Semiconductor integrated MOS tube

Abstract

The utility model discloses a semiconductor integrated MOS tube, and relates to the technical field of MOS tubes. Comprising a plastic package shell and a U-shaped metal cover, a rotating shaft is arranged at the right end of the plastic package shell, a kidney-shaped hole is formed in the left end of the U-shaped metal cover, the U-shaped metal cover is hinged to the plastic package shell through the kidney-shaped hole and the rotating shaft, and an L-shaped heat conduction piece is installed at the inner bottom of the plastic package shell. According to the semiconductor integrated MOS tube, the pins of the MOS tube can be wrapped by the arranged U-shaped metal cover, so that the protection function on the pins is increased, the pins are not easy to deform and damage due to collision in the carrying or transporting process of the MOS tube, and meanwhile, when the MOS tube is installed, the U-shaped metal cover only needs to be folded to the opposite direction of the pins, so that the pins are not easy to deform and damage. And then the U-shaped metal cover is tightly attached to the exposed L-shaped heat-conducting fin, so that through the matching of the L-shaped heat-conducting fin and the U-shaped metal cover, the larger heat capacity and surface area are fully utilized, the heat dissipation efficiency is improved, and the use of the MOS tube is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS tubes, in particular to a semiconductor integrated MOS tube. Background Art

[0002] MOS tube is an important semiconductor device. Its full name is metal-oxide-semiconductor field-effect transistor. MOS tube can be used as a key component in circuits such as switches, amplifiers, and voltage regulators. Its function is to control the flow of current, thereby realizing circuit control and regulation. The principle of MOS tube is based on field effect, that is, by controlling the gate electric field strength, changing the concentration of carriers in the semiconductor, thereby adjusting the current of the circuit.

[0003] In the prior art, after the production of the MOS tube is completed, its pins are directly exposed to the outside, which may easily cause the pins to be deformed or broken during handling and transportation, thereby affecting the use of the MOS tube. Utility Model Content

[0004] The utility model provides a semiconductor integrated MOS tube to solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor integrated MOS tube, comprising a plastic-sealed shell and a U-shaped metal cover, wherein the right end of the plastic-sealed shell is provided with a rotating shaft, the left end of the U-shaped metal cover is provided with a waist-shaped hole, and the U-shaped metal cover is hinged to the plastic-sealed shell through the waist-shaped hole and the rotating shaft, an L-shaped heat-conducting sheet is installed on the inner bottom of the plastic-sealed shell, and one end of the L-shaped heat-conducting sheet extends out of the plastic-sealed shell and is tightly attached to the left side wall of the plastic-sealed shell, a lead frame is installed on the L-shaped heat-conducting sheet, a MOS chip is soldered on the lead frame, and pins are arranged on the lead frame, and one end of the pins extends out of the plastic-sealed shell and is located in the U-shaped metal cover.

[0006] Furthermore, the rotating shaft is located at the upper and lower sides of the plastic package shell, and the waist-shaped hole is located at the upper and lower ends of the U-shaped metal cover.

[0007] Furthermore, a spring and a snap ring are respectively installed on the rotating shaft, and the snap ring is located above the spring.

[0008] Furthermore, the spring is located between the clamping ring and the U-shaped metal cover, and the spring is elastically pressed on the U-shaped metal cover.

[0009] Furthermore, a through hole is provided on the left side wall of the plastic-sealed shell, and one end of the L-shaped heat conducting sheet passes outward from the through hole.

[0010] Furthermore, a via hole is provided on the right side wall of the plastic package shell, and one end of the pin passes outward from the via hole.

[0011] Compared with the prior art, the present invention provides a semiconductor integrated MOS tube having the following features:

[0012] Beneficial effects:

[0013] The semiconductor integrated MOS tube can wrap the pins of the MOS tube by means of a U-shaped metal cover, thereby increasing the protection function of the pins, so that the pins of the MOS tube are not easily deformed and damaged by collision during handling or transportation of the MOS tube. At the same time, when installing the MOS tube, it is only necessary to fold the U-shaped metal cover to the opposite direction of the pins, and then make the U-shaped metal cover close to the L-shaped heat conducting sheet exposed outside, so that the large heat capacity and surface area can be fully utilized through the cooperation of the L-shaped heat conducting sheet and the U-shaped metal cover, thereby improving the heat dissipation efficiency and facilitating the use of the MOS tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a top view of the utility model;

[0016] Figure 3 The U-shaped metal cover of the utility model is folded Figure 1 ;

[0017] Figure 4 The U-shaped metal cover of the utility model is folded Figure 2 .

[0018] In the figure: 1. Plastic package shell; 2. U-shaped metal cover; 3. Rotating shaft; 4. Waist-shaped hole; 5. L-shaped heat conductive sheet; 6. Lead frame; 7. MOS chip; 8. Pin; 9. Spring; 10. Retaining ring; 11. Perforation; 12. Via. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-Figure 4The utility model discloses a semiconductor integrated MOS tube, comprising a plastic-sealed shell 1 and a U-shaped metal cover 2, wherein a rotating shaft 3 is arranged at the right end of the plastic-sealed shell 1, a waist-shaped hole 4 is arranged at the left end of the U-shaped metal cover 2, and the U-shaped metal cover 2 is hinged to the plastic-sealed shell 1 through the waist-shaped hole 4 and the rotating shaft 3, an L-shaped heat-conducting sheet 5 is installed at the inner bottom of the plastic-sealed shell 1, and one end of the L-shaped heat-conducting sheet 5 extends out of the plastic-sealed shell 1 and is closely attached to the left side wall of the plastic-sealed shell 1, a lead frame 6 is installed on the L-shaped heat-conducting sheet 5, and a MOS chip 7 is soldered on the lead frame 6, and the pins of the MOS tube can be connected by the U-shaped metal cover 2. 8 is wrapped up, thereby increasing the protection function of the pin 8, so that the pin 8 is not easily deformed and damaged by collision during the handling or transportation of the MOS tube. At the same time, when installing the MOS tube, it is only necessary to fold the U-shaped metal cover 2 to the opposite direction of the pin 8, and then make the U-shaped metal cover 2 close to the L-shaped heat conducting sheet 5 exposed to the outside, so that the larger heat capacity and surface area can be fully utilized through the cooperation of the L-shaped heat conducting sheet 5 and the U-shaped metal cover 2, so as to improve the heat dissipation efficiency, which is beneficial to the use of the MOS tube. The lead frame 6 is provided with a pin 8, and one end of the pin 8 extends out of the plastic package shell 1 and is located in the U-shaped metal cover 2.

[0021] Specifically, the rotating shaft 3 is located at the upper and lower sides of the plastic package shell 1 , and the waist-shaped hole 4 is located at the upper and lower ends of the U-shaped metal cover 2 .

[0022] In this embodiment, the relative position of the U-shaped metal cover 2 can be easily adjusted through the cooperation between the rotating shaft 3 and the waist-shaped hole 4, thereby facilitating protection or heat dissipation.

[0023] Specifically, a spring 9 and a snap ring 10 are respectively installed on the rotating shaft 3 , and the snap ring 10 is located above the spring 9 .

[0024] In this embodiment, the snap ring 10 is often used to connect various shafts, bearings, needle roller shafts and other components to ensure a tight connection between them, and the spring 9 is used to increase the holding force.

[0025] Specifically, the spring 9 is interposed between the clamping ring 10 and the U-shaped metal cover 2 , and the spring 9 is elastically pressed on the U-shaped metal cover 2 .

[0026] In this embodiment, the spring 9 is mainly used to increase the tension force of the hinge point of the U-shaped metal cover 2 so that the U-shaped metal cover 2 can stay at a certain position.

[0027] Specifically, a through hole 11 is formed on the left side wall of the plastic-sealed housing 1 , and one end of the L-shaped heat conducting sheet 5 passes through the through hole 11 to the outside.

[0028] In this embodiment, the through hole 11 is designed to avoid the position so that one end of the L-shaped heat conducting sheet 5 can pass outward.

[0029] Specifically, a via hole 12 is provided on the right side wall of the plastic package housing 1 , and one end of the pin 8 passes through the via hole 12 to the outside.

[0030] In this embodiment, the via hole 12 is designed to be avoidance, so that one end of the pin 8 can pass outward.

[0031] When in use, the U-shaped metal cover 2 can wrap the pin 8 of the MOS tube, thereby increasing the protection function of the pin 8, so that the pin 8 is not easily deformed and damaged by collision during the handling or transportation of the MOS tube. At the same time, when installing the MOS tube, it is only necessary to fold the U-shaped metal cover 2 to the opposite direction of the pin 8, and then make the U-shaped metal cover 2 close to the L-shaped heat conductive sheet 5 exposed outside. Through the cooperation of the L-shaped heat conductive sheet 5 and the U-shaped metal cover 2, the larger heat capacity and surface area can be fully utilized, the heat dissipation efficiency is improved, and the use of the MOS tube is facilitated.

[0032] In summary, the semiconductor integrated MOS tube can wrap the pin 8 of the MOS tube by the U-shaped metal cover 2, thereby increasing the protection function of the pin 8, so that the pin 8 is not easily deformed and damaged by collision during the handling or transportation of the MOS tube. At the same time, when installing the MOS tube, it is only necessary to fold the U-shaped metal cover 2 to the opposite direction of the pin 8, and then make the U-shaped metal cover 2 close to the L-shaped heat conductive sheet 5 exposed outside, so that the larger heat capacity and surface area can be fully utilized through the cooperation of the L-shaped heat conductive sheet 5 and the U-shaped metal cover 2, so as to improve the heat dissipation efficiency and facilitate the use of the MOS tube.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor integrated MOS tube, comprising a plastic package shell (1) and a U-shaped metal cover (2), Features: The right end of the plastic-encapsulated shell (1) is provided with a rotating shaft (3), the left end of the U-shaped metal cover (2) is provided with a waist-shaped hole (4), and is hinged to the plastic-encapsulated shell (1) through the waist-shaped hole (4) and the rotating shaft (3), an L-shaped heat-conducting sheet (5) is installed on the inner bottom of the plastic-encapsulated shell (1), and one end of the L-shaped heat-conducting sheet (5) extends out of the plastic-encapsulated shell (1) and is closely attached to the left side wall of the plastic-encapsulated shell (1), a lead frame (6) is installed on the L-shaped heat-conducting sheet (5), a MOS chip (7) is soldered on the lead frame (6), and a pin (8) is arranged on the lead frame (6), and one end of the pin (8) extends out of the plastic-encapsulated shell (1) and is located in the U-shaped metal cover (2).

2. A semiconductor integrated MOS tube according to claim 1, Features: The rotating shaft (3) is located at the upper and lower sides of the plastic-sealed shell (1), and the waist-shaped hole (4) is located at the upper and lower ends of the U-shaped metal cover (2).

3. The semiconductor integrated MOS tube according to claim 1, Features: A spring (9) and a snap ring (10) are respectively mounted on the rotating shaft (3), and the snap ring (10) is located above the spring (9).

4. The semiconductor integrated MOS tube according to claim 1, Features: The spring (9) is located between the clamping ring (10) and the U-shaped metal cover (2), and the spring (9) is elastically pressed on the U-shaped metal cover (2).

5. The semiconductor integrated MOS tube according to claim 1, Features: A through hole (11) is provided on the left side wall of the plastic-sealed housing (1), and one end of the L-shaped heat conducting sheet (5) protrudes outward from the through hole (11).

6. The semiconductor integrated MOS tube according to claim 1, Features: A through hole (12) is provided on the right side wall of the plastic-sealed housing (1), and one end of the pin (8) passes outward from the through hole (12).

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