Packaging device for diode production

Abstract

The utility model discloses a packaging device for diode production, which comprises an injection mold and is characterized in that the outer contour of the injection mold is rectangular, a plurality of injection cavities are arranged in the injection mold at equal intervals, pin grooves are arranged on two sides of the injection cavities, and the pin grooves are connected with the injection mold. The pin grooves extend to the left side and the right side of the injection mold and communicate with the outside, a material preparation table is arranged at one end of the injection mold in the arrangement direction of the injection cavities, a detachable discharging frame is arranged at the other end of the injection mold, distributing devices are arranged on the two sides of the injection mold, and a motor for driving the distributing devices is arranged on one side of the injection mold. Compared with the prior art, the diode packaging device has the advantages that automatic feeding and discharging into the packaging injection mold can be realized, manual contact with the mold is not needed, the operation safety is improved, diodes to be packaged can be more accurately stacked in the packaging injection mold by using the diode packaging device, and the quality of injection molding finished products is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to a packaging device for diode production. Background Art

[0002] The diode package injection molding machine is a device used to produce diode packages. The diode package is a shell that protects the diode chip and leads. Its working principle is to heat the plastic particles to a molten state and then inject them into the mold through a syringe to form the desired package shape.

[0003] Due to the characteristics of the diode's contour shape, it is necessary to manually stack them one by one in the injection molding mold during the packaging operation. In the actual production process, in order to ensure the output, the mold still has residual heat from the previous round of production during the manual stacking process. Manual operation has certain safety hazards. At the same time, manual stacking may cause the diode to be crooked, resulting in a deformed appearance of the final packaged product. Utility Model Content

[0004] The technical problem to be solved by the utility model is that the existing diode packaging has certain artificial safety hazards and the packaging quality is unstable. A packaging device for diode production is provided.

[0005] In order to solve the above technical problems, the technical solution provided by the utility model is: a packaging device for diode production, which includes an injection mold, the outer contour of the injection mold is set to a rectangle, a plurality of injection cavities are arranged equidistantly in the injection mold, pin grooves are provided on both sides of the injection cavity, the pin grooves extend to the left and right sides of the injection mold and are connected to the outside, a material preparation table is provided at one end of the injection mold along the arrangement direction of the injection cavity, a detachable discharge frame is provided at the other end of the injection mold, distributors are provided on both sides of the injection mold, and a motor for driving the distributor is provided on one side of the injection mold.

[0006] Furthermore, one end of the distributor extends to the material preparation table, and the other end of the distributor extends to the discharge frame. A plurality of clamping grooves are arranged on the top of the distributor. The spacing between the clamping grooves is matched with the spacing between the injection cavities. The pins at both ends of the diode are clamped by the clamping grooves. Extension rods extending downward are provided at both ends of the distributor for easy connection with the sprocket.

[0007] Furthermore, the injection mold is provided with sprocket brackets connected to the bottom of both sides of the distributor, both ends of the sprocket bracket extend to the bottom end of the extension rod, both ends of the sprocket bracket are rotatably connected to sprockets, an eccentric bearing is provided on the surface of the sprocket facing the extension rod, the distance between the eccentric bearing and the sprocket rotating axis is half of the injection cavity distance, a through hole is provided at the bottom end of the extension rod, and a connecting rod is commonly connected between the sprockets on both sides of the injection mold, the connecting rod passes through the through holes at the bottom ends of the extension rods on both sides of the injection mold and is respectively connected to the eccentric bearings on both sides, when the sprocket rotates, it drives the distributor to move synchronously, the clamping groove clamps the diode pin and moves it from one injection cavity to the next adjacent injection cavity, thereby transporting the diode.

[0008] Furthermore, the sprockets on both sides of the sprocket bracket are meshed with a chain to make the sprockets on both sides rotate synchronously, and the motor is electrically driven to drive the sprocket, and the driving sprocket is meshed with the chain to be electrically driven.

[0009] Furthermore, auxiliary fixing platforms are provided on both sides of the injection mold, and fixing grooves matching the pin grooves are provided on the top of the auxiliary fixing platforms. A cavity is provided between the auxiliary fixing platforms and the injection mold, and the distributor is provided through the cavity to assist in fixing the diode during injection molding.

[0010] Furthermore, a plurality of preparation slots are arranged on the top of the preparation table, the intervals between the preparation slots are equal to the intervals between the injection cavities, an outer edge is arranged around the top of the discharge frame, and a support frame is arranged at one end of the discharge frame of the injection mold, and the discharge frame is arranged at the center of the support frame by snapping the outer edge, so as to facilitate the collection of the packaged diodes.

[0011] The advantages of the utility model compared with the prior art are: the device can realize automatic feeding and discharging of materials into the encapsulation injection mold without manual contact with the mold, thereby improving the operation safety; at the same time, the use of the device can make the stacking of the diodes to be encapsulated in the encapsulation injection mold more accurate, thereby improving the quality of the injection molded products. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The present invention is a schematic diagram of the structure of a packaging device used in diode production.

[0013] Figure 2 The present invention is a schematic diagram of the structure of a packaging device distributor for diode production.

[0014] Figure 3 The present invention is a schematic diagram of the structure of a sprocket of a packaging device used in diode production.

[0015] Figure 4 The present invention is a structural schematic diagram of a discharging frame of a packaging device used in diode production.

[0016] As shown in the figure: 1. injection mold, 2. material preparation table, 3. discharge frame, 4. distributor, 5. auxiliary fixing table, 6. motor, 7. injection cavity, 8. pin groove, 9. material preparation groove, 10. material clamping groove, 11. fixing groove, 12. cavity, 13. extension rod, 14. sprocket bracket, 15. sprocket, 16. chain, 17. connecting rod, 18. through hole, 19. eccentric bearing, 20. driving sprocket, 21. support frame, 22. outer edge. DETAILED DESCRIPTION

[0017] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0018] Combined with Figure 1-4 A packaging device for diode production, comprising an injection mold 1, wherein the outer contour of the injection mold 1 is set to a rectangle, a plurality of injection cavities 7 are arranged equidistantly in the injection mold 1, pin grooves 8 are arranged on both sides of the injection cavity 7, the pin grooves 8 extend to the left and right sides of the injection mold 1 and are connected to the outside, a material preparation table 2 is provided at one end of the injection mold 1 along the arrangement direction of the injection cavity 7, a detachable discharge frame 3 is provided at the other end of the injection mold 1, distributors 4 are provided on both sides of the injection mold 1, and a motor 6 for driving the distributor 4 is provided on one side of the injection mold 1.

[0019] Auxiliary fixing tables 5 are provided on both sides of the injection mold 1. A fixing groove 11 matching the pin groove 8 is provided on the top of the auxiliary fixing table 5. A cavity 12 is provided between the auxiliary fixing table 5 and the injection mold 1. The distributor 4 is provided through the cavity 12. One end of the distributor 4 extends to the material preparation table 2, and the other end of the distributor 4 extends to the discharge frame 3. A plurality of clamping grooves 10 are arranged on the top of the distributor 4. The spacing of the clamping grooves 10 matches the spacing of the injection cavity 7. Extension rods 13 extending downward are provided at both ends of the distributor 4.

[0020] according to Figure 3 As shown, the injection mold 1 is provided with sprocket brackets 14 connected to the bottom of both sides of the distributor 4, and both ends of the sprocket bracket 14 extend to the bottom end of the extension rod 13, and both ends of the sprocket bracket 14 are rotatably connected to sprockets 15. An eccentric bearing 19 is arranged on the surface of the sprocket 15 facing the extension rod 13, and the distance between the eccentric bearing 19 and the rotating axis of the sprocket 15 is half of the distance between the injection cavity 7. A through hole 18 is arranged at the bottom end of the extension rod 13, and a connecting rod 17 is commonly connected between the sprockets 15 located on both sides of the injection mold 1, and the connecting rod 17 passes through the through holes 18 at the bottom ends of the extension rods 13 on both sides of the injection mold 1 and is respectively connected to the eccentric bearings 19 on both sides.

[0021] The sprockets 15 on both sides of the sprocket bracket 14 are meshed together to set the chain 16, and the motor 6 is electrically driven to set the driving sprocket 20, and the driving sprocket 20 is meshed with the chain 16. When the motor 6 is started, the driving sprocket 20 drives the sprocket 15 to rotate through the chain 16, and the sprocket 15 drives the extension rod 13 through the eccentric bearing 19 to make the distributor 4 move synchronously, wherein the clamping groove 10 on the top of the distributor 4 rotates relative to the pin groove 8 with the midpoint between the pin grooves 8 as the center of the circle and half of the spacing between the pin grooves 8 as the radius, and the clamping groove 10 can clamp the pins on both sides of the diode from one pin groove 8 to the next pin groove 8, and successively convey the diodes to be packaged into the mold step by step, and at the same time convey the packaged diodes to the discharge frame 3.

[0022] A plurality of preparation slots 9 are arranged on the top of the preparation table 2, and the intervals between the preparation slots 9 are equal to the intervals between the injection cavities 7. An outer edge 22 is arranged around the top of the discharge frame 3. The injection mold 1 is provided with a support frame 21 at one end of the discharge frame 3, and the discharge frame 3 is buckled with the support frame 21 through the outer edge 22.

[0023] During the specific implementation of the utility model, the staff stacks the diodes to be injected on the material preparation slot 9 of the material preparation table 2, starts the motor 6 to transport the materials on the material preparation table 2 to the injection cavity 7 in the injection mold 1, and stops the motor 6 when the injection cavity 7 is filled with materials, closes the injection mold 1 to start injection packaging, opens the injection mold 1 after the packaging is formed, and starts the motor 6, and the packaged diodes are moved out of the injection mold 1 by the distributor 4, piled on the top of the discharge frame 3 and fall into the discharge frame 3. .

[0024] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A packaging device for diode production, comprising an injection mold (1), Features: The outer contour of the injection mold (1) is arranged in a rectangular shape. A plurality of injection cavities (7) are arranged in an equidistant manner in the injection mold (1). Pin grooves (8) are arranged on both sides of the injection cavities (7). The pin grooves (8) extend to the left and right sides of the injection mold (1) and are connected to the outside. A material preparation table (2) is arranged at one end of the injection mold (1) along the arrangement direction of the injection cavities (7). A detachable discharge frame (3) is arranged at the other end of the injection mold (1). Distributors (4) are arranged on both sides of the injection mold (1). A motor (6) for driving the distributor (4) is arranged on one side of the injection mold (1).

2. A packaging device for diode production according to claim 1, Features: One end of the distributor (4) extends to the material preparation table (2), and the other end of the distributor (4) extends to the material discharge frame (3). A plurality of material clamping grooves (10) are arranged on the top of the distributor (4), and the spacing of the material clamping grooves (10) is arranged to match the spacing of the injection molding cavities (7). Extension rods (13) extending downward are provided at both ends of the distributor (4).

3. A packaging device for diode production according to claim 2, Features: The injection mold (1) is provided with a distributor (4) at both bottom ends thereof, and sprocket brackets (14) are connected thereto. Both ends of the sprocket brackets (14) extend to the bottom end of the extension rod (13). Both ends of the sprocket brackets (14) are rotatably connected thereto with sprockets (15). An eccentric bearing (19) is provided on the surface of the sprocket (15) facing the extension rod (13). The distance between the eccentric bearing (19) and the rotation axis of the sprocket (15) is half the distance between the injection cavity (7). A through hole (18) is provided at the bottom end of the extension rod (13). A connecting rod (17) is connected thereto between the sprockets (15) located on both sides of the injection mold (1). The connecting rod (17) passes through the through holes (18) at the bottom ends of the extension rods (13) on both sides of the injection mold (1) and is respectively connected to the eccentric bearings (19) on both sides.

4. A packaging device for diode production according to claim 3, Features: The sprockets (15) on both sides of the sprocket bracket (14) are meshed with a chain (16), and the motor (6) electrically drives a driving sprocket (20), and the driving sprocket (20) is meshed with the chain (16).

5. A packaging device for diode production according to claim 1, Features: Auxiliary fixing platforms (5) are provided on both sides of the injection mold (1), a fixing groove (11) matching the pin groove (8) is provided on the top of the auxiliary fixing platform (5), a cavity (12) is provided between the auxiliary fixing platform (5) and the injection mold (1), and the distributor (4) is provided through the cavity (12).

6. A packaging device for diode production according to claim 1, Features: A plurality of material preparation troughs (9) are arranged on the top of the material preparation platform (2), and the intervals between the material preparation troughs (9) are equal to the intervals between the injection cavities (7). An outer edge (22) is arranged around the top of the discharge frame (3). The injection mold (1) is provided with a support frame (21) at one end of the discharge frame (3), and the discharge frame (3) is arranged at the center of the support frame (21) by snapping the outer edge (22).

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