Testing tool for wafer packaging

Abstract

The utility model discloses a test tool for wafer packaging, which relates to the technical field of wafer production and comprises a probe station, a fixing station is arranged at the bottom of the probe station, a clamping assembly is mounted at the top of the fixing station and comprises a supporting plate, a containing groove for containing the supporting plate is formed in the top of the fixing station, and the supporting plate is arranged in the containing groove. The bottom of the supporting plate is in transmission connection with a two-way threaded rod through a toothed plate, the two ends of the two-way threaded rod are in threaded connection with threaded sleeves, transmission rods are fixedly arranged at the tops of the threaded sleeves, limiting grooves for the transmission rods to slide are formed in the fixing table, clamping plates are arranged at the tops of the transmission rods, and reset springs are elastically connected between the supporting plate and the containing grooves. According to the utility model, the supporting plate in the clamping assembly is pressed down through the dead weight of the wafer, so that the wafer is automatically fixed, the steps for fixing the wafer are reduced, the time consumed by the wafer in the whole packaging process is shortened, and the efficiency of testing the wafer by the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a testing tool for wafer packaging. Background Art

[0002] Packaging testing is a very important step in the wafer production process. Testing is generally divided into general testing and special testing. The former is to place the packaged chip in various environments to detect its electrical characteristics, such as power consumption, operating speed, voltage resistance, etc. After the test, the chip is divided into different levels according to its electrical characteristics;

[0003] A current wafer packaging test device, such as the one described in the patent with announcement number CN219320359U, comprises: a probe station, a glass shell, an air supply device, an air extraction device and an exhaust port, wherein the top of the glass shell is fixedly connected to the top of the probe station, the air supply device is fixedly connected to one side of the glass shell, the air extraction device is fixedly connected to the top of the glass shell, and the exhaust port is fixedly connected to a corner of the top of the glass shell; a clamping assembly, wherein the clamping assembly comprises a mounting plate slidably connected to the top of the second fixed plate; and an overvoltage protection assembly, wherein the overvoltage protection assembly comprises a second round rod fixedly mounted on the bottom of the mounting plate. In this utility model, the wafer is conveniently clamped and has the function of overvoltage protection, which protects the wafer from being damaged during testing.

[0004] In view of the above-mentioned related technologies, the applicant found that a wafer packaging test device needs to manually pull the handle when fixing the wafer, and fix the wafer under the contact of the spring, but when testing multiple groups of wafers in sequence, it will take too much time to fix each wafer, increasing the time consumed by the wafer during the entire test process and reducing the efficiency of the device when testing the wafer. To this end, we propose a test fixture for wafer packaging. Utility Model Content

[0005] The purpose of the utility model is to provide a device capable of improving wafer testing efficiency, which can solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a test tool for wafer packaging, comprising a probe station, a fixed platform is provided at the bottom of the probe station, a clamping assembly is installed on the top of the fixed platform, the clamping assembly comprises a support plate, a storage groove for accommodating the support plate is provided on the top of the fixed platform, a two-way threaded rod is connected to the bottom of the support plate through a toothed plate transmission, both ends of the two-way threaded rod are threadedly connected with threaded sleeves, a transmission rod is fixed on the top of the threaded sleeve, a limiting groove for sliding the transmission rod is provided inside the fixed platform, a clamping plate is provided on the top of the transmission rod, and a reset spring is elastically connected between the support plate and the storage groove.

[0007] By adopting the above technical solution, automatic fixation of the wafer can be achieved.

[0008] Preferably, a hydraulic rod is fixedly installed between the probe station and the fixed platform, a glass cover is provided on the top of the probe station, a vacuum device is installed on the top of the glass cover, an exhaust valve is installed on the top of the glass cover near the vacuum device, an air supply device is installed at one end of the glass cover, and an adjustment component is installed between the splint and the transmission rod.

[0009] By adopting the above technical solution, wafer testing can be achieved.

[0010] Preferably, a limiting slide bar is fixedly provided at the corner of the bottom of the support plate, the limiting slide bar is U-shaped, and the limiting slide bar is slidably connected to the fixed platform.

[0011] By adopting the above technical solution, the position of the support plate can be limited.

[0012] Preferably, the adjustment component includes a fixed frame, the interior of the fixed frame is a hollow structure, a limit slider is fixedly provided at one end of the clamping plate, the limit slider is slidably connected to the interior of the fixed frame, a fixed slider is slidably connected to the end of the fixed frame away from the limit slider, a compression spring is provided between the fixed slider and the limit slider, one end of the fixed slider is rotatably connected to a threaded shaft, the threaded shaft is threadedly connected to the fixed frame, and a turntable is fixedly provided at one end of the threaded shaft.

[0013] By adopting the above technical solution, it is possible to adjust the abutment effect between the clamping plate and the wafer.

[0014] Preferably, one end of the compression spring is fixedly connected to the limiting sliding block, and the other end of the compression spring is fixedly connected to the fixing sliding block.

[0015] By adopting the above technical solution, the compression spring can be fixed.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] Firstly, by providing a clamping assembly, the wafer can be automatically fixed by pressing down the support plate in the clamping assembly through the wafer's own weight, thereby reducing the steps in fixing the wafer, shortening the time consumed by the wafer in the entire packaging process, and improving the efficiency of the device in testing the wafer.

[0018] Secondly, by providing a clamping plate and an adjusting component, and by driving the threaded shaft through the turntable in the adjusting component, the abutment effect between the clamping plate and the wafer can be quickly adjusted, thereby ensuring the stability of the wafer when fixed and improving the practicability of the device when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the internal structure of the probe station of the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the fixed platform of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the adjustment component of the utility model.

[0023] In the figure: 1. Probe station; 101. Fixed station; 102. Hydraulic rod; 103. Glass cover; 104. Vacuum device; 105. Exhaust valve; 106. Air supply device; 2. Clamping assembly; 201. Support plate; 202. Storage slot; 203. Tooth plate; 204. Bidirectional threaded rod; 205. Threaded sleeve; 206. Transmission rod; 2061. Limiting slot; 207. Clamp; 208. Return spring; 209. Limiting slide bar; 3. Adjusting assembly; 301. Fixed frame; 302. Limiting slide bar; 303. Fixed slide bar; 304. Compression spring; 305. Threaded shaft; 3051. Turntable. DETAILED DESCRIPTION

[0024] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The following is combined with Figure 1-4 The utility model is described in further detail.

[0029] See also Figure 1-Figure 3 , a test tool for wafer packaging is shown in the figure, including a probe station 1, a fixed platform 101 is provided at the bottom of the probe station 1, a hydraulic rod 102 is fixedly installed between the probe station 1 and the fixed platform 101, and the fixed platform 101 is lifted and lowered by the hydraulic rod 102, a glass cover 103 is provided on the top of the probe station 1, a vacuum device 104 is installed on the top of the glass cover 103, an exhaust valve 105 is installed at the top of the glass cover 103 near the vacuum device 104, an air supply device 106 is installed at one end of the glass cover 103, a clamping assembly 2 is installed on the top of the fixed platform 101, the clamping assembly 2 includes a support plate 201, the support plate 201 is located in the middle of the top of the fixed platform 101, and the top of the fixed platform 101 is provided with a supply The receiving groove 202 received by the support plate 201, the bottom of the support plate 201 is connected to a bidirectional threaded rod 204 through a tooth plate 203, the bidirectional threaded rod 204 is rotatably connected to the fixed platform 101, both ends of the bidirectional threaded rod 204 are threadedly connected to threaded sleeves 205, a transmission rod 206 is fixed on the top of the threaded sleeve 205, a limiting groove 2061 for sliding the transmission rod 206 is provided inside the fixed platform 101, a clamping plate 207 is provided on the top of the transmission rod 206, a return spring 208 is elastically connected between the support plate 201 and the receiving groove 202, a limiting slide bar 209 is fixed at the corner of the bottom of the support plate 201, the limiting slide bar 209 is U-shaped, and the limiting slide bar 209 is slidably connected to the fixed platform 101;

[0030] When performing a pressure resistance test during the wafer packaging process, the wafer is first placed on the top of the support plate 201. As the wafer's own gravity presses down the support plate 201, the support plate 201 moves downward under the limit of the limit slide bar 209, while compressing the return spring 208 and synchronously driving the tooth plate 203 to move downward. Through the downward movement of the tooth plate 203, the bidirectional threaded rod 204 is driven to rotate inside the threaded sleeve 205, and the threaded sleeve 205 drives the transmission rod 206 to drive the clamping plate 207 to move closer to the position of the wafer under the limit of the limit groove 2061 until the clamping plate 207 and the wafer are in abutment. Automatic fixation of the wafer can be achieved, and then the wafer's own weight is used to press down the support plate 201 in the clamping assembly 2, thereby achieving automatic fixation of the wafer, reducing the steps in fixing the wafer, shortening the time consumed by the wafer in the entire packaging process, and improving the efficiency of the device when testing the wafer.

[0031] See also Figure 2 , Figure 3 and Figure 4 In the figure, an adjustment component 3 is installed between the clamping plate 207 and the transmission rod 206, and the adjustment component 3 includes a fixed frame 301, the bottom of the fixed frame 301 is fixedly connected to the top of the transmission rod 206, the interior of the fixed frame 301 is a hollow structure, one end of the clamping plate 207 is fixedly provided with a limiting slider 302, the limiting slider 302 is slidably connected to the interior of the fixed frame 301, and the end of the fixed frame 301 away from the limiting slider 302 is slidably connected to a fixed slide plate 303, a compression spring 304 is provided between the fixed slide plate 303 and the limiting slider 302, one end of the compression spring 304 is fixedly connected to the limiting slider 302, and the other end of the compression spring 304 is fixedly connected to the fixed slide plate 303, one end of the fixed slide plate 303 is rotatably connected to a threaded shaft 305, the threaded shaft 305 is threadedly connected to the fixed frame 301, and one end of the threaded shaft 305 is fixedly provided with a rotating disk 3051;

[0032] When adjusting the abutment effect between the clamp 207 and the wafer, the turntable 3051 is manually rotated to drive the threaded shaft 305 to rotate, and through the rotation of the threaded shaft 305, the fixed slide 303 is driven to slide toward the position of the limit slide 302, so that the clamp 207 and the wafer maintain contact. At the same time, as the fixed slide 303 gradually approaches, the compression spring 304 between the limit slide 302 and the fixed slide 303 is gradually compressed, and then, under the compressed state of the compression spring 304, the limit slide 302 and the clamp 207 are pushed to improve the abutment effect between the clamp 207 and the wafer, and then, by driving the threaded shaft 305 by the turntable 3051 in the adjustment component 3, the rapid adjustment of the abutment effect between the clamp 207 and the wafer is realized, thereby ensuring the stability of the wafer when fixed and improving the practicality of the device when in use.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include"-"comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process-method-article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process-method-article or device.

[0034] In addition, the structures not introduced in the present invention do not involve the design points and improvement directions of the present invention, and all adopt the existing technology. The above content belongs to the technical cognition scope of the inventor. Since the technical content in this field is vast and too complicated, the above content of this application does not necessarily constitute the prior art.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A test tool for wafer packaging, characterized in that: The invention comprises a probe platform (1), wherein a fixed platform (101) is provided at the bottom of the probe platform (1), a clamping assembly (2) is installed at the top of the fixed platform (101), the clamping assembly (2) comprises a support plate (201), a storage groove (202) for storing the support plate (201) is provided at the top of the fixed platform (101), a bidirectional threaded rod (204) is connected to the bottom of the support plate (201) through a tooth plate (203), both ends of the bidirectional threaded rod (204) are threadedly connected to threaded sleeves (205), a transmission rod (206) is fixedly provided at the top of the threaded sleeve (205), a limiting groove (2061) for sliding the transmission rod (206) is provided inside the fixed platform (101), a clamping plate (207) is provided at the top of the transmission rod (206), and a return spring (208) is elastically connected between the support plate (201) and the storage groove (202).

2. A test tool for wafer packaging according to claim 1, characterized in that: A hydraulic rod (102) is fixedly installed between the probe platform (1) and the fixed platform (101); a glass cover (103) is provided on the top of the probe platform (1); a vacuum device (104) is installed on the top of the glass cover (103); an exhaust valve (105) is installed on the top of the glass cover (103) near the vacuum device (104); an air supply device (106) is installed at one end of the glass cover (103); and an adjustment component (3) is installed between the clamping plate (207) and the transmission rod (206).

3. The test tool for wafer packaging according to claim 1, characterized in that: A limiting slide bar (209) is fixedly provided at a corner of the bottom of the support plate (201); the limiting slide bar (209) is U-shaped, and the limiting slide bar (209) is slidably connected to the fixed platform (101).

4. The test tool for wafer packaging according to claim 2, characterized in that: The adjustment component (3) comprises a fixed frame (301), the interior of the fixed frame (301) is a hollow structure, one end of the clamping plate (207) is fixedly provided with a limit slider (302), the limit slider (302) is slidably connected to the interior of the fixed frame (301), one end of the fixed frame (301) away from the limit slider (302) is slidably connected to a fixed slide plate (303), a compression spring (304) is provided between the fixed slide plate (303) and the limit slider (302), one end of the fixed slide plate (303) is rotatably connected to a threaded shaft (305), the threaded shaft (305) is threadedly connected to the fixed frame (301), and one end of the threaded shaft (305) is fixedly provided with a rotating disk (3051).

5. The test tool for wafer packaging according to claim 4, characterized in that: One end of the compression spring (304) is fixedly connected to the limiting slider (302), and the other end of the compression spring (304) is fixedly connected to the fixed slide plate (303).

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