottom plate 42 . A heat dissipation slot 41 is provided on the loading bottom plate 42 , and a heat dissipation hole 43 is provided in the middle of the loading bottom plate 42 .

[0026] Furthermore, the cargo box 4 is provided with a box body supporting side plate 44, and the box body supporting side plate 44 is provided with a locking hole 441, and the locking hole 441 is embedded with a locking pull plate 442, and the locking pull plate 442.

[0027] Furthermore, a pull plate handle 443 is provided on the locking pull plate 442, and the box body supporting side plate 44 is connected to the locking pull plate 442 through a locking spring 45. A carrier substrate 5 is embedded between the locking pull plates 442. When the pull plate handle 443 is pulled, the locking spring 45 is stretched and the carrier substrate 5 is inserted, and the locking pull plate 442 rebounds to clamp the carrier substrate 5 to fix it.

[0028] Furthermore, a hollow net 51 is provided on the carrier substrate 5, and the heat dissipation component 3 includes a heat dissipation plug plate 31, and the heat dissipation plug plate 31 includes a plug plate hole 32. A heat dissipation fan fixing plate 33 is provided on one side of the heat dissipation plug plate. The heat dissipation plug plate 31 can be inserted into the heat dissipation slot 41 of the carrier bottom plate 42 to fix the heat dissipation component. When maintenance and cleaning are required, it can be removed at any time, which is convenient and quick.

[0029] Furthermore, a heat dissipation fan blade 321 is provided in the plug hole 32, and the heat dissipation fan blade 321 is connected to a motor 322, and the motor 322 is fixed on the heat dissipation fan fixing plate 33. A loading top plate 46 is provided above the loading substrate 5, and a heat dissipation component 3 is embedded in the loading top plate 46. Photovoltaic electronic components are placed on the hollow mesh 51 of the loading substrate 5, and the motor 322 is started to drive the heat dissipation fan blade 321 to rotate, and the electronic components are cooled by blowing air from the upper and lower directions through the plug hole 32 and the heat dissipation hole 43, thereby achieving a good heat dissipation effect.

[0030] First, pull the support rod 21, which can rotate with the rotating shaft 12, driving the grounded bottom rod 22 to open the bottom rod connecting rope 23 to form a supporting structure. The structure and the supporting main board 1 form a trapezoidal structure with a strong stabilizing effect; put photovoltaic electronic components on the hollow net 51 of the carrier substrate 5, pull the pull plate handle 443, the positioning spring 45 is stretched, put into the carrier substrate 5, the positioning pull plate 442 rebounds and clamps the carrier substrate 5 to fix it, insert the heat dissipation plug plate 31 into the heat dissipation slot 41 of the carrier bottom plate 42 to fix the main heat dissipation component, which can be removed at any time when maintenance and cleaning are needed, which is convenient and quick, start the motor 322, drive the heat dissipation fan blades 321 to rotate, and blow air to dissipate heat from the upper and lower directions through the plug plate hole 32 and the heat dissipation hole 43 to dissipate heat to the electronic components, which has a good heat dissipation effect.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0033] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A heat dissipation device for photovoltaic equipment and component manufacturing, comprising a carrier mainboard (1) and a movable support assembly (2) arranged on the carrier mainboard (1), It is characterized in that A heat dissipation component (3) is provided between the movable support components (2), a loading box (4) is provided above the heat dissipation component (3), a loading base plate (5) is provided in the loading box (4), and a heat dissipation component (3) is provided above the loading box (4).

2. A heat dissipation device for photovoltaic equipment and component manufacturing according to claim 1, It is characterized in that The supporting main plate (1) is provided with a supporting through hole (11), the supporting through hole (11) is rectangular, a rotating shaft (12) is provided in the supporting through hole (11), and the rotating shaft (12) is embedded in the shaft sleeve (13).

3. A heat dissipation device for photovoltaic equipment and components manufacturing according to claim 1, It is characterized in that The movable support assembly (2) comprises a plurality of support rods (21), one end of each support rod (21) being connected to a rotating shaft (12) and the other end being connected to a grounded bottom rod (22), wherein a bottom rod connecting rope (23) is connected between the grounded bottom rods (22).

4. A heat dissipation device for photovoltaic equipment and component manufacturing according to claim 2, It is characterized in that The carrier mainboard (1) is connected to a carrier box (4), the carrier box (4) is provided with a carrier bottom plate (42), a heat dissipation slot (41) is provided on the carrier bottom plate (42), and a heat dissipation hole (43) is provided in the middle of the carrier bottom plate (42).

5. A heat dissipation device for photovoltaic equipment and component manufacturing according to claim 1, It is characterized in that The cargo box (4) is provided with a box body supporting side plate (44), the box body supporting side plate (44) is provided with a locking hole (441), the locking hole (441) is engaged with a locking pull plate (442), and the locking pull plate (442) is engaged with the locking hole (441).

6. A heat dissipation device for photovoltaic equipment and component manufacturing according to claim 5, It is characterized in that The locking pull plate (442) is provided with a pull plate handle (443), the box body supporting side plate (44) is connected to the locking pull plate (442) via a locking spring (45), and a carrier base plate (5) is embedded between the locking pull plates (442).

7. A heat dissipation device for photovoltaic equipment and component manufacturing according to claim 1, It is characterized in that The carrier substrate (5) is provided with a hollow mesh (51), the heat dissipation assembly (3) comprises a heat dissipation plug plate (31), the heat dissipation plug plate (31) comprises a plug plate hole (32), and a heat dissipation fan fixing plate (33) is provided on one side of the heat dissipation plug plate.

8. A heat dissipation device for photovoltaic equipment and component manufacturing according to claim 7, It is characterized in that A heat dissipation fan blade (321) is provided in the plug plate hole (32), the heat dissipation fan blade (321) is connected to a motor (322), the motor (322) is fixed on the heat dissipation fan fixing plate (33), a loading top plate (46) is provided above the loading base plate (5), and a heat dissipation component (3) is embedded in the loading top plate (46).

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