Power supply

Abstract

The utility model discloses a power supply, comprising a substrate having an upper surface, a lower surface and a groove arranged on the lower surface; the first electronic component is welded on the upper surface; the second electronic component is arranged in the groove, and the vertical distance from one end, far away from the groove bottom of the groove, of the second electronic component to the groove bottom is smaller than the depth of the groove; the plurality of first bonding pads are arranged on the lower surface, and the welding surfaces of the first bonding pads are positioned on the same plane; a plurality of second pads disposed on the upper surface; and the inductor is arranged on the upper surface of the substrate, and a pin of the inductor is welded on the second bonding pad. According to the utility model, the first bonding pads of the substrate are used as product function pins, so that the first bonding pads on the lower surface can be kept at the same height, the coplanarity of the product function pins on the lower surface can be ensured, and the welding reliability can be effectively improved during application.

Description

Technical Field

[0001] The utility model relates to the technical field of power supplies, in particular to a power supply. Background Art

[0002] The existing POL open-frame power supply assembly process generally consists of copper block terminals, inductors and substrates. However, the current POL open-frame power supply not only has the problem of large size, but also has the problem of poor terminal coplanarity and weak terminal welding strength, which makes the welding reliability of the power supply terminal low and cannot meet the needs of power supply development. Utility Model Content

[0003] In view of this, the utility model provides a power supply which can not only meet the demand for small volume, but also solve the problems of terminal coplanarity and welding strength.

[0004] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0005] In a first aspect, the utility model provides a power supply, comprising:

[0006] A substrate having an upper surface, a lower surface, and a groove arranged on the lower surface;

[0007] A first electronic component is welded on the upper surface;

[0008] A second electronic component is disposed in the groove, wherein a vertical distance from an end of the second electronic component away from the groove bottom to the groove bottom is less than a depth of the groove;

[0009] A plurality of first solder pads are arranged on the lower surface, and the soldering surfaces of the first solder pads are located in the same plane;

[0010] A plurality of second pads are arranged on the upper surface;

[0011] The inductor is arranged on the upper surface of the substrate, and the pins of the inductor are welded on the second pad.

[0012] Furthermore, the power supply further includes a connection substrate, the second electronic component is welded to the lower surface of the connection substrate, a third soldering pad is provided at the bottom of the groove, and the connection substrate is welded to the third soldering pad.

[0013] Furthermore, a fourth pad is provided on the side wall of the connection substrate, and the connection substrate is welded to the third pad via the fourth pad.

[0014] Furthermore, a fifth soldering pad is provided on the upper surface of the connection substrate, and the connection substrate is soldered to the third soldering pad via the fifth soldering pad.

[0015] Furthermore, a third pad is provided at the bottom of the groove, and the second electronic component is welded to the third pad.

[0016] Furthermore, the first pad includes a first function pin pad and a second function pin pad.

[0017] Furthermore, the thickness of each of the second pads is consistent.

[0018] Furthermore, the thickness of each of the first pads is the same, and the thickness of each of the first pads is 50um-80um.

[0019] Furthermore, the power supply is a POL open-board power supply.

[0020] In a second aspect, the utility model further provides a power supply, the power supply comprising:

[0021] A substrate, the substrate having an upper surface, a lower surface, and a groove arranged on the lower surface;

[0022] A first electronic component is welded on the upper surface;

[0023] A second electronic component is disposed in the groove, and the second electronic component does not extend beyond the groove;

[0024] A plurality of first solder pads are arranged on the lower surface, and the soldering surfaces of the first solder pads are located in the same plane;

[0025] A plurality of second pads are arranged on the upper surface;

[0026] The inductor is arranged on the upper surface of the substrate, and the pins of the inductor are welded on the second pad.

[0027] The beneficial effects of the utility model are as follows:

[0028] (1) The utility model provides a power supply with a groove on the lower surface of a substrate and installs a second electronic component in the groove, and the height of the second electronic component is less than the depth of the groove, so that the components are only arranged on the upper surface and the groove of the substrate, but not on the lower surface of the substrate. In addition, the first solder pad of the substrate is used as the product function pin, and the copper block terminal is eliminated as the product function pin, so that the first solder pad on the lower surface can be maintained at the same height, which not only ensures the coplanarity of the product function pin on the lower surface, but also effectively improves the welding reliability when used.

[0029] (2) The power supply provided by the utility model uses the groove bottom of the substrate to layout the components, thereby increasing the layout area of ​​the substrate, thereby reducing the substrate area, and further facilitating the reduction of the volume of the entire power supply;

[0030] (3) The power supply provided by the utility model adopts the first solder pad of the substrate as the product function pin, thereby eliminating the copper block terminal as the product function pin, which is beneficial to reducing the overall height of the power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0032] Figure 1 This is a three-dimensional diagram of the front direction of a power supply of the utility model;

[0033] Figure 2 This is a three-dimensional diagram of the bottom surface of a power supply of the utility model;

[0034] Figure 3 This is an exploded view of the front side of a power supply of the utility model;

[0035] Figure 4 It is an exploded view of the bottom surface of a power supply of the utility model;

[0036] Figure 5 This is a three-dimensional diagram of the upper surface direction of a substrate in a power supply of the utility model;

[0037] Figure 6 This is a three-dimensional diagram of the lower surface direction of a substrate in a power supply of the utility model;

[0038] Figure 7 This is a front perspective view of a connection substrate in a power supply embodiment of the utility model;

[0039] Figure 8 This is a bottom perspective view of a connection substrate in a power supply embodiment of the utility model;

[0040] Fig. 9 A three-dimensional diagram of the front direction of an inductor in a power supply embodiment of the utility model;

[0041] Fig.10 It is a three-dimensional diagram of the bottom surface of an inductor in a power supply embodiment of the utility model.

[0042] The above drawings include the following reference numerals:

[0043] 1. substrate; 101. upper surface; 102. lower surface; 103. bottom of the groove; 104. first functional pin pad; 105. second functional pin pad; 106. first electronic component 106; 107. second pad;

[0044] 108, third pad; 109, second electronic component; 2, inductor; 201, pin; 3, connection substrate;

[0045] 301, upper surface of the connecting substrate; 302, lower surface of the connecting substrate; 303, fourth pad; 4, groove. DETAILED DESCRIPTION

[0046] See also Figures 1 to 10 , an embodiment of the utility model provides a power supply, which includes:

[0047] The substrate 1 has an upper surface 101, a lower surface 102 and a groove 4 arranged on the lower surface 102;

[0048] A first electronic component 106, welded on the upper surface 101;

[0049] The second electronic component 109 is disposed in the groove 4, and the vertical distance from one end of the second electronic component 109 away from the groove bottom of the groove 4 to the groove bottom is less than the depth of the groove 4;

[0050] A plurality of first solder pads are disposed on the lower surface 102, and the soldering surfaces of the first solder pads are located on the same plane;

[0051] A plurality of second pads 107 , disposed on the upper surface 101 ;

[0052] The inductor 2 is disposed on the upper surface 101 of the substrate 1 , and the pin 201 of the inductor 2 is soldered to the second solder pad 107 .

[0053] In this embodiment, the power supply is a POL open-board power supply, and the inductor 2 is soldered to the upper surface 101 through the pin 201 and is located above the first electronic component 106; and because the height of the second electronic component 109 is less than the depth of the groove 4, the second electronic component 109 in the groove 4 is lower than the lower surface 102 of the substrate 1, so that no second electronic component 109 protrudes from the lower surface 102, ensuring the coplanarity of the lower surface 102 of the power supply. And the thickness of each first pad on the lower surface 102 is consistent, so the coplanar effect of the terminals on the lower surface 102 can be effectively achieved.

[0054] In one embodiment, the power supply further includes a connection substrate 3 , the second electronic component 109 is soldered to the lower surface 301 of the connection substrate 3 , the groove bottom 103 of the groove 4 is provided with a third soldering pad 108 , and the connection substrate 3 and the third soldering pad 108 are soldered.

[0055] The manufacturing process of this embodiment is as follows:

[0056] In the first step, the main second electronic components 109 are arranged on the upper surface 301 of the connection substrate 3 and soldered;

[0057] In the second step, the lower surface 302 of the connecting substrate 3 is assembled onto the groove bottom 103 of the groove 4, and the fourth pad 303 is welded to the third pad 108;

[0058] In the third step, the first electronic component 106 and the inductor 2 are arranged on the upper surface 101 of the substrate 1 , and the inductor 2 is soldered to the second soldering pad 107 of the substrate 1 through the pin 201 .

[0059] In the above-mentioned production process, SMT surface mounting technology can be used to complete product manufacturing.

[0060] refer to Figure 7 In one embodiment, the side wall of the connection substrate 3 is provided with a fourth solder pad 303, and the connection substrate 3 is soldered to the third solder pad 108 through the fourth solder pad 303. In this embodiment, the fourth solder pad 303 is provided on the side wall, and the connection substrate 3 can be soldered to the third solder pad 108 through the fourth solder pad 303, so that the side creeping solder is formed during tinning, and the specific situation of soldering on the side wall can be easily seen, which helps to increase the reliability of the solder joints after product welding and facilitates the detection of solder joints.

[0061] In another embodiment, a fifth soldering pad is disposed on the upper surface 302 of the connection substrate 3 , and the connection substrate 3 can be soldered to the third soldering pad 108 via the fifth soldering pad.

[0062] In one embodiment, the groove bottom 103 of the groove 4 is provided with a third pad 108, and the second electronic component 109 is welded on the third pad 108. In this embodiment, the second electronic component 109 can be directly welded on the third pad 108. Compared with the above embodiment, the connection substrate 3 is no longer required, thereby further reducing the manufacturing cost.

[0063] In one embodiment, the first pad includes a first function pin pad 104 and a second function pin pad 105. The first function pin pad 104 is used for electrical connection, and the second function pin pad 105 is used for signal transmission.

[0064] In one embodiment, the thickness of each second pad 107 is consistent.

[0065] In one embodiment, the thickness of each first pad is the same, and the thickness of each first pad is 50um-80um.

[0066] From the above content, it can be known that the utility model provides a power supply by setting a groove 4 on the lower surface 102 of the substrate 1 and installing the second electronic component 109 in the groove 4, and the height of the second electronic component 109 is less than the depth of the groove 4, so that the components are only laid out for the upper surface 101 and the groove 4 of the substrate 1, but not for the lower surface 102 of the substrate 1. In addition, by adopting the first soldering pad of the substrate 1 as the product function pin, the copper block terminal is eliminated as the product function pin, so that the first soldering pad of the lower surface 102 can be maintained at the same height, which not only ensures the coplanarity of the product function pin of the lower surface 102, but also effectively improves the welding reliability when used.

[0067] The above are only preferred embodiments of the utility model patent. It should be pointed out that the above preferred embodiments should not be regarded as limitations of the utility model. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the utility model. These improvements and modifications should also be regarded as the protection scope of the utility model. The protection scope of the utility model shall be based on the scope defined by the claims.

Claims

1. A power source, It is characterized in that The power supply comprises: A substrate, the substrate having an upper surface, a lower surface, and a groove arranged on the lower surface; A first electronic component is welded on the upper surface; A second electronic component is disposed in the groove, wherein a vertical distance from an end of the second electronic component away from the groove bottom to the groove bottom is less than a depth of the groove; A plurality of first solder pads are arranged on the lower surface, and the soldering surfaces of the first solder pads are located in the same plane; A plurality of second pads are arranged on the upper surface; The inductor is arranged on the upper surface of the substrate, and the pins of the inductor are welded on the second pad.

2. A power supply according to claim 1, Features: The power supply further includes a connection substrate, the second electronic component is welded to the lower surface of the connection substrate, a third soldering pad is provided at the bottom of the groove, and the connection substrate is welded to the third soldering pad.

3. A power supply according to claim 2, Features: A fourth pad is disposed on the side wall of the connection substrate, and the connection substrate is welded to the third pad via the fourth pad.

4. A power supply according to claim 2, Features: A fifth pad is disposed on the upper surface of the connection substrate, and the connection substrate is welded to the third pad via the fifth pad.

5. A power supply according to claim 1, Features: A third pad is provided at the bottom of the groove, and the second electronic component is welded on the third pad.

6. A power supply according to claim 1, Features: The first pads include a first function pin pad and a second function pin pad.

7. A power supply according to claim 1, Features: The thickness of each of the second pads is consistent.

8. A power supply according to claim 1, Features: The thickness of each of the first pads is the same, and the thickness of each of the first pads is 50um-80um.

9. A power supply according to claim 1, Features: The power supply is a POL open-board power supply.

10. A power source, It is characterized in that The power supply comprises: A substrate, the substrate having an upper surface, a lower surface, and a groove arranged on the lower surface; A first electronic component is welded on the upper surface; A second electronic component is disposed in the groove, and the second electronic component does not extend beyond the groove; A plurality of first solder pads are arranged on the lower surface, and the soldering surfaces of the first solder pads are located in the same plane; A plurality of second pads are arranged on the upper surface; The inductor is arranged on the upper surface of the substrate, and the pins of the inductor are welded on the second pad.

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