Wafer transfer assembly capable of leveling

Abstract

The utility model discloses a wafer transfer assembly capable of leveling, which comprises a mounting rack, three vertically stacked transfer discs are arranged at the tail end of the mounting rack, a first transfer disc is fixed on the mounting rack, a second transfer disc is positioned below the first transfer disc, an air cylinder is arranged at the tail end of the mounting rack, and an air cylinder rod penetrates through the first transfer disc and is connected with the second transfer disc; a plurality of screw holes are formed in the first transfer disc, and adjusting jackscrews are arranged in the screw holes; the air cylinder can drive the second transfer disc to abut against or be separated from the adjusting jackscrew. A plurality of adjusting screws are arranged at the ends of the third transfer disc and the second transfer disc, one end of each adjusting screw is fixed to the third transfer disc, and the other end of each adjusting screw penetrates through a second through hole in the end of the second transfer disc and is locked and fixed through a second nut. According to the utility model, the ceramic adsorption table board is provided with two gradients, so that two table boards with different gradients are matched, wafers are convenient to transfer, the use requirements of different gradients can be met, and the universality is good.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer equipment, in particular to a wafer transfer component that can be leveled. Background Art

[0002] In the production process of semiconductor devices, wafers are usually picked up and fed by robots. In some processing stations, such as cleaning stations and debonding stations, the same robot is used to feed and pick up materials. When transferring some wafers, a ceramic adsorption table is needed to adsorb the wafers. The ceramic adsorption table is suitable for transferring wafers between two tables of the same level. When the robot needs to transfer wafers between different devices, the inclination of the loading tables on different devices may be different. When the ceramic adsorption table adsorbs the wafer, there is an angle between the two, which makes the wafer unable to be adsorbed, or the wafer may be misaligned or damaged during transfer. Utility Model Content

[0003] In order to solve the above problems, the utility model provides a wafer transfer component with adjustable leveling, which can adjust the horizontality of the ceramic adsorption table for multiple times, so that it can be used to transfer wafers on tables with different inclinations.

[0004] To this end, the technical solution of the utility model is: a levelable wafer transfer assembly, including a mounting frame, three vertically stacked transfer plates are provided at the end of the mounting frame, the first transfer plate is fixed on the mounting frame, and the second transfer plate is located below the first transfer plate, and a vertically arranged cylinder is provided at the end of the mounting frame, and the cylinder rod passes through the first transfer plate and is connected to the second transfer plate; the first transfer plate is provided with a plurality of through screw holes, and the screw holes are provided with adjusting top screws; the cylinder can drive the second transfer plate to abut or separate from the adjusting top screw; a third transfer plate is provided below the second transfer plate, and a plurality of adjusting screws are provided at the ends of the third transfer plate and the second transfer plate, one end of the adjusting screw is fixed on the third transfer plate, and the other end passes through the second through hole at the end of the second transfer plate and is locked and fixed by a second nut; a ceramic adsorption table is installed below the third transfer plate.

[0005] On the basis of the above scheme and as a preferred scheme of the above scheme: a spring is sleeved on the adjusting screw, and two ends of the spring are respectively against the second transfer plate and the third transfer plate.

[0006] On the basis of the above scheme and as a preferred scheme of the above scheme: the positions of the adjusting top screw and the adjusting screw rod are staggered with each other.

[0007] On the basis of the above scheme and as a preferred scheme of the above scheme: a connecting screw is provided between the first transfer disk and the second transfer disk, one end of the connecting screw is fixed on the second transfer disk, and the other end passes through the first through hole at the end of the first transfer disk and is locked and fixed by a first nut.

[0008] On the basis of the above scheme and as a preferred scheme of the above scheme: the first transfer disk is provided with three evenly divided first connecting parts, the second transfer disk is provided with six evenly divided second connecting parts, and the third transfer disk is provided with three evenly divided third connecting parts; the first connecting part of the first transfer disk and the third connecting part of the third transfer disk are staggered and are respectively connected to the second connecting part of the second transfer disk.

[0009] On the basis of the above scheme and as a preferred scheme of the above scheme: the first through hole and the screw hole of the first transfer plate are located in the first connecting part, and the height of the adjusting screw in the screw hole is adjusted by rotation.

[0010] The utility model is suitable for transferring wafers on screw tables with different inclinations:

[0011] 1) In the initial state, the cylinder rod of the cylinder is extended, and the second transfer plate has no contact with the adjusting top screw on the first transfer plate;

[0012] 2) According to the inclination of the first table, the second nut is rotated to adjust the distance between the second transfer plate and the end of the third transfer plate, so that the third transfer plate is tilted. At this time, it is the first inclination, that is, the ceramic adsorption table is at the first inclination, parallel to the first table, and the second transfer plate is in a horizontal state;

[0013] 3) The robot drives the ceramic adsorption table to adsorb the wafer on the first table and move it to the top of the second table;

[0014] 4) The cylinder contracts the cylinder rod, so that the distance between the second transfer plate and the first transfer plate is reduced, and the second transfer plate abuts against the adjusting top screw;

[0015] 5) According to the inclination of the second table, the top screw is rotated and adjusted to make the second transfer plate tilted, and finally the second transfer plate drives the third transfer plate to tilt together, so that the third transfer plate has the second inclination, that is, the ceramic adsorption table is at the second inclination and is parallel to the second table;

[0016] 6) The robot drives the ceramic adsorption table to place the wafer on the second table;

[0017] 7) When transferring the next wafer, the cylinder extends the cylinder rod, the second transfer plate leaves the limit of the adjusting screw and returns to the horizontal state, then the third transfer plate is at the first inclination, that is, the ceramic adsorption table is at the first inclination, which is convenient for picking up the wafer on the first table;

[0018] 8) After picking up the wafer, the cylinder contracts the cylinder rod, and the second transfer plate abuts against the adjusting top screw. Restricted by the adjusting top screw, the third transfer plate is at the second inclination, that is, the ceramic adsorption table is at the second inclination, which facilitates placing the wafer on the second table;

[0019] 9) Repeat the above steps until all wafers are picked up.

[0020] Compared with the prior art, the beneficial effects of the utility model are: two inclinations are set for the ceramic adsorption table, so as to match two tables with different inclinations, which is convenient for transferring wafers; the cylinder rod of the cylinder is used to switch the inclination of the ceramic adsorption table, and the inclination switching is faster and more convenient, and the inclination is adjusted by adjusting the top screw and the adjusting screw, which can meet the use requirements of different inclinations and has good versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings.

[0022] Figure 1 It is a structural schematic diagram of the utility model;

[0023] Figure 2 It is an exploded view of the parts of the utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the transfer plate of the utility model;

[0025] Figure 4 This is an exploded view of the parts of the transfer plate of the utility model;

[0026] Figure 5 This is a schematic diagram of the adjustment principle between the second transfer plate and the third transfer plate of the utility model;

[0027] Figure 6 This is a schematic diagram of the adjustment principle between the first transfer plate and the second transfer plate of the utility model.

[0028] Marked in the figure are: mounting frame 1, first transfer plate 2, first connecting part 21, screw hole 22, third through hole 23, second transfer plate 3, second connecting part 31, third transfer plate 4, third connecting part 41, adjusting top screw 5, cylinder 6, connecting screw 7, first nut 71, adjusting screw 8, second nut 81, spring 82, spring steel sheet 9, ceramic adsorption table 10. DETAILED DESCRIPTION

[0029] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" and "a number" is two or more, unless otherwise clearly and specifically defined.

[0031] See the attached drawings. The wafer transfer assembly described in this embodiment includes a mounting frame 1, at the end of which three vertically stacked transfer trays are provided, which are a first transfer tray 2, a second transfer tray 3 and a third transfer tray 4 from top to bottom.

[0032] The first transfer plate 2 is fixed on the mounting frame 1, and the middle of the first transfer plate 2 is a circular structure. Three evenly distributed first connecting parts 21 are provided on the outer side of the first transfer plate 2. The ends of the first connecting parts 21 are provided with screw holes 22 and first through holes. An adjusting top screw 5 is screwed into the screw hole 22, and the lower end of the adjusting top screw 5 extends below the first transfer plate 2.

[0033] A vertically arranged cylinder 6 is provided above the first transfer disk 2, and the cylinder rod of the cylinder 6 passes through the third through hole 23 in the middle of the first transfer disk 2 and is connected to the second transfer disk 3, and the cylinder rod is not connected to the first transfer disk. Six equally divided second connecting parts 31 are provided on the second transfer disk 3, wherein the first, third and fifth second connecting parts 31 are opposite to the first connecting part 21 of the first transfer disk 2. A connecting screw 7 is provided between the first transfer disk 2 and the second transfer disk 3, one end of the connecting screw 7 is fixed on the second transfer disk 3, and the other end passes through the first through hole at the end of the first transfer disk 2 and is locked and fixed by a first nut 71. The connecting screw does not limit the distance between the first transfer disk and the second transfer disk, but is only used to prevent the first transfer disk and the second transfer disk from rotating or disengaging.

[0034] The third transfer disk 4 is provided with three evenly divided third connecting parts 41, which are opposite to the 2nd, 4th and 6th second connecting parts 31 on the second transfer disk 3, and the ends of the 2nd, 4th and 6th second connecting parts 31 are provided with second through holes, and the third transfer disk 4 and the ends of the second transfer disk 3 are provided with multiple adjusting screws 8, one end of the adjusting screw 8 is fixed on the third transfer disk 4, and the other end passes through the second through hole at the end of the second transfer disk 3, and is locked and fixed by a second nut 81; a spring 82 is mounted on the adjusting screw 8, and the two ends of the spring 82 are respectively against the second transfer disk 3 and the third transfer disk 4.

[0035] A spring steel sheet 9 is also installed between the first transfer disk 2 and the third transfer disk 4 to prevent the transfer disks from deflecting, but will not interfere with the tilting of the third transfer disk.

[0036] A ceramic adsorption table 10 is installed below the third transfer plate 4 , and a plurality of vent holes connected to negative pressure equipment are arranged on the ceramic adsorption table for adsorbing wafers.

[0037] This embodiment is suitable for transferring wafers on screw tables with different inclinations:

[0038] 1) In the initial state, the cylinder rod of the cylinder 6 is extended, and the second transfer plate 3 is not in contact with the adjusting top screw 5 on the first transfer plate 2;

[0039] 2) According to the inclination of the first table, the second nut 81 is rotated to adjust the distance between the ends of the second transfer plate 3 and the third transfer plate 4, so that the third transfer plate 4 is tilted. At this time, it is the first inclination, that is, the ceramic adsorption table is at the first inclination, parallel to the first table, and the second transfer plate 3 is in a horizontal state; Figure 5 As described above, since the inclination is relatively small, the adjusting screw can be slightly offset at the second through hole without interfering with the leveling;

[0040] 3) The robot drives the ceramic adsorption table 10 to adsorb the wafer on the first table and move it to the top of the second table;

[0041] 4) The cylinder 6 contracts the cylinder rod, so that the distance between the second transfer plate 3 and the first transfer plate 2 is reduced, and the second transfer plate 3 abuts against the adjusting top screw 5;

[0042] 5) According to the inclination of the second table, the top screw 5 is rotated and adjusted to make the second transfer plate 3 tilted, and finally the second transfer plate 3 drives the third transfer plate 4 to tilt together, so that the third transfer plate 4 has a second inclination, that is, the ceramic adsorption table 10 is at the second inclination, parallel to the second table; Figure 6 As shown, because the inclination is relatively small, the connecting screw can be slightly offset at the first through hole without interfering with the leveling;

[0043] 6) The robot drives the ceramic adsorption table 10 to place the wafer on the second table;

[0044] 7) When transferring the next wafer, the cylinder 6 extends the cylinder rod, the second transfer plate 3 leaves the limit of the adjusting screw 5 and returns to the horizontal state, then the third transfer plate 4 is at the first inclination, that is, the ceramic adsorption table is at the first inclination, which is convenient for picking up the wafer on the first table;

[0045] 8) After picking up the wafer, the cylinder 6 contracts the cylinder rod, and the second transfer plate 3 abuts against the adjusting top screw 5. Restricted by the adjusting top screw 5, the third transfer plate is at the second inclination, that is, the ceramic adsorption table is at the second inclination, which facilitates placing the wafer on the second table;

[0046] 9) Repeat the above steps until all wafers are picked up.

[0047] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A wafer transfer assembly capable of being leveled, characterized in that: It includes a mounting frame, and three vertically stacked transfer plates are provided at the end of the mounting frame, the first transfer plate is fixed on the mounting frame, and the second transfer plate is located below the first transfer plate, and a vertically arranged cylinder is provided at the end of the mounting frame, and the cylinder rod passes through the first transfer plate and is connected to the second transfer plate; the first transfer plate is provided with a plurality of penetrating screw holes, and the screw holes are provided with adjusting top screws; the cylinder can drive the second transfer plate to abut or separate from the adjusting top screw; a third transfer plate is provided below the second transfer plate, and a plurality of adjusting screws are provided at the ends of the third transfer plate and the second transfer plate, one end of the adjusting screw is fixed on the third transfer plate, and the other end passes through the second through hole at the end of the second transfer plate and is locked and fixed by a second nut; a ceramic adsorption table is installed below the third transfer plate.

2. The wafer transfer assembly capable of being leveled according to claim 1, characterized in that: The adjusting screw rod is sleeved with a spring, and two ends of the spring are respectively against the second transfer plate and the third transfer plate.

3. The levelable wafer transfer assembly according to claim 1, characterized in that: The positions of the adjusting top screw and the adjusting screw rod are staggered with each other.

4. The levelable wafer transfer assembly according to claim 1, characterized in that: A connecting screw is provided between the first transfer disk and the second transfer disk. One end of the connecting screw is fixed on the second transfer disk, and the other end passes through the first through hole at the end of the first transfer disk and is locked and fixed by a first nut.

5. The levelable wafer transfer assembly according to claim 1, characterized in that: The first transfer disk is provided with three evenly divided first connecting parts, the second transfer disk is provided with six evenly divided second connecting parts, and the third transfer disk is provided with three evenly divided third connecting parts; the first connecting part of the first transfer disk and the third connecting part of the third transfer disk are staggered and are respectively connected to the second connecting part of the second transfer disk.

6. The wafer transfer assembly capable of being leveled according to claim 5, characterized in that: The first through hole and the screw hole of the first transfer plate are located at the first connecting portion, and the height of the adjusting screw in the screw hole is adjusted by rotation.

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