Auxiliary structure for electroplating sealing

Abstract

The utility model relates to the technical field of wafer electroplating equipment, in particular to an auxiliary structure for electroplating sealing, which comprises a machine table and a sealing rubber ring, and one end of the sealing rubber ring is used for abutting against a wafer photoresist layer; a bracket is further arranged on the lower side of the machine table, diameter shrinkage frames are movably arranged on the bracket and used for abutting against the sealing rubber ring so that the sealing rubber ring can deform towards the inner side in the radial direction, and the multiple diameter shrinkage frames are evenly distributed in the circumferential direction of the sealing rubber ring. Compared with the prior art, the utility model has the following effects: when the wafer is placed in the operation table, the diameter-reducing frame abuts against the sealing rubber ring, the diameter-reducing frame is directly driven or is linked with other structures, so that the edge of the sealing rubber ring moves towards the circle center side, and the edge of the sealing rubber ring can be in contact with the edge of the photoresist layer to form an intact sealing structure; and the electroplating effect is improved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer electroplating equipment, and in particular to an auxiliary structure for electroplating sealing. Background Art

[0002] When placing the wafer electroplating equipment, it is usually necessary to ensure that the surface of the wafer to be plated faces down, and the anode is placed in the electrolyte solution. Electroplating occurs when the electrolyte solution flows toward the wafer and collides with the surface of the wafer with great force. At this time, the circuit pattern formed by the photoresist comes into contact with the electrolyte solution on the wafer to be plated. The electrons are distributed in the electroplating equipment at the edge of the wafer, and eventually the metal ions in the electrolyte solution meet the pattern drawn by the photoresist on the wafer. Subsequently, the electrons combine with the metal ions in the electrolyte solution and undergo a reduction reaction where the photoresist pattern is drawn, forming metal leads or bumps.

[0003] The wafer needs to expose the outermost metal sputtering layer through contact photolithography exposure and masking, and retain the photoresist layer. In this way, the electroplating ring pins can contact the sputtering layer to conduct the current smoothly, and the sealing rubber ring in the ring must contact the photoresist layer to make the conductive area completely sealed and waterproof.

[0004] When the edge of the photoresist layer is not necessarily in an ideal circular shape, when the sealing rubber ring does not contact the photoresist layer, the electroplating is not sealed and leakage plating will occur, which will affect the entire electroplating tank and the electroplating effect. Utility Model Content

[0005] In order to improve the contact integrity between the sealing rubber ring and the photoresist layer, the present application provides an auxiliary structure for electroplating sealing.

[0006] The present application provides an auxiliary structure for electroplating sealing, which adopts the following technical solution: an auxiliary structure for electroplating sealing, comprising a machine table and a sealing rubber ring, one end of which is used to abut against a photoresist layer of a wafer; a bracket is also provided on the lower side of the machine table, and a reducing frame is movably provided on the bracket, and the reducing frame is used to abut against the sealing rubber ring so that the sealing rubber ring is deformed radially inward, and a plurality of reducing frames are evenly distributed along the circumference of the sealing rubber ring.

[0007] By adopting the above technical solution, when the wafer is placed in the operating table, the reducing frame is in contact with the sealing rubber ring, and the reducing frame is directly driven or linked to other structures, so that the edge of the sealing rubber ring moves toward the center of the circle, so that the edge of the sealing rubber ring can contact the edge of the photoresist layer, forming a complete sealing structure and improving the electroplating effect.

[0008] Preferably, the cross-section of the sealing rubber ring includes a first part having one end connected to the machine and extending downward away from the machine side, and a second part extending toward the machine side. The connection point between the first part and the second part forms a connecting ring located at the lowest point, and the reducing frame abuts against the connecting ring.

[0009] By adopting the above technical solution, during the process of resistance, the resistance at the top and the pressure at the top cause one side of the sealing rubber ring to shrink inward, thereby reducing the direct force on the vertical surface of the wafer, pushing it through the horizontal component force, and not occupying the space on the outside in the horizontal direction, so as to facilitate diameter reduction.

[0010] Preferably, a linkage rod is rotatably connected to the middle portion of the bracket, one end of the linkage rod is connected to the reducing frame, and the other end of the linkage rod has a contact block for abutting against the lower side of the wafer.

[0011] By adopting the above technical solution, when the sealing rubber ring does not contact the photoresist layer, the wafer moves downward as a whole, the contact block will also move downward, and the linkage rod will rotate accordingly, so that the reduction frame at the other end presses upward against the lower side of the sealing rubber ring, causing it to deform.

[0012] Preferably, a connecting rod is rotatably connected to the lower side of the contact block, and one end of the connecting rod is fixedly connected to the end of the linkage rod.

[0013] By adopting the above technical solution, due to the interference relationship, the angle between the relative contact block and the linkage rod will change, so that the contact block can still remain in contact with the lower side of the wafer to protect the lower side of the wafer.

[0014] Preferably, a reset elastic member is provided at the rotation point between the linkage rod and the bracket.

[0015] By adopting the above technical solution, when the linkage rod rotates, the resetting elastic member can, on the one hand, maintain tight resistance, and on the other hand, facilitate its resetting.

[0016] Preferably, the reducing frame is rotatably connected to a contact platform for abutting against the connecting ring, and one end of the reducing frame away from the contact platform is fixedly connected to the linkage rod.

[0017] By adopting the above technical solution, the contact platform is used to abut against the connecting ring, and a larger area is used to align the ring line, which can improve the overall stability.

[0018] Preferably, a photosensitive element is also provided on the bracket for detecting an edge where the second part abuts against the wafer.

[0019] By adopting the above technical solution, the photosensitive element can detect whether there is photoresist at the position where the edge of the sealing rubber ring is located by irradiating reflection.

[0020] Preferably, return springs are provided on the bracket and at both ends of the linkage rod, for returning the linkage rod to a horizontal state.

[0021] By adopting the above technical solution, after operating the previous wafer, the linkage rod can be reset to its original position after detachment, so as to facilitate the next electroplating.

[0022] Preferably, a movable platform is provided on the bracket so as to be adjustable in the vertical direction, one end of the return spring is connected to the linkage rod, and the other end is connected to the movable platform.

[0023] By adopting the above technical solution, the initial position of the movable platform in the vertical direction can form a control for the initial length of the reset spring, so that the resistance during the collision and the subsequent speed of returning to the original state can be adjusted.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. The reducing frame is pressed against the connecting ring of the sealing rubber ring, so that the edge of the sealing rubber ring moves toward the center of the circle, so that the edge of the sealing rubber ring can contact the edge of the photoresist layer to form a complete sealing structure and improve the effect of electroplating;

[0026] 2. During the movement, the resistance block and the contact platform can move with the change of state, maintain the original resistance state, and can press the sealing rubber ring in a relatively uniform way;

[0027] 3. The setting of the photosensitive element can help identify the edge position of the sealing rubber ring and adjust the position of the sealing rubber ring more accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of the structure of Example 1 of the present application;

[0029] Figure 2 is a partial cross-sectional view of Example 1 of the present application;

[0030] Figure 3 It is a partial cross-sectional view of the bracket in Example 2 of the present application.

[0031] Explanation of the reference numerals: 100, machine platform; 110, sealing rubber ring; 111, first part; 112, second part; 113, connecting ring; 120, bracket; 121, reducing frame; 122, linkage rod; 123, contact block; 124, contact platform; 135, connecting rod; 130, photosensitive member; 140, return spring; 141, movable table; 142, adjusting slot; 143, rotating table; 144, adjusting stud. DETAILED DESCRIPTION

[0032] The present application is further described in detail below in conjunction with the accompanying drawings. Example

[0033] Embodiment 1 of the present application discloses an auxiliary structure for electroplating sealing, referring to Figure 1 , Figure 2 , including a machine 100 and a sealing rubber ring 110, the machine 100 is used to receive the wafer, and one end of the sealing rubber ring 110 is used to abut against the photoresist layer of the wafer. The cross section of the sealing ring includes a first part 111, one end of which is fixedly connected to the machine 100 and extends downward away from the machine 100, and a second part 112 extending toward the machine 100. The cross section is V-shaped as a whole, and the inner side is the active side. The inner side of the second part 112 will be used to abut against the lower side of the wafer and fit on the photoresist layer.

[0034] Specifically, a bracket 120 is further provided at the lower side of the machine 100, and a reducing frame 121 is movably provided on the bracket 120. The reducing frame 121 is used to contact the sealing rubber ring 110 so that the sealing rubber ring 110 is deformed radially inward. Several reducing frames 121 are evenly distributed along the circumference of the sealing rubber ring 110. In theory, the more reducing frames 121 are provided along the circumference, the better. In actual testing, evenly distributing four reducing frames 121 has a better effect, so four reducing frames 121 are used as an example in this embodiment.

[0035] The connection point between the first part 111 and the second part 112 of the sealing rubber ring 110 forms a connection ring 113 located at the lowest point, and the diameter reduction frame 121 abuts against the connection ring 113. A linkage rod 122 is rotatably connected to the middle of the bracket 120, and a reset elastic member is installed at the rotation point. In this embodiment, a torsion spring is used as the reset elastic member (not shown in the figure), so that the linkage rod 122 has a reset function after rotation. One end of the linkage rod 122 is connected to the diameter reduction frame 121, and the other end of the linkage rod 122 has a contact block 123 for abutting against the lower side of the wafer.

[0036] The lower side of the contact block 123 is rotatably connected with a connecting rod 135, and one end of the connecting rod 135 is fixedly connected to the end of the linkage rod 122. The diameter reducing frame 121 is rotatably connected with a contact platform 124 for contacting the connecting ring 113, and one end of the diameter reducing frame 121 away from the contact platform 124 is fixedly connected to the linkage rod 122. Generally speaking, the connecting rod 135 and the diameter reducing frame 121 are perpendicular to the linkage rod 122, and in order to adapt to the rotation angle during movement, the contact block 123 and the contact platform 124 are both rotatably connected and arranged to be suitable for maintaining a horizontal fit state after movement, and a torsion spring is also arranged at the rotation connection between the contact block 123 and the contact platform 124, so as to maintain a horizontal state when not in contact. In addition, in the present embodiment, a photosensitive member 130 is installed on the bracket 120, and one end of the photosensitive member 130 extends to the edge of the second part 112 (generally at 2.5mm), which is used to irradiate the edge of the photoresist layer to form a detection of the photoresist. Specifically, in this embodiment, the photosensitive member 130 is fixed on the contact block 123 to obtain a consistent detection position during the movement.

[0037] When the second part 112 does not contact the photoresist, the photoresist is not blocked here and the photoresist can still be detected. Therefore, the feedback signal is used to make the wafer move downward as a whole. At this time, the contact block 123 will drive one end of the linkage rod 122 to move downward. Relatively speaking, the other end, that is, one end of the contact platform 124, will be lifted up. After the connecting ring 113 is partially subjected to force, the second part 112 will move toward the inside of the center of the circle to block the photoresist at 2.5 mm. At this time, it can be known through the photosensitive element 130 that the second part 112 has contacted the photoresist layer to ensure overall contact.

[0038] It is worth noting that during the overall detection process, as long as the sealing rubber ring 110 corresponding to one of the shrinking frames 121 does not contact the photoresist, the entirety will move downward until all parts are in contact. In other embodiments, a ring may be connected to each contact platform 124 to contact the outside of the first part 111, so as to facilitate overall deformation and maintain the shrinking effect of the sealing rubber ring 110. Example

[0039] The difference from Example 1 is that, referring to Figure 3 The resetting elastic member of the bracket 120 and the linkage rod 122 is not a torsion spring, but a resetting spring 140 disposed on the bracket 120 and located at both ends of the linkage rod 122. In order to adapt to different electroplating conditions, in this embodiment, the initial compression degree of the resetting spring 140 can be adjusted.

[0040] A movable platform 141 is adjustable in the vertical direction on the bracket 120, one end of the return spring 140 is connected to the linkage rod 122, and the other end is connected to the movable platform 141. The initial elastic force of the return spring 140 is adjusted by the up and down movement of the movable platform 141, so that the contact block 123 and the contact platform 124 have appropriate pressing force when they are in contact, and also so that they can always keep in contact during the movement.

[0041] Specifically, the bracket 120 is provided with an adjustment groove 142, the movable platform 141 is embedded and slidably disposed in the adjustment groove 142, one end of the movable platform 141 is rotatably connected and axially fixed with a rotating platform 143, and an adjustment stud 144 is threadedly connected to the bracket 120, one end of the adjustment stud 144 extends into the adjustment groove 142 and is fixedly connected to the rotating platform 143. By screwing the adjustment stud 144, the end thereof moves, and the adjustment groove 142 and the movable platform 141 are rectangular in cross section in this embodiment and will be circumferentially limited in the adjustment groove 142.

[0042] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An auxiliary structure for electroplating sealing, comprising a machine (100) and a sealing rubber ring (110), characterized in that: One end of the sealing rubber ring (110) is used to abut against the photoresist layer of the wafer; a bracket (120) is further provided on the lower side of the machine (100), and a reducing frame (121) is movably provided on the bracket (120), and the reducing frame (121) is used to abut against the sealing rubber ring (110) so that the sealing rubber ring (110) is deformed radially inward, and a plurality of reducing frames (121) are evenly distributed along the circumference of the sealing rubber ring (110).

2. The auxiliary structure for electroplating sealing according to claim 1, characterized in that: The cross section of the sealing rubber ring (110) includes a first portion (111) having one end connected to the machine (100) and extending downward away from the machine (100), and a second portion (112) extending toward the machine (100). The connection point between the first portion (111) and the second portion (112) forms a connecting ring (113) located at the lowest point, and the reducing frame (121) contacts the connecting ring (113).

3. The auxiliary structure for electroplating sealing according to claim 2, characterized in that: A linkage rod (122) is rotatably connected to the middle of the bracket (120), one end of the linkage rod (122) is connected to the reducing frame (121), and the other end of the linkage rod (122) has a contact block (123) for contacting the lower side of the wafer.

4. The auxiliary structure for electroplating sealing according to claim 3, characterized in that: The lower side of the contact block (123) is rotatably connected to a connecting rod (135), and one end of the connecting rod (135) is fixedly connected to the end of the linkage rod (122).

5. The auxiliary structure for electroplating sealing according to claim 4, characterized in that: A reset elastic member is provided at the rotation point between the linkage rod (122) and the bracket (120).

6. The auxiliary structure for electroplating sealing according to claim 5, characterized in that: The reducing frame (121) is rotatably connected to a contact platform (124) for contacting the connecting ring (113), and one end of the reducing frame (121) away from the contact platform (124) is fixedly connected to the linkage rod (122).

7. The auxiliary structure for electroplating sealing according to claim 2 or 6, characterized in that: A photosensitive element (130) is also provided on the bracket (120) for detecting the edge of the second portion (112) contacting the wafer.

8. The auxiliary structure for electroplating sealing according to claim 6, characterized in that: Return springs (140) are provided on the bracket (120) and at both ends of the linkage rod (122), for returning the linkage rod (122) to a horizontal state.

9. The auxiliary structure for electroplating sealing according to claim 8, characterized in that: A movable platform (141) is provided on the bracket (120) so as to be adjustable in the vertical direction. One end of the return spring (140) is connected to the linkage rod (122), and the other end is connected to the movable platform (141).

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