Silicon wafer separating device

Abstract

The utility model provides a silicon wafer separating device, which is characterized by comprising a wafer carrying table used for carrying a silicon wafer group, and the silicon wafer group comprises a plurality of silicon wafers stacked along the vertical direction; the lifting assembly can drive the slide holder to lift; the limiting assembly is used for limiting the horizontal movement of the silicon wafer; the adsorption assembly comprises a vibration piece and a suction cup, the suction cup is arranged above the wafer carrying table in a lifting mode, the suction cup can adsorb the silicon wafer, and the vibration piece can drive the suction cup to vibrate. According to the invention, silicon wafers which are adhered to each other can be separated, so that the effect of taking a single silicon wafer is realized.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor production technology, in particular to a silicon wafer separation device. Background Art

[0002] Silicon wafer is a thin, flat, round silicon matrix material, which is commonly used in the preparation of integrated circuit manufacturing and other semiconductor devices. It is one of the most common substrate materials in the semiconductor industry.

[0003] In the related art, for the convenience of operation, multiple silicon wafers are often placed in a stack before testing. However, due to the influence of the front-end process of the silicon wafer, the flatness of the silicon wafer is relatively high, which makes the stacked silicon wafers stick together more frequently. When taking the silicon wafer on the top of the stack, it is easy to take multiple silicon wafers at a time due to the sticking phenomenon, affecting the normal production of the equipment. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a silicon wafer separation device, which has the effect of separating silicon wafers that are adhered to each other and taking a single silicon wafer.

[0005] The utility model according to the embodiment of the utility model provides a silicon wafer separation device, characterized in that it includes: a wafer carrier, which is used to carry a silicon wafer group, and the silicon wafer group includes multiple silicon wafers stacked vertically; a lifting component, which can drive the wafer carrier to rise and fall; a limit component, which is used to limit the horizontal movement of the silicon wafer; an adsorption component, which includes a vibrator and a suction cup, the suction cup can be lifted and lowered above the wafer carrier, the suction cup can adsorb the silicon wafer, and the vibrator can drive the suction cup to vibrate.

[0006] A silicon wafer separation device according to an embodiment of the utility model includes at least the following beneficial effects: when the suction cup needs to adsorb the silicon wafer, the wafer carrier is driven up by the lifting assembly, and the horizontal movement of the silicon wafer is restricted by the limit assembly, so that the suction cup can descend to adsorb the silicon wafer; since silicon wafers are prone to adhesion, the suction cup can easily pick up multiple silicon wafers at one time; at this time, a vibration force is generated by the vibrating member to drive the suction cup to vibrate, so that the adhesion force between the two silicon wafers is reduced by the vibration force, so that the excess silicon wafers in the adsorbed silicon wafers fall back into the silicon wafer group, thereby achieving the removal of a single silicon wafer, thereby solving the problem of picking up multiple silicon wafers at one time due to adhesion.

[0007] According to some embodiments of the utility model, the silicon wafer separation device includes a vertically arranged fixed plate, the lifting assembly is arranged on the fixed plate, the lifting assembly includes a slide rail, a slide plate, a drive motor, and a screw rod, the slide rail is vertically arranged on one side of the fixed plate, the slide plate is slidably matched with the slide rail, the drive motor is arranged at the bottom of the slide rail, the screw rod is vertically arranged, the bottom of the screw rod is fixedly connected to the output end of the drive motor, a screw hole is opened on the slide plate, the screw rod is threadedly matched with the screw hole, and one side of the wafer carrier is fixedly connected to the slide plate.

[0008] According to some embodiments of the utility model, a support frame is provided on the fixed plate, a support plate is provided on one side of the slide plate, the support plate is located below the wafer carrier, the limit assembly is carried on the support plate, the limit assembly includes an elastic member and a plurality of limit rods, the elastic member is carried on the support plate, the plurality of limit rods are distributed at intervals along the circumference of the silicon wafer, the limit rods are vertically arranged, a plurality of waist-shaped holes are opened on the wafer carrier, the plurality of waist-shaped holes correspond one by one to the plurality of limit rods respectively, the waist-shaped holes are opened along the radial direction of the silicon wafer, the bottom end of the limit rod is supported by the elastic member, the top end passes through the waist-shaped hole and extends vertically upward, the elastic member can simultaneously drive the plurality of limit rods along the length direction of the waist-shaped hole to approach or move away from the silicon wafer group.

[0009] According to some embodiments of the utility model, the tensioner includes a clamping cylinder and a plurality of transmission rods, the clamping cylinder is arranged on the support plate, the plurality of transmission rods respectively correspond to the plurality of limiting rods, one end of the transmission rod is connected to the clamping cylinder, and the other end is connected to the limiting rod, and the clamping cylinder can drive the plurality of transmission rods to expand or contract.

[0010] According to some embodiments of the present invention, the adsorption assembly includes a lifting member, and the lifting member is used to drive the suction cup to rise and fall.

[0011] According to some embodiments of the utility model, the lifting member includes a cylinder and an adapter seat, the cylinder is fixedly connected to the fixed plate via a connecting frame, one side of the adapter seat is connected to the cylinder, the cylinder can drive the adapter seat to rise and fall, the suction cup is movably arranged at the bottom of the adapter seat, and the vibrator is arranged between the adapter seat and the suction cup.

[0012] According to some embodiments of the utility model, the vibration member includes a guide rod, a limit plate, a vibration motor and an elastic member, the limit plate is movably arranged above the adapter, a through hole is formed through the top of the adapter, the bottom end of the guide rod is fixedly connected to the suction cup, and the other end passes through the through hole and is fixedly connected to the limit plate, the elastic member is located between the adapter and the suction cup, the elastic member provides elastic force for pressing the limit plate against the adapter, a receiving groove is formed on the top of the suction cup, and the vibration motor is embedded in the receiving groove.

[0013] According to some embodiments of the utility model, the elastic member includes a spring, and the spring is sleeved outside the guide rod. One end of the spring abuts against the adapter, and the other end abuts against the suction cup.

[0014] According to some embodiments of the present utility model, a capacitive sensor is provided on the suction cup.

[0015] According to some embodiments of the utility model, a plurality of blowing members are arranged on the support plate, and the plurality of blowing members are distributed along the circumference of the silicon wafer, and the blowing members are used to blow air between two adjacent silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0017] Figure 2 It is a structural schematic diagram of the lifting assembly in the embodiment of the present application;

[0018] Figure 3 It is a schematic diagram of the structure of the limit assembly in the embodiment of the present application;

[0019] Figure 4 A schematic diagram of the structure of the adsorption component in an embodiment of the present application.

[0020] Description of reference numerals: 100, fixed plate; 200, wafer carrier; 300, silicon wafer assembly; 310, silicon wafer; 410, driving motor; 420, slide rail; 430, slide plate; 440, lead screw; 500, support plate; 611, clamping claw cylinder; 612, transmission rod; 620, limit rod; 630, waist-shaped hole; 700, adsorption component; 710, suction cup; 721, cylinder; 722, adapter; 731, guide rod; 732, limit plate; 733, vibration motor; 7341, spring; 735, perforation; 736, accommodation groove. 740, capacitive sensor; 810, air nozzle; 820, support. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0022] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In the description of the utility model, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] The following is combined with Figure 1-4 This application is further described in detail.

[0026] The present invention provides a silicon wafer separation device, referring to Figure 1 and Figure 2 , including a fixed plate 100 and a wafer stage 200 , the wafer stage 200 is carried on the fixed plate 100 , the wafer stage 200 is used to carry a silicon wafer group 300 , and the silicon wafer group 300 includes a plurality of stacked silicon wafers 310 .

[0027] It is understandable that in some embodiments of the present invention, reference Figure 1 and Figure 2, a lifting assembly for driving the wafer carrier 200 to rise and fall is provided on the fixed plate 100. Specifically, the lifting assembly includes a driving motor 410, a slide rail 420, a slide plate 430 and a screw rod 440. The slide rail 420 is vertically arranged on one side of the fixed plate 100, the slide plate 430 is slidably matched with the slide rail 420, and the driving motor 410 is arranged at the bottom of the slide rail 420; the screw rod 440 is vertically arranged, and the bottom of the screw rod 440 is fixedly connected to the output end of the driving motor 410. A screw hole is provided on the slide plate 430, and the screw rod 440 is threadedly matched with the screw hole. One side of the wafer carrier 200 is fixedly connected to the slide plate 430, and the screw rod 440 is driven to rotate by the driving motor 410, and the screw rod 440 is threadedly matched with the screw hole to drive the slide plate 430 to slide relative to the slide rail 420, thereby driving the wafer carrier 200 to rise and fall, and driving the silicon wafer group 300 to rise and fall.

[0028] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3 A support plate 500 is disposed on one side of the slide plate 430 , and the support plate 500 is located below the wafer carrier 200 . A limit assembly is disposed on the support plate 500 , and the limit assembly is used to limit the horizontal movement of the silicon wafer 310 .

[0029] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3 The limiting assembly includes an elastic member and multiple limiting rods 620. The elastic member is carried on the support plate 500. The multiple limiting rods 620 are distributed at intervals along the circumference of the silicon wafer 310. The limiting rods 620 are vertically arranged. A plurality of waist-shaped holes 630 are opened on the wafer carrier 200. The multiple waist-shaped holes 630 correspond to the multiple limiting rods 620 one by one. The waist-shaped holes 630 are opened along the radial direction of the silicon wafer 310. The bottom end of the limiting rod 620 is supported by the elastic member, and the top end passes through the waist-shaped hole 630 and extends vertically upward. The elastic member can simultaneously drive the multiple limiting rods 620 to approach or move away from the silicon wafer group 300 along the length direction of the waist-shaped hole 630. Therefore, when the silicon wafer group 300 is placed on the wafer carrier 200, the multiple limiting rods 620 are driven by the elastic member to approach the silicon wafer group 300 along the length direction of the waist-shaped hole 630 to limit the horizontal movement of the silicon wafer 310. In some embodiments, there are three limiting rods 620 , and the three limiting rods 620 are distributed in a triangle relative to the silicon wafer 310 to limit the horizontal movement of the silicon wafer 310 .

[0030] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3The tensioner includes a clamping cylinder 611 and a plurality of transmission rods 612. The clamping cylinder 611 is arranged on the support plate 500. The plurality of transmission rods 612 correspond to the plurality of limiting rods 620 one by one. One end of the transmission rod 612 is connected to the clamping cylinder 611, and the other end is connected to the limiting rod 620. When the plurality of limiting rods 620 need to move, the clamping cylinder 611 can drive the plurality of transmission rods 612 to expand or contract, so that the limiting rods 620 are away from or close to the silicon wafer group 300 along the length direction of the waist-shaped hole 630.

[0031] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4 The silicon wafer separation device further includes an adsorption assembly 700, which is used to adsorb the silicon wafer 310 on the top of the silicon wafer group 300, so as to pick up the silicon wafer 310, and can detach the silicon wafer 310 that is adhered to the picked silicon wafer 310. Specifically, the adsorption assembly 700 includes a suction cup 710, a lifting member, and a vibrating member. The suction cup 710 can adsorb the silicon wafer 310, and the vibrating member can generate a vibration force, thereby driving the suction cup 710 to vibrate. The lifting member is used to drive the suction cup 710 to rise and fall, and the suction cup 710 is located above the wafer carrier 200.

[0032] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4 The lifting member includes a cylinder 721 and an adapter 722. The cylinder 721 is fixedly connected to the fixed plate 100 through a connecting frame. One side of the adapter 722 is connected to the cylinder 721. The cylinder 721 can drive the adapter 722 to rise and fall. The suction cup 710 is movably arranged at the bottom of the adapter 722. The vibrating member is arranged between the adapter 722 and the suction cup 710. When the suction cup 710 needs to absorb the silicon wafer 310, the suction cup 710 is driven by the cylinder 721 to descend to the silicon wafer assembly. 300, to adsorb the silicon wafer 310. Since multiple silicon wafers 310 are prone to adhesion, the suction cup 710 can easily pick up multiple silicon wafers 310 at one time. At this time, a vibration force can be generated by a vibrating member to drive the suction cup 710 to vibrate, so that the adhesion force between the two silicon wafers 310 is reduced by the vibration force, so that the excess silicon wafers 310 in the adsorbed silicon wafers 310 fall back into the silicon wafer group 300, thereby achieving the removal of a single silicon wafer 310.

[0033] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4The vibrating member includes a guide rod 731, a limit plate 732, a vibration motor 733 and an elastic member. The limit plate 732 is movably arranged above the adapter 722. A through hole 735 is provided on the top of the adapter 722. The bottom end of the guide rod 731 is fixedly connected to the suction cup 710, and the other end passes through the through hole 735 and is fixedly connected to the limit plate 732, so that the suction cup 710 is hung on the adapter 722 through the limit of the limit plate 732. The elastic member is located between the adapter 722 and the suction cup 710. The elastic member provides elastic force for the limit plate 732 to press against the adapter 722, so that when the suction cup 710 is subjected to vibration force, the elastic member can offset part of the vibration force, thereby making the suction cup 710 more stable. A receiving groove is provided on the top of the suction cup 710, and a vibration motor 733 is embedded in the receiving groove. When multiple silicon wafers 310 need to be separated, the vibration motor 733 generates a vibration force to drive the suction cup 710 to vibrate, so that the adhesion force between the two silicon wafers 310 is reduced due to the influence of the vibration force, so that the excess silicon wafers 310 in the adsorbed silicon wafers 310 fall back into the silicon wafer group 300, thereby realizing the removal of a single silicon wafer 310.

[0034] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4 The elastic member includes a spring 7341, which is sleeved outside the guide rod 731. One end of the spring 7341 abuts against the adapter 722, and the other end abuts against the suction cup 710. When the spring 7341 is arranged between the adapter 722 and the suction cup 710, the spring 7341 is in a compressed state, so that the spring 7341 always applies pressure to the suction cup 710, so that when the suction cup 710 is subjected to vibration force, part of the vibration force can be offset by the spring 7341, thereby making the suction cup 710 more stable.

[0035] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4 A capacitive sensor is provided on the suction cup 710. The capacitance change of the capacitive sensor is used to transmit the sensing signal to the controller. The controller controls the drive of the cylinder 721, so as to control the distance between the suction cup 710 and the silicon wafer group 300, thereby reducing the situation where the suction cup 710 squeezes the silicon wafer group 300 when it descends and causes damage to the silicon wafer 310.

[0036] It is understandable that in some embodiments of the present invention, reference Figure 2, a plurality of blowing parts are arranged on the support plate 500, and the plurality of blowing parts are distributed along the circumference of the silicon wafer 310, and the blowing parts are used to blow air between two adjacent silicon wafers 310. Specifically, the blowing parts include air nozzles, and a plurality of supports are vertically arranged on the support plate 500, and the plurality of supports are distributed along the circumference of the silicon wafer 310, and the plurality of air nozzles correspond to the plurality of supports one by one, and the air nozzles are used to blow air between two adjacent silicon wafers 310, so as to further assist the vibration motor 733 to increase the gap between the two silicon wafers 310, thereby increasing the separation rate of the two silicon wafers 310, and further increasing the success rate and efficiency of the suction cup 710 adsorbing a single silicon wafer 310.

[0037] The implementation principle of the present application is: when the suction cup 710 needs to adsorb the silicon wafer 310, the lead screw 440 is driven to rotate by the driving motor 410, and the thread of the lead screw 440 cooperates with the thread of the screw hole to drive the slide plate 430 to slide relative to the slide rail 420, thereby driving the wafer carrier 200 to rise, so as to drive the silicon wafer group 300 to rise. At this time, the cylinder 721 drives the suction cup 710 to descend above the silicon wafer group 300 to adsorb the silicon wafer 310. Since multiple silicon wafers 310 are prone to adhesion, the suction cup 710 is easy to pick up multiple silicon wafers 310 at one time. At this time, the vibration motor 733 can generate a vibration force to drive the suction cup 710 to vibrate, so that the adhesion force between the two silicon wafers 310 is reduced due to the vibration force, so that the excess silicon wafers 310 in the adsorbed silicon wafers 310 fall back into the silicon wafer group 300, so as to achieve the removal of a single silicon wafer 310, thereby solving the problem of picking up multiple silicon wafers 310 at one time due to adhesion.

[0038] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A silicon wafer separation device, characterized in that: include: A wafer carrier (200) for carrying a silicon wafer group (300), wherein the silicon wafer group (300) comprises a plurality of silicon wafers (310) stacked vertically; A lifting component capable of driving the wafer carrier (200) to move up and down; A limiting component, used for limiting the horizontal movement of the silicon wafer (310); The adsorption assembly (700) includes a vibrating member and a suction cup (710). The suction cup (710) is movably disposed above the wafer carrier (200). The suction cup (710) can adsorb the silicon wafer (310), and the vibrating member can drive the suction cup (710) to vibrate.

2. The silicon wafer separation device according to claim 1, characterized in that: The silicon wafer separation device comprises a vertically arranged fixed plate (100), the lifting component is arranged on the fixed plate (100), the lifting component comprises a slide rail (420), a slide plate (430), a drive motor (410), and a screw rod (440), the slide rail (420) is vertically arranged on one side of the fixed plate (100), the slide plate (430) is slidably matched with the slide rail (420), the drive motor (410) is arranged at the bottom of the slide rail (420), the screw rod (440) is vertically arranged, the bottom of the screw rod (440) is fixedly connected to the output end of the drive motor (410), a screw hole is opened on the slide plate (430), the screw rod (440) is threadedly matched with the screw hole, and one side of the wafer carrier (200) is fixedly connected to the slide plate (430).

3. The silicon wafer separation device according to claim 2, characterized in that: A support plate (500) is provided on one side of the slide plate (430), the support plate (500) is located below the wafer carrier (200), the limit assembly is carried on the support plate (500), the limit assembly includes an elastic member and a plurality of limit rods (620), the elastic member is carried on the support plate (500), the plurality of limit rods (620) are distributed at intervals along the circumference of the silicon wafer (310), the limit rods (620) are vertically arranged, and the wafer carrier (200) is opened. A plurality of waist-shaped holes (630) are provided, and the plurality of waist-shaped holes (630) correspond one by one to the plurality of limiting rods (620), respectively. The waist-shaped holes (630) are opened along the radial direction of the silicon wafer (310), and the bottom end of the limiting rod (620) is supported by the elastic member, and the top end passes through the waist-shaped hole (630) and extends vertically upward. The elastic member can simultaneously drive the plurality of limiting rods (620) to approach or move away from the silicon wafer group (300) along the length direction of the waist-shaped hole (630).

4. The silicon wafer separation device according to claim 3, characterized in that: The tensioner comprises a clamping cylinder (611) and a plurality of transmission rods (612); the clamping cylinder (611) is arranged on the support plate (500); the plurality of transmission rods (612) correspond one by one to the plurality of limit rods (620); one end of the transmission rod (612) is connected to the clamping cylinder (611), and the other end is connected to the limit rod (620); the clamping cylinder (611) can drive the plurality of transmission rods (612) to expand or contract.

5. The silicon wafer separation device according to claim 2, characterized in that: The adsorption assembly (700) comprises a lifting member, and the lifting member is used to drive the suction cup (710) to move up and down.

6. The silicon wafer separation device according to claim 5, characterized in that: The lifting component comprises a cylinder (721) and an adapter seat (722); the cylinder (721) is fixedly connected to the fixed plate (100) via a connecting frame; one side of the adapter seat (722) is connected to the cylinder (721); the cylinder (721) can drive the adapter seat (722) to rise and fall; the suction cup (710) is movably arranged at the bottom of the adapter seat (722); and the vibrating component is arranged between the adapter seat (722) and the suction cup (710).

7. The silicon wafer separation device according to claim 6, characterized in that: The vibrating member comprises a guide rod (731), a limit plate (732), a vibration motor (733) and an elastic member. The limit plate (732) is movably arranged above the adapter seat (722). A through hole (735) is provided on the top of the adapter seat (722). The bottom end of the guide rod (731) is fixedly connected to the suction cup (710), and the other end passes through the through hole (735) and is fixedly connected to the limit plate (732). The elastic member is located between the adapter seat (722) and the suction cup (710). The elastic member provides elastic force for pressing the limit plate (732) against the adapter seat (722). A receiving groove is provided on the top of the suction cup (710), and the vibration motor (733) is embedded in the receiving groove.

8. The silicon wafer separation device according to claim 7, characterized in that: The elastic member comprises a spring (7341), and the spring (7341) is sleeved outside the guide rod (731), one end of the spring (7341) abuts against the adapter seat (722), and the other end abuts against the suction cup (710).

9. The silicon wafer separation device according to claim 1, characterized in that: The suction cup (710) is provided with a capacitive sensor.

10. The silicon wafer separation device according to claim 3, characterized in that: A plurality of blowing parts are arranged on the support plate (500), and the plurality of blowing parts are distributed along the circumference of the silicon wafer (310), and the blowing parts are used to spray air between two adjacent silicon wafers (310).

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