Device for enhancing silicon wafer cleaning effect of N-type alkali polishing process trough machine

Abstract

The utility model discloses a silicon wafer cleaning effect enhancing device for an N-type alkali polishing process trough machine, which belongs to the technical field of wet-process alkali polishing trough machines for solar cells and comprises a hydrochloric acid tank, a water tank, a spraying tank, a water tank, a slow lifting tank and a drying tank which are connected in series. The spraying tank comprises a main tank and a water storage auxiliary tank, the main tank comprises a tank cover spraying pipe and tank wall spraying pipes which are respectively connected with the tank cover spraying pipe in the vertical direction, and a tank base spraying pipe is arranged between the two tank wall spraying pipes; a hot water inlet pipeline and a cold water inlet pipeline are respectively arranged above the auxiliary water storage tank; the water storage auxiliary tank is provided with an auxiliary tank high liquid level sensor, an auxiliary tank working liquid level sensor and an auxiliary tank low liquid level sensor according to the high-low sequence. According to the utility model, the problems of more degradation and more abnormities of a production line are solved, the EL yield and appearance yield of the solar cell are further improved, and the value of a single finished product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of a wet alkali polishing tank machine for solar cell sheets, and is a device for improving the cleaning effect of the alkali polishing machine, in particular a device for enhancing the cleaning effect of silicon wafers in a tank machine for an N-type alkali polishing process. Background Art

[0002] As solar power generation grows stronger and photovoltaic cells develop rapidly, the cost of raw silicon in the photovoltaic industry remains high, and the requirements for product EL and appearance are getting higher and higher. When the alkaline polishing tank cleaning effect is not good, the poly process will cause the poly film to burst after crystallization during the annealing process when preparing the poly film.

[0003] In response to such problems, there are many abnormal feedbacks from the back-end, which need to be solved urgently. Now we need to make targeted solutions to such phenomena, so as to reduce the occurrence of abnormalities, reduce the downgrade rate and customer complaint risks. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a spray tank device for transforming the water tank of a trough machine in the topcon alkali polishing process, which has the advantages of improving the disadvantage of film bursting at the flower basket position during the process, solving the problems of frequent production line degradation and abnormalities, thereby improving the EL yield and appearance yield of solar cells, and improving the value of single finished films.

[0005] The utility model is implemented as follows: To achieve the above-mentioned purpose, the utility model provides the following technical solutions: After a batch of flower baskets pass through the acid tank, they are first grabbed by a robotic arm and passed through a water tank and bubbling is turned on to first clean the hydrochloric acid and silicate attached to the silicon wafers, and then the robotic arm grabs them to the spray tank, and after entering the spray tank, spraying is turned on. The upper spray, tank wall spray, and lower spray can clean the residues attached to the flower basket teeth position to the greatest extent, and then the robotic arm grabs them to the water tank for cleaning again, and then the robotic arm grabs them to the slow pulling tank for pre-dehydration. When the flower basket reaches the unloading, the appearance of the flower basket teeth position is checked, and the foreign matter attached to the silicon wafer is significantly reduced by observation through a microscope.

[0006] The specific plan is:

[0007] The utility model discloses a spray device used after a hydrochloric acid tank in a tank-type machine of an N-type topcon battery alkali polishing process, belongs to the field of solar cell manufacturing, improves the shortcomings of residual hydrochloric acid and silicate on silicon wafers in the alkali polishing process, solves the problem that poly film bursting occurs at a basket tooth position on the appearance after a poly process and annealing crystallization due to residual substances on silicon wafers polished in the production line. The utility model mainly comprises an upper spray port arranged on a tank cover, a middle spray port arranged in the tank, a lower spray port arranged on the bottom, and a sub-tank is added to the rear of the machine to ensure that the silicon wafer can be in a spraying state all the time, so as to ensure the spraying effect. Specifically, the device includes: a hydrochloric acid tank, a spray tank, a water tank, a slow pulling tank, and a drying tank; the spray tank includes a main tank, and the main tank includes a plurality of spray pipes, namely, a tank cover spray pipe, and tank wall spray pipes vertically connected to the tank cover spray pipe, and a tank base spray pipe is between the two tank wall spray pipes; the spray pipe of the main tank is connected to the water storage sub-tank; a hot water inlet pipe and a cold water inlet pipe are respectively arranged above the water storage sub-tank; the water storage sub-tank is respectively provided with a sub-tank high liquid level sensor, a sub-tank working liquid level sensor, and a sub-tank low liquid level sensor in order of height.

[0008] Furthermore, a drain port is provided at the bottom of the spray tank; spray holes are provided on the inner sides of the tank cover spray pipe, tank wall spray pipe and tank base spray pipe. According to the above spray device, a tank cover spray pipe, two tank wall spray pipes and tank base spray pipe are added to the original water tank for spraying, and a water storage tank is added for water storage. The temperature of the water storage tank is controlled by the hot water inlet pipe, the cold water inlet pipe and the thermometer reaction temperature to adjust the hot and cold water ratio on the central control computer to achieve the desired temperature.

[0009] Furthermore, a secondary tank water outlet pipe is provided at a position corresponding to the secondary tank working liquid level sensor of the water storage secondary tank.

[0010] Furthermore, the water storage sub-tank has three liquid level sensors, namely, a sub-tank low liquid level sensor, a sub-tank working liquid level sensor, and a sub-tank high liquid level sensor; the high liquid level sensor is used to control the liquid level, when the water level in the sub-tank is lower than the high liquid level sensor, water is added to the sub-tank; the sub-tank working liquid level sensor is used to control the working liquid level, when the liquid level is lower than the sub-tank working liquid level sensor, the main tank body does not work, and the water storage sub-tank continues to be added with water; the sub-tank low liquid level sensor is a safety protection liquid level, when the liquid level is lower than the low liquid level sensor, the pump does not start, which is used to protect the pump from dry burning.

[0011] Furthermore, the tank cover spray pipe performs upward spraying, the tank wall spray pipe performs tank wall spraying, and the tank base spray pipe performs downward spraying.

[0012] The warm water sprayed by the spray pipe in the utility model must reach the set temperature, and there must be no water residue in the tank (the drain port is in a state of continuous drainage). The tank cover spray pipe, the two tank wall spray pipes, and the tank base spray pipe are made of deformation-resistant plastic PVC structure. The storage water auxiliary tank is a PVDF corrosion-resistant structure. The hot and cold water inlet and outlet pipes are made of deformation-resistant plastic PVC structure. The auxiliary tank low liquid level sensor, auxiliary tank working liquid level sensor, and auxiliary tank high liquid level sensor need to have the ability to identify the liquid level and respond to the central control computer. The thermometer needs to respond to the central control computer.

[0013] The utility model discloses a device for enhancing the cleaning effect of silicon wafers in a slot machine of an N-type alkali polishing process, which is characterized by:

[0014] The required spray water temperature is set by the central control computer; during spraying, the drain port is always open to prevent foreign matter from being soaked and attached;

[0015] The storage water auxiliary tank has three liquid level sensors, namely, the auxiliary tank low liquid level sensor, the auxiliary tank working liquid level sensor, and the auxiliary tank high liquid level sensor; the high liquid level sensor controls the liquid level. When the auxiliary tank water level is lower than the high liquid level sensor, the auxiliary tank is filled with water; the auxiliary tank working liquid level sensor controls the working liquid level. When the liquid level is lower than the auxiliary tank working liquid level sensor, the main tank body does not work, and the storage water auxiliary tank continues to add water.

[0016] After a flower basket is grabbed by the robot arm and enters the main tank, the drain port is opened and is in a state of continuous draining. The water storage tank is constantly filled with water. The tank cover spray pipe sprays on the tank wall spray pipe sprays on the tank wall, and the tank base spray pipe sprays on the bottom to clean the hydrochloric acid, silicates, inorganic salts and other substances attached to the silicon wafers.

[0017] After the spray tank is finished, the robot arm grabs it to the water tank for cleaning, and then enters the slow pull tank for pre-dehydration; then it enters the drying tank for drying to clean the attachments on the silicon wafer at the basket tooth position to the greatest extent, preparing for the subsequent preparation of the poly film.

[0018] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0019] A spray tank device for transforming the water tank of a trough machine in the topcon alkali polishing process can be promoted and used in normal production. When in use, after the flower basket enters the spray tank, the spray device and the drain valve are opened at the same time, and the sub-tank liquid level sensor monitors the liquid level to ensure the spraying effect. This technology is currently only used to solve the poor cleaning effect after alkali polishing and solve the problem of poly film bursting. This technology can also be widely used in texturing, primary alkali polishing, and RCA machines, which improves the EL yield and appearance yield of solar cells and the value of single finished films. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1This is a schematic diagram of the structure of a device for enhancing the cleaning effect of silicon wafers in a slot-type machine for an N-type alkali polishing process according to the utility model;

[0021] Among them, 1-tank cover spray pipe, 2-tank wall spray pipe, 3-tank base spray pipe, 4-drain port, 5-storage water sub-tank, 6-hot water inlet pipe, 7-cold water inlet pipe, 8-sub-tank outlet pipe, 9-1-sub-tank low liquid level sensor, 9-2-sub-tank working liquid level sensor, 9-3-sub-tank high liquid level sensor, 10-thermometer. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1 The utility model is a device for enhancing the cleaning effect of silicon wafers in a slot machine for an N-type alkali polishing process, characterized in that the device comprises: a hydrochloric acid slot, a spray slot, a water slot, a slow pull slot, and a drying slot; the spray slot comprises a main slot, and the main slot comprises a plurality of spray pipes, namely, a slot cover spray pipe 1, and slot wall spray pipes 2 respectively connected to the slot cover spray pipe 1 in a vertical direction, and a slot base spray pipe 3 is provided between the two slot wall spray pipes 2; a liquid discharge port 4 is provided at the bottom of the spray slot; spray holes are provided on the inner sides of the slot cover spray pipe 1, the slot wall spray pipe 2, and the slot base spray pipe 3. The slot cover spray pipe 1 performs upper spraying, the slot wall spray pipe 2 performs slot wall spraying, and the slot base spray pipe 3 performs lower spraying.

[0024] The spray pipe of the main tank is connected to the water storage tank 5. A hot water inlet pipe 6 and a cold water inlet pipe 7 are respectively arranged above the water storage tank 5. The connection of the water storage tank 5 in the tank machine is the same. The water storage tank is arranged behind the machine to facilitate the water supply of the machine. The tank cover spray pipe 1, tank wall spray pipe 2 and tank base spray pipe 3 are spray pipes. The water outlet pipe of the auxiliary tank is directly connected to the tank body spray pipe. The water storage tank 5 is behind the machine, parallel to the main tank, and is connected to the spray pipe through a pipe (power is provided by a circulating pump).

[0025] The sub-tank 5 for storing water is provided with a sub-tank high liquid level sensor 9-3, a sub-tank working liquid level sensor 9-2, and a sub-tank low liquid level sensor 9-1 in descending order. A sub-tank water outlet pipe 8 is provided at the position corresponding to the sub-tank working liquid level sensor 9-2 of the sub-tank 5 for storing water. The sub-tank 5 for storing water has three liquid level sensors, namely, a sub-tank low liquid level sensor 9-1, a sub-tank working liquid level sensor 9-2, and a sub-tank high liquid level sensor 9-3; the high liquid level sensor 9-3 is used to control the liquid level. When the water level in the sub-tank is lower than the high liquid level sensor 9-3, water is added to the sub-tank; the sub-tank working liquid level sensor 9-2 is used to control the working liquid level. When the liquid level is lower than the sub-tank working liquid level sensor 9-2, the main tank body does not work, and the sub-tank 5 for storing water continues to add water; the sub-tank low liquid level sensor 9-1 is a safety protection liquid level. When the liquid level is lower than the low liquid level sensor, the pump does not start, which is used to protect the pump from dry burning.

[0026] The working principle flow of the above embodiment is as follows:

[0027] After a batch of flower baskets pass through the acid tank, they are first grabbed by a robotic arm and passed through a water tank and bubbled. First, the hydrochloric acid and silicate attached to the silicon wafers are cleaned off. Then, the robotic arm grabs them to the spray tank. After entering the spray tank, spraying is turned on. The upper spray, tank wall spray, and lower spray can clean the residue attached to the flower basket teeth to the greatest extent.

[0028] Next, the robot arm grabs it to the water tank for cleaning again, and then grabs it to the slow pull tank for pre-dehydration. This utility model gets rid of the traditional water tank bubbling circulation, and uses spraying to wash the dirt on the flower basket teeth to the greatest extent.

[0029] The working process of the device is:

[0030] The required spray water temperature is set by the central control computer; during spraying, the drain port 4 is always open to prevent foreign matter from being soaked and attached;

[0031] The water storage sub-tank 5 has three liquid level sensors, namely, the sub-tank low liquid level sensor 9-1, the sub-tank working liquid level sensor 9-2, and the sub-tank high liquid level sensor 9-3; the high liquid level sensor 9-3 controls the liquid level, and when the water level in the sub-tank is lower than the high liquid level sensor 9-3, the sub-tank is filled with water; the sub-tank working liquid level sensor 9-2 controls the working liquid level, and when the liquid level is lower than the sub-tank working liquid level sensor 9-2, the main tank body does not work, and the water storage sub-tank 5 continues to be filled with water;

[0032] After a flower basket is grabbed by the robot arm and enters the main tank, the drain port 4 is opened and is in a state of continuous draining, the water storage tank 5 is continuously filled with water, and the tank cover spray pipe 1 sprays upward, the tank wall spray pipe 2 sprays the tank wall, and the tank base spray pipe 3 sprays downward to clean the hydrochloric acid, silicates, inorganic salts and other substances attached to the silicon wafers;

[0033] After the spray tank is finished, the robot arm grabs it to the water tank for cleaning, and then enters the slow pull tank for pre-dehydration; then it enters the drying tank for drying to clean the attachments on the silicon wafer at the basket tooth position to the greatest extent, preparing for the subsequent preparation of the poly film.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for enhancing the cleaning effect of silicon wafers in a slot machine for an N-type alkali polishing process, characterized in that: The device comprises: a hydrochloric acid tank, a spray tank, a water tank, a slow pulling tank, and a drying tank; The spray tank comprises a main tank, and the main tank comprises a plurality of spray pipes, namely a tank cover spray pipe (1), and tank wall spray pipes (2) respectively connected to the tank cover spray pipe (1) in a vertical direction, and tank base spray pipes (3) are arranged between the tank wall spray pipes (2); The spray pipe of the main tank is connected to the water storage sub-tank (5); a hot water inlet pipe (6) and a cold water inlet pipe (7) are respectively arranged above the water storage sub-tank (5); the water storage sub-tank (5) is respectively provided with a sub-tank high liquid level sensor (9-3), a sub-tank working liquid level sensor (9-2), and a sub-tank low liquid level sensor (9-1) in descending order.

2. The device for enhancing the cleaning effect of silicon wafers in a slot machine for an N-type alkali polishing process according to claim 1, characterized in that: A liquid discharge port (4) is arranged at the bottom of the spray tank; spray holes are arranged inside the tank cover spray pipe (1), the tank wall spray pipe (2) and the tank base spray pipe (3).

3. The device for enhancing the cleaning effect of silicon wafers in a slot machine for an N-type alkali polishing process according to claim 1, characterized in that: A sub-tank water outlet pipe (8) is provided at a position corresponding to the sub-tank working liquid level sensor (9-2) of the water storage sub-tank (5); a thermometer (10) is also provided in the water storage sub-tank (5).

4. The device for enhancing the cleaning effect of silicon wafers in a slot machine for an N-type alkali polishing process according to claim 1, characterized in that: The water storage sub-tank (5) has three liquid level sensors, namely, a sub-tank low liquid level sensor (9-1), a sub-tank working liquid level sensor (9-2), and a sub-tank high liquid level sensor (9-3); the high liquid level sensor (9-3) is used to control the liquid level. When the water level in the sub-tank is lower than the high liquid level sensor (9-3), water is added to the sub-tank; the sub-tank working liquid level sensor (9-2) is used to control the working liquid level. When the liquid level is lower than the sub-tank working liquid level sensor (9-2), the main tank body does not work, and the water storage sub-tank (5) continues to add water; the sub-tank low liquid level sensor (9-1) is a safety protection liquid level. When the liquid level is lower than the low liquid level sensor, the pump does not start, which is used to protect the pump from dry burning.

5. The device for enhancing the cleaning effect of silicon wafers in a slot machine for an N-type alkali polishing process according to claim 1, characterized in that: The tank cover spray pipe (1) performs upward spraying, the tank wall spray pipe (2) performs tank wall spraying, and the tank base spray pipe (3) performs downward spraying.

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