Coating machine for coating silicon wafer

Abstract

The utility model discloses a coating machine for coating a silicon wafer, and belongs to the technical field of coating. The coating machine comprises a sample table fixedly arranged on a rack; a leveling mechanism is arranged in a leveling mounting hole of the sample table and comprises a silicon wafer adsorption platform and a six-foot displacement table leveling mechanism, the silicon wafer adsorption platform is located in the leveling mounting hole, an adsorption groove is formed in the upper surface of the silicon wafer adsorption platform, and an opening in the upper end of the adsorption groove is flush with the upper surface of the silicon wafer adsorption platform; the upper end of the six-foot displacement platform leveling mechanism is connected with the silicon wafer adsorption platform and adjusts the silicon wafer adsorption platform, and a coating head of the coating die head is arranged in the width direction of the sample platform. The leveling mechanism is arranged to level the silicon wafer, so that the silicon wafer coating stability is ensured, the silicon wafer coating is more accurate, simpler, more efficient, quicker and more convenient, and the silicon wafer coating efficiency and quality are effectively improved; and the coating effect and the coating quality of the surface of the silicon wafer can be improved by cooperatively using the coating equipment, the positioning mechanism and the detection mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of coating, in particular to a coating machine used for coating silicon wafers. Background Art

[0002] The flat plate coating machine is a machine in which the substrate is fixed by vacuum adsorption on a marble platform, and the gantry drives the slit coating head to make precise movements relative to the substrate. During the movement, after the syringe pump squeezes the solution, the solution is deposited on the substrate from the slit between the precision die heads, thereby forming a film of a certain preset thickness. The coating thickness can be accurately calculated by the liquid flow rate and the substrate movement speed. Its advantages are high coating uniformity, a wide range of applicable solution viscosities, fast coating speed, and large-area coating.

[0003] Currently, there is a new application area for coating machines, namely silicon wafer coating.

[0004] Problems with silicon wafer coating: The size of silicon wafers is small and very thin, generally around 100-300um thick, and the thickness of silicon wafers is uneven. In addition, the shape of silicon wafers (such as (M6, M10)) is irregular, which requires the development of a new coating technology to meet the needs of silicon wafer coating.

[0005] At present, flat panel coating is mainly carried out on float glass substrates with good thickness consistency such as glass. In recent years, the technical direction of perovskite stacked cells has attracted much attention in the industry. Among them, the technical direction of perovskite / crystalline silicon two-electrode stacking has been continuously updated with breakthrough progress, and the efficiency record of small-area laboratory has risen rapidly. The efficiency of small-area devices shows the potential level of efficiency of this technical route, while the size of large-area devices is closer to the industrial-grade product standards. At the same time, the process methods and processing difficulties of large-area devices are much different from those of small-area devices, and more product problems need to be solved from an engineering perspective, so they are more concerned by the industry. The industrial process development of M6-G12 industrial-grade specification batteries requires the development of crystalline silicon coating equipment. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a coating machine for coating silicon wafers.

[0007] The technical solution of the utility model is: a coating machine for silicon wafer coating, comprising:

[0008] frame;

[0009] A sample stage, wherein the sample stage is fixedly arranged on the frame;

[0010] A leveling mechanism, the leveling mechanism is arranged in the leveling installation hole of the sample stage, the leveling mechanism comprises: a silicon wafer adsorption platform and a hexapod displacement stage leveling mechanism, the silicon wafer adsorption platform is located in the leveling installation hole, an adsorption groove is arranged on the upper surface of the silicon wafer adsorption platform, the upper end opening of the adsorption groove is flush with the upper surface of the silicon wafer adsorption platform, at least one adsorption connection hole is arranged in the adsorption groove, and the adsorption connection hole is connected to the vacuum component; the upper end of the hexapod displacement stage leveling mechanism is connected to the silicon wafer adsorption platform and adjusts the silicon wafer adsorption platform, and the lower end of the hexapod displacement stage leveling mechanism is fixedly arranged; and

[0011] The coating mechanism comprises a first movable unit arranged along the length direction of the sample stage, a second movable unit arranged on the first movable unit along the vertical direction, a coating die head arranged on the second movable unit, and a coating head of the coating die head arranged along the width direction of the sample stage.

[0012] Furthermore, a coating mask plate is arranged on the working surface of the sample stage, a working hole is arranged on the coating mask plate, and the working hole is arranged in coordination with the leveling installation hole, that is, the working hole is located above the leveling installation hole.

[0013] Furthermore, the working hole is higher than the silicon wafer adsorption platform, and the upper surface of the silicon wafer is flush with the upper surface of the coating mask plate. That is, the silicon wafer is placed on the silicon wafer adsorption platform, and the silicon wafer is located in the working hole, and the surface of the silicon wafer is flush with the surface of the coating mask plate, ensuring the coating effect of the silicon wafer.

[0014] Furthermore, a positioning mechanism is also provided on the side of the sample stage, and the positioning mechanism includes at least two positioning cylinders located on two adjacent sides of the sample stage, the telescopic rods of the positioning cylinders are vertically arranged upward, and positioning wheels are rotatably arranged at the ends of the telescopic rods. At least one positioning cylinder is provided on each side.

[0015] Furthermore, a detection sensor is also arranged on the coating die head to test the levelness of the upper surface of the silicon wafer, so as to facilitate the coating.

[0016] Furthermore, two groups of the first moving units are arranged in parallel and are symmetrically distributed on both sides of the sample stage.

[0017] Furthermore, two groups of second moving units are provided, and are respectively provided on both sides of the coating die head, so as to ensure the stable movement of the coating die head during the coating process.

[0018] Furthermore, the first movable unit and the second movable unit adopt any one of a pneumatic cylinder, an electric cylinder, a screw assembly, and a linear module.

[0019] Furthermore, the adsorption grooves are arranged in a continuous pattern and are evenly distributed at the center and around the upper surface of the silicon wafer adsorption platform.

[0020] Furthermore, the adsorption groove is arranged in a rectangular shape around the periphery, and at least one circle is arranged inside the rectangle, and the circle and the rectangle are connected through a connecting groove arranged along the radial direction of the circle. That is, the adsorption effect around the periphery and the center is guaranteed, and the stable adsorption of the silicon wafer is guaranteed to avoid damage to the silicon wafer.

[0021] Further, the center of the circle is set at the center of the rectangle.

[0022] Furthermore, at least two circles are provided and arranged in concentric circles, so as to ensure the stability of adsorption.

[0023] Furthermore, the adsorption connection hole is connected to the vacuum component through an adsorption air nozzle.

[0024] Furthermore, the vacuum component is a vacuum pump or a negative pressure pump.

[0025] The beneficial technical effect of the utility model is as follows: by setting a leveling mechanism to level the silicon wafer, the stability of the silicon wafer coating is ensured, the silicon wafer coating is made more accurate, simple and efficient, quick and convenient, and the efficiency and quality of the silicon wafer coating are effectively improved; the use of coating equipment, positioning mechanism and detection mechanism in combination can improve the coating effect and coating quality of the silicon wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an overall schematic diagram of a coating machine used for coating silicon wafers.

[0027] Figure 2 It is a schematic diagram of coating work.

[0028] Figure 3 It is a schematic diagram of the detection sensor when it is working.

[0029] Figure 4 is a schematic diagram of the sample stage.

[0030] Figure 5 This is a schematic diagram of the sample stage adjustment.

[0031] Figure 6 It is a schematic diagram of the silicon wafer adsorption platform.

[0032] Figure 7 yes Figure 6 A partial enlarged view of .

[0033] in:

[0034] 1. Sample stage,

[0035] 2. Level the mounting holes.

[0036] 3. Silicon wafer adsorption platform, 31. Adsorption groove, 32. Adsorption connection hole, 33. Adsorption air nozzle,

[0037] 4. Hexapod leveling mechanism,

[0038] 5. Coating mask plate,

[0039] 6. Working hole,

[0040] 7. Rack,

[0041] 8. Coating mechanism, 81. First moving unit, 82. Second moving unit, 83. Coating die head,

[0042] 9. Positioning mechanism, 91. Positioning cylinder, 92. Positioning wheel,

[0043] 10. Detection sensor. DETAILED DESCRIPTION

[0044] In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the specific implementation methods of the utility model are further described in detail below in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model.

[0045] See attached Figure 1-7 As shown, the coating machine for silicon wafer coating of this embodiment includes:

[0046] Rack 7;

[0047] A sample stage 1, wherein the sample stage 1 is fixedly arranged on a frame 7;

[0048] A leveling mechanism, the leveling mechanism is arranged in the leveling mounting hole 2 of the sample stage 1, and the leveling mechanism includes: a silicon wafer adsorption platform 3 and a hexapod displacement stage leveling mechanism 4, the silicon wafer adsorption platform 3 is located in the leveling mounting hole 2, an adsorption groove 31 is arranged on the upper surface of the silicon wafer adsorption platform 3, the upper end opening of the adsorption groove 31 is flush with the upper surface of the silicon wafer adsorption platform 3, at least one adsorption connection hole 32 is arranged in the adsorption groove 31, and the adsorption connection hole 32 is connected to the vacuum component; the upper end of the hexapod displacement stage leveling mechanism 4 is connected to the silicon wafer adsorption platform 3 and adjusts the silicon wafer adsorption platform 3, and the lower end of the hexapod displacement stage leveling mechanism 4 is fixedly arranged; and

[0049] The coating mechanism 8 includes a first movable unit 81 arranged along the length direction of the sample stage 1, a second movable unit 82 is arranged on the first movable unit 81 along the vertical direction, a coating die 83 is arranged on the second movable unit 82, and the coating head of the coating die 83 is arranged along the width direction of the sample stage 1.

[0050] Furthermore, a coating mask plate 5 is disposed on the working surface of the sample stage 1 , and a working hole 6 is disposed on the coating mask plate 5 , and the working hole 6 is disposed in coordination with the leveling installation hole 2 , that is, the working hole 6 is located above the leveling installation hole 2 .

[0051] Furthermore, the working hole 6 is higher than the silicon wafer adsorption platform 3, and the upper surface of the silicon wafer is flush with the upper surface of the coating mask plate 5. That is, the silicon wafer is placed on the silicon wafer adsorption platform 3, and the silicon wafer is located in the working hole 6, and the surface of the silicon wafer is flush with the surface of the coating mask plate 5, ensuring the coating effect of the silicon wafer.

[0052] Furthermore, a positioning mechanism 9 is also provided on the side of the sample stage 1, and the positioning mechanism 9 includes at least two positioning cylinders 91 located on two adjacent sides of the sample stage 1, and the telescopic rods of the positioning cylinders 91 are vertically arranged upward, and a positioning wheel 92 is rotatably arranged at the end of the telescopic rod. At least one positioning cylinder 91 is provided on each side.

[0053] Furthermore, a detection sensor 10 is also provided on the coating die head 83. The detection sensor 10 tests the levelness of the upper surface of the silicon wafer to facilitate coating.

[0054] Furthermore, two groups of the first moving units 81 are arranged in parallel and symmetrically distributed on both sides of the sample stage 1 .

[0055] Furthermore, two groups of second moving units 82 are provided, and are respectively provided on both sides of the coating die head 83. This ensures that the coating die head 83 moves stably during the coating process.

[0056] Furthermore, the first movable unit 81 and the second movable unit 82 are any one of a pneumatic cylinder, an electric cylinder, a screw assembly, and a linear module.

[0057] Furthermore, the adsorption grooves 31 are arranged in a continuous pattern and are evenly distributed at the center and around the upper surface of the silicon wafer adsorption platform 3 .

[0058] Furthermore, the adsorption groove 31 is arranged in a rectangular shape around the periphery, and at least one circle is arranged inside the rectangle, and the circle and the rectangle are connected through a connecting groove arranged along the radial direction of the circle. That is, the adsorption effect around the periphery and the center is guaranteed, and the stable adsorption of the silicon wafer is guaranteed to avoid damage to the silicon wafer.

[0059] Further, the center of the circle is set at the center of the rectangle.

[0060] Furthermore, at least two circles are provided and arranged in concentric circles, so as to ensure the stability of adsorption.

[0061] Furthermore, the adsorption connection hole 32 is connected to the vacuum component through the adsorption air nozzle 33 .

[0062] Furthermore, the vacuum component is a vacuum pump or a negative pressure pump.

[0063] By setting up a leveling mechanism to level the silicon wafer, the stability of the silicon wafer coating is ensured, making the silicon wafer coating more accurate, simple, efficient, quick and convenient, and effectively improving the efficiency and quality of the silicon wafer coating; the use of coating equipment, positioning mechanism 9, and detection mechanism can be used to check the coating effect and coating quality on the silicon wafer surface.

[0064] The specific usage method is to set the coating mask plate on the sample table through the positioning mechanism. At this time, the working hole and the leveling installation hole are set correspondingly; the cut silicon wafer is placed in the leveling installation hole and adsorbed through the adsorption groove, and adjusted through the hexapod displacement stage leveling mechanism to make the upper surface of the silicon wafer level with the surface of the coating mask plate. After the detection sensor completes the detection, the coating mechanism officially starts coating and evenly coats the surface of the silicon wafer.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A coating machine for coating silicon wafers, characterized in that: include: Frame (7); A sample stage (1), wherein the sample stage (1) is fixedly arranged on a frame (7); A leveling mechanism, the leveling mechanism being arranged in a leveling mounting hole (2) of a sample stage (1), the leveling mechanism comprising: a silicon wafer adsorption platform (3) and a hexapod leveling mechanism (4), the silicon wafer adsorption platform (3) being arranged in the leveling mounting hole (2), an adsorption groove (31) being arranged on the upper surface of the silicon wafer adsorption platform (3), the upper end opening of the adsorption groove (31) being flush with the upper surface of the silicon wafer adsorption platform (3), at least one adsorption connection hole (32) being arranged in the adsorption groove (31), the adsorption connection hole (32) being connected to a vacuum component; the upper end of the hexapod leveling mechanism (4) being connected to the silicon wafer adsorption platform (3) and adjusting the silicon wafer adsorption platform (3), the lower end of the hexapod leveling mechanism (4) being fixedly arranged; and A coating mechanism (8), the coating mechanism (8) comprising a first movable unit (81) arranged along the length direction of a sample stage (1), a second movable unit (82) arranged on the first movable unit (81) along the vertical direction, a coating die head (83) arranged on the second movable unit (82), and a coating head of the coating die head (83) arranged along the width direction of the sample stage (1).

2. The coating machine for silicon wafer coating according to claim 1, characterized in that: A coating mask plate (5) is arranged on the working surface of the sample stage (1), and a working hole (6) is arranged on the coating mask plate (5), and the working hole (6) is arranged in coordination with the leveling installation hole (2).

3. The coating machine for silicon wafer coating according to claim 2, characterized in that: The working hole (6) is higher than the silicon wafer adsorption platform (3), and the upper surface of the silicon wafer is flush with the upper surface of the coating mask plate (5).

4. The coating machine for coating silicon wafers according to claim 1, characterized in that: A positioning mechanism (9) is also provided on the side of the sample stage (1), and the positioning mechanism (9) comprises at least two positioning cylinders (91) located on two adjacent sides of the sample stage (1), the telescopic rods of the positioning cylinders (91) are arranged vertically upward, and a positioning wheel (92) is rotatably arranged at the end of the telescopic rod.

5. The coating machine for coating silicon wafers according to claim 1, characterized in that: A detection sensor (10) is also arranged in front of the coating die head (83).

6. The coating machine for silicon wafer coating according to claim 1, characterized in that: The adsorption grooves (31) are arranged in a continuous pattern and are evenly distributed at the center and around the upper surface of the silicon wafer adsorption platform (3).

7. The coating machine for coating silicon wafers according to claim 6, characterized in that: The adsorption groove (31) is arranged in a rectangular shape on all sides, at least one circle is arranged inside the rectangle, and the circle and the rectangle are connected via a connecting groove arranged along the radial direction of the circle.

8. The coating machine for silicon wafer coating according to claim 1, characterized in that: The adsorption connection hole (32) is connected to the vacuum component via an adsorption air nozzle (33).

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