Light sensing chip packaging structure

Abstract

The utility model discloses a light-sensitive chip packaging structure, which comprises a carrier plate, an optical chip and a light-transmitting piece, the optical chip is installed on the carrier plate in an inverted mode, the inside of the carrier plate is provided with an optical channel formed by through holes, the inverted optical chip reduces the thickness of the whole packaging structure, and the front surface of the carrier plate is packaged by adopting a sealing film and a plastic packaging layer. And the optical chip is effectively protected.

Description

Technical Field

[0001] The utility model relates to the technical field of photosensitive chips, in particular to a photosensitive chip packaging structure. Background Art

[0002] The existing photosensitive chip packaging structure mainly adopts a wire bonding structure, in which wires are welded on the front of the mounted photochip to connect with the wiring points on the carrier board. The plastic packaging layer during packaging needs to cover the wires and the photochip. The final packaging structure is relatively thick and cannot meet the requirements of modern equipment for lightness, miniaturization and high integration. Utility Model Content

[0003] Therefore, in order to solve the above problems, the purpose of the present invention is to provide a light sensing chip packaging structure, including:

[0004] A carrier plate, wherein a groove is provided on the back of the carrier plate, and a through hole is provided in the carrier plate, and the through hole passes through the front side of the carrier plate and the groove;

[0005] A light-transmitting member installed in the groove;

[0006] An optical chip, wherein the optical chip is fixed at a through hole on the front side of the carrier board, with the front side of the optical chip facing the through hole;

[0007] A sealing film is attached to and covers the back side of the optical chip and the front side of the carrier board.

[0008] The diameter of the through hole is smaller than the diameter of the groove.

[0009] Preferably, the light-transmitting member is a glass sheet.

[0010] Preferably, the sealing film is a TSA film.

[0011] Preferably, the sealing film is covered with a plastic sealing layer.

[0012] Preferably, the sealing film and the plastic sealing layer are provided with conductive holes, the conductive holes are filled with solder balls, and the solder balls are electrically connected to the optical chip.

[0013] The beneficial effects of the utility model are:

[0014] The chip is installed in a flip-chip manner, and a light-transmitting component is installed on the back of the carrier. Light can pass through the light-transmitting component and the through-holes in the carrier from the back of the carrier to interact with the optical chip. The flip-chip optical chip reduces the thickness of the entire packaging structure, and the front of the carrier is packaged in the form of a sealing film plus a plastic sealing layer, which effectively protects the optical chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Explanation of the accompanying drawings: 1. carrier board; 11. groove; 12. through hole; 2. optical chip; 3. light-transmitting member; 4. sealing film; 5. solder ball; 6. sealing layer.

[0018] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0020] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0021] Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] Embodiment 1:

[0023] Figure 1The utility model shows a photosensitive chip packaging structure provided by the present invention, including a carrier board 1, a light-transmitting member 3 and an optical chip 2. A groove 11 is provided on the back of the carrier board 1. The groove 11 is used for installing the light-transmitting member 3. The light-transmitting member 3 is installed in the groove 11 through a mounting process. A through hole 12 is provided at the bottom of the groove 11. Both ends of the through hole 12 pass through the groove 11 and the front of the carrier board 1. The aperture of the through hole 12 is smaller than the diameter of the groove 11. The optical chip 2 is fixed to the front of the carrier board 1 by reflow soldering. The optical chip 2 is specifically arranged at the through hole 12 and the front of the optical chip 2 faces the through hole 12. The front of the optical chip 2 is a photosensitive functional surface with the functions of emitting and collecting light. Light can pass through the through hole 12 and the light-transmitting member 3. After the optical chip 2 is installed on the carrier board 1, a sealing film 4 is also provided. The sealing film 4 covers the front of the entire carrier board 1 and the back of the flip-mounted optical chip 2 to protect the optical chip 2 and prevent the optical chip 2 from being contaminated.

[0024] The light-transmitting member 3 is a glass sheet, and a corresponding optical coating may be applied on the glass sheet according to actual functional requirements, such as an optical coating with functions of anti-reflection, anti-reflection, infrared cutoff, and visible light filtering.

[0025] The sealing film 4 is specifically a TSA film, which is an epoxy film adhesive with excellent linear tearing performance. Corresponding holes can be opened on the film to facilitate the connection of the optical chip 2.

[0026] The sealing film 4 is also provided with a plastic sealing layer 6, and the material of the plastic sealing layer 6 is epoxy resin.

[0027] Conductive holes are correspondingly provided on the plastic sealing layer 6 and the sealing film 4 , and the conductive holes are filled with solder balls 5 . The solder balls 5 are electrically connected to the optical chip 2 through the solder pads provided in the carrier board 1 , and the optical chip 2 can be connected to the external circuit through the solder balls 5 .

[0028] The solder ball 5 has a protrusion relative to the plastic packaging layer 6, which is convenient for connecting to an external circuit.

[0029] During the actual manufacturing of the utility model, it is necessary to first install the optical chip 2 and the light-transmitting member 3 on the carrier board 1, and then set a sealing film 4 on the front side of the carrier board 1 and the back side of the optical chip 2 by using a film coating process. After a hole is opened on the sealing film 4, a solder ball 5 is pre-fabricated and electrically connected to the optical chip 2 by using a ball planting process, and then a plastic sealing layer 6 is set by an injection molding process to seal the above components. After the plastic sealing layer 6 is ground, the solder ball 5 is exposed, and then a protrusion is made on the exposed part of the solder ball 5 by using flux and reflow soldering.

[0030] Working principle:

[0031] The optical chip 2 is mounted on a carrier board 1 having a through hole 12 in a flip-chip manner, and a groove 11 is provided on the back side of the carrier board 1 to mount the light-transmitting component 3. The front side of the optical chip 2 is also the photosensitive functional surface, which has the function of emitting light and receiving light. The light can pass through the glass sheet and the through hole 12 to interact with the optical chip 2. Compared with the conventional wiring front side mounting method, the flip-chip mounting of the optical chip 2 can prevent chips with larger areas within the same area, and the thickness of the plastic encapsulation layer 6 can be thinner.

[0032] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A light sensing chip packaging structure, characterized in that: include: A carrier plate (1), wherein a groove (11) is provided on the back of the carrier plate (1), a through hole (12) is provided in the carrier plate (1), the through hole (12) passes through the front of the carrier plate (1) and the groove (11), and the aperture of the through hole (12) is smaller than the diameter of the groove (11); A light-transmitting member (3), wherein the light-transmitting member (3) is installed in the groove (11); An optical chip (2), wherein the optical chip (2) is fixed at a through hole (12) on the front side of the carrier board (1), with the front side of the optical chip (2) facing the through hole (12); A sealing film (4) is attached to and covers the back side of the optical chip (2) and the front side of the carrier board (1).

2. The light sensing chip packaging structure according to claim 1, characterized in that: The light-transmitting member (3) is a glass sheet.

3. The light sensing chip packaging structure according to claim 1, characterized in that: The sealing film (4) is a TSA film.

4. The light sensing chip packaging structure according to claim 3, characterized in that: The sealing film (4) is covered with a plastic sealing layer (6).

5. The light sensing chip packaging structure according to claim 4, characterized in that: The sealing film (4) and the plastic sealing layer (6) are provided with conductive holes, the conductive holes are filled with solder balls (5), and the solder balls (5) are electrically connected to the optical chip (2).

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