Tool for placing heat sink material with radian
By designing a tool set with spherical curved boss and electrostatic adsorption strip, the problem of damage to the heat sink material during transportation is solved, and the stability and protection effect is achieved, which is suitable for long-distance transportation.
Patent Information
- Application Number
- CN202323641270.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-29
AI Technical Summary
Heat sink materials with specific arcs are prone to damage during packaging and transportation, and the prior art lacks targeted packaging tools, especially when there is an increased risk of damage during long-distance transportation.
A tooling is designed, including a substrate and a cover plate, with a placement groove and a boss arranged on the substrate. The boss has a spherical curved surface to adapt to the arcuate portion of the heat sink material. The cover plate is removable and an electrostatic generator can be optionally equipped with Electrostatic adsorbing strips to prevent shaking and friction, and improve stability and protection through snap-on structure and soft pads.
Through the use of spherical curved surface support and electrostatic adsorption strips, the contact area between the tooling and the heat sink material is increased, deformation and damage caused by stress concentration is avoided, and long-distance transportation is adapted to long-distance transportation through stacking and snapping structures, reducing the risk of damage.
Smart Images
Figure CN222190710U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of electronic device packaging, and in particular relates to a tooling for placing a heat sink material with an arc. Background Art
[0002] Heat sink materials generally refer to micro heat sinks, which are devices used to cool electronic chips. Heat sink materials are one of the key materials in the field of microelectronics. When power electronic devices and circuits are running, a lot of heat will be generated, and heat is dissipated by using heat sink materials. This material has a thermal expansion coefficient that matches different substrates and high thermal conductivity, which helps to remove chip heat and transfer it to other media to keep the chip working stably.
[0003] In order to meet the heat dissipation requirements of different power electronic devices, some heat sink material products are often designed with a specific curvature shape, such as Figure 1 As shown, this curvature design can better fit the curved surface of electronic devices, increase the contact area, and improve the heat conduction efficiency. During the packaging and transportation process, the heat sink material products with curvature are easily damaged by external extrusion and collision due to their special shape. Especially during long-distance transportation or stacking, the risk of damage will be further increased. In the prior art, there are relatively few packaging and transportation tools for heat sink material products with such specific curvatures. Utility Model Content
[0004] The present application provides a tooling for placing a heat sink material with a curvature, which can solve the problem that the heat sink material with a curvature may be damaged during packaging and placement.
[0005] The present application provides a tool for placing a heat sink material with an arc, comprising:
[0006] A substrate having at least one placement groove disposed thereon, the placement groove being used to place a heat sink material product with an arc, a boss for supporting the heat sink material product being disposed in the placement groove, a convex spherical surface being disposed on the same side of the boss as the opening of the placement groove, and the spherical surface being adapted to the arc portion on the heat sink material product; and
[0007] The cover plate is detachably covered on one side of the base plate where the placement groove is provided.
[0008] Optionally, an electrostatic generator is provided in the boss, a plurality of electrostatic adsorption strips are provided on the spherical surface, each electrostatic adsorption strip is electrically connected to the electrostatic generator, and a switch is provided on one side of the substrate, and the switch is used to control the start and stop of the electrostatic generator.
[0009] Optionally, a plurality of stacking columns are arranged on a side of the substrate away from the placement grooves, and a plurality of stacking grooves having the same number as the stacking columns are arranged on a side of the cover away from the substrate, and each stacking column is arranged in one-to-one correspondence with each stacking groove.
[0010] Optionally, a plurality of buckle grooves are provided on the base plate, and the plurality of buckle grooves and the placement groove are located on the same side of the base plate, and a plurality of buckle columns having the same number as the buckle grooves are provided on the cover plate, and when the cover plate is covered on the base plate, each buckle column is snap-fitted with each buckle groove in a one-to-one correspondence.
[0011] Optionally, the placement slot is a rectangular structure, and each corner of the placement slot is provided with a gap-avoiding slot hole.
[0012] Optionally, the cross section of the boss is a rectangular structure, and the length direction of the boss is parallel to the length direction of the placement groove.
[0013] Optionally, a first soft pad is attached to the inner wall of the placement groove, and a second soft pad is attached to the inner side of the cover plate.
[0014] Optionally, a handle is provided on the outer side wall of the base plate.
[0015] Optionally, a plurality of placement grooves are provided on the substrate, and the plurality of placement grooves are distributed in a matrix.
[0016] Optionally, the curvature of the spherical surface ranges from 2 rad to 8 rad.
[0017] The above solution of the present application has the following beneficial effects:
[0018] In the present application, when the tooling is used, the heat sink material product with a curvature is placed in the placement groove, and the heat sink material product is supported by the spherical surface on the boss. The spherical surface is adapted to the curved portion on the heat sink material product, and the spherical surface lifts the curved portion of the heat sink material product to increase the contact area between the tooling and the heat sink material product, thereby avoiding deformation and breakage caused by stress concentration when the heat sink material product is placed. After the cover plate is covered, multiple toolings can be stacked together to adapt to long-distance transportation, further reducing the risk of such damage.
[0019] Other beneficial effects of the present application will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0021] Figure 1 Heat sink material products applicable to this application;
[0022] Figure 2A schematic structural diagram of a substrate of a tooling provided in an embodiment of the present application having a side provided with a placement groove;
[0023] Figure 3 A schematic diagram of an enlarged structure of part of the structure on the substrate of a tooling provided in one embodiment of the present application;
[0024] Figure 4 A schematic diagram of the structure of a substrate of a tooling provided in an embodiment of the present application, which is away from the placement groove;
[0025] Figure 5 A schematic structural diagram of a side of a cover plate of a tooling provided in an embodiment of the present application that is away from a substrate;
[0026] Figure 6 A schematic structural diagram of a cover plate of a tooling provided in an embodiment of the present application, which is disposed on one side of a substrate.
[0027] [Description of Reference Numerals]
[0028] 100. Heat sink material products;
[0029] 1. Substrate;
[0030] 11. Placement slot; 12. Boss; 13. Electrostatic generator; 14. Electrostatic adsorption strip; 15. Switch; 16. Stacking column; 17. Buckle slot; 18. Avoidance slot; 19. Handle;
[0031] 2. Cover plate;
[0032] 21. Stacking slot; 22. Buckle column. DETAILED DESCRIPTION
[0033] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.
[0034] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.
[0035] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0036] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.
[0037] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.
[0038] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.
[0039] The following is an exemplary description of the tooling for placing a curved heat sink material provided by the present application in conjunction with a specific embodiment.
[0040] In order to meet the heat dissipation requirements of different power electronic devices, some heat sink material products 100 are often designed to have a specific curvature shape, such as Figure 1 As shown, this curvature design can better fit the curved surface of electronic devices, increase the contact area, and improve heat conduction efficiency.
[0041] like Figure 2 to Figure 6 The embodiment of the present application provides a tool for placing a heat sink material with a curve, comprising a substrate 1 and a cover plate 2. The substrate 1 is provided with at least one placement groove 11, the placement groove 11 is used to place a heat sink material product 100 with a curve, a boss 12 is provided in the placement groove 11 for supporting the heat sink material product 100, and an outwardly convex spherical surface is provided on the side facing the same direction as the opening of the placement groove 11, and the spherical surface is adapted to the arc portion on the heat sink material product 100; the cover plate 2 is detachably covered on the side of the substrate 1 where the placement groove 11 is provided.
[0042] In the above embodiment, when the tooling is used, the heat sink material product 100 with a curvature is placed in the placement groove 11, and the heat sink material product 100 is supported by the spherical surface on the boss 12, and the spherical surface is adapted to the arc portion on the heat sink material product 100 to provide stable support. The arc portion of the heat sink material product 100 is supported by the spherical surface on the boss 12 to increase the contact area between the tooling and the heat sink material product 100, so as to avoid stress concentration when the heat sink material product 100 is placed, resulting in deformation and damage. Then the cover plate 2 is placed on the side of the substrate 1 where the placement groove 11 is provided. The cover plate 2 can provide additional protection to prevent the heat sink material product 100 from being damaged during transportation. At the same time, through the covering of the cover plate 2, the heat sink material product 100 is isolated from the external environment to avoid possible contamination, damage or interference.
[0043] The tooling provided in the present application can support the arc-shaped portion of the heat sink material product 100 through the spherical surface to increase the contact area between the tooling and the heat sink material product 100, thereby avoiding deformation and damage caused by stress concentration when the heat sink material product 100 is placed. After the cover plate 2 is covered, multiple toolings can be stacked together to adapt to long-distance transportation, further reducing the risk of such damage.
[0044] A snap-fit structure may be provided between the cover plate 2 and the base plate 1 , and a detachable connection between the cover plate 2 and the base plate 1 may be achieved by engaging and disengaging the snap-fit structure with the slot.
[0045] A plurality of placement grooves 11 may be provided on the substrate 1 , and a boss 12 is provided in each placement groove 11 , so as to increase the number of heat sink material products 100 accommodated in a single substrate 1 .
[0046] In one embodiment, if Figure 3 As shown, an electrostatic generator 13 is arranged in the boss 12, and a plurality of electrostatic adsorption bars 14 are arranged on the spherical surface. Each electrostatic adsorption bar 14 is electrically connected to the electrostatic generator 13. A switch 15 is arranged on one side of the substrate 1, and the switch 15 is used to control the start and stop of the electrostatic generator 13.
[0047] In the above embodiment, when the heat sink material product 100 is placed in the placement groove 11, there will be a certain gap between the heat sink material product 100 and the placement groove 11. During transportation, the heat sink material product 100 will shake to a certain extent, and there is a possibility of damage. This problem can be solved by providing an electrostatic generator 13 and an electrostatic adsorption bar 14. After the arc-shaped portion of the heat sink material product 100 is placed on the spherical surface, after pressing the switch 15, the electrostatic generator 13 provides current to the electrostatic adsorption bar 14, so that the electrostatic adsorption bar 14 generates static electricity that can adsorb the heat sink material product 100, thereby adsorbing the arc-shaped portion of the heat sink material product 100 on the spherical surface to prevent the heat sink material product 100 from shaking during transportation.
[0048] It should be noted that if Figure 1 As shown, the heat sink material product 100 applicable to the present application is a thin sheet structure with a thickness of 2 mm to 10 mm, and the static electricity generated by the electrostatic adsorption strip 14 can adsorb it.
[0049] Among them, the electrostatic generator 13 is mainly used to provide current for the electrostatic adsorption strip 14. The electrostatic generator 13 can be a prior art and will not be further described here. The electrostatic adsorption strip 14 is mainly used to receive the current generated by the electrostatic generator 13 and generate static electricity to adsorb the heat sink material product 100. For example, the material of the electrostatic adsorption strip 14 can be metal, graphite, etc.
[0050] There are multiple grooves on the spherical surface, and the electrostatic adsorption strips 14 are embedded in the grooves one by one, and the electrostatic adsorption strips 14 do not protrude from the grooves, so as to prevent the electrostatic adsorption strips 14 from wearing the heat sink material product 100.
[0051] It is understandable that when a plurality of placement grooves 11 are provided on the substrate 1, an electrostatic generator 13 may be provided in the boss 12 in each placement groove 11, and each electrostatic generator 13 is electrically connected to the switch 15, and the start and stop of the electrostatic generator 13 are uniformly controlled by the switch 15.
[0052] It is conceivable that there may be only one electrostatic generator 13 , and each electrostatic adsorption strip 14 is electrically connected to the electrostatic generator 13 , and the start and stop of the electrostatic generator 13 is controlled by the switch 15 so that each electrostatic adsorption strip 14 generates static electricity.
[0053] In one embodiment, if Figure 4 As shown, a plurality of stacking columns 16 are provided on the side of the substrate 1 away from the placement groove 11 , and a plurality of stacking grooves 21 having the same number as the stacking columns 16 are provided on the side of the cover plate 2 away from the substrate 1 , and each stacking column 16 is arranged in one-to-one correspondence with each stacking groove 21 .
[0054] In the above embodiment, the stacking columns 16 and the stacking grooves 21 are mainly used for the stable stacking of two adjacent toolings to avoid relative sliding. When stacking, the stacking columns 16 on the base plate 1 of the tooling located at the upper side can be aligned with the stacking grooves 21 on the cover plate 2 of the tooling located at the lower side, and then the stacking columns 16 located at the upper side can be inserted into the stacking grooves 21 located at the lower side one by one.
[0055] In one embodiment, if Figure 2 As shown, a plurality of buckle grooves 17 are provided on the base plate 1, and the plurality of buckle grooves 17 and the placement groove 11 are located on the same side of the base plate 1, and a plurality of buckle columns 22 having the same number as the buckle grooves 17 are provided on the cover plate 2. When the cover plate 2 is covered on the base plate 1, each buckle column 22 is snap-fitted with each buckle groove 17 one by one.
[0056] In the above embodiment, after placing the heat sink material product 100, align the buckle columns 22 on the cover plate 2 with the buckle grooves 17 on the base plate 1 one by one, and then cover the cover plate 2. The structural arrangement of the buckle grooves 17 and the buckle columns 22 can effectively prevent the cover plate 2 and the base plate 1 from relative displacement, reducing the risk of damage caused by shaking of the heat sink material product 100 during transportation. At the same time, the coordination of the buckle grooves 17 and the buckle columns 22 can ensure the stability of the connection between the cover plate 2 and the base plate 1.
[0057] In one embodiment, if Figure 2 and Figure 3 As shown, the placement slot 11 is a rectangular structure, and each corner of the placement slot 11 is provided with a space-avoiding slot hole 18 .
[0058] In the above embodiment, the shape of the heat sink material product 100 is generally rectangular, and the placement groove 11 is set to a rectangular structure to better adapt to the heat sink material product 100. Specifically, the heat sink material product 100 is tungsten copper, molybdenum copper, copper molybdenum copper copper material. The maximum size of the placement groove 11 is 100mm*60mm*15mm (length*width*height, the same below), and the minimum size is 30mm*10mm*7mm. The four right angles of the heat sink material product 100 correspond to the four air-avoiding slots 18 respectively to prevent the right angles from being damaged by stress.
[0059] Among them, Figure 2 , Figures 4 to 6 As shown, the substrate 1 and the cover plate 2 can both be rectangular structures. The maximum size of the substrate 1 is 450mm*220mm*20mm, and the minimum size is 150mm*60mm*10mm. The size of the cover plate 2 is adapted to the size of the substrate 1.
[0060] In a specific embodiment, Figure 3 As shown, the cross section of the boss 12 is a rectangular structure, and the length direction of the boss 12 is parallel to the length direction of the placement groove 11.
[0061] In the above embodiment, the cross-section of the boss 12 is a rectangular structure, and the spherical surface is arranged along the length direction of the boss 12, so as to increase the contact area between the spherical surface and the arc portion of the heat sink material product 100, so that the heat sink material product 100 can be placed more stably on the boss 12, and at the same time, the possibility of damage to the heat sink material product 100 can be reduced.
[0062] It can be understood that the cross-sectional area of the boss 12 is smaller than the cross-sectional area of the placement groove 11 , and the boss 12 is located at the inner center of the placement groove 11 .
[0063] In one embodiment, a first soft pad is attached to the inner wall of the placement groove 11 , and a second soft pad is attached to the inner side of the cover plate 2 .
[0064] In the above embodiment, a first soft pad (not shown in the figure) and a second soft pad (not shown in the figure) are provided to protect the heat sink material product 100 and prevent the heat sink material product 100 from being damaged by friction.
[0065] In one embodiment, if Figure 2 and Figure 4 As shown, a handle 19 is provided on the outer side wall of the base plate 1 .
[0066] In the above embodiment, the handle 19 is provided to facilitate the movement and transportation of the substrate 1 .
[0067] In one embodiment, if Figure 2 As shown, a plurality of placement grooves 11 are arranged on the substrate 1, and the plurality of placement grooves 11 are distributed in a matrix.
[0068] In the above embodiment, the plurality of placement slots 11 are distributed in a matrix, which can maximize the number of placement slots 11 on the substrate 1 , so as to improve the efficiency of the tooling in placing the heat sink material product 100 .
[0069] In one embodiment, the curvature of the spherical surface ranges from 2 rad to 8 rad.
[0070] In the above embodiment, the curvature of the spherical surface ranges from 2 rad to 8 rad to meet the requirements of the curved parts of different heat sink material products 100 .
[0071] The above is a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles described in the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. A tool for placing a heat sink material with an arc, characterized in that: include: A substrate having at least one placement groove disposed thereon, the placement groove being used to place a heat sink material product with an arc, a boss for supporting the heat sink material product being disposed in the placement groove, a convex spherical surface being disposed on the same side of the boss as the opening of the placement groove, the spherical surface being adapted to the arc portion on the heat sink material product; and The cover plate is detachably covered on one side of the base plate where the placement groove is provided.
2. The tooling according to claim 1, characterized in that: An electrostatic generator is arranged in the boss, a plurality of electrostatic adsorption bars are arranged on the spherical surface, each of the electrostatic adsorption bars is electrically connected to the electrostatic generator, and a switch is arranged on one side of the substrate, and the switch is used to control the start and stop of the electrostatic generator.
3. The tooling according to claim 1, characterized in that: A plurality of stacking columns are arranged on a side of the substrate away from the placement grooves, and a plurality of stacking grooves having the same number as the stacking columns are arranged on a side of the cover plate away from the substrate, and each stacking column is arranged in one-to-one correspondence with each stacking groove.
4. The tooling according to claim 1, characterized in that: The base plate is provided with a plurality of buckle grooves, and the plurality of buckle grooves and the placement groove are located on the same side of the base plate. The cover plate is provided with a plurality of buckle columns having the same number as the buckle grooves. When the cover plate is covered on the base plate, each buckle column is engaged with each buckle groove in a one-to-one correspondence.
5. The tooling according to claim 1, characterized in that: The placement groove is a rectangular structure, and each corner of the placement groove is provided with a space-avoiding slot hole.
6. The tooling according to claim 5, characterized in that: The cross section of the boss is a rectangular structure, and the length direction of the boss is parallel to the length direction of the placement groove.
7. The tooling according to claim 1, characterized in that: A first soft pad is attached to the inner wall of the placement groove, and a second soft pad is attached to the inner side of the cover plate.
8. The tooling according to claim 1, characterized in that: A handle is arranged on the outer side wall of the base plate.
9. The tooling according to claim 1, characterized in that: A plurality of placement grooves are arranged on the substrate, and the plurality of placement grooves are distributed in a matrix.
10. The tooling according to claim 1, characterized in that: The radian range of the spherical curved surface is 2 rad to 8 rad.