Plate limiting device for electroplating processing

Abstract

The utility model provides a plate limiting device for electroplating processing, which relates to the technical field of electroplating processing and comprises a base, rollers and symmetrically distributed fixing rods are arranged on the base, a mounting plate is arranged at one end of each fixing rod, a connecting roller is rotatably connected in the mounting plate, and a driving component is arranged on the mounting plate. The driving assembly is connected with a connecting roller, one end of the connecting roller penetrates through the mounting plate and is connected with an air cylinder, the air cylinder is connected with a porous placing box, a plurality of partition plates are arranged in the porous placing box at intervals, and a porous baffle is matched with the porous placing box; according to the device, the placing and taking processes before and after plate electroplating are more convenient, the plates only need to be independently stored one by one and then matched with the porous baffle for top limiting, discharging can be achieved after the porous baffle is taken down subsequently, operation is easy, it is guaranteed that the plates cannot be separated from the porous placing box in the electroplating process, and multiple plates are machined and electroplated at a time; and the electroplating effect of the plate is uniform, and the efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating processing, in particular to a plate limiting device for electroplating processing. Background Art

[0002] Electroplating is not unfamiliar to us. We often use electroplated products in our daily life. As the name implies, electroplating is a surface processing method that uses electrolysis to deposit the cations of pre-plated metals in the plating solution on the surface of the base metal to form a coating. This coating gives the plate new features, such as protective, functional and decorative properties.

[0003] However, there are also some problems in the electroplating process. The common electroplating method is to place the plate directly in the electroplating solution. In this process, the uniformity of the electroplating cannot be effectively guaranteed. In addition, the common electroplating method is to electroplate one time at a time, which is inefficient.

[0004] Announcement No. CN212451703U proposes a flip-type plate limiting device for electroplating processing. The structure realizes the up and down change of the position of the support plate through an electric telescopic rod, thereby driving the limiting device connected to the lower end to move up and down through the support plate, that is, the electrolysis of the plated plate is realized, and the limiting device is driven to rotate by the operation of the motor, thereby realizing the rotation of the plated plate, which facilitates the plated plate to better contact with the solution; however, the device is not fast enough for placing and removing the plate before and after electroplating, and the limiting pins need to be pulled one by one to realize the limited installation and subsequent disassembly of the plate, and the convenience of operation needs to be improved. Utility Model Content

[0005] The purpose of the utility model is to solve the problems raised in the above background technology, and then propose a plate limiting device for electroplating processing.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A plate limiting device for electroplating processing includes a base, on which rollers and symmetrically distributed fixing rods are arranged, one end of the fixing rod is provided with a mounting plate, a connecting roller is rotatably connected in the mounting plate, and a driving assembly is arranged on the mounting plate, the driving assembly is connected to the connecting roller, and one end of the connecting roller passes through the mounting plate and is connected to a cylinder, the cylinder is connected to a porous placement box, a plurality of partition plates are arranged at intervals in the porous placement box, and the porous placement box is matched with a porous baffle.

[0008] This device is more convenient for the placement and retrieval process of the plates before and after electroplating. The plates only need to be stored separately one by one and then limited on the top with the porous baffle. The porous baffle can be removed later to discharge the materials. The operation is simple and ensures that the plates will not leave the porous placement box during the electroplating process. Multiple plates can be electroplated at one time, and the electroplating effect of the plates is uniform and the efficiency is improved.

[0009] Furthermore, the porous placement box is symmetrically provided with card slots, and the porous baffle is provided with card blocks which correspond to the card slots one by one and cooperate with each other.

[0010] The above scheme can limit the plate inside the porous placement box with the help of a porous baffle through the cooperation of the card slot and the card block, thereby preventing the plate from escaping from the porous placement box and flowing into the electroplating pool during the electroplating process. At the same time, the porous baffle does not affect the inflow and outflow of the electroplating solution.

[0011] Furthermore, the driving assembly includes a servo motor, a main gear and a sub gear. The mounting plate is provided with a servo motor, the servo motor is connected with the main gear, and the main gear is meshed with the sub gear provided on the connecting roller.

[0012] Furthermore, a locking buckle is provided on the roller.

[0013] Furthermore, the partition plate is a porous plate.

[0014] In the above scheme, the use of a porous plate as the partition plate can improve the fluidity of the electroplating solution in the porous placement box, further improving the electroplating effect of the plate.

[0015] Furthermore, a reinforcing plate is provided at the connection between the fixing rod and the base.

[0016] The above solution improves the load-bearing strength of the fixing rod by reinforcing the plate, so that multiple plates can be electroplated stably at one time.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] Compared with the prior art, the device is more convenient for the placement and retrieval process of the plates before and after electroplating through the mutual cooperation of the base, fixed rod, mounting plate, connecting roller, driving assembly, cylinder, porous placement box, partition plate and porous baffle. The plates only need to be stored independently one by one and then limit the top with the porous baffle. The porous baffle can be removed later to discharge the materials. The operation is simple and it ensures that the plates will not leave the porous placement box during the electroplating process. Multiple plates can be electroplated at one time, and the electroplating effect of the plates is uniform and the efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the installation of a porous baffle;

[0021] Figure 3 This is a schematic diagram of the coordination between the device and the electroplating cell;

[0022] Reference numerals:

[0023] 1. Base; 11. Roller; 12. Fixing rod; 13. Mounting plate; 14. Connecting roller; 21. Servo motor; 22. Main gear; 23. Sub gear; 24. Cylinder; 3. Multi-hole placement box; 31. Partition plate; 32. Card slot; 33. Multi-hole baffle; 34. Card block; 4. Electroplating tank. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. The utility model is further described in combination with the drawings and embodiments:

[0025] like Figures 1 to 3 As shown, a plate limiting device for electroplating processing includes a base 1, a plurality of rollers 11 and symmetrically distributed fixing rods 12 are arranged on the base 1, a locking buckle is arranged on the roller 11, the locking buckle is shown in the figure but not numbered, a mounting plate 13 is arranged at one end of the fixing rod 12, a connecting roller 14 is rotatably connected to the mounting plate 13 through a bearing, and a driving component is arranged on the mounting plate 13, the driving component is connected to the connecting roller 14, and one end of the connecting roller 14 passes through the mounting plate 13 and is connected to a cylinder 24, the cylinder 24 is connected to a porous placement box 3, and a plurality of partitions are arranged at intervals in the porous placement box 3. The plate 31 and the porous placing box 3 are equipped with a porous baffle 33. Specifically, the porous placing box 3 is symmetrically provided with card slots 32, and the porous baffle 33 is provided with card blocks 34 which correspond to the card slots 32 one by one and cooperate with each other. Through the cooperation of the card slots 32 and the card blocks 34, the porous baffle 33 can be used to limit the plate inside the porous placing box 3 to avoid the situation where the plate separates from the porous placing box 3 and flows into the electroplating pool 4 during the electroplating process. At the same time, the porous baffle 33 does not affect the entry and exit of the electroplating solution; in addition, it also includes the electroplating pool 4, and the porous placing box 3 is located directly above the electroplating pool 4.

[0026] Further refinement of the embodiment of the present utility model is as follows: Figure 1 and Figure 3As shown, the driving assembly includes a servo motor 21 , a main gear 22 and a sub gear 23 . The servo motor 21 is disposed on the mounting plate 13 . The servo motor 21 is connected to the main gear 22 . The main gear 22 meshes with the sub gear 23 disposed on the connecting roller 14 .

[0027] It should be noted that the servo motor 21 and the cylinder 24 are both electrically connected to the controller, which is not shown in the figure.

[0028] The workflow of this utility model:

[0029] First, push the device to move to one side of the electroplating pool 4, and then stop the device through the locking buckle. Before stopping, ensure that the porous placement box 3 is in the area directly above the electroplating pool 4. This design makes the device more flexible and can be transferred and used according to the needs of different electroplating metal layers. In the initial state, the cylinder 24 is in a retracted state. At this time, a number of plates can be placed in the porous placement box 3. The plates are not shown in the figure. The plates are separated by the partition plate 31 and will not touch each other. When all the plates are placed, the porous baffle 33 is installed above the porous placement box 3 through the cooperation of the card slot 32 and the card block 34. After the porous baffle 33 is installed, the controller controls the cylinder 24 to extend so that the porous placement box 3 is completely immersed in the electroplating solution. At this time, the electroplating solution will flow into the porous placement box 3 from multiple directions. When the plate is completely immersed, the controller immediately powers on the electroplating pool 4, and the electroplating process of the plate can be started. As the electroplating process progresses, the controller controls the servo motor 21 to work. After the servo motor 21 works, it cooperates with the gear rotation to To realize the rotation of the porous placing box 3, it should be noted that the porous placing box 3 will not contact the inner wall of the electroplating pool 4 during the rotation process. At this time, several plates in the porous placing box 3 can move at the same time to make the electroplating more uniform. When the electroplating is completed, the controller controls the cylinder 24 to contract so that the porous placing box 3 discharges liquid, and controls the servo motor 21 to stop working. As the porous placing box 3 discharges liquid, the electroplating liquid inside it will naturally flow out. Then, after draining the plates for a period of time, the porous baffle 33 can be removed. The plates are then removed and discharged, and a new round of plate limiting electroplating process can be restarted after all the plates have been discharged. Compared with the prior art, the device is more convenient for the placement and retrieval process before and after plate electroplating. It only requires the plates to be stored independently one by one and then limited at the top with the porous baffle 33. The porous baffle 33 can be removed later for discharge. The operation is simple and ensures that the plates will not leave the porous placement box 3 during the electroplating process. Multiple plates can be electroplated at one time, and the electroplating effect of the plates is uniform and the efficiency is improved.

[0030] In some embodiments, the partition plate 31 is a porous plate. In this embodiment, the partition plate 31 is a porous plate, which can make the fluidity of the electroplating solution in the porous placement box 3 better, further improving the electroplating effect of the plate.

[0031] In other embodiments, a reinforcing plate is provided at the connection between the fixing rod 12 and the base 1, and the reinforcing plate is not shown in the figure; this embodiment improves the load-bearing strength of the fixing rod 12 by the reinforcing plate, so that multiple plates can be stably electroplated at one time.

[0032] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. A plate limiting device for electroplating processing, characterized in that: The invention comprises a base (1), on which a roller (11) and symmetrically distributed fixing rods (12) are arranged, one end of the fixing rod (12) is arranged with a mounting plate (13), a connecting roller (14) is rotatably connected in the mounting plate (13), and a driving assembly is arranged on the mounting plate (13), the driving assembly is connected to the connecting roller (14), and one end of the connecting roller (14) passes through the mounting plate (13) and is connected to a cylinder (24), the cylinder (24) is connected to a porous placement box (3), a plurality of partition plates (31) are arranged at intervals in the porous placement box (3), and a porous baffle (33) is matched on the porous placement box (3).

2. A plate limiting device for electroplating processing according to claim 1, characterized in that: The porous placement box (3) is symmetrically provided with card slots (32), and the porous baffle (33) is provided with card blocks (34) which correspond to the card slots (32) one by one and cooperate with each other.

3. A plate limiting device for electroplating processing according to claim 1, characterized in that: The driving assembly comprises a servo motor (21), a main gear (22) and a sub gear (23); the servo motor (21) is arranged on the mounting plate (13); the servo motor (21) is connected to the main gear (22); the main gear (22) is meshed with the sub gear (23) arranged on the connecting roller (14).

4. A plate limiting device for electroplating processing according to claim 1, characterized in that: The roller (11) is provided with a locking buckle.

5. The plate limiting device for electroplating processing according to claim 1, characterized in that: The partition plate (31) is a porous plate.

6. A plate limiting device for electroplating processing according to claim 1, characterized in that: A reinforcing plate is provided at the connection between the fixing rod (12) and the base (1).

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