Storage device

Abstract

The utility model discloses a storage device. The storage device comprises a shell and an overlapping structure, an accommodating cavity is formed in the shell, and cooling fins are arranged on the shell; a circuit board is fixed in the overlapping structure, and the overlapping structure is accommodated in the accommodating cavity of the shell; the number of the heat dissipation fins is multiple, and the multiple heat dissipation fins are arranged on the upper portion of the shell at intervals. Under the condition that a plurality of circuit boards form an overlapped structure, the heat of the circuit boards in the shell can be effectively dissipated, so that the performance of the storage device is ensured.

Description

Technical Field

[0001] The present application relates to the field of storage, and in particular to a storage device. Background Art

[0002] In the storage field, with the continuous development of technology, computing density continues to grow, the demand for memory capacity is increasing, and the corresponding heat dissipation requirements are also higher.

[0003] When the space on the circuit board in the storage device has been utilized as much as possible, in order to further improve the server performance, people usually consider expanding the capacity of the storage particles themselves. However, the process level for expanding the storage particles themselves is high and complex, and the internal space of the storage device is not expanded, that is, the space of the circuit board cannot be expanded within the same space. In addition, multi-layer circuit board assembly is used to increase the memory capacity of the storage device, but heat generation increases, affecting the performance of the storage device. Heat dissipation is a technical problem that technicians in this field currently need to solve. Utility Model Content

[0004] The main purpose of the present application is to provide a storage device that can effectively dissipate heat from a circuit board in a housing, thereby ensuring the performance of the storage device.

[0005] In order to solve the above technical problems, the first technical solution adopted in the present application is: to provide a storage device, which includes: a shell, a receiving cavity is arranged in the shell, and heat dissipation fins are arranged on the shell; a stacking structure, a circuit board is fixed in the stacking structure, wherein the stacking structure is accommodated in the receiving cavity of the shell; wherein the heat dissipation fins include a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals on the upper part of the shell.

[0006] The beneficial effects of the present application are as follows: a housing cavity is provided in the shell of the storage device to accommodate the stacked structure with the circuit board fixed thereon, and a plurality of heat dissipation fins are provided on the shell and are spaced apart at the upper part of the shell. While expanding the storage space for the circuit board, the storage device can be effectively cooled to ensure the performance of the storage device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1is a schematic structural diagram of a first embodiment of a storage device in the present application;

[0009] Figure 2 is a schematic structural diagram of a second embodiment of a storage device in the present application;

[0010] Figure 3 is a schematic diagram of a top view of the structure of the first embodiment of the heat dissipation fin in the present application;

[0011] Figure 4 is a schematic diagram of a top view of the structure of the second embodiment of the heat dissipation fin in the present application;

[0012] Figure 5 It is a structural diagram of the third embodiment of the storage device in this application.

[0013] In the drawings, there are a storage device 10 , a housing 100 , heat sink fins 110 , a lower housing 120 , an upper housing 130 , a stacked structure 200 , a first circuit board 210 , a second circuit board 220 , a bottom plate 230 , a connector 300 , and a thermal conductive adhesive 400 . DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0015] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0016] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0017] As mentioned above, in order to expand the capacity of the storage device, people usually choose to expand the capacity of the storage particles in a limited space when the space on the circuit board has been almost fully utilized. In the same circuit board space, when the storage capacity of a single storage particle increases, the overall storage capacity of the storage device also increases.

[0018] However, expanding the capacity of storage particles is a very challenging technical problem, which involves multiple levels of complexity and technical requirements. First of all, the structure and properties of the storage particles themselves are extremely delicate, and their internal circuit design and material selection have been rigorously scientifically calculated and experimentally verified. Therefore, when expanding their capacity, it is necessary to ensure that the new storage unit is perfectly integrated with the original structure without any conflict or interference. Secondly, various physical and chemical parameters such as temperature, pressure, electric field, etc. need to be precisely controlled during the expansion process to ensure that the newly added storage unit can work stably. Slight changes in these parameters may have a significant impact on the performance of the storage particles, so technicians are required to have extremely high operating precision and rich experience. Moreover, capacity expansion research is not achieved overnight and requires long-term efforts.

[0019] In summary, the research on storage particle expansion requires not only technical personnel to have profound professional knowledge and a deep understanding of storage technology, but also the ability to master and apply these professional knowledge, rich practical experience, and unremitting innovative spirit, and the ability to continuously innovate and try in the long-term research process. Only by overcoming these problems can we find a suitable expansion plan in the process of experiment and realize the improvement of storage particle capacity.

[0020] Considering the difficulty and cycle of implementing the above expansion scheme, in order to realize the expansion of the storage device more quickly and easily, the present application chooses to increase the circuit board space to realize the expansion of the storage device. Adding a circuit board has higher flexibility and scalability. As one of the core components of the storage device, the circuit board can be customized and expanded according to demand. When the storage capacity needs to be increased, the expansion is achieved by adding additional circuit boards or extending the circuit board. Compared with the complex expansion operation of the storage particles themselves, it is simpler, more convenient and easier to implement. Secondly, compared with the expansion of storage particles, adding a circuit board can provide better performance and stability. Because the expansion of storage particles may involve more physical and chemical parameter control, the change of these parameters may have unexpected effects. As part of the overall system, the circuit board can work better with other components to provide a more reliable data storage and access experience. In addition, adding a circuit board also means better compatibility and standardization. Circuit boards usually use standardized interfaces and protocols, which makes it easier to integrate and connect the added circuit boards when expanding capacity, reducing the trouble caused by compatibility issues.

[0021] However, the circuit board in the storage device is almost the same as the bottom plate area of ​​the storage device shell, and there is no extra expansion space. Therefore, the present application chooses to utilize the longitudinal space to add an expansion circuit board in a direction perpendicular to the circuit board to form a stacked structure to achieve the expansion of the storage device, and by arranging heat dissipation fins on the upper part of the shell, the storage device containing the stacked structure can effectively dissipate heat, thereby ensuring the performance of the storage device.

[0022] See also Figure 1 , Figure 1 It is a structural diagram of the first embodiment of the storage device in this application.

[0023] like Figure 1 As shown, the storage device 10 includes: a housing 100 and a stacking structure 200 .

[0024] The housing 100 is provided with a receiving cavity, and the housing is provided with heat dissipation fins 110 ; a circuit board is fixed in the stacked structure 200 , and the stacked structure 200 is accommodated in the receiving cavity of the housing 100 .

[0025] Specifically, the heat dissipation fins 110 include a plurality of heat dissipation fins 110 , which are spaced apart on the upper portion of the housing 100 to increase the surface area of ​​the outer surface of the housing 100 , thereby improving the heat dissipation efficiency.

[0026] Among them, the stacked structure 200 may be fixed with multiple circuit boards, and the multiple circuit boards are stacked and connected together in the shell. Without improving the circuit boards, the storage space of the storage device can be expanded by stacking and connecting multiple circuit boards. At this time, the heat generated by the storage device during operation is inevitably higher than the heat generated by the original architecture, thereby affecting the performance of the original storage device. Therefore, on the original shell frame structure, the present application arranges heat dissipation fins on the shell to increase the surface area of ​​the outer surface of the shell, thereby effectively improving the heat dissipation efficiency, and further, for the storage device with a multi-circuit board stacking structure, the heat can also be effectively dissipated to ensure the performance of the storage device.

[0027] The circuit boards described in the present application may be storage-type circuit boards or other types of circuit boards, for example, one circuit board is a main circuit board, and the other circuit boards are sub-circuit boards, for example, the main circuit board is a storage-type circuit board, and the sub-circuit boards are storage-type circuit boards or other types of circuit boards; this embodiment is described by taking the circuit boards as storage-type circuit boards as an example, so as to use the sub-circuit boards as expansion spaces for the main circuit boards. It can be understood by those skilled in the art that when the main circuit board and the sub-circuit boards are storage-type circuit boards, the storage modules in the sub-circuit boards are expanded into storage spaces in the storage circuit boards.

[0028] In this embodiment, heat dissipation fins are arranged on the shell to increase the external surface area of ​​the shell; and according to the principle of heat flow, the heat generated by the circuit board in the stacked structure during operation will flow to the upper part of the shell. Therefore, heat dissipation fins are arranged on the upper part of the shell, which can effectively increase the external surface area of ​​the upper part of the shell, and then effectively dissipate the heat generated in the shell and flowing to the upper part of the shell through the heat dissipation fins, thereby improving the heat dissipation effect of the shell and ensuring the performance of the storage device.

[0029] See also Figure 2 , Figure 2 It is a structural diagram of the second embodiment of the storage device in this application.

[0030] like Figure 2 As shown, the housing 100 includes a lower housing 120 and an upper housing 130 .

[0031] The stacking structure 200 is fixedly arranged on the lower shell 120, and the upper shell 130 is arranged corresponding to the lower shell 120. When the lower shell 120 and the upper shell 130 are combined, a receiving cavity is formed to accommodate the stacking structure in the receiving cavity; and the upper shell 130 is provided with heat dissipation fins 110, thereby increasing the surface area of ​​the outer surface of the upper shell 130.

[0032] Furthermore, the airflow direction of the heat dissipation fins 110 matches the airflow direction of the storage device's environment to remove the heat from the heat dissipation fins, so that the storage device can effectively dissipate the heat from the heat dissipation fins according to the airflow direction of the storage device.

[0033] In some embodiments, the airflow direction for heat dissipation of the storage device can be the heat dissipation airflow direction formed by an externally arranged heat dissipation device. The externally arranged heat dissipation device can be a fan, etc., which can perform external heat dissipation on the outer surface of the storage device, and the airflow direction for heat dissipation by the heat dissipation fins matches the airflow direction for heat dissipation formed by the fan. For example, the airflow direction for heat dissipation formed by the fan is a first direction, and the airflow direction for heat dissipation by the heat dissipation fins is also the first direction, so as to maximize the heat dissipation efficiency.

[0034] In some embodiments, a plurality of heat sink fins extend along a first direction and are spaced apart in a second direction; the first direction is a direction from one side where the external communication interface on the circuit board is located to the other opposite side, and the second direction is perpendicular thereto.

[0035] The external communication interface is arranged at one side edge of the circuit board, for example, the external communication interface on the circuit board is located at a first edge of the circuit board, and the second edge is opposite to the first edge, and the first direction is the direction from the first edge to the second edge. The external communication interface is configured to communicate with an external host; the external communication interface includes a PCIe interface that meets the open interconnection standard CXL (Compute Express Link).

[0036] In some embodiments, the shell is made of aluminum or aluminum alloy.

[0037] Among them, the material of the lower shell 120 is aluminum or aluminum alloy, and the material of the upper shell 130 is also aluminum or aluminum alloy. Under the premise of meeting the structural strength of the shell, the heat dissipation performance of the shell can be improved according to the metal properties of aluminum or aluminum alloy, thereby improving the heat dissipation efficiency of the storage device.

[0038] In some embodiments, a plurality of heat dissipation holes may be provided on the housing (not shown in the figure).

[0039] Specifically, multiple heat dissipation holes are arranged on two opposite sides of the upper shell, and the heat dissipation airflow channel formed by the multiple heat dissipation holes matches the airflow direction for heat dissipation in the environment where the storage device is located, which can effectively bring out the heat inside the storage device to improve the heat dissipation efficiency of the storage device.

[0040] For example, the airflow direction for heat dissipation in the environment where the storage device is located is set to a first direction, and three heat dissipation holes are set on each of the two opposite sides of the upper shell, the first heat dissipation hole on the first side corresponds to the first heat dissipation hole on the second side, forming a first heat dissipation airflow channel; the second heat dissipation hole on the first side corresponds to the second heat dissipation hole on the second side, forming a second heat dissipation airflow channel; the third heat dissipation hole on the first side corresponds to the third heat dissipation hole on the second side, forming a third heat dissipation airflow channel; then the first heat dissipation airflow channel, the second heat dissipation airflow channel and the third heat dissipation airflow channel all match the first direction.

[0041] In this embodiment, the heat dissipation fins and heat dissipation through holes on the shell cooperate to dissipate heat from both the inner surface of the shell and the outer surface of the shell of the storage device, thereby achieving heat dissipation of the storage device with greater efficiency.

[0042] See also Figure 3 , Figure 3 It is a schematic diagram of the top view of the structure of the first embodiment of the heat dissipation fin in the present application.

[0043] like Figure 3 As shown, the heat dissipation fins 110 extend along the first direction and are arranged at intervals in the second direction.

[0044] It can extend from one end of the outer surface of the upper shell 130 to the other opposite end, and multiple heat sink fins are spaced apart in the second direction, so that the air flow direction for heat dissipation by the heat sink fins is also the first direction, and the air flow direction for heat dissipation by the heat sink fins matches the air flow direction for heat dissipation in the environment where the storage device is located, so as to improve the heat dissipation efficiency of the storage device.

[0045] See also Figure 4 , Figure 4 It is a schematic diagram of the top view of the structure of the second embodiment of the heat dissipation fin in the present application.

[0046] like Figure 4 As shown, the heat dissipation fins 110 may also be arranged at intervals in the first direction. Figure 1 and Figure 2 The heat sink fins shown in Figure 4 The structure of the cooling fins.

[0047] That is Figure 3 On this basis, the heat dissipation fins are spaced in the first direction, and each strip-shaped heat dissipation fin is divided into a plurality of block-shaped heat dissipation fins, thereby further increasing the surface area of ​​the outer surface of the upper shell 130, thereby further improving the heat dissipation efficiency of the storage device.

[0048] In this embodiment, by arranging heat sink fins on the upper part of the shell of the storage device, and arranging the heat sink fins to extend along the first direction and to be spaced apart in the second direction, the airflow direction of the heat dissipation by the heat sink fins matches the airflow direction of the heat dissipation in the environment in which the storage device is located, thereby effectively improving the heat dissipation efficiency of the storage device and ensuring the performance of the storage device.

[0049] See also Figure 5 , Figure 5 It is a structural diagram of the third embodiment of the storage device in this application.

[0050] like Figure 5 As shown, the stacked structure includes at least two circuit boards.

[0051] Take two circuit boards as an example, that is, the stacking structure 200 includes a first circuit board 210 and a second circuit board 220, the first circuit board 210 is provided with at least one first expansion interface and a first storage module, the second circuit board 220 is provided with a second expansion interface and a second storage module, a first expansion interface of the first circuit board 210 and a second expansion interface of the second circuit board 220 are matched, and are connected through a connector 300 to supplement the second storage module on the second circuit board 220 as the storage space of the first circuit board 210.

[0052] The connector 300 is arranged between the first circuit board and the second circuit board, and the connector is used to connect at least one first expansion interface of the first circuit board with at least one second expansion interface of the second circuit board, so as to supplement the storage space of the first circuit board with the second storage module arranged in the second circuit board.

[0053] Thermally conductive adhesive 400 is filled between the first circuit board 210 and the shell to transfer the heat generated by the first circuit board 210 to the shell through the thermally conductive adhesive 400, and then the heat of the first circuit board 210 is dissipated through the shell; for example, thermally conductive adhesive 400 is filled between the first circuit board 210 and the lower shell 120, and the heat generated by the first circuit board 210 during operation is transferred to the lower shell 120 through the thermally conductive adhesive 400.

[0054] Among them, thermal conductive adhesive 400 is a single-component, heat-conductive, room-temperature curing silicone adhesive sealant. It undergoes a condensation reaction with moisture in the air to release low-molecular substances, causing cross-linking and curing, and vulcanizes into a high-performance elastomer with good thermal conductivity and electrical insulation properties, which can effectively transfer the heat generated by the circuit board to the housing.

[0055] In some embodiments, the first storage module and the second storage module both include a plurality of storage units disposed on a first surface and a second surface of the circuit board, and the first surface and the second surface are opposite to each other.

[0056] Those skilled in the art will appreciate that by setting the specifications and quantity of the storage units on the second circuit board 220 to be consistent with the specifications and quantity of the storage units on the first circuit board 210, the main control of the first circuit board does not need to change the communication protocol with the storage units, and does not need to make major improvements to the sending of control signals. The storage units on the second circuit board can be controlled directly in accordance with the control method of the storage units on the first circuit board or with reference to the control method of the storage units on the first circuit board.

[0057] In some embodiments, a main control is also provided on the first circuit board, and a first expansion interface is located between the main control and the first storage module. When the first circuit board is expanded, the first expansion interface is configured to connect to a matching second expansion interface of at least one second circuit board through a connector to supplement the storage space of the first circuit board with the second storage module provided in the second circuit board.

[0058] The expansion interfaces described in this application are all standardized connection interfaces with expansion capabilities. The user can connect the second circuit board through the expansion interface to use the second storage module in the second circuit board as the storage space of the first circuit board. It can be understood by those skilled in the art that the expansion interface described in this application is a standardized connection interface, which is dedicated to realizing the connection between the storage circuit board (first circuit board) and the matching expansion capacitor board (second circuit board), so as to expand the storage module in the expansion circuit board (second circuit board) into the storage space in the storage circuit board (first circuit board). The storage circuit board (first circuit board) will not be connected to other types of circuit boards through the first expansion interface, for example, other types of circuit boards without storage modules or other types of circuit boards with other functional electronic devices attached.

[0059] The second expansion interface described in this embodiment is the same as the first expansion interface, and both are standardized connection interfaces with expansion capabilities. The user realizes the connection between the first circuit board and the second circuit board through the expansion interface, so that the storage module on the second circuit board is used as the storage space of the first circuit board. The second expansion interface is formulated in the same standard as the first expansion interface, so that the second expansion interface can be connected to the second expansion interface.

[0060] In the present application, preferably, when the first expansion interface is connected to the second expansion interface of the expansion circuit board to perform data transmission, the data transmission rate between the first expansion interface and the second expansion interface can be designed to be greater than or equal to 2 Gbps.

[0061] In some embodiments, the first circuit board 210 is fixedly disposed on the lower shell so that the circuit board has a stable structure inside the shell, which can effectively avoid the instability of the circuit board connection structure caused by tilting or impact of the shell, and ensure the stability of the contact between the circuit boards.

[0062] In some embodiments, a thermal conductive adhesive 400 is also filled between the second circuit board 220 and the housing to transfer the heat generated by the second circuit board 220 to the housing through the thermal conductive adhesive.

[0063] Specifically, thermal conductive adhesive 400 is filled between the second circuit board 220 and the upper shell 130 so that the heat generated by the second circuit board 220 during operation can be transferred to the upper shell 130 through the thermal conductive adhesive 400, and then dissipated through the heat dissipation fins on the outer surface of the upper shell 130.

[0064] In this embodiment, thermally conductive adhesive is filled between the circuit board and the shell to conduct the heat generated by the circuit board during operation to the shell, and a plurality of heat dissipation fins are arranged at intervals on the upper part of the shell, and the airflow direction of the heat dissipation by the heat dissipation fins matches the airflow direction of the heat dissipation in the environment where the storage device is located, so as to dissipate heat from the outer surface of the shell; further, a plurality of heat dissipation through holes are arranged on two opposite sides of the shell to form a heat dissipation airflow channel that matches the airflow direction of the heat dissipation in the environment where the storage device is located, so as to dissipate heat to the inside of the shell, so as to effectively dissipate heat for the storage device composed of the multi-layer circuit board, thereby ensuring the performance of the storage device.

[0065] In some embodiments, the stacked structure 200 further includes a bottom plate 230 .

[0066] The bottom plate 230 is fixedly arranged at the bottom of the shell, that is, the bottom plate is fixedly arranged on the lower shell, and the first circuit board 210 is fixedly arranged on the bottom plate 230, so that the stacking structure as a whole is fixedly arranged in the accommodating cavity of the shell, so that the storage stacking structure has a stable structure in the shell, which can effectively avoid the instability of the storage stacking structure caused by the tilting or impact of the shell, and ensure the stability of the contact between the circuit boards in the storage stacking structure.

[0067] Among them, the area of ​​the bottom plate 230 is smaller than the area of ​​the first circuit board 210, and the position of the bottom plate 230 corresponds to the position of the connector 300. Therefore, there is still a spare area between the first circuit board 210 and the lower shell 120. The spare area between the first circuit board 210 and the lower shell 120 is filled with thermal conductive adhesive, so that the heat generated by the first circuit board 210 during operation is transferred to the lower shell, thereby dissipating heat.

[0068] In one embodiment, the specification of the housing complies with one of the E3.S specification, the E3.S2T specification, the E3.L specification and the E3.L 2T specification of the network storage.

[0069] The specifications of E3.S are: Height 76mm, Length 112.75mm, Thickness 7.5mm.

[0070] The specifications of E3.S2T are 76mm in height, 112.75mm in length and 16.8mm in thickness.

[0071] The specifications of E3.L are height 76mm, length 142.2mm, and thickness 7.5mm.

[0072] The specifications of E3.L 2T are 76mm in height, 142.2mm in length and 16.8mm in thickness.

[0073] In this application Figure 5In the example, only a first circuit board is shown to be connected to a second circuit board, which is limited by the current E3 specification, as well as the circuit board manufacturing process and the device manufacturing process on the circuit board. It can be imagined that in this application, the first circuit board can be provided with multiple first expansion interfaces, and the first expansion interface can be set at multiple positions on the first side of the first circuit board, and can also be set on the second side of the first circuit board. Both the first side and the second side of the first circuit board can be provided with a first expansion interface to establish a connection with the second expansion interfaces of multiple second circuit boards.

[0074] It is understandable that the first circuit board can be connected to multiple expanded circuit boards, such as the second circuit board and the third circuit board, through a connector; the stacked structure can also fix multiple circuit boards inside the shell.

[0075] All the expanded circuit boards and the first circuit board can be stacked in parallel.

[0076] To sum up, the stacking structure can stack multiple storage circuit boards, which can expand the storage space of the circuit board without the need to make process improvements to the storage particles on the circuit board; and the manufacturing process requirements for the circuit board are not high, the circuit board to be manufactured can still use the current manufacturing process, and the various devices arranged thereon can also use the current manufacturing process or communication standards, without the need for major process improvements. Therefore, by adding circuit boards through the stacking structure, it is possible to conveniently and quickly realize the assembly and fixation of the storage circuit board and the expansion of the storage space in a short time; on this basis, for the storage device corresponding to the multi-layer circuit board, the present application arranges heat dissipation fins on the shell, increases the surface area of ​​the outer surface of the shell, so that the heat transferred to the shell can be dissipated through the heat dissipation fins, thereby improving the heat dissipation efficiency, and can effectively avoid the heat generated by the multi-layer circuit board from affecting the performance of the storage device.

[0077] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only illustrative, for example, the division of the modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0078] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0079] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0080] If the integrated units in the above other embodiments are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), disk or optical disk and other media that can store program codes.

[0081] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A storage device, characterized in that: include: A housing is provided with a receiving cavity and heat dissipation fins; A stacked structure, in which a circuit board is fixed, wherein the stacked structure is accommodated in a receiving cavity of the shell; There are multiple heat dissipation fins, and the multiple heat dissipation fins are arranged at intervals on the upper part of the shell.

2. The storage device according to claim 1, characterized in that The housing comprises: A lower shell, on which the stacked structure is fixedly arranged; An upper shell is arranged corresponding to the lower shell, and the heat dissipation fins are arranged on the upper shell; wherein the lower shell and the upper shell are combined to form the accommodating cavity to accommodate the superimposed structure in the accommodating cavity.

3. The storage device according to claim 2, characterized in that: The airflow direction of the heat dissipation by the heat dissipation fins matches the airflow direction of the heat dissipation in the environment where the storage device is located.

4. The storage device according to claim 3, characterized in that: The circuit board is provided with an external communication interface, which is arranged at one side edge of the circuit board, and the external communication interface is configured to communicate with an external host; The plurality of heat dissipation fins extend along a first direction and are spaced apart in a second direction; wherein the first direction is a direction from one side of the circuit board where the external communication interface is located to another opposite side.

5. The storage device according to claim 4, characterized in that: The plurality of heat dissipation fins are arranged at intervals in the first direction.

6. The storage device according to claim 2, characterized in that: The housing also includes a plurality of heat dissipation holes; The plurality of heat dissipation through holes are arranged on two opposite side surfaces of the upper shell, and the heat dissipation airflow channel formed by the plurality of heat dissipation through holes matches the airflow direction for heat dissipation in the environment where the storage device is located.

7. The storage device according to claim 1, characterized in that: The shell is made of aluminum or aluminum alloy.

8. The storage device according to claim 1, characterized in that: The stacked structure includes at least two circuit boards; A first expansion interface and a first storage module are provided on the first circuit board; a second expansion interface and a second storage module are provided on the second circuit board, and the first expansion interface of the first circuit board and the second expansion interface of the second circuit board are connected through a connector to supplement the second storage module on the second circuit board as the storage space of the first circuit board; Wherein, heat-conducting glue is filled between the first circuit board and the shell, so as to transfer the heat generated by the first circuit board to the shell through the heat-conducting glue.

9. The storage device according to claim 8, characterized in that: Thermally conductive adhesive is filled between the second circuit board and the housing to transfer heat generated by the second circuit board to the housing through the thermally conductive adhesive.

10. The storage device according to claim 8, characterized in that: The stacked structure also includes: A bottom plate, the bottom plate is fixedly arranged at the bottom of the shell; The first circuit board is fixed on the bottom plate so as to transfer the heat generated by the first circuit board to the housing through the bottom plate.

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