Integrated cleaning device

Abstract

The utility model discloses an integrated cleaning device, relates to the technical field of semiconductor wafer cleaning, and aims to solve the problems of large occupied space and tedious debugging of the conventional wafer cleaning equipment. The integrated cleaning device comprises an integrated cleaning assembly with a surface brushing part and a surface grinding part, and a leveling mechanism for leveling the cleaning assembly, the surface brushing part and the surface grinding part are arranged on different surfaces, the cleaning assembly reciprocates along the leveling mechanism so as to clean the to-be-cleaned part in a reciprocating contact manner, the cleaning assembly further comprises an overturning assembly, so that the surface brushing part and the surface grinding part are overturned and switched at a working position, and the surface grinding part and the surface brushing part alternately work through overturning of the cleaning assembly. The face grinding part or the face brushing part can be adjusted to enter a cleaning state, so that the face grinding part and the face brushing part can alternately work without mutual interference, and compared with a traditional arrangement scheme, leveling can be achieved through the leveling mechanism, and the adjusting time is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer cleaning, and more specifically to an integrated cleaning device. Background Art

[0002] In the wafer packaging process, wafer thinning is a crucial link. This process requires cleaning of the wafer and the microporous ceramic suction cups used to transport the wafer. It is necessary to ensure that the bottom of the wafer after thinning and the microporous ceramic suction cups responsible for transporting the wafer are clean to prevent dust from being accumulated on the bottom of the microporous ceramic suction cups, which may cause the wafer to break when the wafer is transported by vacuum suction. It can also prevent dust from adhering to the circuit surface of the wafer after grinding, which may cause damage to the wafer when it is vacuum-cleaned in the cleaning machine after transportation.

[0003] In the existing technical solution, the brush and the oilstone are placed separately to complete the cleaning of the wafer and the microporous ceramic suction cup for transporting the wafer, which will cause a waste of space. At the same time, it cannot ensure that the oilstone and the brush are absolutely parallel. The oilstone and the brush need to be debugged separately, which will waste time.

[0004] Therefore, how to solve the problem that the existing wafer cleaning equipment occupies a large space and is cumbersome to debug is an urgent problem to be solved by technical personnel in this field. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide an integrated cleaning device, which can reduce the occupied space and leveling time of the entire equipment, and can also reduce the cost of the equipment.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An integrated cleaning device includes an integrated cleaning component with a brush surface portion and a grinding surface portion, and a leveling mechanism for leveling the cleaning component. The brush surface portion and the grinding surface portion are arranged on different surfaces. The cleaning component reciprocates along the leveling mechanism to perform reciprocating contact cleaning on the parts to be cleaned. The device also includes a flipping component to flip and switch the brush surface portion and the grinding surface portion at the working position.

[0008] Preferably, both ends of the cleaning assembly are arranged on a moving base plate through brackets, and the moving base plate is reciprocally movable and arranged on a leveling mechanism.

[0009] Preferably, the cleaning component also includes a special-shaped rotating shaft, both ends of which are rotatably connected to the bracket, an adjustment plate for installing the grinding surface portion is provided on the special-shaped rotating shaft, and a brushing surface portion is fixed on the special-shaped rotating shaft.

[0010] Preferably, a fixing groove for installing the grinding surface portion is provided on the adjustment plate, and threaded holes are provided on both sides of the adjustment plate, which cooperate with the first screw to fix the grinding surface portion to the adjustment plate, and the cleaning assembly has a leveling structure, which is provided on the adjustment plate, and the leveling structure includes a top screw and a second screw, which cooperate with the top screw to level and fix the adjustment plate to the special-shaped rotating shaft.

[0011] Preferably, a spray assembly is provided on both sides of the brushing surface and the grinding surface, the spray assembly is connected to the control device and is used to spray the parts to be cleaned, the spray assembly includes a support arranged on the leveling mechanism, a water spray pipe is provided on the top of the support, and a plurality of spray holes are provided on the water spray pipe.

[0012] Preferably, the leveling mechanism comprises:

[0013] The leveling bottom plate is arranged on the fixed base, the leveling bottom plate is provided with a shock absorbing member, the moving bottom plate is provided with a slot hole for accommodating the shock absorbing member, and a buffer pad is sleeved on the outer periphery of the shock absorbing member;

[0014] The leveling screw is a hollow structure and is arranged on the leveling base plate;

[0015] The locking screw is inserted into the leveling screw, one end of the locking screw is connected to the fixed base, and the two end surfaces of the locking screw relative to the leveling base plate are locked by locking nuts to achieve the positioning and locking of the leveling base plate. The leveling screw and the locking screw cooperate to adjust the horizontality of the leveling base plate.

[0016] Preferably, a slider with a guide groove is fixed on the leveling base plate, the moving base plate is connected to the output end of a cylindrical cylinder fixed on the leveling base plate, the cylindrical cylinder is connected to the control device, and the cylindrical cylinder drives the moving base plate to reciprocate along the guide groove.

[0017] Preferably, a flip cylinder connected to the control device is provided on the bracket, and an output end of the flip cylinder is connected to a gear, which is provided at the end of the special-shaped rotating shaft and is used to drive the rotation of the special-shaped rotating shaft.

[0018] Preferably, two limit screws are provided on the bracket, and the two limit screws are symmetrically arranged on both sides of the special-shaped rotating shaft. A limit baffle is provided on one side of the special-shaped rotating shaft, and the limit baffle cooperates with the limit screws to stabilize the position of the grinding surface and the brushing surface after flipping.

[0019] Preferably, a scraper is installed on one side of the top of the bracket, and the top of the scraper is lower than the water spray pipe.

[0020] The integrated cleaning device provided by the utility model comprises a cleaning component, a leveling mechanism and a flipping component. Specifically, the cleaning component is an integrated cleaning component with a brushing surface and a grinding surface to achieve cleaning of the parts to be cleaned, and the overall leveling is achieved through the leveling effect of the leveling mechanism.

[0021] The cleaning component can reciprocate along the leveling mechanism. The reciprocating movement of the cleaning component can realize repeated cleaning of the parts to be cleaned. The cleaning component can be flipped on the leveling mechanism through the action of the flipping component. The grinding surface part and the brush surface part are arranged at different positions of the leveling mechanism. The grinding surface part is used to clean the suction cup that adsorbs the wafer, and the brush surface part is used to clean the wafer. The grinding surface part and the brush surface part can work alternately by flipping the cleaning component. That is to say, by flipping the cleaning component, the grinding surface part or the brush surface part can be adjusted to enter the cleaning state, so that the two can work alternately without interfering with each other. Compared with the traditional setting scheme, leveling can be achieved through the leveling mechanism to reduce adjustment time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the structure of the integrated cleaning device provided by the utility model;

[0024] Figure 2 It is a partial schematic diagram of the integrated cleaning device provided by the utility model.

[0025] Reference numerals:

[0026] 1-cleaning component, 101-grinding surface, 102-brushing surface, 103-special-shaped rotating shaft, 104-adjusting plate;

[0027] 2-leveling mechanism, 21-leveling base plate, 22-leveling screw, 23-locking screw;

[0028] 3- Bracket;

[0029] 4-Sports base;

[0030] 5-leveling structure, 51-top screw, 52-second screw;

[0031] 6-spray washing assembly, 61-support, 62-spray pipe;

[0032] 7-Fix the base;

[0033] 8- shock absorbing parts;

[0034] 9- Slider;

[0035] 10-cylindrical cylinder;

[0036] 11- Turn over the cylinder;

[0037] 12-Gear;

[0038] 13-limit screw;

[0039] 14-limit baffle;

[0040] 15- Scraper. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0042] It should be noted that the directional words such as "upper" and "lower" mentioned below are defined based on the drawings in the specification.

[0043] The core of the utility model is to provide an integrated cleaning device, which can reduce the occupied space and leveling time of the entire equipment and can also reduce the cost of the equipment.

[0044] Please refer to Figure 1 and Figure 2 An integrated cleaning device includes a cleaning component 1, a leveling mechanism 2 and a flipping component.

[0045] Specifically, the cleaning component 1 is an integrated cleaning component 1 having a grinding surface portion 101 and a brushing surface portion 102 to achieve cleaning of the parts to be cleaned, and the leveling effect of the leveling mechanism 2 is used to achieve overall leveling.

[0046] The cleaning component 1 can reciprocate along the leveling mechanism 2. The reciprocating movement of the cleaning component 1 can realize repeated cleaning of the parts to be cleaned. The cleaning component 1 can be flipped on the leveling mechanism 2 through the action of the flipping component. The grinding surface portion 101 and the brush surface portion 102 are arranged at different positions of the leveling mechanism 2. The grinding surface portion 101 is used to clean the suction cup that adsorbs the wafer, and the brush surface portion 102 is used to clean the wafer. The grinding surface portion 101 and the brush surface portion 102 can be alternately operated by flipping the cleaning component 1. That is to say, by flipping the cleaning component 1, the grinding surface portion 101 or the brush surface portion 102 can be adjusted to enter the cleaning state, so that the two can work alternately without interfering with each other. Compared with the traditional setting scheme, leveling can be achieved through the leveling mechanism 2 to reduce the adjustment time.

[0047] Among them, in this embodiment, the brush surface part 102 is a brush and the grinding surface part 101 is an oilstone, but in actual application, there is no limitation to this, and it can also be an abrasive, a cleaning cloth, a sponge cloth, a loose stone, a grinding wheel, silicon carbide, etc. It is not limited to the specific brush surface part 102 and the grinding surface part 101, as long as the above-mentioned technical effect can be achieved.

[0048] By adopting the integrated cleaning device arranged in the above manner, the grinding surface portion 101 and the brush surface portion 102 are arranged at different positions of the leveling mechanism 2, which can reduce the overall occupied space, reduce the waste of parts cost caused by placing the grinding surface portion 101 and the brush surface portion 102 separately, and reduce the time cost due to adjusting the flatness of the grinding surface portion 101 and the brush surface portion 102.

[0049] In the above embodiment, both ends of the cleaning assembly 1 are arranged on the moving base plate 4 through the brackets 3, and the moving base plate 4 is reciprocally movable on the leveling mechanism 2.

[0050] It should be noted that, through the reciprocating movement of the moving bottom plate 4, the brushing surface portion 102 and the grinding surface portion 101 can reciprocate, thereby achieving repeated cleaning actions on the wafer and the microporous ceramic suction cup.

[0051] In the above case, the cleaning component 1 also includes a special-shaped rotating shaft 103, both ends of which are rotatably connected to the bracket 3, an adjustment plate 104 for installing the grinding surface portion 101 is provided on the special-shaped rotating shaft 103, and a brush surface portion 102 is fixed on the special-shaped rotating shaft 103.

[0052] It can be understood that the grinding surface portion 101 and the brush surface portion 102 are integrated into one by setting the special-shaped rotating shaft 103, and the grinding surface portion 101 and the brush surface portion 102 are installed on two opposite surfaces of the special-shaped rotating shaft 103, so that the special-shaped rotating shaft 103 switches once every 180 degrees of rotation. Through the rotation of the special-shaped rotating shaft 103, the grinding surface portion 101 and the brush surface portion 102 are smoothly switched, and the grinding surface portion 101 and the brush surface portion 102 will not interfere with each other during the process of separately cleaning the wafer and the microporous ceramic suction cup.

[0053] The cross-sectional shape of the special-shaped rotating shaft 103 along its radial direction is square, so as to facilitate the installation of the grinding surface portion 101 and the brushing surface portion 102. However, in practical applications, there is no limitation to this as long as the above-mentioned technical effect can be achieved.

[0054] In the present embodiment, the grinding surface portion 101 and the brushing surface portion 102 are configured in this manner, but in actual life, there is no limitation thereto as long as the above-mentioned technical effects can be achieved.

[0055] Furthermore, a fixing groove for installing the grinding surface portion 101 is provided on the adjustment plate 104, and threaded holes are provided on both sides of the adjustment plate 104, which cooperate with the first screw to fix the grinding surface portion 101 to the adjustment plate 104. The cleaning component 1 has a leveling structure 5, and the leveling structure 5 is provided on the adjustment plate 104. The leveling structure 5 includes a top screw 51 and a second screw 52, ​​and the top screw 51 and the second screw 52 cooperate to level and fix the adjustment plate 104 to the special-shaped rotating shaft 103.

[0056] When in use, the entire device is fixed in a wafer cleaning water tank by a fixed base 7. The water tank has a certain inclination. The entire device is first leveled once by a leveling mechanism 2 to ensure the parallelism between the grinding surface 101 and the adsorption surface of the cleaning arm. After the overall leveling, if the grinding surface 101 is damaged during the cleaning process, the leveling structure 5 is used to complete the secondary leveling and lifting.

[0057] It should be noted that a fixing groove for mounting the grinding surface portion 101 is provided on the adjustment plate 104. The grinding surface portion 101 is mounted in the fixing groove, and the grinding surface portion 101 is fixed to the adjustment plate 104 on the side of the adjustment plate 104 with a first screw. The adjustment plate 104 with the grinding surface portion 101 already mounted is leveled at the top of the adjustment plate 104 with a top screw 51 and a second screw 52, ​​thereby achieving secondary leveling of the grinding surface portion 101.

[0058] In this embodiment, the grinding surface portion 101 and the adjustment plate 104 are fixed by the first screw and the threaded hole, but in real life, other fixing methods can be used without limitation. In addition, in this embodiment, a fixing groove is provided on the adjustment plate 104 to install the grinding surface portion 101, or the grinding surface portion 101 can be directly installed on the adjustment plate 104 without limitation, as long as the above-mentioned technical effect can be achieved.

[0059] In the above embodiment, a spray cleaning assembly 6 is provided on both sides of the brushing portion 102 and the grinding portion 101. The spray cleaning assembly 6 is connected to the control device and is used to spray the wafer and the suction cup. The spray cleaning assembly 6 includes a support 61 provided on the leveling mechanism 2. A water spray pipe 62 is provided on the top of the support 61. A plurality of spray holes are provided on the water spray pipe 62.

[0060] It can be understood that the control device controls the water spray pipe 62 to pass water during cleaning, and water is sprayed out from the spray holes on the water spray pipe 62 to flush the wafer and the suction cup, and cooperates with the grinding surface part 101 and the brushing surface part 102 to achieve cleaning of the wafer and the microporous ceramic suction cup.

[0061] On the basis of the above embodiment, the leveling mechanism 2 includes a leveling base plate 21, a leveling screw 22 and a locking screw 23. The leveling base plate 21 is arranged on the fixed base 7. A shock absorber 8 is provided on the leveling base plate 21. A slot for accommodating the shock absorber 8 is provided on the moving base plate 4. A buffer pad is sleeved on the outer periphery of the shock absorber 8. The leveling screw 22 is a hollow structure. The leveling screw 22 is arranged on the leveling base plate 21. The locking screw 23 is inserted into the leveling screw 22. One end of the locking screw 23 is connected to the fixed base 7. The locking screw 23 is locked relative to the two end surfaces of the leveling base plate 21 by a locking nut to realize the positioning and locking of the leveling base plate 21. The horizontality of the leveling base plate 21 can be adjusted by the cooperation of the leveling screw 22 and the locking screw 23.

[0062] It should be noted that when using the leveling screw 22 and the locking screw 23 to level the leveling base plate 21, first loosen the locking nut on the locking screw 23, and move the distance between the leveling base plate 21 and the fixed base 7 according to actual conditions, so that the locking screw 23 moves up and down along the length direction of the leveling screw 22. After leveling, lock the locking screw 23 and the leveling base plate 21 with the locking nut, and the locking nuts are distributed on the two end surfaces of the leveling base plate 21.

[0063] In one embodiment, the leveling screw 22 is threadedly connected to the leveling base plate 21 , and the locking screw 23 is threadedly connected to the fixed base 7 , but in real life, there is no limitation to this.

[0064] Among them, one end of the locking screw 23 is fixed or integrally connected to the fixed base 7, or welded, and there is no limitation on this, as long as the above-mentioned technical effect can be achieved.

[0065] The leveling screws 22 and locking screws 23 on the leveling base plate 21 are used to level the entire mechanism, thereby ensuring the parallelism between the grinding surface 101 and the adsorption surface of the cleaning arm. The moving base plate 4 generates a large noise during the reciprocating motion. By arranging the shock absorbing member 8 and the buffer pad on the leveling base plate 21, the noise generated by the moving base plate 4 during the motion can be effectively reduced. By arranging the buffer pad, the wear caused by the collision between the moving base plate 4 and the shock absorbing member 8 can also be reduced.

[0066] Among them, in this embodiment, three leveling screws 22 are provided, but in actual life, there is no limitation on the number, specification and position of the leveling screws 22 as long as the above-mentioned technical effect can be achieved.

[0067] In the above embodiment, a slider 9 with a guide groove is provided on the leveling base plate 21, the moving base plate 4 is connected to the output end of the cylindrical cylinder 10 fixed on the leveling base plate 21, the cylindrical cylinder 10 is connected to the control device, and the cylindrical cylinder 10 drives the moving base plate 4 to reciprocate along the guide groove.

[0068] It can be understood that the extension and contraction direction of the cylindrical cylinder 10 is the same as the reciprocating direction of the moving base plate 4. The control device controls the driving of the cylindrical cylinder 10 so that the output end of the cylindrical cylinder 10 extends to drive the moving base plate 4 to move away from the cylindrical cylinder 10. After the moving base plate 4 abuts against the groove wall of the guide groove, the output end of the cylindrical cylinder 10 is controlled to contract to drive the moving base plate 4 to move toward the cylindrical cylinder 10 until the moving base plate 4 abuts against the groove wall of the guide groove, and the cycle is repeated again, thereby realizing the reciprocating movement of the slider 9 in the guide groove. During the movement of the moving base plate 4, it will collide with the two groove walls of the guide groove, thereby generating noise. Therefore, by arranging the shock absorber 8 and the buffer pad, the noise generated by the moving base plate 4 during the movement can be effectively reduced.

[0069] Among them, in this embodiment, a slider 9 is set on the leveling base plate 21 to limit the operation of the moving base plate 4, but in actual life, the telescopic stroke of the cylindrical cylinder 10 can also be directly controlled by the control device to achieve the above-mentioned technical effect. There is no limitation on this, and there is no limitation on the structure and position of the silencer, as long as the above-mentioned technical effect can be achieved.

[0070] As a preferred embodiment, a flip cylinder 11 connected to the control device is provided on the bracket 3, and the output end of the flip cylinder 11 is connected to the gear 12. The gear 12 is provided at the end of the special-shaped rotating shaft 103 and is used to drive the rotation of the special-shaped rotating shaft 103.

[0071] It should be noted that the power for the overall flipping is provided by the flipping cylinder 11. The control device controls the flipping cylinder 11 to drive the gear 12 to rotate, and then drives the special-shaped shaft 103 to rotate, so that the grinding surface 101 and the brushing surface 102 can be switched smoothly.

[0072] Among them, in this embodiment, the rotation of the special-shaped shaft 103 is achieved by the cooperation of the flip cylinder 11 and the gear 12, but in actual life, there is no limitation to this, as long as the above technical effect can be achieved.

[0073] In the above situation, two limit screws 13 are provided on the bracket 3, and the two limit screws 13 are symmetrically arranged on both sides of the special-shaped rotating shaft 103. A limit baffle 14 is provided on one side of the special-shaped rotating shaft 103. The limit baffle 14 cooperates with the limit screws 13 to stabilize the positions of the grinding surface 101 and the brushing surface 102 after flipping.

[0074] It is understandable that the use of the flip cylinder 11 and the addition of the limit baffle 14 and the limit screw 13 to complete the movement limit on both sides of the brushing surface 102 and the grinding surface 101 ensures that the use space is reduced and the use of some parts is saved, thereby achieving the purpose of reducing costs. The limit baffle 14 is fixed on one side of the special-shaped rotating shaft 103 to complete the flipping limit of the grinding surface 101 and the brushing surface 102. At the same time, the limit screw 13 is used to limit the flipping position of the grinding surface 101 and the brushing surface 102 respectively, ensuring the accuracy after flipping.

[0075] When the flip cylinder 11 drives the shaped shaft 103 to rotate 180 degrees in the forward direction, the limit baffle 14 abuts against a limit screw 13 on the bracket 3 to limit the position of the shaped shaft 103 after flipping. At this time, the grinding surface 101 faces upward and the brushing surface 102 faces downward; when the flip cylinder 11 drives the shaped shaft 103 to rotate 180 degrees in the reverse direction, the limit baffle 14 abuts against another limit screw 13 on the bracket 3 to limit the position of the shaped shaft 103 after flipping. At this time, the grinding surface 101 faces downward and the brushing surface 102 faces upward. There is no restriction on the orientation of the corresponding grinding surface 101 and brushing surface 102 after forward rotation and reverse rotation, as long as the above-mentioned technical effect can be achieved.

[0076] In the above embodiment, a scraper 15 is installed on one side of the top of the bracket 3 , and the top of the scraper 15 is lower than the water spray pipe 62 .

[0077] It should be noted that, by providing the scraper 15 , dirt on the brush surface 102 during the brushing process can be rubbed off by the rubbing of the brush surface 102 and the scraper 15 .

[0078] In summary, the integrated cleaning device provided by the utility model integrates the grinding surface portion 101 and the brush surface portion 102 into one body, which can effectively reduce the space occupied by the overall device, reduce the waste of parts cost caused by placing the grinding surface portion 101 and the brush surface portion 102 separately, and reduce the time cost due to adjusting the parallelism of the grinding surface portion 101 and the brush surface portion 102 relative to the microporous ceramic suction cup.

[0079] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0080] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0081] The above is a detailed introduction to an integrated cleaning device provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. An integrated cleaning device, characterized in that: The invention comprises an integrated cleaning component (1) having a brushing surface portion (101) and a grinding surface portion (102), and a leveling mechanism (2) for leveling the cleaning component (1); the brushing surface portion (101) and the grinding surface portion (102) are arranged on different surfaces; the cleaning component (1) moves back and forth along the leveling mechanism (2) to perform reciprocating contact cleaning on a component to be cleaned; and a flipping component is further included to flip and switch the brushing surface portion (101) and the grinding surface portion (102) at a working position.

2. The integrated cleaning device according to claim 1, characterized in that: The two ends of the cleaning component (1) are arranged on a moving base plate (4) via brackets (3); the moving base plate (4) is arranged on the leveling mechanism (2) in a reciprocating manner.

3. The integrated cleaning device according to claim 2, characterized in that: The cleaning assembly (1) further comprises a special-shaped rotating shaft (103), the two ends of which are rotatably connected to the bracket (3), an adjustment plate (104) for mounting the grinding surface portion (102) is provided on the special-shaped rotating shaft (103), and the brushing surface portion (101) is fixed on the special-shaped rotating shaft (103).

4. The integrated cleaning device according to claim 3, characterized in that: The adjustment plate (104) is provided with a fixing groove for mounting the grinding surface portion (102), and threaded holes are provided on both sides of the adjustment plate (104), and the threaded holes cooperate with a first screw to fix the grinding surface portion (102) to the adjustment plate (104). The cleaning component (1) has a leveling structure (5), and the leveling structure (5) is provided on the adjustment plate (104). The leveling structure (5) comprises a top screw (51) and a second screw (52), and the top screw (51) and the second screw (52) cooperate to level and fix the adjustment plate (104) to the special-shaped rotating shaft (103).

5. The integrated cleaning device according to claim 4, characterized in that: A spray cleaning assembly (6) is provided on both sides of the brushing surface (101) and the grinding surface (102); the spray cleaning assembly (6) is connected to a control device and is used for spray cleaning the parts to be cleaned; the spray cleaning assembly (6) comprises a support (61) provided on the leveling mechanism (2); a water spray pipe (62) is provided on the top of the support (61); and a plurality of spray holes are provided on the water spray pipe (62).

6. The integrated cleaning device according to claim 5, characterized in that: The leveling mechanism (2) comprises: A leveling base plate (21) is arranged on the fixed base (7), a shock absorbing member (8) is arranged on the leveling base plate (21), a slot hole for accommodating the shock absorbing member (8) is arranged on the moving base plate (4), and a buffer pad is sleeved on the outer periphery of the shock absorbing member (8); A leveling screw (22) is a hollow structure, and the leveling screw (22) is arranged on the leveling base plate (21); A locking screw (23) is inserted into the leveling screw (22), one end of the locking screw (23) is connected to the fixed base (7), and the locking screw (23) is locked relative to the two end surfaces of the leveling base plate (21) through locking nuts to achieve the positioning and locking of the leveling base plate (21). The leveling screw (22) and the locking screw (23) cooperate to adjust the horizontality of the leveling base plate (21).

7. The integrated cleaning device according to claim 6, characterized in that: A slider (9) with a guide groove is fixedly provided on the leveling base plate (21); the moving base plate (4) is connected to the output end of a cylindrical cylinder (10) fixed on the leveling base plate (21); the cylindrical cylinder (10) is connected to the control device; the cylindrical cylinder (10) drives the moving base plate (4) to reciprocate along the guide groove.

8. The integrated cleaning device according to claim 7, characterized in that: The bracket (3) is provided with a flip cylinder (11) connected to the control device, and the output end of the flip cylinder (11) is connected to a gear (12). The gear (12) is provided at the end of the special-shaped rotating shaft (103) and is used to drive the rotation of the special-shaped rotating shaft (103).

9. The integrated cleaning device according to claim 8, characterized in that: The bracket (3) is provided with two limit screws (13), and the two limit screws (13) are symmetrically arranged on both sides of the special-shaped rotating shaft (103). A limit baffle (14) is provided on one side of the special-shaped rotating shaft (103), and the limit baffle (14) cooperates with the limit screws (13) to stabilize the positions of the brushing surface (101) and the grinding surface (102) after flipping.

10. The integrated cleaning device according to any one of claims 5 to 9, characterized in that: A scraper (15) is installed on one side of the top of the bracket (3), and the top of the scraper (15) is lower than the water spray pipe (62).

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