Test crimping structure

Abstract

The utility model relates to the technical field of power semiconductor testing, and provides a test crimping structure. The test crimping structure comprises a test part, a first water channel plate and a second water channel plate. The test component comprises an assembly substrate, a test capacitor and a three-phase copper bar connected to the assembly substrate, and the three-phase copper bar is used for connecting a cable; the first water channel plate is connected to the three-phase copper bar, and the first water channel plate is provided with a first cooling flow channel used for circulation of cooling liquid. The second water channel plate and the assembly substrate are oppositely arranged in a spaced mode in the first direction, the first direction is the thickness direction of the assembly substrate, the side, facing the assembly substrate, of the second water channel plate is provided with a bearing part used for containing a power semiconductor, and the second water channel plate is provided with a second cooling flow channel used for circulation of cooling liquid. The test crimping structure provided by the utility model is used for a power semiconductor test, has relatively high heat dissipation performance, can perform heat dissipation on a three-phase copper bar and a test position, effectively guarantees the test safety, and prevents the structure from being damaged due to overheating.

Description

Technical Field

[0001] The present application relates to the technical field of power semiconductor testing, and in particular to a testing crimping structure. Background Art

[0002] During the reactive power test of power semiconductors, the three-phase terminals of the power semiconductors will output large currents, which will generate a lot of heat when passing through the three-phase copper busbars connected to them. It is necessary to cool them down to prevent the three-phase copper busbars from overheating and being damaged.

[0003] In the related art, most of them use a blowing plate to blow air on the three-phase copper busbar to achieve cooling of the three-phase copper busbar. However, the cooling effect of this method is general, and there will be noise during the cooling process. Moreover, with the development of technology, the voltage and current during power semiconductor testing will gradually increase. Therefore, the above method is far from meeting the cooling needs. Utility Model Content

[0004] Based on this, it is necessary to provide a test crimping structure that can meet the power semiconductor test while having high heat dissipation performance, can dissipate heat for the three-phase copper busbar and the test point, effectively ensure the test safety, and avoid damage due to overheating of the structure.

[0005] A test crimping structure, comprising:

[0006] The test component includes an assembly substrate, a test capacitor, and a three-phase copper busbar connected to the assembly substrate, wherein the three-phase copper busbar is used to connect the cable;

[0007] A first water channel plate, connected to the three-phase copper busbar, wherein the first water channel plate is configured with a first cooling channel for the circulation of a coolant;

[0008] A second waterway plate is arranged opposite to the mounting substrate along a first direction and spaced apart from each other, a bearing portion for placing a power semiconductor is configured on a side of the second waterway plate facing the mounting substrate, and a second cooling channel for circulating a coolant is configured on the second waterway plate; the first direction is a thickness direction of the mounting substrate;

[0009] The test component can move toward and away from the second waterway plate along the thickness direction of the assembly substrate, and the three-phase copper busbar and the test capacitor are both used to connect power semiconductors.

[0010] It is understandable that the power semiconductor can be placed on the bearing portion of the second waterway plate, and the test component can be close to the second waterway plate along the thickness direction of the assembly substrate, so that the three-phase copper bar and the capacitor component are connected to the power semiconductor to perform a performance test of the power semiconductor. In this process, since the first waterway plate and the second waterway plate are respectively provided with the first cooling channel and the second cooling channel, it is convenient for the coolant to flow. Therefore, when the power semiconductor is placed on the bearing portion of the second waterway plate, the second waterway plate can be directly used to dissipate heat and cool the power semiconductor; and, since the three-phase copper bar is connected with the first waterway plate, the three-phase copper bar can be dissipated and cooled. In this way, at least two positions for heat dissipation and cooling can be set in the power semiconductor test, which not only ensures that the power semiconductor itself is fully cooled, but also that the three-phase copper bar used for testing is fully cooled. Therefore, the test crimping structure provided by the present application has a high heat dissipation performance while meeting the power semiconductor test, and can dissipate heat for the three-phase copper bar and the power semiconductor at the test site, effectively ensuring the safety of the test and avoiding the structure from being overheated and destroyed. In addition, due to the use of liquid cooling using the waterway plate, compared to air cooling, there will be no continuous leakage of gas during the cooling process, no harsh noise will be generated, and it will not affect the gas pressure of other components.

[0011] In some embodiments, a plurality of heat dissipation columns are arranged at intervals in the first cooling channel, and the axial direction of each heat dissipation column is arranged at an angle to the flow direction of the coolant in the first cooling channel; wherein the projection range of the plurality of heat dissipation columns along the thickness direction of the three-phase copper busbar is not less than the projection range of the three-phase copper busbar along its own thickness direction.

[0012] It can be understood that the heat transfer area is increased by providing multiple heat dissipation columns, and the heat generated by the three-phase copper busbar can be more fully transferred to the corresponding heat dissipation columns, thereby further improving the heat dissipation effect.

[0013] In some embodiments, along the axial direction of the heat dissipation column, the first cooling channel has a first side wall and a second side wall, and the first side wall and the second side wall are arranged opposite to each other and at intervals; one end of each heat dissipation column along its own axial direction is connected to the first side wall, and a flow gap is constructed between the other end and the second side wall.

[0014] Such an arrangement increases the contact area of ​​each heat dissipation column with respect to the coolant, further improving the heat dissipation efficiency; and, such an arrangement facilitates the coolant to flow along the circulation gap, reducing the flow resistance to the coolant.

[0015] In some embodiments, the first water channel plate includes a first plate body and a second plate body, a mounting groove is recessed on a side of the first plate body facing away from the three-phase copper busbar, the second plate body is at least partially inserted in the mounting groove, and an assembly gap is constructed between the first plate body and the second plate body; the first plate body is respectively provided with a liquid inlet hole and a liquid outlet hole on both sides along the flow direction of the coolant, and the liquid inlet hole and the liquid outlet hole are both connected to the assembly gap to jointly define the first cooling channel; wherein each of the heat dissipation columns is connected to the first plate body or the second plate body along one side of its own axial direction.

[0016] That is to say, the method of assembling the first plate body and the second plate body facilitates the manufacture of each heat dissipation column and the arrangement of the liquid inlet and outlet holes, so as to realize the flow of the coolant to meet the heat dissipation.

[0017] In some embodiments, the assembly gap includes a heat conduction section and a transition section, and the transition section is connected to both sides of the heat conduction section along the flow direction of the coolant; the heat conduction section is arranged close to the three-phase copper busbar, and each of the transition sections is arranged at an angle to the heat conduction section, and is respectively connected to the liquid inlet hole and the liquid outlet hole; wherein each of the heat dissipation columns is arranged in the heat conduction section.

[0018] In this way, the heat conducting section has a height difference compared with the liquid inlet hole and the liquid outlet hole. The liquid inlet hole and the liquid outlet hole can be arranged in the middle of the first water channel plate along its own thickness direction to ensure the structural strength of the first water channel plate; and the height difference between the heat conducting section and the liquid outlet hole is utilized to enhance the circulation of the coolant.

[0019] In some embodiments, the bearing portion is configured as a bearing groove, and the second cooling channel is communicated with the bearing groove.

[0020] It can be understood that the provision of the bearing groove is equivalent to providing a flow space for the flow of the coolant, and the coolant flows into the bearing groove through the second cooling channel to act on the power semiconductor to achieve cooling.

[0021] In some embodiments, the second cooling channel includes a liquid inlet channel and a liquid outlet channel, the liquid inlet channel and the liquid outlet channel are respectively arranged on both sides of the supporting groove along the second direction, and both extend along the third direction; a first oblique channel is connected between the liquid inlet channel and the supporting groove, and a second oblique channel is connected between the liquid outlet channel and the supporting groove; wherein the first direction, the second direction and the third direction are arranged at an angle to each other.

[0022] It can be understood that the coolant introduced through the liquid inlet channel flows along the first inclined channel to the supporting tank, acts on the power semiconductor to absorb heat, flows along the second inclined channel to the liquid outlet channel, and is then discharged through the liquid outlet channel to meet the heat dissipation and cooling requirements; and, such a setting creates a height difference between the liquid outlet channel and the supporting tank, which can effectively accelerate the circulation of the coolant and improve the heat dissipation effect.

[0023] In some embodiments, the second waterway plate is configured with an annular groove, which is arranged circumferentially around the bearing groove and located on the outside of the bearing groove, and the annular groove is used to install a sealing ring; wherein the notch edge of the bearing groove is lower than the notch edge of the annular groove.

[0024] Such an arrangement can seal the power semiconductor and the second waterway plate to ensure that the coolant does not leak; and, by utilizing the difference in the groove edge between the bearing groove and the ring groove, the gap between the power semiconductor and the second waterway plate can be avoided as much as possible, thereby improving the sealing.

[0025] In some embodiments, the test crimping structure further includes a heat-conducting component, and the heat-conducting component is connected between the three-phase copper busbar and the first waterway plate.

[0026] It can be understood that the provision of the heat-conducting component improves the thermal conductivity between the three-phase copper busbar and the first water channel plate, which is beneficial for sufficient and timely transfer of heat to the first water channel plate through the heat-conducting component, thereby improving the heat dissipation efficiency.

[0027] In some embodiments, the heat-conducting component includes a heat-conducting substrate and a fixing block, the fixing block is provided on at least one side of the heat-conducting substrate along the width direction of the three-phase copper busbar, the heat-conducting substrate is installed on the side of the first waterway plate facing the three-phase copper busbar, and the fixing block is used to press the heat-conducting substrate onto the first waterway plate; wherein, the first waterway plate is configured with an assembly groove on the side facing the heat-conducting substrate, and the heat-conducting substrate is at least partially accommodated in the assembly groove; and / or, thermal conductive glue is filled between the heat-conducting substrate and the first waterway plate.

[0028] It can be understood that the thermally conductive substrate serves as the main body of heat conduction to ensure the heat transfer effect. The fixing block fixes the thermally conductive substrate relative to the first water channel plate to ensure that the thermally conductive substrate will not be offset or fluctuate with the movement of the three-phase copper busbar. The assembly groove is set to limit and position the assembly of the thermally conductive substrate relative to the first water channel plate. The setting of the thermally conductive adhesive further improves the thermal conductivity effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 A schematic diagram of the test crimping structure provided for this application;

[0031] Figure 2 A cross-sectional view of the first waterway plate in the test crimping structure provided in the present application;

[0032] Figure 3 A cross-sectional view of the second waterway plate in the test crimping structure provided for this application;

[0033] Figure 4 Schematic diagram of the heat-conducting component in the test crimping structure provided in this application.

[0034] Reference numerals: 100, test crimping structure; 10, test component; 11, assembly substrate; 12, three-phase copper busbar; 13, test capacitor; 20, first water channel plate; 21, first plate body; 22, second plate body; 23, heat dissipation column; 201, first cooling channel; 202, assembly groove; 2011, first side wall; 2012, second side wall; 2013, assembly gap; 2013a, heat conduction section; 2013b, transition section; 2014, Liquid inlet hole; 2015, liquid outlet hole; 2016, flow gap; 2101, mounting groove; 30, second water channel plate; 31, bearing portion; 311, bearing groove; 312, annular groove; 301, second cooling channel; 3011, liquid inlet channel; 3012, liquid outlet channel; 3013, first oblique channel; 3014, second oblique channel; 40, cable; 50, heat-conducting component; 51, heat-conducting substrate; 52, fixing block; 200, power semiconductor. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0036] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0040] See also Figure 1 As shown, an embodiment of the present application provides a test crimping structure 100 that can meet the requirements of power semiconductor 200 testing while having high heat dissipation performance. It can dissipate heat for both the three-phase copper bus 12 and the power semiconductor 200, effectively ensuring test safety and avoiding damage to the structure due to overheating.

[0041] Specifically, the test crimping structure 100 includes a test component 10, a first waterway plate 20 and a second waterway plate 30. The test component 10 includes an assembly substrate 11, a test capacitor 13 and a three-phase copper busbar 12 connected to the assembly substrate 11, and the three-phase copper busbar 12 is used to connect the cable 40. The first waterway plate 20 is connected to the three-phase copper busbar 12, and the first waterway plate 20 is configured with a first cooling channel 201 for the circulation of coolant. The second waterway plate 30 is arranged opposite to and spaced from the assembly substrate 11 along a first direction, and the first direction is the thickness direction of the assembly substrate 11. The second waterway plate 30 is configured with a bearing portion 31 for placing the power semiconductor 200 on one side facing the assembly substrate 11, and the second waterway plate 30 is configured with a second cooling channel 301 for the circulation of coolant. In actual use, the test component 10 can move closer to and away from the second waterway plate 30 along the first direction, and the three-phase copper busbar 12 and the test capacitor 13 are both used to connect the power semiconductor 200 to meet the power semiconductor 200 test.

[0042] Among them, Figure 1 For example, the thickness direction of the mounting substrate 11 is along the vertical direction, and the first direction is the vertical direction, that is, the Z-axis direction.

[0043] It is understandable that the power semiconductor 200 can be placed on the bearing portion 31 of the second waterway plate 30, and the test component 10 can be close to the second waterway plate 30 along the thickness direction of the assembly substrate 11, so that the three-phase copper busbar 12 and the capacitor component are connected to the power semiconductor 200, and the performance test of the power semiconductor 200 is performed. In this process, since the first waterway plate 20 and the second waterway plate 30 are respectively provided with the first cooling channel 201 and the second cooling channel 301, it is convenient for the coolant to flow. Therefore, when the power semiconductor 200 is placed on the bearing portion 31 of the second waterway plate 30, the second waterway plate 30 can be directly used to dissipate heat and cool the power semiconductor 200; and, the first waterway plate 20 can be used to dissipate heat and cool the three-phase copper busbar 12. That is to say, by setting the first waterway plate 20 and the second waterway plate 30, at least two locations for heat dissipation and cooling are set during the test of the power semiconductor 200, which not only ensures that the heat generated by the power semiconductor 200 itself can be fully cooled, but also the heat generated by the three-phase copper busbar 12 used for testing can be fully cooled.

[0044] In summary, the test crimping structure 100 provided by the present application has a high heat dissipation performance while meeting the test of the power semiconductor 200, and can dissipate heat for both the three-phase copper bus 12 and the power semiconductor 200 at the test site, effectively ensuring the safety of the test and avoiding damage caused by overheating of the structure. In addition, due to the use of liquid cooling using a water channel plate, compared to air cooling, there will be no continuous gas leakage during the cooling process, and no harsh noise will be generated, and the gas pressure of other components will not be affected.

[0045] Furthermore, a clamping structure is also provided on the side of the assembly substrate 11 facing the second waterway plate 30, so as to utilize the setting of the clamping structure to clamp and fix the test capacitor 13 and the three-phase copper busbar 12 relative to the terminals of the power semiconductor 200, thereby improving the connection reliability and avoiding the problem of poor contact. Among them, the terminals on the power semiconductor 200 include three-phase terminals and positive and negative terminals, the three-phase terminals are connected to the three-phase copper busbar 12, and the positive and negative terminals are connected to the positive and negative electrodes of the test capacitor 13. The clamping structure includes a first clamping structure for clamping the three-phase copper busbar 12 and the three-phase terminals, and a second clamping structure for clamping the positive and negative electrodes and the positive and negative terminals. Both the first clamping structure and the second clamping structure adopt the cooperation of a clamping column and a spring.

[0046] Furthermore, in order to meet the lifting and lowering of the test component 10, the test crimping structure 100 also includes a first lifting structure connected to the assembly substrate 11 and a second lifting structure connected to the test capacitor 13. The first lifting structure drives the assembly substrate 11 to drive the three-phase copper bus 12 to move along the Z-axis direction, and the second lifting structure drives the test capacitor 13 to move along the Z-axis direction to achieve close compression and distance relaxation relative to the power semiconductor 200.

[0047] The structures of the first water channel plate 20 and the second water channel plate 30 are described in detail below.

[0048] Please combine Figure 1 and Figure 2 , exemplarily, a plurality of heat dissipation columns 23 are arranged at intervals in the first cooling channel 201, and the axial direction of each heat dissipation column 23 is set at an angle to the flow direction of the coolant in the first cooling channel 201. It can be understood that by setting a plurality of heat dissipation columns 23, the contact area with the coolant is increased, thereby increasing the heat transfer area. When the coolant flows in the first cooling channel 201, it can not only contact the channel wall of the first cooling channel 201 to take away the heat transferred to the channel wall through the three-phase copper bus 12; and the coolant is also in full contact with a plurality of heat dissipation columns 23, taking away the heat transferred to each heat dissipation column 23; thus, the heat dissipation and cooling effect is improved. Among them, it is precisely because the axial direction of the heat dissipation column 23 is set at an angle to the flow direction of the coolant in the first cooling channel 201, so the coolant must impact the outer peripheral surface of the heat dissipation column 23 during the flow process, which is more convenient to continuously take away the heat.

[0049] In some embodiments, the bearing portion 31 on the second waterway plate 30 can carry more than two power semiconductors 200, and the more than two power semiconductors 200 can be arranged at intervals along the Y-axis direction. At this time, a plurality of three-phase copper bars 12 are correspondingly provided and arranged at intervals along the Y-axis direction. At this time, the coolant flow direction can be along the Y-axis direction to flow through each three-phase copper bar 12 to ensure that each three-phase copper bar 12 can be fully dissipated and cooled. The axial direction of each heat dissipation column 23 is along the Z-axis direction, which is convenient for full contact with the coolant. Among them, the Y-axis direction is the width direction of the three-phase copper bar 12, and the X-axis direction is the length direction of the three-phase copper bar 12 on the horizontal plane.

[0050] Further, the projection range of multiple heat dissipation columns 23 along the thickness direction of the three-phase copper bar 12 is not less than the projection range of the three-phase copper bar 12 along the thickness direction of the three-phase copper bar 12. Such a setting ensures that the heat generated by the three-phase copper bar 12 can be more fully transferred to the corresponding heat dissipation columns 23, further improving the heat dissipation effect. For example, the projection range of multiple heat dissipation columns 23 is greater than the projection range of the three-phase copper bar 12, or the two are equal, as long as it is ensured that each three-phase copper bar 12 has a sufficient heat dissipation range. In actual use, multiple heat dissipation columns 23 are connected to the first cooling channel 201 along one end of their own axial direction toward the flow channel wall of the three-phase copper bar 12, which is more convenient for fully absorbing the heat of the three-phase copper bar 12.

[0051] In some embodiments, a flat hole structure may be machined inside the first water channel plate 20 to serve as the first cooling channel 201. In this case, the cross section of the hole structure along the Z-axis direction is a rectangle.

[0052] Please continue to combine Figure 1 and Figure 2 In an optional embodiment, along the axial direction of the heat dissipation column 23, the first cooling channel 201 has a first side wall 2011 and a second side wall 2012, and the first side wall 2011 and the second side wall 2012 are arranged opposite to each other and at intervals; one end of each heat dissipation column 23 along its own axial direction is connected to the first side wall 2011, and a flow gap 2016 is constructed between the other end and the second side wall 2012.

[0053] Specifically, the first side wall 2011 is arranged close to the three-phase copper busbar 12, the second side wall 2012 and the first side wall 2011 are opposite and spaced apart along the Z-axis direction, and each heat dissipation column 23 is connected to the first side wall 2011 along its own axial direction and one end facing the three-phase copper busbar 12, and the other end extends toward the second side wall 2012 and does not contact the second side wall 2012, so as to ensure that there is a flow gap 2016 between the two, which is convenient for the circulation of the coolant. Moreover, such a configuration increases the contact area of ​​each heat dissipation column 23 with the coolant, that is, the coolant needs to fully contact the outer peripheral surface of each heat dissipation column 23 and one end surface facing the second side wall 2012, further improving the heat dissipation efficiency.

[0054] Furthermore, the diameter of each heat dissipation column 23 can be between 2mm and 6mm, which ensures timely and sufficient heat transfer while having sufficient structural strength and is easy to manufacture. Among them, the diameter of each heat dissipation column 23 should not be too large or too small. If it is too large, it will increase the thermal resistance of the heat dissipation column 23 itself, which is not conducive to the sufficient and timely transfer of heat to the outer peripheral surface of the heat dissipation column 23, and weaken the heat dissipation effect; of course, if it is too small, although it is convenient for heat transfer, it is not conducive to manufacturing and is easy to break under stress. In some specific embodiments, the diameter of each heat dissipation column 23 can be 2mm, 3mm, 5mm or 6mm.

[0055] Furthermore, the height of each heat dissipation column 23 along its own axial direction can be between 2 mm and 10 mm, and the size of the flow gap 2016 along the axial direction of the heat dissipation column 23 is between 0.1 mm and 0.5 mm.

[0056] It is understandable that, since the heat dissipation column 23 is arranged in the first cooling channel 201, and there is a circulation gap 2016 between the heat dissipation column 23 and the second side wall 2012 for the circulation of the coolant, the dimension of the first cooling channel 201 along the axial direction of the heat dissipation column 23 is bound to be greater than the height of the heat dissipation column 23 itself; and, since the first side wall 2011 is arranged close to the three-phase copper bus 12, when the coolant flows in the first cooling channel 201, in addition to contacting each heat dissipation column 23, it also needs to contact the first side wall 2011 as much as possible to ensure sufficient heat dissipation effect. Therefore, the dimension of the first cooling channel 201 along the axial direction of the heat dissipation column 23 should not be too large or too small. If it is too large, in order to meet the contact between the coolant and the first side wall 2011, more coolant needs to be introduced; and, part of the coolant far away from the first side wall 2011 cannot directly contact the first side wall 2011, but causes waste. If it is too small, the volume of the first cooling channel 201 will be reduced, the amount of coolant introduced will be reduced, and the heat dissipation effect will be affected. In addition, the distance between the heat dissipation column 23 and the second side wall 2012 is used as the flow gap 2016. If it is too large, it will also cause coolant waste. If there is no distance, it will affect the flow of coolant.

[0057] In some specific embodiments, the height of each heat dissipation column 23 along its own axis is 2 mm, 5 mm, 8 mm or 10 mm, and the size of the flow gap 2016 along the axis of the heat dissipation column 23 is 0.1 mm, 0.3 mm or 0.5 mm.

[0058] Please combine Figure 1 , Figure 2 and Figure 4, exemplarily, the test crimping structure 100 further includes a heat-conducting component 50, which is connected between the three-phase copper busbar 12 and the first waterway plate 20. It can be understood that the provision of the heat-conducting component 50 improves the thermal conductivity of the three-phase copper busbar 12 relative to the first waterway plate 20, which is more conducive to sufficient and timely transfer of heat to the first waterway plate 20 through the heat-conducting component 50, thereby improving the heat dissipation efficiency. Among them, the projection range of the heat-conducting component 50 along the Z-axis direction is not less than the projection range of the three-phase copper busbar 12 along the Z-axis direction, so as to ensure that each three-phase copper busbar 12 has a sufficient heat-conducting area corresponding to the heat-conducting component 50.

[0059] like Figure 1 and Figure 4 As shown, further, the heat-conducting component 50 includes a heat-conducting substrate 51 and a fixing block 52. The heat-conducting substrate 51 is provided with a fixing block 52 on at least one side along the width direction of the three-phase copper busbar 12. The heat-conducting substrate 51 is installed on the side of the first waterway plate 20 facing the three-phase copper busbar 12. The fixing block 52 is used to press the heat-conducting substrate 51 on the first waterway plate 20. It can be understood that the heat-conducting substrate 51, as a heat-conducting body, can be made of a heat-conducting material, such as a heat-conducting ceramic material. The thickness of the heat-conducting substrate 51 is small, and it is pressed on the first waterway plate 20 by using the fixing block 52 to ensure that the heat-conducting substrate 51 will not be offset or fluctuated with the movement of the three-phase copper busbar 12. Among them, the fixing block 52 can be made of glass fiber material.

[0060] In some specific embodiments, two fixing blocks 52 are provided, which are disposed on both sides of the heat conductive substrate 51 along the Y-axis direction to form a two-point constraint to improve assembly reliability.

[0061] Please continue to combine Figure 1 , Figure 2 and Figure 4 Furthermore, the first waterway plate 20 is configured with an assembly groove 202 on the side facing the heat-conducting substrate 51, and the heat-conducting substrate 51 is at least partially accommodated in the assembly groove 202. In other words, the assembly groove 202 is used to limit and position the assembly of the heat-conducting substrate 51 relative to the first waterway plate 20, and the assembly groove 202 is just corresponding to the three-phase copper busbar 12 and the first cooling channel 201 to ensure the heat conduction range. Among them, the depth of the assembly groove 202 can be greater than the thickness of the heat-conducting substrate 51, so that part of the three-phase copper busbar 12 is also accommodated in the assembly groove 202, so as to reduce the distance between the first cooling channel 201 and the three-phase copper busbar 12 along the Z-axis direction.

[0062] Wherein, thermal conductive glue is filled between the thermal conductive substrate 51 and the first water channel plate 20 to further improve the thermal conductive effect.

[0063] like Figure 2As shown, in some embodiments, the first water channel plate 20 includes a first plate body 21 and a second plate body 22, a mounting groove 2101 is recessed on a side of the first plate body 21 away from the three-phase copper busbar 12, the second plate body 22 is at least partially inserted in the mounting groove 2101, and an assembly gap 2013 is constructed between the first plate body 21 and the second plate body 22. The first plate body 21 is provided with a liquid inlet hole 2014 and a liquid outlet hole 2015 on both sides along the flow direction of the coolant, and the liquid inlet hole 2014 and the liquid outlet hole 2015 are both connected to the assembly gap 2013 to jointly define the first cooling channel 201.

[0064] That is to say, the method of assembling and forming the first plate body 21 and the second plate body 22 facilitates the manufacture of each heat dissipation column 23, and facilitates the manufacture of the liquid inlet hole 2014 and the liquid outlet hole 2015. The liquid inlet hole 2014 and the liquid outlet hole 2015 both penetrate the side wall on the same side to extend to the mounting groove 2101, so as to facilitate the communication with the assembly gap 2013 after the second plate body 22 is assembled relative to the first plate body 21. In actual use, the coolant flows into the assembly gap 2013 through the liquid inlet hole 2014, flows through the plurality of heat dissipation columns 23, and then flows out from the liquid outlet hole 2015 to meet the heat dissipation.

[0065] Among them, the first side wall 2011 of the first cooling channel 201 is located on the first plate body 21, and the second side wall 2012 of the first cooling channel 201 is located on the side where the second plate body 22 extends into the installation groove 2101, then each heat dissipation column 23 is connected to the first plate body 21, which is conducive to transferring the heat of the three-phase copper busbar 12. In actual use, a limited end face is set at the notch of the installation groove 2101, and a limited boss is convexly provided on the edge of the second plate body 22. When the second plate body 22 is inserted into the installation groove 2101, the limited boss can be pressed on the limited end face to limit the insertion depth of the second plate body 22 relative to the installation groove 2101, so as to ensure that an assembly gap 2013 for the flow of coolant is formed between the second plate body 22 and the first plate body 21; and, by using the limited cooperation between the limited end face and the limited boss, the second plate body 22 and the end face of the heat dissipation column 23 will not contact, so as to ensure the existence of the flow gap 2016.

[0066] Furthermore, a sealing ring is provided between the first plate 21 and the second plate 22, and the sealing ring can be pressed between the limiting end surface and the limiting protrusion to prevent leakage of the cooling liquid. A side wall of the first plate 21 away from the second plate 22 is provided with an assembly groove 202 for installing the heat conducting component 50.

[0067] Please continue reading Figure 2Furthermore, the assembly gap 2013 includes a heat conducting section 2013a and a transition section 2013b, and the heat conducting section 2013a is connected to the transition section 2013b on both sides along the flow direction of the coolant; the heat conducting section 2013a is arranged close to the three-phase copper bus 12, and each transition section 2013b is arranged at an angle to the heat conducting section 2013a, and is respectively connected to the liquid inlet hole 2014 and the liquid outlet hole 2015.

[0068] That is, the cross section of the second plate body 22 along the Z-axis direction is set in a trapezoidal shape, and the shape of the mounting groove 2101 is adapted to the shape of the second plate body 22, thereby forming a "︹"-shaped assembly gap 2013. In this way, the heat conduction section 2013a can be made to have a height difference compared with the liquid inlet hole 2014 and the liquid outlet hole 2015. The liquid inlet hole 2014 and the liquid outlet hole 2015 can be set in the middle of the first waterway plate 20 along its own thickness direction to ensure the structural strength of the first waterway plate 20; and the height difference between the heat conduction section 2013a and the liquid outlet hole 2015 is used to enhance the circulation of the coolant. In addition, since the heat conduction component 50 is installed on the first plate body 21, the fixing block 52 can be fixed relative to the first plate body 21 by means of a screw or the like, and the first plate body 21 is provided with a threaded hole for connecting with the screw; therefore, the above-mentioned setting can ensure that the liquid inlet hole 2014 and the liquid outlet hole 2015 are set away from the threaded hole to avoid interference between the two and leakage.

[0069] Among them, each heat dissipation column 23 is arranged in the heat conduction section 2013a. At the same time, the liquid inlet hole 2014 and the liquid outlet hole 2015 can be circular holes. In this case, the transition section 2013b connected to the liquid inlet hole 2014 can be used for cooling liquid diversion to ensure that the flow range of the cooling liquid is compatible with the projection range of the three-phase copper busbar 12; and the transition section 2013b connected to the liquid outlet hole 2015 can be used for cooling liquid confluence.

[0070] In an alternative embodiment, the liquid inlet hole 2014 and the liquid outlet hole 2015 can both be flat holes, as long as they can meet the requirements of the input and output of the cooling liquid.

[0071] See also Figure 1 and Figure 3As shown, in some embodiments, the bearing portion 31 is configured as a bearing groove 311, and the second cooling channel 301 is connected to the bearing groove 311. It can be understood that the use of the bearing groove 311 is equivalent to providing sufficient space for the flow of the coolant, and the coolant through the second cooling channel 301 flows into the groove cavity of the bearing groove 311 to act on the power semiconductor 200 to achieve cooling. In actual use, the power semiconductor 200 can be placed on a carrier plate, and the carrier plate is pressed on the edge of the notch of the bearing groove 311. At this time, the coolant flowing into the bearing groove 311 can directly and fully act on the carrier plate to achieve cooling and heat dissipation of the power semiconductor 200. Of course, the power semiconductor 200 can also be directly pressed on the edge of the notch of the bearing groove 311; wherein, the power semiconductor 200 is convexly provided with a heat dissipation rod, and the heat dissipation rod directly extends into the bearing groove 311 to contact the coolant to dissipate heat.

[0072] The depth of the bearing groove 311 is greater than the axial length of the heat sink. For example, the difference between the depth of the bearing groove 311 and the axial length of the heat sink is between 0.1 mm and 0.5 mm, so as to ensure that the coolant can flow at the bottom of the heat sink. Such a setting is similar to the reason for setting the flow gap 2016 between the heat sink column 23 and the second side wall 2012 in the first waterway plate 20, so it will not be repeated.

[0073] like Figure 1 and Figure 3 As shown, further, the second waterway plate 30 is constructed with an annular groove 312, which is arranged around the circumference of the bearing groove 311 and is located on the outside of the bearing groove 311. A sealing ring can be installed in the annular groove 312. When the power semiconductor 200 is placed on the bearing portion 31, the sealing ring is pressed between the second waterway plate 30 and the power semiconductor 200. In this way, the power semiconductor 200 and the second waterway plate 30 can be sealed to ensure that the coolant does not leak. Among them, the notch edge of the bearing groove 311 is lower than the notch edge of the annular groove 312. In this way, the gap between the power semiconductor 200 and the second waterway plate 30 can be avoided as much as possible, and the sealing performance can be improved. Of course, when a carrier plate is used, the sealing ring is pressed between the carrier plate and the second waterway plate 30.

[0074] Furthermore, the second waterway plate 30 is provided with a plurality of locating pins arranged at intervals, and the plurality of locating pins are all arranged around the outer peripheral side of the bearing groove 311. Correspondingly, the carrier plate or the power semiconductor 200 is provided with a plurality of locating holes arranged at intervals for plugging with the locating pins, and each locating pin is plugged into a corresponding locating hole to ensure the placement stability of the power semiconductor 200 relative to the second waterway plate 30, thereby ensuring that the power semiconductor 200 will not be easily offset, and avoiding poor contact with the test capacitor 13 and the three-phase copper busbar 12.

[0075] In an alternative embodiment, the bearing slot 311 may also be arranged in a stepped shape, including a large-diameter slot section and a small-diameter slot section, which are connected, and the large-diameter slot section is arranged close to the mounting substrate 11. In this case, a step surface is formed between the large-diameter slot section and the small-diameter slot section, and the power semiconductor 200 may be pressed on the step surface and partially accommodated in the large-diameter slot section for positioning, thereby ensuring the stability of the power semiconductor 200.

[0076] Among them, the second waterway plate 30 is also provided with a support block for supporting the three-phase terminals and the positive and negative terminals on the power semiconductor 200 to facilitate crimping and fitting.

[0077] In another alternative embodiment, the second cooling channel 301 may be provided in a flat hole structure and close to the bottom of the bearing groove 311, and the thickness of the bottom of the groove is small. The power semiconductor 200 or the carrier plate may be directly placed in the bearing groove 311 for positioning, and the heat of the power semiconductor 200 is fully transferred to the coolant in the second cooling channel 301 through the bottom of the groove to achieve heat dissipation.

[0078] Please continue to combine Figure 1 and Figure 3 Exemplarily, the second cooling channel 301 includes a liquid inlet channel 3011 and a liquid outlet channel 3012, and the liquid inlet channel 3011 and the liquid outlet channel 3012 are respectively arranged on both sides of the supporting groove 311 along the second direction, and both extend along the third direction; a first oblique channel 3013 is connected between the liquid inlet channel 3011 and the supporting groove 311, and a second oblique channel 3014 is connected between the liquid outlet channel 3012 and the supporting groove 311; wherein the first direction is a vertical direction, and the first direction, the second direction and the third direction are arranged at angles to each other.

[0079] For example, the second direction is the Y-axis direction and the third direction is the X-axis direction.

[0080] In this way, the coolant flows in the second cooling channel 301 along the Y-axis direction to ensure that the coolant can flow through each power semiconductor 200 located in the bearing part 31 to meet the heat dissipation requirements of each power semiconductor 200. At the same time, due to the extension of the liquid inlet channel 3011 and the liquid outlet channel 3012 along the X-axis direction, the power semiconductor 200 can be fully in contact with the coolant along the X-axis direction, thereby improving the heat dissipation efficiency. In actual use, the coolant introduced through the liquid inlet channel 3011 flows along the first oblique channel 3013 to the bearing groove 311, acts on the power semiconductor 200 to absorb heat, and then flows along the second oblique channel 3014 to the liquid outlet channel 3012, and then is discharged through the liquid outlet channel 3012. The coolant that absorbs heat and is discharged can be cooled by a structure such as a heat exchanger to ensure that the coolant reaches a lower temperature and can be used again to cool the power semiconductor 200 to meet the recycling use.

[0081] It should be added that the heat exchanger that meets the cooling requirement of the coolant is an existing mature technology and will not be described in detail here.

[0082] Among them, the setting of the first inclined flow channel 3013 and the second inclined flow channel 3014 allows the liquid inlet channel 3011 and the liquid outlet channel 3012 to be set at a position of the second waterway plate 30 away from the assembly substrate 11, for example, in the middle of the second waterway plate 30, so as to ensure the structural strength of the second waterway plate 30 itself; and, such a setting allows a height difference between the liquid outlet channel 3012 and the supporting groove 311, which can effectively accelerate the circulation of the coolant and improve the heat dissipation effect.

[0083] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A test crimping structure, characterized in that: The test crimping structure (100) comprises: A test component (10) comprises a mounting substrate (11), a test capacitor (13), and a three-phase copper busbar (12) connected to the mounting substrate (11), wherein the three-phase copper busbar (12) is used to connect a cable (40); A first water channel plate (20) connected to the three-phase copper busbar (12), wherein the first water channel plate (20) is configured with a first cooling channel (201) for circulating a coolant; a second waterway plate (30) arranged opposite to and spaced from the assembly substrate (11) along a first direction; a bearing portion (31) for placing a power semiconductor (200) is configured on a side of the second waterway plate (30) facing the assembly substrate (11); and a second cooling channel (301) for circulating a cooling liquid is configured on the second waterway plate (30); the first direction is a thickness direction of the assembly substrate (11); The test component (10) is capable of moving toward and away from the second waterway plate (30) along the thickness direction of the assembly substrate (11), and the three-phase copper busbar (12) and the test capacitor (13) are both used to connect the power semiconductor (200).

2. The test crimping structure according to claim 1, characterized in that: A plurality of heat dissipation columns (23) are arranged at intervals in the first cooling channel (201), and the axial direction of each heat dissipation column (23) is arranged at an angle to the flow direction of the coolant in the first cooling channel (201); The projection range of the plurality of heat dissipation columns (23) along the thickness direction of the three-phase copper busbar (12) is not less than the projection range of the three-phase copper busbar (12) along its own thickness direction.

3. The test crimping structure according to claim 2, characterized in that: Along the axial direction of the heat dissipation column (23), the first cooling channel (201) has a first side wall (2011) and a second side wall (2012), and the first side wall (2011) and the second side wall (2012) are arranged opposite to each other and spaced apart; One end of each heat dissipation column (23) along its own axial direction is connected to the first side wall (2011), and a flow gap (2016) is constructed between the other end and the second side wall (2012).

4. The test crimping structure according to claim 2, characterized in that: The first waterway plate (20) comprises a first plate body (21) and a second plate body (22); a mounting groove (2101) is recessed on a side of the first plate body (21) facing away from the three-phase copper busbar (12); the second plate body (22) is at least partially inserted into the mounting groove (2101); and an assembly gap (2013) is constructed between the first plate body (21) and the second plate body (22); The first plate body (21) is provided with a liquid inlet hole (2014) and a liquid outlet hole (2015) on both sides along the flow direction of the coolant, and the liquid inlet hole (2014) and the liquid outlet hole (2015) are both connected to the assembly gap (2013) to jointly define the first cooling channel (201); Wherein, each of the heat dissipation columns (23) is connected to the first plate body (21) or the second plate body (22) along one side of its own axial direction.

5. The test crimping structure according to claim 4, characterized in that: The assembly gap (2013) comprises a heat conduction section (2013a) and a transition section (2013b), and the transition sections (2013b) are connected to both sides of the heat conduction section (2013a) along the flow direction of the coolant; The heat conducting section (2013a) is arranged close to the three-phase copper busbar (12), and each of the transition sections (2013b) is arranged at an angle to the heat conducting section (2013a), and is respectively connected to the liquid inlet hole (2014) and the liquid outlet hole (2015); Wherein, each of the heat dissipation columns (23) is arranged in the heat conduction section (2013a).

6. The test crimping structure according to claim 1, characterized in that: The bearing portion (31) is configured as a bearing groove (311), and the second cooling channel (301) is in communication with the bearing groove (311).

7. The test crimping structure according to claim 6, characterized in that: The second cooling channel (301) comprises a liquid inlet channel (3011) and a liquid outlet channel (3012), wherein the liquid inlet channel (3011) and the liquid outlet channel (3012) are respectively arranged on two sides of the bearing groove (311) along the second direction, and both extend along the third direction; A first oblique flow channel (3013) is connected between the liquid inlet flow channel (3011) and the bearing groove (311), and a second oblique flow channel (3014) is connected between the liquid outlet flow channel (3012) and the bearing groove (311); Wherein, the first direction, the second direction and the third direction are arranged at an angle in pairs.

8. The test crimping structure according to claim 6, characterized in that: The second waterway plate (30) is configured with an annular groove (312), the annular groove (312) is arranged around the circumference of the bearing groove (311) and is located outside the bearing groove (311), and the annular groove (312) is used to install a sealing ring; Wherein, the notch edge of the bearing groove (311) is lower than the notch edge of the annular groove (312).

9. The test crimping structure according to claim 1, characterized in that: The test crimping structure (100) further comprises a heat-conducting component (50), wherein the heat-conducting component (50) is connected between the three-phase copper busbar (12) and the first water channel plate (20).

10. The test crimping structure according to claim 9, characterized in that: The heat-conducting component (50) comprises a heat-conducting substrate (51) and a fixing block (52); the heat-conducting substrate (51) is provided with the fixing block (52) on at least one side along the width direction of the three-phase copper busbar (12); the heat-conducting substrate (51) is installed on a side of the first waterway plate (20) facing the three-phase copper busbar (12); the fixing block (52) is used to press the heat-conducting substrate (51) onto the first waterway plate (20); Wherein, a mounting groove (202) is configured on a side of the first waterway plate (20) facing the heat-conducting substrate (51), and the heat-conducting substrate (51) is at least partially accommodated in the mounting groove (202); and / or, heat-conducting glue is filled between the heat-conducting substrate (51) and the first waterway plate (20).

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