Circuit board capable of avoiding copper leakage during gold plating
By adopting a reinforced layer and groove design with bent fiber material in the circuit board, the poor exposure problem caused by the lifting of the circuit board is solved, and the stability of the circuit board and the reliability of the electrical connection are improved.
Patent Information
- Application Number
- CN202421063792.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-05-16
AI Technical Summary
Existing circuit boards are prone to curling during dry film adhesion, resulting in a difference in height between lines, resulting in poor exposure and problems of copper leakage due to electro-gold anti-plating.
A circuit board structure including a copper foil layer, a substrate body, an insulating layer, an adhesive layer and a reinforcement layer were designed. The reinforcement layer is made of bent fiber material, which increases the stability of the circuit board and passes through grooves and The wave-shaped reinforcement layer enhances structural strength.
It effectively solves the problem of circuit board lifting, reduces the height difference between lines, improves manufacturing quality and electrical connection stability, and ensures the reliability of electronic components.
Smart Images
Figure CN222216048U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board that avoids copper leakage from electroplating gold resistance. Background Art
[0002] Circuit boards are the support for electronic components and the carrier for electrical connections of electronic components. Through circuit boards, electronic components can be densely arranged, signal interference can be reduced, circuit performance can be improved, and large-scale production and assembly can be facilitated. Circuit boards are widely used in various electronic devices, such as computers, communication equipment, consumer electronics, etc.
[0003] When the existing PCB board is dry film attached, part of the main body of the PCB board is warped, and there is a height difference between the warped lines, resulting in poor exposure. The poor exposure caused by the height difference is not developed cleanly, causing residual film to adhere to the gold finger and cause copper leakage of electroplating gold resist. This project aims to develop a circuit board that avoids copper leakage of electroplating gold resist to solve the problem. Utility Model Content
[0004] In view of at least one of the above technical problems, the present application provides a circuit board that avoids copper leakage due to electro-gold resist plating, and adopts the following technical solution to solve the problem.
[0005] According to one aspect of the present application, there is provided a circuit board for preventing copper leakage due to electroplating gold resistance, comprising: a copper foil layer, one side of the copper foil layer being glued with a substrate body;
[0006] The substrate body includes a semi-solid layer, a first insulating layer is connected below the semi-solid layer, a first adhesive layer is connected below the first insulating layer, a first reinforcement layer is connected below the first adhesive layer, a second adhesive layer is connected below the first reinforcement layer, and a second insulating layer is connected below the second adhesive layer.
[0007] The utility model is further configured such that a first reinforcement strip is provided between the first insulating layer and the first adhesive layer, and a second reinforcement strip is provided between the second insulating layer and the second adhesive layer. Both the first reinforcement strip and the second reinforcement strip are made of fiber material, the outer portion of the first reinforcement strip is bent, and the folding angle of the first reinforcement strip is 90-135°.
[0008] The utility model is further configured such that the bending angles of the first adhesive layer and the first reinforcement strip are equal, the first reinforcement strip is arranged inside the bending angle of the first adhesive layer away from the first reinforcement strip, and the second reinforcement strip is arranged inside the bending angle of the second adhesive layer away from the first reinforcement layer.
[0009] The utility model is further configured such that the first reinforcement strip and the second reinforcement strip are both made of resin material, and the first reinforcement strip and the second reinforcement strip are both in the shape of a triangular prism.
[0010] The utility model is further configured that the outer wall of the first reinforcement strip is glued and connected to the first insulating layer.
[0011] The utility model is further configured that the outer wall of the second reinforcement strip is glued and connected to the second insulating layer.
[0012] The utility model is further configured that a side of the first insulating layer close to the first adhesive layer is provided with evenly distributed grooves, and the positions of the grooves on the side of the first insulating layer correspond to the positions of the bending angles of the first reinforcement layer.
[0013] The utility model is further configured that a side of the second insulating layer close to the first adhesive layer is provided with evenly distributed grooves, and the positions of the grooves on the side of the second insulating layer correspond to the positions of the bending angles of the first reinforcement layer.
[0014] The utility model is further configured to include a second reinforcement layer, the second reinforcement layer has a third adhesive layer and a fourth adhesive layer glued to its two sides respectively, the outer wall of the third adhesive layer is glued to the first insulating layer, and the outer wall of the fourth adhesive layer is glued to the second insulating layer.
[0015] The utility model is further configured that the outer wall of the second reinforcement layer is wavy, and the third reinforcement strip and the fourth reinforcement strip are respectively arranged on the wavy inner side of the second reinforcement layer.
[0016] This application has the following technical effects:
[0017] The utility model uses a first reinforcement layer, which is a bent structure as a whole. The first reinforcement layer increases the internal support effect, effectively solving the problem of warping of the circuit board that may occur during use. The provision of the first reinforcement layer makes the main part of the circuit board more stable, reduces the height difference between wires, and thus avoids the occurrence of poor exposure, which not only improves the manufacturing quality of the circuit board, but also ensures that the electrical connection of electronic components is more stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 is a cross-sectional view of the first embodiment of the present application;
[0020] Figure 2 is a schematic diagram of the structure of the first adhesive layer in this application;
[0021] Figure 3 is a cross-sectional view of the second embodiment of the present application;
[0022] Figure 4 This is a schematic diagram of the third reinforcement strip structure in this application.
[0023] Reference numerals:
[0024] 1. Copper foil layer; 2. Semi-solid layer; 3. First insulating layer; 4. First reinforcement strip; 5. First bonding layer; 6. First reinforcement layer; 7. Second reinforcement strip; 8. Second insulating layer; 9. Second bonding layer; 10. Third bonding layer; 11. Fourth bonding layer; 12. Third reinforcement strip; 13. Fourth reinforcement strip; 14. Second reinforcement layer; 15. Second reinforcement layer. DETAILED DESCRIPTION
[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are explained to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below. For example, the terms such as "tightening sheet" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the present invention without substantially changing the technical content.
[0026] Embodiment 1
[0027] In this embodiment of the present application, Figure 1 and Figure 2 As shown, a circuit board for preventing copper leakage during electroplating is provided, comprising: a copper foil layer 1, one side of the copper foil layer 1 is glued with a substrate body;
[0028] The substrate body includes a semi-solid layer 2, a first insulating layer 3 is connected below the semi-solid layer 2, a first adhesive layer 5 is connected below the first insulating layer 3, a first reinforcement layer 6 is connected below the first adhesive layer 5, a second adhesive layer 9 is connected below the first reinforcement layer 6, and a second insulating layer 8 is connected below the second adhesive layer 9.
[0029] The first reinforcement layer 6 effectively solves the problem of warping of the circuit board that may occur during use. The first reinforcement layer 6 makes the main part of the circuit board more stable, reduces the height difference between the lines, and thus avoids the occurrence of poor exposure. This not only improves the manufacturing quality of the circuit board, but also ensures that the electrical connection of the electronic components is more stable and reliable.
[0030] Furthermore, a first reinforcing strip 4 is provided between the first insulating layer 3 and the first adhesive layer 5, and a second reinforcing strip 7 is provided between the second insulating layer 8 and the second adhesive layer 9. The first reinforcing strip 4 and the second reinforcing strip 7 are both made of fiber material. The outside of the first reinforcing strip 4 is bent, and the folding angle of the first reinforcing strip 4 is 90-135°. The first reinforcing strip 4 and the second reinforcing strip 7 are made of fiber material, which generally has good strength and toughness. At the same time, the outside of the first reinforcing strip 4 and the second reinforcing strip 7 is bent, and the folding angle is between 90-135°. The folding angle of this angle has a large bearing capacity, which can enhance the mechanical strength of the circuit board.
[0031] Furthermore, the first adhesive layer 5 has an equal bending angle to the first reinforcement strip 4, a first reinforcement strip 4 is arranged on the inner side of the bending angle of a side of the first adhesive layer 5 away from the first reinforcement strip 4, a second reinforcement strip 7 is arranged on the inner side of the bending angle of a side of the second adhesive layer 9 away from the first reinforcement layer 6, and the bending angle of the first adhesive layer 5 is equal to that of the first reinforcement strip 6, which helps to maintain the overall structural stability of the circuit board.
[0032] Furthermore, the first reinforcement strip 4 and the second reinforcement strip 7 are both made of resin material, and the first reinforcement strip 4 and the second reinforcement strip 7 are both in the shape of a triangular prism, and the resin material has good insulation performance and mechanical strength. At the same time, the first reinforcement strip 4 and the second reinforcement strip 7 are both in the shape of a triangular prism, and this shape can ensure strength.
[0033] Furthermore, the outer wall of the first reinforcement strip 4 is glued and connected to the first insulating layer 3 .
[0034] Furthermore, the outer wall of the second reinforcement strip 7 is glued to the second insulation layer 8 .
[0035] Furthermore, a side of the first insulating layer 3 close to the first adhesive layer 5 is provided with evenly distributed grooves, and the position of the grooves on one side of the first insulating layer 3 corresponds to the bending angle position of the first reinforcement layer 6; a side of the second insulating layer 8 close to the first adhesive layer 5 is provided with evenly distributed grooves, and the position of the grooves on one side of the second insulating layer 8 corresponds to the bending angle position of the first reinforcement layer 6.
[0036] By providing evenly distributed grooves on one side of the first insulating layer 3 and the second insulating layer 8 close to the adhesive layer, and corresponding to the bending angle position of the first reinforcing layer 6, the present application further enhances the structural strength and stability of the circuit board. This design helps to disperse the stress concentration of the circuit board when it is subjected to force, improves the overall anti-deformation ability, and thus prolongs the service life of the circuit board.
[0037] Embodiment 2
[0038] This embodiment 2 is an improved implementation method based on the embodiment 1. Figure 3 and Figure 4 , and also includes a second reinforcement layer 15, the two sides of the second reinforcement layer 15 are respectively glued with a third adhesive layer 10 and a fourth adhesive layer 11, the outer wall of the third adhesive layer 10 is glued with a first insulating layer 3, the outer wall of the fourth adhesive layer 11 is glued with a second insulating layer 8, the outer wall of the second reinforcement layer 15 is wavy, and the third reinforcement strip 12 and the fourth reinforcement strip 13 are respectively arranged on the wavy inner side of the second reinforcement layer 15.
[0039] The present application also adopts a wavy second reinforcement layer 15 design, and sets a third reinforcement strip 12 and a fourth reinforcement strip 13 on the inner side of the second reinforcement layer 15. The wavy third reinforcement strip 12 and the fourth reinforcement strip 13 not only increase the mechanical strength of the circuit board, but also ensure that the circuit board can maintain good performance under high-load working conditions.
[0040] In summary, the circuit board for avoiding copper leakage from electroplating gold resist provided by the present application has achieved remarkable results in structural design and performance optimization, effectively solved the problems existing in the prior art, and provided users with a more stable and reliable electronic component support and electrical connection carrier. This will help improve the overall performance and service life of electronic equipment.
[0041] The above are only preferred embodiments of the present application, and do not constitute any formal limitation on the present application. Any technician familiar with the art can use the above disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the present application without departing from the scope of the technical solution of the present application, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the present application without departing from the content of the technical solution of the present application should be included in the protection scope of the present application.
Claims
1. A circuit board for preventing copper leakage from electroplating, characterized in that: include: The copper foil layer (1) is characterized in that: one side of the copper foil layer (1) is glued with a substrate body; The substrate body comprises a semi-solid layer (2), a first insulating layer (3) is connected below the semi-solid layer (2), a first adhesive layer (5) is connected below the first insulating layer (3), a first reinforcement layer (6) is connected below the first adhesive layer (5), a second adhesive layer (9) is connected below the first reinforcement layer (6), and a second insulating layer (8) is connected below the second adhesive layer (9).
2. A circuit board for preventing copper leakage from electroplating gold resistance according to claim 1, characterized in that: A first reinforcement strip (4) is arranged between the first insulating layer (3) and the first adhesive layer (5), and a second reinforcement strip (7) is arranged between the second insulating layer (8) and the second adhesive layer (9). Both the first reinforcement strip (4) and the second reinforcement strip (7) are made of fiber material. The outside of the first reinforcement strip (4) is bent, and the folding angle of the first reinforcement strip (4) is 90-135°.
3. A circuit board for preventing copper leakage from electroplating gold resist according to claim 2, characterized in that: The first adhesive layer (5) and the first reinforcement strip (4) have the same bending angle; the first reinforcement strip (4) is arranged inside the bending angle of a side of the first adhesive layer (5) away from the first reinforcement strip (4); and the second reinforcement strip (7) is arranged inside the bending angle of a side of the second adhesive layer (9) away from the first reinforcement layer (6).
4. A circuit board for preventing copper leakage from electroplating gold resist according to claim 3, characterized in that: The first reinforcement strip (4) and the second reinforcement strip (7) are both made of resin material, and the first reinforcement strip (4) and the second reinforcement strip (7) are both in the shape of a triangular prism.
5. A circuit board for preventing copper leakage from electroplating gold resist according to claim 4, characterized in that: The outer wall of the first reinforcement strip (4) is glued to the first insulation layer (3).
6. A circuit board for preventing copper leakage from electroplating gold resist according to claim 4, characterized in that: The outer wall of the second reinforcement strip (7) is glued to the second insulation layer (8).
7. A circuit board for preventing copper leakage from electroplating gold resist according to claim 1, characterized in that: A surface of the first insulating layer (3) close to the first adhesive layer (5) is provided with evenly distributed grooves, and the positions of the grooves on the surface of the first insulating layer (3) correspond to the positions of the bending angles of the first reinforcement layer (6).
8. A circuit board for preventing copper leakage from electroplating gold resist according to claim 7, characterized in that: A surface of the second insulating layer (8) close to the first adhesive layer (5) is provided with evenly distributed grooves, and the positions of the grooves on one surface of the second insulating layer (8) correspond to the positions of the bending angles of the first reinforcement layer (6).
9. A circuit board for preventing copper leakage from electroplating gold resist according to claim 1, characterized in that: It also includes a second reinforcement layer (15), the second reinforcement layer (15) having two surfaces respectively bonded with a third adhesive layer (10) and a fourth adhesive layer (11), the outer wall of the third adhesive layer (10) being bonded with the first insulating layer (3), and the outer wall of the fourth adhesive layer (11) being bonded with the second insulating layer (8).
10. A circuit board for preventing copper leakage from electroplating gold resist according to claim 9, characterized in that: The outer wall of the second reinforcement layer (15) is wavy, and a third reinforcement strip (12) and a fourth reinforcement strip (13) are respectively arranged on the wavy inner side of the second reinforcement layer (15).