Power amplifier assembly and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a power amplifier assembly and electronic equipment. The power amplifier assembly comprises a circuit board, a power amplifier module and a vibration reduction module. The circuit board is electrically connected with the mainboard. The power amplifier module is electrically connected to the circuit board, and the vibration reduction module is attached to the surface, away from the power amplifier module, of the circuit board so as to reduce board vibration of the power amplifier module. The electronic equipment comprises a main board and the power amplifier assembly, and the circuit board is electrically connected to the main board. According to the power amplifier assembly and the electronic equipment provided by the invention, the vibration reduction module is attached to the surface of the power amplifier module, so that the board vibration intensity of the power amplifier module is reduced; meanwhile, a split-board design is adopted, that is, an independent circuit board is arranged on the power amplifier assembly, and the power amplifier module is electrically connected to the circuit board, so that impedance is increased, and the board vibration intensity of the power amplifier module is further reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a power amplifier component and electronic equipment. Background Art

[0002] GSM (Global System for Mobile Communications) is the second generation mobile communication system. Electronic devices that support the GSM standard need to communicate with base stations through radio signals. Since the communication distance between electronic devices and base stations is very far, the signals sent by electronic devices need to be amplified by power amplifier components before they can be received by the base station.

[0003] The power amplifier component will work in time slots, and the prior art generally uses the system power supply of the electronic device to power the power amplifier component. When the power amplifier component is working, due to the power pumping effect, the power amplifier component will generate a large plate vibration, thereby affecting the electronic device. Utility Model Content

[0004] The present application discloses a power amplifier component and an electronic device, which can reduce the noise generated by the power amplifier component due to board vibration.

[0005] In order to achieve the above objectives, in a first aspect, the present application discloses a power amplifier assembly, comprising:

[0006] A circuit board, the circuit board is used to electrically connect to the main board;

[0007] a power amplifier module, the power amplifier module being electrically connected to the circuit board; and

[0008] A vibration reduction module is attached to a surface of the circuit board away from the power amplifier module to reduce board vibration of the power amplifier module.

[0009] The vibration reduction module is attached to the surface of the circuit board away from the power amplifier module, which can reduce the intensity of the board vibration caused by the power pumping effect, thereby reducing the impact on the power amplifier module and electronic equipment.

[0010] Optionally, the power amplifier component further includes an independent power supply, which supplies power to the power amplifier module.

[0011] The power amplifier module has an independent power supply, that is to say, the system power supply of the electronic device does not power the power amplifier module. Therefore, the power pumping effect of the power amplifier module will not act on the system power supply, thereby further reducing the intensity of the board vibration. At the same time, the system power supply will not be affected by the power pumping effect to avoid periodic ripples, thereby reducing or even preventing the human ear from receiving noise similar to electric current, thereby improving the user experience and the stability of the electronic device.

[0012] Optionally, the vibration reduction module includes a first vibration damping member, and the first vibration damping member is attached to a surface of the circuit board away from the power amplifier module.

[0013] The first vibration damping member is attached to the surface of the circuit board away from the power amplifier module to separate the circuit board from the main board, thereby reducing the impact on the main board when the power amplifier module vibrates, thereby reducing the impact on the electronic device.

[0014] Optionally, the first vibration dampening element is plasticine.

[0015] First, since the plasticine has good plasticity, it can adapt to the surface of various shapes of amplifier modules, so that it can better fill the space between the plasticine and the amplifier module and effectively reduce the board vibration. Secondly, the plasticine is composed of many small particles, and the friction between the small particles can absorb and disperse the impact of the board vibration. Of course, the plasticine also has good elasticity and good buffering performance, which can effectively reduce the impact of the board vibration.

[0016] Optionally, the vibration reduction module further includes a second vibration damping member, and the second vibration damping member wraps the circuit board, the power amplifier module and the first vibration damping member.

[0017] The second vibration damper wraps the circuit board, the power amplifier module and the first vibration damper, so that the second vibration damper can cooperate with the first vibration damper to weaken the impact of the board vibration of the power amplifier module from all directions, thereby further reducing the impact of the board vibration of the power amplifier module.

[0018] Optionally, the second vibration dampening member is sound-absorbing cotton.

[0019] The sound-absorbing cotton has a wave-shaped sound-absorbing groove, and its acoustic impedance can be well matched with the acoustic impedance of air, so that sound waves in a wider frequency band can be efficiently absorbed. In addition, the sound-absorbing cotton also has a multi-hole structure. The porous structure can absorb a large amount of incoming sound wave energy and play a role in attenuating the sound waves. Therefore, the sound-absorbing cotton has a good sound absorption and vibration reduction effect.

[0020] Optionally, the power amplifier assembly further includes a flexible circuit board, one end of the flexible circuit board is electrically connected to the circuit board, and the other end is used to electrically connect to the main board.

[0021] Flexible circuit boards have good flexibility, that is, they can be bent, folded or twisted freely, so that they can be designed arbitrarily in three-dimensional space and have strong flexibility. Flexible circuit boards are thin and flat, which can reduce the size and weight of power amplifier components.

[0022] In a second aspect, the present application further discloses an electronic device, comprising:

[0023] a mainboard, the mainboard being provided with a mounting area; and

[0024] As in the above-mentioned power amplifier assembly, the circuit board is embedded in the installation area and electrically connected to the mainboard, and a gap is formed between the circuit board and the edge of the installation area.

[0025] The power amplifier component and the main board are connected by separate boards, that is, the power amplifier module is connected to the main circuit system of the electronic device by means of a circuit board electrically connected to the main board, so that a greater contact impedance is formed between the power amplifier component and the main board, thereby reducing the board vibration. In addition, a gap is formed between the edge of the circuit board and the installation area, which can increase the distance between the power amplifier component and other functional components on the main board, thereby reducing the impact on other functional components when the power amplifier component has board vibration.

[0026] Optionally, the electronic device further includes:

[0027] an audio component, the audio component being electrically connected to the mainboard; and

[0028] A system power supply is electrically connected to the mainboard to supply power to the mainboard and the audio components.

[0029] The motherboard supplies power to the audio components by being electrically connected to the system power supply, while the power amplifier components are powered by an independent power supply, which greatly reduces or even avoids the impact of the periodic ripple generated by the system power supply caused by the power extraction effect of the power amplifier components on the audio components.

[0030] Optionally, a charging module is further included, and the charging module charges the system power supply and the independent power supply respectively.

[0031] By charging the system power supply and the independent power supply respectively through the charging module, it is possible to avoid contact between the system power supply and the independent power supply, thereby avoiding the power amplifier module from affecting the system power supply.

[0032] Compared with the prior art, the beneficial effects of this application are:

[0033] The power amplifier assembly provided in the present application is an electronic device, which reduces the board vibration strength of the power amplifier module by attaching a vibration reduction module to the surface of the power amplifier module; at the same time, a split-board design is adopted, that is, a separate circuit board is provided in the power amplifier assembly, and the power amplifier module is electrically connected to the circuit board, thereby increasing impedance and further reducing the board vibration strength of the power amplifier module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 is a structural schematic diagram of a first embodiment of a power amplifier assembly provided by the present application at a first viewing angle;

[0036] Figure 2 is a connection diagram of the power amplifier assembly provided by the present application;

[0037] Figure 3 is a structural schematic diagram of a second embodiment of a power amplifier assembly provided by the present application at a first viewing angle;

[0038] Figure 4 is a schematic diagram of a portion of the structure of an electronic device provided by the present application at a second viewing angle;

[0039] Figure 5 is a connection diagram of a first embodiment of an electronic device provided by the present application;

[0040] Figure 6 It is a connection diagram of the second embodiment of the electronic device provided by the present application.

[0041] Description of main reference numerals

[0042] 1- Power amplifier components;

[0043] 11- Circuit board;

[0044] 12-power amplifier module;

[0045] 13-vibration damping module; 131-first vibration damping member; 132-second vibration damping member;

[0046] 14-Independent power supply;

[0047] 2-Electronic equipment;

[0048] 21-mainboard; 211-installation area; 212-gap;

[0049] 22- audio component;

[0050] 23- System power supply;

[0051] 24-Charging module. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0053] In this application, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0054] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0055] GSM (Global System for Mobile Communications) is a mobile communication standard widely used around the world. It can use frequency bands such as 900MHz and 1800MHz for communication. At the same time, GSM uses TDMA (Time division multiple access) technology to transmit their data by allocating a specific time slot to each user. Among them, TDMA technology is a network communication technology. In TDMA technology, each user is assigned a specific time slot for transmitting their data. This time slot is pre-allocated, and users can quickly transmit data in their own time slots, allowing multiple users to share the same transmission media, thereby improving spectrum utilization and the capacity of the communication system.

[0056] Electronic devices supporting the GSM standard need to communicate with the base station through radio signals. Since the communication distance between the electronic device and the base station is very far, the signal sent by the electronic device needs to be power amplified before it can be received by the base station. The power amplifier component that can perform power amplification can meet the above requirements. Therefore, the power amplifier component is one of the important components of electronic devices supporting the GSM standard. In the prior art, the power amplifier component is powered by a system power supply.

[0057] Since GSM uses TDMA technology, the power amplifier components will also work in the allocated time slots and stop working at other times. Since the time slot is very short, usually only a few hundred milliseconds, when the power amplifier components switch from a stopped state to a working state, a power pumping effect will occur, that is, a large amount of current will be drawn from the system power supply in a short period of time, causing the system power supply voltage to drop and generate a 217HZ periodic ripple. In addition to causing board vibration in the power amplifier components, the periodic ripple will also receive current-like noise because the human ear can perceive an audio frequency range of 20Hz-20kHz, which seriously affects the stability of electronic equipment and the user experience.

[0058] Based on this, the embodiment of the present application discloses a power amplifier component and an electronic device to improve the above problems. The technical solution of the present application will be further described below in conjunction with specific embodiments and drawings.

[0059] See also Figure 1 In the first aspect, the present application discloses a power amplifier assembly 1, including a circuit board 11, a power amplifier module 12, and a vibration reduction module 13. The circuit board 11 is used to electrically connect a mainboard 21 (such as Figure 4 The power amplifier module 12 is electrically connected to the circuit board 11 , and the vibration reduction module 13 is attached to the surface of the circuit board 11 away from the power amplifier module 12 to reduce the board vibration of the power amplifier module 12 .

[0060] Among them, the power amplifier module 12 is a module that mainly plays the role of power amplification in the power amplifier component 1. The power amplifier module 12 may include a power amplifier, an oscillating element, a noise reduction element, a protective element, a control element, a heat dissipation element, etc. The function of the power amplifier is to amplify the low-power RF signal, obtain a sufficiently large RF output power and then radiate it. The power amplifier is the main component of the RF front-end transmission path, which determines the key parameters such as the wireless communication distance and signal quality of the mobile terminal and the base station. The oscillating element is used to generate a high-frequency signal to provide an input signal for the power amplifier. The noise reduction element is used to compensate for the noise inside the power amplifier to reduce the signal-to-noise ratio and improve the communication performance. The protection element is used to protect the power amplifier from hazards such as overvoltage and overcurrent. The control element is used to adjust the gain, bias or other parameters of the power amplifier to ensure the normal operation and performance of the power amplifier. The heat dissipation element is used to dissipate the heat generated by the power amplifier to prevent overheating from affecting the performance and service life of the device. Of course, the power amplifier module 12 may also include other components, which are not limited here.

[0061] It should be noted that, in this embodiment, the power amplifier assembly 1 includes an independent circuit board 11, the power amplifier module 12 is electrically connected to the circuit board 11, and the circuit board 11 is connected to the main board 21. Specifically, the various components of the power amplifier module 12 are mounted on the circuit board 11, and are connected to each other through the wires or printed circuits on the circuit board 11. When the circuit board 11 is powered on, the various components of the power amplifier module 12 are connected to the loop and work to achieve the transmission and control of electrical signals. It can be understood that when the various components of the power amplifier module 12 are mounted on the circuit board 11, the circuit board 11 can provide mechanical support for the power amplifier module 12, so that the power amplifier module 12 can be stably installed on the electronic device 2 (such as Figure 4 In addition, the circuit board 11 can also function to conduct heat generated by the power amplifier module 12 and reduce the interference of the power amplifier module 12 to other electronic components of the electronic device 2.

[0062] The vibration reduction module 13 is attached to the surface of the circuit board 11 away from the power amplifier module 12 , which can reduce the intensity of the board vibration caused by the power pumping effect, thereby reducing the impact on the power amplifier module 12 and the electronic device 2 .

[0063] See also Figure 2 In some embodiments, the power amplifier assembly 1 further includes an independent power supply 14 , which supplies power to the power amplifier module 12 .

[0064] In this embodiment, the power amplifier module 12 is powered by an independent power supply 14, that is, the system power supply 23 of the electronic device 2 does not power the power amplifier module 12, so the power pumping effect of the power amplifier module 12 will not act on the system power supply 23, thereby further reducing the intensity of the board vibration. At the same time, the system power supply 23 will not be affected by the power pumping effect to avoid generating periodic ripples, thereby reducing or even preventing the human ear from receiving noise similar to electric current, thereby improving the user experience and the stability of the electronic device 2.

[0065] In some other embodiments, the power amplifier module 12 may also be powered by the system power supply 23 of the electronic device 2 .

[0066] Please refer again Figure 1 In some embodiments, the vibration reduction module 13 includes a first vibration damping member 131 , and the first vibration damping member 131 is attached to a surface of the circuit board 11 away from the power amplifier module 12 .

[0067] In this embodiment, the first vibration dampening member 131 is attached to the surface of the circuit board 11 away from the power amplifier module 12 to separate the circuit board 11 from the main board 21, thereby reducing the impact on the main board 21 when the power amplifier module 12 vibrates, thereby reducing the impact on the electronic device 2.

[0068] In some other embodiments, the first vibration damping member 131 may also be disposed on a surface of the circuit board 11 away from the power amplifier module 12 .

[0069] In some embodiments, the first vibration dampening element 131 is plasticine.

[0070] First, since the plasticine has a good plastic effect, the plasticine can adapt to the surface of the power amplifier module 12 of various shapes, so that it can better fill the space between the plasticine and the power amplifier module 12, effectively reducing the board vibration. Secondly, the plasticine is composed of many small particles, and the friction between the small particles can absorb and disperse the impact caused by the board vibration. Of course, the plasticine also has good elasticity and good buffering performance, which can effectively reduce the impact caused by the board vibration.

[0071] In some other implementations, the first vibration damping member 131 may also be made of silica gel, etc., which is not limited here.

[0072] See also Figure 3 In some more specific embodiments, the vibration reduction module 13 further includes a second vibration damping member 132 , and the second vibration damping member 132 wraps the circuit board 11 , the power amplifier module 12 and the first vibration damping member 131 .

[0073] The second vibration damper 132 wraps the circuit board 11, the power amplifier module 12 and the first vibration damper 131, which means that the second vibration damper 132 is attached to the surface of the power amplifier module 12 away from the circuit board 11 and the surface of the first vibration damper 131 away from the power circuit board 11, and the second vibration damper 132 is attached to the peripheral surfaces of the power amplifier module 12, the circuit board 11 and the first vibration damper 131, so that the second vibration damper 132 can cooperate with the first vibration damper 131 to weaken the influence of the board vibration of the power amplifier module 12 from all directions, thereby further reducing the influence of the board vibration of the power amplifier module 12.

[0074] In some other more specific embodiments, the second vibration damping member 132 may also only be attached to the peripheral surface of the power amplifier module 12 .

[0075] In some more specific implementations, the second vibration dampening element 132 is sound-absorbing cotton.

[0076] The sound-absorbing cotton has a wave-shaped sound-absorbing groove, and its acoustic impedance can be well matched with the acoustic impedance of air, so that sound waves in a wider frequency band can be efficiently absorbed. In addition, the sound-absorbing cotton also has a multi-hole structure. The porous structure can absorb a large amount of incoming sound wave energy and play a role in attenuating the sound waves. Therefore, the sound-absorbing cotton has a good sound absorption and vibration reduction effect.

[0077] In some other more specific implementations, the second vibration damping member 132 is foam rubber, etc., which is not limited here.

[0078] In some embodiments, the power amplifier assembly 1 further includes a flexible circuit board (not shown in the figure), one end of the flexible circuit board is electrically connected to the circuit board 11 , and the other end of the flexible circuit board is used to be electrically connected to the main board 21 .

[0079] First, the flexible circuit board has good flexibility, that is, the flexible circuit board can be bent, folded or twisted freely, so that the flexible circuit board can be arbitrarily designed in three-dimensional space and has strong flexibility. Therefore, by using a flexible circuit board to electrically connect the circuit board 11 and the main board 21, the relative position between the circuit board 11 and the main board 21 can be designed in a diversified manner, so that the best relative position between the circuit board 11 and the main board 21 can be found. In addition, the flexible circuit board is thin and flat, which can reduce the volume of the power amplifier component 1 and reduce the weight of the power amplifier component 1.

[0080] In some other embodiments, the circuit board 11 and the main board 21 may also be electrically connected by a flexible flat cable.

[0081] Please also read Figure 3 and Figure 4 In a second aspect, the embodiment of the present application further discloses an electronic device 2, which includes a mainboard 21 and the power amplifier assembly 1 as described above. The mainboard 21 is provided with a mounting area 211, the circuit board 11 is embedded in the mounting area 211 and electrically connected to the mainboard 21, and a gap 212 is formed between the circuit board 11 and the edge of the mounting area 211.

[0082] The mainboard 21 is one of the most important components of the electronic device 2 , integrating the main hardware components of the electronic device 2 , such as a processor and memory, etc., thereby forming the main circuit system of the electronic device 2 .

[0083] In this embodiment, the power amplifier component 1 and the main board 21 are connected in a split-board manner, that is, the power amplifier module 12 and the like are connected to the main circuit system of the electronic device 2 by being electrically connected to the main board 21 via the circuit board 11, so that a larger contact impedance is formed between the power amplifier component 1 and the main board 21, thereby reducing the board vibration.

[0084] In addition, a gap 212 is formed between the circuit board 11 and the edge of the mounting area 211, which can increase the distance between the power amplifier component 1 and other functional components on the main board 21, thereby reducing the impact on other functional components when the power amplifier component 1 has board vibration.

[0085] See also Figure 5 In some embodiments, the electronic device 2 further includes an audio component 22 and a system power supply 23. The audio component 22 is electrically connected to the motherboard 21, and the system power supply 23 is electrically connected to the motherboard 21 to supply power to the motherboard 21 and the audio component 22.

[0086] Among them, in this embodiment, the audio component 22 may include an amplifier, a filter, a mixer and a frequency converter. The amplifier is one of the most basic components of the audio component 22, and its main function is to amplify the weak audio signal to the power that the human ear can receive; the filter mainly plays the role of filtering noise and signal modulation, such as removing high-frequency noise or low-frequency noise, or even only releasing the signal within a certain frequency band; the mixer can combine the frequencies of two or more sound signals to generate a new mixed frequency; the frequency converter can change the timbre, volume and sound quality of the sound by controlling the frequency and amplitude. Therefore, the working principle of the audio component 22 is mainly to decode the received audio data, restore it to a digital signal, convert the digital signal into an analog signal, and perform post-processing such as noise elimination, echo elimination and audio gain control, and finally release the audio signal. Of course, the audio component 22 may also include other components, which are not limited here.

[0087] In this embodiment, the mainboard 21 supplies power to the audio component 22 by being electrically connected to the system power supply 23, while the power amplifier component 1 is powered by an independent power supply 14, which greatly reduces or even avoids the influence of the periodic ripple generated by the system power supply 23 on the audio component 22 due to the power extraction effect of the power amplifier component 1.

[0088] In some other embodiments, an independent audio power supply may be provided to power the audio component 22 .

[0089] See also Figure 6 In some embodiments, the electronic device 2 further includes a charging module 24, and the charging module 24 charges the system power supply 23 and the independent power supply 14 respectively.

[0090] The charging module 24 has functions such as battery protection, charging control and temperature detection. During the charging process, the circuit between the battery interface and the charging interface will form a complete loop so that electrical energy can be transferred from the charger to the battery. Secondly, during the charging process, the charging module 24 will control the power output of the charger and monitor the voltage and current of the battery to ensure that the battery will not be overcharged or over-discharged before it is fully charged. In addition, when the battery is fully charged or the battery fails, the charging module 24 will automatically cut off the charging to protect the battery.

[0091] Exemplarily, in this embodiment, the charging module 24 has a first charging mode and a second charging mode. When the charging module 24 is in the first charging mode, the charging module 24 is connected to the system power supply 23 and forms a loop, thereby charging the system power supply 23. When the system power supply 23 is fully charged, the connection between the charging module 24 and the system power supply 23 is automatically cut off. When the charging module 24 is in the second charging mode, the charging module 24 is connected to the independent power supply 14 and forms a loop, thereby charging the independent power supply 14. When the independent power supply 14 is fully charged, the connection between the charging module 24 and the independent power supply 14 is automatically cut off.

[0092] The charging module 24 charges the system power supply 23 and the independent power supply 14 respectively, so as to avoid the connection between the system power supply 23 and the independent power supply 14 , thereby preventing the power amplifier module 12 from affecting the system power supply 23 .

[0093] In some other embodiments, the charging module 24 may also charge the system power supply 23 and the independent power supply 14 at the same time. Specifically, the charging module 24 may include a first charging submodule and a second charging submodule, the first charging submodule is electrically connected to the system power supply 23 to form a loop, and the second charging submodule is electrically connected to the independent power supply 14 to form a loop, so that the charging module 24 can charge the system power supply 23 and the independent power supply 14 at the same time.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power amplifier assembly, characterized in that: include: A circuit board, the circuit board is used to electrically connect to the main board; A power amplifier module, the power amplifier module is electrically connected to the circuit board; as well as A vibration reduction module is attached to a surface of the circuit board away from the power amplifier module to reduce board vibration of the power amplifier module.

2. The power amplifier assembly according to claim 1, characterized in that: The power amplifier assembly also includes an independent power supply, which supplies power to the power amplifier module.

3. The power amplifier assembly according to claim 1, characterized in that: The vibration reduction module includes a first vibration damping member, and the first vibration damping member is attached to a surface of the circuit board away from the power amplifier module.

4. The power amplifier assembly according to claim 3, characterized in that: The first vibration damping member is plasticine.

5. The power amplifier assembly according to claim 3, characterized in that: The vibration reduction module further includes a second vibration damping member, and the second vibration damping member wraps the circuit board, the power amplifier module and the first vibration damping member.

6. The power amplifier assembly according to claim 5, characterized in that: The second vibration damping member is sound absorbing cotton.

7. The power amplifier assembly according to any one of claims 1 to 6, characterized in that: The power amplifier assembly also includes a flexible circuit board, one end of which is electrically connected to the circuit board, and the other end of which is used to be electrically connected to the main board.

8. An electronic device, characterized in that: include: A mainboard, wherein the mainboard is provided with a mounting area; as well as According to the power amplifier assembly as described in any one of claims 2-7, the circuit board is embedded in the installation area and electrically connected to the mainboard, and a gap is formed between the power amplifier assembly and the edge of the installation area.

9. The electronic device according to claim 8, characterized in that: Also includes: An audio component, the audio component is electrically connected to the mainboard; as well as A system power supply is electrically connected to the mainboard to supply power to the mainboard and the audio components.

10. The electronic device according to claim 9, characterized in that: It also includes a charging module, which charges the system power supply and the independent power supply respectively.

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