Curing and cooling integrated device for SMT adhesive

Abstract

The utility model relates to a curing and cooling integrated device for SMT patch adhesive, which belongs to the technical field of SMT patch processing equipment and comprises a curing chamber and a cooling chamber arranged at one end of the curing chamber, a liquid cooling channel is arranged between the curing chamber and the cooling chamber, a water pump and a heat dissipation assembly are arranged on the liquid cooling channel, and liquid cooling media are filled in the liquid cooling channel. The liquid cooling channel is composed of a heat absorption section used for absorbing heat in the cooling chamber, a heat return section used for guiding the heat absorbed by the heat absorption section into the curing chamber, and a heat dissipation section used for cooling the liquid cooling medium through a heat dissipation assembly. According to the utility model, the liquid cooling medium in the liquid cooling channel flows through the water pump, the liquid cooling medium firstly absorbs heat at the heat absorption section, then flows into the heat return section to transmit waste heat to the curing chamber, and flows back to the heat absorption section after being cooled, so that the energy consumption required by subsequent PCB heating and curing is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of PCB board patch processing equipment, and specifically relates to an integrated device for curing and cooling SMT patch glue. Background Art

[0002] When mounting electronic components such as chips, capacitors, resistors, etc. on PCB boards, SMT adhesive needs to be cured and cooled. PCB and SMT are the abbreviations of Printed Circuit Board and Surface Mount Technology, respectively. Since adhesive is usually a thermosetting material, it undergoes a chemical cross-linking reaction after being heated to form a hardened structure, thereby fixing the electronic components on the PCB board. Therefore, when mounting electronic components, the circuit board needs to be cured and heated and cooled.

[0003] The existing SMT patch glue curing device is usually an oven structure, and the PCB board is heated and cured in the oven structure. After the curing is completed, the PCB board is taken out of the oven for cooling, or the oven is cooled to achieve cooling of the PCB board. For example, the Chinese patent document with patent number CN216087150U discloses an SMT patch glue curing device, including a box body, and the inner cavity of the box body is divided into a heating cavity and a cooling cavity. The device can quickly cool and cure the patch glue and cool down the cured workpiece by setting the heating cavity and the cooling cavity, so that the user can take the PCB board conveniently. However, the above-mentioned cooling operation is likely to cause heat loss in the heating area. When continuously processing the PCB board patch processing operation, the cooling operation of the PCB board in the previous process is likely to have an adverse effect on the curing operation of the PCB board in the next process, which is not conducive to saving the energy loss of the heating component. Utility Model Content

[0004] The purpose of the utility model is to provide an integrated device for curing and cooling SMT patch adhesive in order to solve the above problems.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0006] An integrated device for curing and cooling SMT patch glue, comprising a curing chamber for curing the SMT patch glue on a PCB board, and a cooling chamber arranged at one end of the curing chamber, a liquid cooling channel is arranged between the curing chamber and the cooling chamber, a water pump and a heat dissipation component are arranged on the liquid cooling channel, and the liquid cooling channel is filled with a liquid cooling medium; the liquid cooling channel is composed of a heat absorption section for absorbing heat in the cooling chamber, a heat return section for introducing the heat absorbed by the heat absorption section into the curing chamber, and a heat dissipation section for cooling the liquid cooling medium through the heat dissipation component. During the curing process, the PCB board coated with the SMT patch glue is placed in the curing chamber, the heating component of the curing chamber is started, the SMT patch glue is cured by heat, and then the PCB board is transferred to the cooling chamber for cooling. During the cooling process, the liquid cooling medium in the liquid cooling channel is made to flow through the water pump. The liquid cooling medium first absorbs the heat released by the PCB board at the heat absorption section of the liquid cooling channel, and then the liquid cooling medium flows into the heat return section of the liquid cooling channel to transfer the waste heat in the cooling chamber to the surrounding of the curing chamber, reducing the heat loss of the curing chamber. After that, the liquid cooling medium flows into the heat dissipation section of the liquid cooling channel, and the heat in the liquid cooling medium is dissipated to the air outside the device through the heat dissipation component. The cooled liquid cooling medium re-enters the heat absorption section of the liquid cooling channel under the action of the water pump. Using the waste heat of the cooling chamber to keep the curing chamber warm can reduce the energy loss required for the subsequent curing of other PCB boards.

[0007] As a further optimization scheme of the utility model, the heat absorption section is arranged inside the cooling chamber, the heat return section is arranged on the outer wall of the curing chamber, the water inlet of the heat dissipation section is connected to the water outlet of the heat return section, and the water outlet of the heat dissipation section is connected to the water inlet of the water pump, and the two ends of the heat absorption section are respectively connected to the water outlet of the water pump and the water inlet of the heat return section.

[0008] As a further optimization solution of the utility model, the heat dissipation assembly includes a heat dissipation plate and a fan arranged on one side of the heat dissipation plate, and the heat dissipation section runs through the heat dissipation plate.

[0009] As a further optimization scheme of the utility model, a transfer port connected to the interior of the cooling chamber is provided at one end of the curing chamber close to the cooling chamber, and a position adjustment component for moving the PCB board from the curing chamber to the cooling chamber is provided between the curing chamber and the cooling chamber.

[0010] As a further optimization scheme of the utility model, the position adjustment assembly includes a first carrier plate arranged inside the curing chamber, a second carrier plate arranged inside the cooling chamber, a first telescopic component arranged between the curing chamber and the cooling chamber, and a shift plate fixedly connected to the output end of the first telescopic component, and the shift plate is used to move the PCB board.

[0011] As a further optimization scheme of the utility model, the first telescopic component is fixedly arranged on the lower side of the second carrier plate, a connecting piece is fixedly arranged between the output end of the first telescopic component and the shift plate, and a groove corresponding to the connecting piece is arranged in the middle of the first carrier plate.

[0012] As a further optimization solution of the present invention, a guide shaft is fixedly provided inside the curing chamber, and the guide shaft passes through the shift plate.

[0013] As a further optimization solution of the present invention, a stopper for stopping the PCB board is provided on the top of the second carrier board.

[0014] As a further optimization solution of the utility model, a sealing component for separating the curing chamber and the cooling chamber is provided on the transfer port.

[0015] As a further optimization solution of the utility model, the sealing assembly includes a second telescopic component fixedly mounted on the top of the curing chamber and a partition plate arranged at the output end of the second telescopic component, and the partition plate is slidably connected to the transfer port.

[0016] The beneficial effects of the utility model are:

[0017] 1) In the process of cooling the PCB board, the utility model uses a water pump to make the liquid cooling medium in the liquid cooling channel flow. The liquid cooling medium first absorbs the heat released by the PCB board at the heat absorption section of the liquid cooling channel, and then flows into the heat return section, thereby transferring the residual heat to the curing chamber. After that, it is cooled by the heat dissipation component and flows back to the heat absorption section to continue to absorb heat, so that the curing chamber can be kept warm and the energy consumption required for curing the remaining PCB boards is reduced;

[0018] 2) The utility model transfers the PCB board to the cooling chamber along the groove through the first telescopic component in conjunction with the connecting piece and the shift plate. There is no need to open the curing chamber during the transfer process, which improves the convenience of operation. The heat loss caused by the transfer process is then driven by the second telescopic component to drive the partition to close the transfer port, further saving the energy loss of the curing chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a top view structural diagram of the utility model;

[0021] Figure 3 It is a bottom-up structural diagram of the utility model;

[0022] Figure 4 It is a side view of the curing chamber of the present utility model.

[0023] In the figure: 1. curing chamber; 2. cooling chamber; 3. liquid cooling channel; 31. heat absorption section; 32. heat return section; 33. heat dissipation section; 4. water pump; 5. heat dissipation assembly; 51. heat sink; 52. fan; 6. transfer port; 7. position adjustment assembly; 71. first carrier plate; 72. second carrier plate; 73. first telescopic component; 74. shift plate; 75. connector; 76. groove; 77. guide shaft; 78. stopper; 8. sealing assembly; 81. second telescopic component; 82. partition. DETAILED DESCRIPTION

[0024] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0025] Example

[0026] like Figure 1-4 As shown, a device for curing and cooling SMT patch glue comprises a curing chamber 1 for curing SMT patch glue on a PCB board, and a cooling chamber 2 arranged at one end of the curing chamber 1, wherein the cooling chamber 2 and the curing chamber 1 are fixed to each other, and the cooling chamber 2 is arranged at an opening at one end close to the curing chamber 1, a feed port is arranged at the front end of the curing chamber 1, and a heat insulation cover is arranged in the feed port, after opening the heat insulation cover, the PCB board can be placed, and a discharge port is arranged at the end of the cooling chamber 2 away from the curing chamber 1, and a door body is arranged at the discharge port, and the PCB board can be taken out from the cooling chamber 2 after opening the door body. In addition, the position design of the feed port of the curing chamber 1 and the discharge port of the cooling chamber 2 can be adjusted according to actual needs. A liquid cooling channel 3 is provided between the curing chamber 1 and the cooling chamber 2, and a water pump 4 and a heat dissipation component 5 are provided on the liquid cooling channel 3, and the liquid cooling channel 3 is filled with a liquid cooling medium; the liquid cooling channel 3 is composed of a heat absorption section 31 for absorbing heat in the cooling chamber 2, a heat return section 32 for introducing the heat absorbed by the heat absorption section 31 into the curing chamber 1, and a heat dissipation section 33 for cooling the liquid cooling medium through the heat dissipation component 5. A heating component is provided in the curing chamber 1. The heating component can be a heating plate arranged at the bottom or top of the curing chamber 1, or a hot air blower, and an ultraviolet lamp can also be added to the curing chamber 1 to accelerate the curing process. During the curing process, the PCB board coated with SMT patch glue is placed in the curing chamber 1, the heating component is started, the SMT patch glue is cured by heat, and then the PCB board is transferred to the cooling chamber 2 for cooling.

[0027] During the cooling process, the liquid cooling medium in the liquid cooling channel 3 is made to flow by the water pump 4. The liquid cooling medium first absorbs the heat released by the PCB board at the heat absorption section 31 of the liquid cooling channel 3, and then the liquid cooling medium flows into the heat return section 32 of the liquid cooling channel 3, transferring the residual heat of the cooling chamber 2 to the surrounding of the curing chamber 1, reducing the heat loss of the curing chamber 1, and then the liquid cooling medium flows into the heat dissipation section 33 of the liquid cooling channel 3, and dissipates the heat in the liquid cooling medium to the air outside the device through the heat dissipation component 5. The cooled liquid cooling medium re-enters the heat absorption section 31 of the liquid cooling channel 3 under the action of the water pump 4. Using the residual heat of the cooling chamber 2 to keep the curing chamber 1 warm can reduce the energy loss required for the subsequent curing of other PCB boards.

[0028] Specifically, see Figure 1-3 , the heat absorption section 31 is arranged inside the cooling chamber 2, the heat return section 32 is arranged on the outer wall of the curing chamber 1, the water inlet of the heat dissipation section 33 is connected to the water outlet of the heat return section 32, and the water outlet of the heat dissipation section 33 is connected to the water inlet of the water pump 4, and the two ends of the heat absorption section 31 are respectively connected to the water outlet of the water pump 4 and the water inlet of the heat return section 32. The heat dissipation component 5 includes a heat sink 51 and a fan 52 arranged on one side of the heat sink 51, and the heat dissipation section 33 runs through the heat sink 51. Preferably, the part of the heat return section 32 that is not in contact with the air in the part where the heat return section 32 is attached to the outer wall of the curing chamber 1 is made of heat conductive material, and the rest of the heat return section 32 is made of heat insulating material. The part of the curing chamber 1 connected to the heat return section 32 is made of heat conductive material, and the rest of the part is made of heat insulating material, so as to improve the waste heat recovery effect. In addition, the heat return section 32 can also be completely buried in the inner wall of the curing chamber 1 to reduce the energy loss of the heat return section 32.

[0029] Furthermore, if Figure 2 As shown, in order to improve the convenience of transferring PCB boards and reduce the energy loss of the curing chamber 1 during the transfer of the PCB boards, a transfer port 6 connected to the interior of the cooling chamber 2 is provided at one end of the curing chamber 1 close to the cooling chamber 2, and a position adjustment component 7 for moving the PCB board from the curing chamber 1 to the cooling chamber 2 is provided between the curing chamber 1 and the cooling chamber 2.

[0030] Specifically, Figure 2 and Figure 3As shown, the position adjustment component 7 includes a first carrier plate 71 disposed inside the curing chamber 1, and a second carrier plate 72 disposed inside the cooling chamber 2. The first carrier plate 71 and the second carrier plate 72 are respectively fixedly disposed inside the curing chamber 1 and the cooling chamber 2 through support columns. The heat absorption section 31 of the liquid cooling channel 3 is in close contact with the bottom of the second carrier plate 72, and the heat absorption section 31 absorbs the heat of the PCB board through the second carrier plate 72. In addition, the heat absorption section 31 can also be embedded in the second carrier plate 72, and can also be a water channel opened inside the second carrier plate 72 to enhance the heat absorption capacity. The second carrier plate 72 is made of a heat-conducting material, and the first carrier plate 71 and the second carrier plate 72 are both used to carry the PCB board, and the two carrier plates 71 and 72 are of the same height. In addition, the height of the second carrier plate 72 can also be slightly lower than that of the first carrier plate 71.

[0031] The position adjustment assembly 7 also includes a first telescopic component 73 disposed between the curing chamber 1 and the cooling chamber 2, and a shift plate 74 fixedly connected to the output end of the first telescopic component 73. The shift plate 74 is used to move the PCB board, and the shift plate 74 is in contact with the upper surface of the first carrier 71. The first telescopic component 73 is fixedly disposed on the lower side of the second carrier 72, and a connecting member 75 is fixedly disposed between the output end of the first telescopic component 73 and the shift plate 74. The connecting member 75 is in an inverted C shape or an inverted L shape. The first telescopic component 73 is preferably an electric push rod, and the outer shell of the electric push rod is fixed to the bottom of the second carrier 72 through a positioning hoop. A groove 76 corresponding to the connecting member 75 is disposed in the middle of the first carrier 71. A guide shaft 77 is fixedly disposed inside the curing chamber 1, and the guide shaft 77 passes through the shift plate 74. A stopper 78 for stopping the PCB board is disposed on the top of the second carrier 72.

[0032] When moving the PCB board, the first telescopic component 73 drives the shift plate 74 to move toward the cooling chamber 2 through the connecting member 75, and the connecting member 75 moves along the groove 76. The PCB board on the first carrier plate 71 passes through the transfer port 6 and enters the second carrier plate 72 of the cooling chamber 2 under the push of the shift plate 74. There is no need to open the curing chamber 1, thereby improving the convenience of transferring the PCB board and reducing the energy loss of the curing chamber 1 during the transfer of the PCB board.

[0033] Furthermore, if Figure 2 and Figure 4 As shown, a sealing assembly 8 for separating the curing chamber 1 from the cooling chamber 2 is provided on the transfer port 6. The sealing assembly 8 includes a second telescopic component 81 fixedly arranged on the top of the curing chamber 1 and a partition 82 arranged at the output end of the second telescopic component 81, and the partition 82 is slidably connected to the transfer port 6. After the PCB board enters the cooling chamber 2, the first telescopic component 73 is reset, and the partition 82 is driven by the second telescopic component 81 to close the transfer port 6. The partition 82 is made of heat insulating material, which can reduce the heat loss generated by the curing chamber 1 when cooling the PCB board.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. A device for curing and cooling SMT patch adhesive, comprising a curing chamber (1) for curing the SMT patch adhesive on a PCB board, and a cooling chamber (2) arranged at one end of the curing chamber (1), characterized in that: A liquid cooling channel (3) is provided between the curing chamber (1) and the cooling chamber (2); a water pump (4) and a heat dissipation component (5) are provided on the liquid cooling channel (3); and the liquid cooling channel (3) is filled with a liquid cooling medium; The liquid cooling channel (3) is composed of a heat absorbing section (31) for absorbing heat in the cooling chamber (2), a heat returning section (32) for introducing the heat absorbed by the heat absorbing section (31) into the curing chamber (1), and a heat dissipation section (33) for cooling the liquid cooling medium through a heat dissipation component (5).

2. The SMT patch adhesive curing and cooling integrated device according to claim 1, characterized in that: The heat absorption section (31) is arranged inside the cooling chamber (2), the heat return section (32) is arranged on the outer wall of the curing chamber (1), the water inlet of the heat dissipation section (33) is connected to the water outlet of the heat return section (32), and the water outlet of the heat dissipation section (33) is connected to the water inlet of the water pump (4), and the two ends of the heat absorption section (31) are respectively connected to the water outlet of the water pump (4) and the water inlet of the heat return section (32).

3. The SMT patch adhesive curing and cooling integrated device according to claim 2, characterized in that: The heat dissipation assembly (5) comprises a heat dissipation plate (51) and a fan (52) arranged on one side of the heat dissipation plate (51), and the heat dissipation section (33) passes through the heat dissipation plate (51).

4. The SMT patch adhesive curing and cooling integrated device according to claim 2, characterized in that: A transfer port (6) communicating with the interior of the cooling chamber (2) is provided at one end of the curing chamber (1) close to the cooling chamber (2), and a position adjustment component (7) for moving the PCB board from the curing chamber (1) to the cooling chamber (2) is provided between the curing chamber (1) and the cooling chamber (2).

5. The SMT patch adhesive curing and cooling integrated device according to claim 4, characterized in that: The position adjustment assembly (7) comprises a first carrier plate (71) arranged inside the curing chamber (1), a second carrier plate (72) arranged inside the cooling chamber (2), a first telescopic component (73) arranged between the curing chamber (1) and the cooling chamber (2), and a shift plate (74) fixedly connected to the output end of the first telescopic component (73), wherein the shift plate (74) is used to move the PCB board.

6. The SMT patch adhesive curing and cooling integrated device according to claim 5, characterized in that: The first telescopic component (73) is fixedly arranged on the lower side of the second carrier plate (72); a connecting member (75) is fixedly arranged between the output end of the first telescopic component (73) and the shift plate (74); and a groove (76) corresponding to the connecting member (75) is arranged in the middle of the first carrier plate (71).

7. The SMT patch adhesive curing and cooling integrated device according to claim 5, characterized in that: A guide shaft (77) is fixedly arranged inside the curing chamber (1), and the guide shaft (77) passes through the shift plate (74).

8. The SMT patch adhesive curing and cooling integrated device according to claim 5, characterized in that: A stopper (78) for stopping the PCB board is provided on the top of the second carrier board (72).

9. The SMT patch adhesive curing and cooling integrated device according to claim 4, characterized in that: The transfer port (6) is provided with a sealing component (8) for separating the curing chamber (1) and the cooling chamber (2).

10. The SMT patch adhesive curing and cooling integrated device according to claim 9, characterized in that: The sealing assembly (8) comprises a second telescopic component (81) fixedly mounted on the top of the curing chamber (1) and a partition (82) arranged at the output end of the second telescopic component (81), wherein the partition (82) is slidably connected to the transfer port (6).

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