Wafer electroplating equipment capable of flushing wafer

Abstract

The utility model relates to the technical field of wafer processing equipment, in particular to wafer electroplating equipment capable of flushing wafers, which comprises a workbench, an electroplating tank, a flushing tank and a U-shaped mounting column are respectively arranged at the top of the workbench, a transmission screw is movably arranged on the inner side of the U-shaped mounting column, a movable support block is sleeved on the outer side of the transmission screw, and the movable support block is connected with the electroplating tank. A supporting plate is fixedly mounted on the rear side of the movable supporting block, an electric sliding rail is fixedly mounted at the bottom of the supporting plate, an electric sliding block is slidably arranged on the outer side of the electric sliding rail, a mounting block is arranged at the bottom of the electric sliding block, and a buffering mechanism is arranged between the mounting block and the electric sliding block. According to the wafer electroplating equipment capable of flushing the wafers, the buffering effect on the placing frame is improved, the situation that a wafer disc is rubbed with impurities is effectively reduced, and the machining quality of the wafer disc is guaranteed through the arrangement of the wafer electroplating equipment capable of flushing the wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to wafer electroplating equipment capable of washing wafers. Background Art

[0002] Wafer electroplating equipment is used to plate a layer of coating on the wafer disk, and after electroplating, it needs to be placed in a cleaning equipment to clean off the impurities on its surface to prevent the impurities from affecting the use of the wafer.

[0003] A wafer electroplating device that can wash the wafer is currently used. After searching, it was found that, for example, the Chinese patent document with the authorization publication number CN217459643U discloses a wafer electroplating device that can wash the wafer, including a cabinet, a washing nozzle fixedly connected to the inner wall of the washing tank, the end surface of the washing nozzle is flush with the inner wall of the washing tank, and the water spraying direction of the washing nozzle is inclined downward; the actuator is used to take the wafer disc out of the electroplating tank and put it into the washing tank; the wafer is first slowly placed in the electroplating tank through the actuator, and after it is electroplated, the wafer disc is slowly lifted up by the actuator and slowly placed in the washing tank, so that the wafer can be directly washed and cleaned after electroplating, and impurities on the surface of the wafer disc are cleaned in time, and then it is transported to a designated place through a transfer device; the wafer electroplating device allows the wafer disc to be directly washed and cleaned after electroplating, avoiding the occurrence of friction during transportation by the transfer device, thereby ensuring the quality of the wafer disc.

[0004] Although the above patents solve the problems in the above-mentioned background technology, they still have the following shortcomings: 1. The device only relies on springs to achieve buffering protection for the wafer disc. This buffering method is too simple. Therefore, when the wafer disc is moved up, it is easy for the wafer disc to shake and rub against impurities, thereby causing the processing quality of the wafer disc to deteriorate; 2. The device relies on the magnetic attraction between the magnetic plates and the contact between the slots and the contacts to achieve the installation of the wafer disc placement plate. The fastening effect of this installation method is not good, which can easily cause the wafer disc placement plate to separate from the connecting plate, which is not conducive to the subsequent electroplating processing of the wafer disc, affecting the practical effect of the equipment.

[0005] In summary, the utility model solves the problems in the above-mentioned background technology by designing a wafer electroplating device in which the wafer can be rinsed. Utility Model Content

[0006] The utility model aims to provide a wafer electroplating device capable of washing wafers, so as to solve the problems raised in the above-mentioned background technology.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A wafer electroplating device in which wafers can be washed comprises a workbench, wherein the top of the workbench is respectively provided with an electroplating tank, a washing tank and a U-shaped mounting column, a rotating motor is fixedly installed on the top of the U-shaped mounting column, a transmission screw is movably arranged on the inner side of the U-shaped mounting column, a movable support block is sleeved on the outer side of the transmission screw, a support plate is fixedly installed on the rear side of the movable support block, an electric slide rail is fixedly installed on the bottom of the support plate, an electric slider is slidably arranged on the outer side of the electric slide rail, a mounting block is arranged on the bottom of the electric slider, a buffer mechanism is arranged between the mounting block and the electric slider, a plum blossom screw is rotatably arranged on the front and rear ends of the mounting block through a bearing, a guide plate is sleeved on the outer thread of the plum blossom screw, a guide column is fixedly installed on the side of the guide plate close to the mounting block, a mounting groove is provided on the bottom surface of the mounting block, a placement rack is arranged inside the mounting groove, and guide holes are provided on the front and rear end surfaces of the placement rack;

[0009] The buffer mechanism includes a square groove and a buffer block. The square groove is opened on the bottom surface of the electric slider, and the top inner wall thereof is fixedly installed with a shock absorber and a buffer support respectively. The outer matching sleeve of the shock absorber is provided with a shock absorber spring. The interior of the buffer support is opened with a buffer cavity. The interior of the buffer cavity is respectively provided with a rubber buffer ball and a limit plate. The bottom end of the limit plate is fixedly installed with a buffer support rod, and the buffer block is fixedly installed on the top surface of the mounting block.

[0010] As a preferred solution of the utility model, the output end of the rotating motor passes through the top surface of the U-shaped mounting column and is fixedly connected to the top end of the transmission screw.

[0011] As a preferred solution of the utility model, the front side surface of the movable support block is in contact with the inner side surface of the U-shaped mounting column, and the inner wall thereof is threadedly connected with the outer side surface of the transmission screw.

[0012] As a preferred solution of the utility model, the electric slide rail is electrically connected to the electric slider via a wire.

[0013] As a preferred solution of the utility model, the outer top surface of the placement rack is in contact with the inner wall of the installation groove, and the opposite ends of the guide column are movable through the front and rear end surfaces of the installation block and extend to the interior of the installation groove, and are plugged into the guide hole.

[0014] As a preferred solution of the utility model, the cross-sectional shape of the square groove matches the buffer block.

[0015] As a preferred solution of the utility model, the shock absorber and the buffer support are distributed symmetrically front and back about the internal center axis of the mounting groove, the outer surface of the limit plate is in close contact with the inner wall of the buffer cavity, the bottom end of the buffer support rod passes through the bottom inner wall of the buffer cavity and is fixedly connected to the top surface of the buffer block, and the bottom end of the shock absorber is fixedly connected to the top surface of the buffer block.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. In the utility model, a wafer electroplating device with wafer washability is set up, so that the extension and retraction of the shock absorber and the movement of the buffer support rod are realized by utilizing the structural design in the buffer mechanism, so that the shock absorber spring generates elastic supporting force and the limit plate squeezes the rubber buffer ball, thereby improving the buffering effect of the placement rack, effectively reducing the friction between the wafer disc and impurities, and ensuring the processing quality of the wafer disc.

[0018] 2. In the utility model, a wafer electroplating device with wafer washability is set up, thereby utilizing the structural design of the mounting groove, guide hole, plum screw, guide plate and guide column to realize the screwing connection between the plum screw and the guide plate, so that the guide column and the guide hole are plugged in, thereby achieving the purpose of fastening and installing the placement frame, ensuring the fixing effect between the placement frame and the mounting block, facilitating the subsequent electroplating processing of the wafer disc, and ensuring the practical effect of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the U-shaped mounting column of the utility model;

[0021] Figure 3 It is a schematic diagram of the partial decomposition structure of the device of the utility model;

[0022] Figure 4 It is a structural schematic diagram of the buffer mechanism of the utility model.

[0023] In the figure: 1. workbench; 101. electroplating tank; 102. rinsing tank; 103. U-shaped mounting column; 1031. rotating motor; 1032. transmission screw; 1033. moving support block; 104. support plate; 105. electric slide rail; 106. electric slider; 107. mounting block; 1071. plum screw; 1072. guide plate; 1073. guide column; 108. mounting slot; 109. placement rack; 1091. guide hole; 2. buffer mechanism; 201. square slot; 202. buffer block; 203. shock absorber; 204. buffer support; 205. shock absorbing spring; 206. buffer cavity; 207. rubber buffer ball; 208. limit plate; 209. buffer support rod. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0025] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0028] For examples, see Figure 1-4 , the utility model provides a technical solution:

[0029] A wafer electroplating device with wafer washability comprises a workbench 1, wherein a plating tank 101, a washing tank 102 and a U-shaped mounting column 103 are respectively arranged on the top of the workbench 1, a rotating motor 1031 is fixedly installed on the top of the U-shaped mounting column 103, a transmission screw 1032 is movably arranged on the inner side of the U-shaped mounting column 103, a movable support block 1033 is sleeved on the outer side of the transmission screw 1032, a support plate 104 is fixedly installed on the rear side of the movable support block 1033, an electric slide rail 105 is fixedly installed on the bottom of the support plate 104, and an electric slider 1031 is slidably arranged on the outer side of the electric slide rail 105 6. A mounting block 107 is provided at the bottom of the electric slider 106, a buffer mechanism 2 is provided between the mounting block 107 and the electric slider 106, plum screws 1071 are rotatably provided at the front and rear ends of the mounting block 107 through bearings, a guide plate 1072 is provided on the outer thread sleeve of the plum screw 1071, a guide column 1073 is fixedly installed on the side of the guide plate 1072 close to the mounting block 107, a mounting groove 108 is provided on the bottom surface of the mounting block 107, a placement frame 109 is provided inside the mounting groove 108, and guide holes 1091 are provided on the front and rear end surfaces of the placement frame 109;

[0030] Specifically, the output end of the rotating motor 1031 passes through the top surface of the U-shaped mounting column 103 and is fixedly connected to the top of the transmission screw 1032. The front surface of the moving support block 1033 fits the inner surface of the U-shaped mounting column 103, and the inner wall thereof is threadedly connected to the outer surface of the transmission screw 1032. The electric slide rail 105 is electrically connected to the electric slider 106 through a wire.

[0031] In this embodiment, the rotating motor 1031 is mainly used to drive the transmission screw 1032, and the transmission screw 1032 can be threadedly matched with the movable support block 1033, thereby realizing the up and down movement of the movable support block 1033 and the support plate 104, wherein the sliding cooperation between the electric slide rail 105 and the electric slider 106 is mainly used to horizontally move the mounting block 107 and the placement rack 109, and the placement rack 109 is mainly used to contact with the wafer disk, thereby facilitating the placement rack 109 to be moved to the electroplating tank 101 or the rinsing tank 102, which is convenient for the staff to operate.

[0032] Specifically, the outer top surface of the placement frame 109 is in contact with the inner wall of the installation groove 108, and the opposite ends of the guide column 1073 are movably penetrated through the front and rear end surfaces of the installation block 107 and extend to the inside of the installation groove 108, and are plugged and matched with the guide hole 1091;

[0033] In this embodiment, the plum screw 1071 is mainly used to drive the guide plate 1072 to move, so that the guide plate 1072 drives the guide column 1073 to be close to or away from the guide hole 1091, thereby achieving the purpose of convenient disassembly and assembly of the placement rack 109, and facilitating the loading or unloading operations of the wafer disc.

[0034] In this embodiment, please refer to Figure 1 and Figure 4 The buffer mechanism 2 includes a square groove 201 and a buffer block 202. The square groove 201 is provided on the bottom surface of the electric slider 106, and a damper 203 and a buffer support 204 are fixedly installed on the inner wall of the top thereof. A damper spring 205 is provided on the outer side of the damper 203. A buffer cavity 206 is provided inside the buffer support 204. A rubber buffer ball 207 and a limit plate 208 are provided inside the buffer cavity 206. A buffer support rod 209 is fixedly installed on the bottom end of the limit plate 208. The buffer block 202 is fixedly installed on the top surface of the mounting block 107.

[0035] Specifically, the cross-sectional shape of the square groove 201 matches the buffer block 202, the shock absorber 203 and the buffer support 204 are symmetrically distributed front and back about the inner central axis of the installation groove 108, the outer surface of the limit plate 208 is in contact with the inner wall of the buffer cavity 206, the bottom end of the buffer support rod 209 passes through the bottom inner wall of the buffer cavity 206 and is fixedly connected to the top surface of the buffer block 202, and the bottom end of the shock absorber 203 is fixedly connected to the top surface of the buffer block 202;

[0036] In the present embodiment, the square groove 201 is mainly used to form a fitting slide with the buffer block 202, and the shock absorber 203 and the shock absorber spring 205 can elastically support the buffer block 202, thereby realizing the initial buffering protection of the mounting block 107, wherein the buffer support rod 209 is mainly used to drive the limit plate 208 to move upward along the inner wall of the buffer cavity 206 and elastically squeeze the rubber buffer ball 207, thereby achieving the effect of secondary buffering of the mounting block 107, which is convenient for protecting the wafer disk and meets the use needs of the staff.

[0037] The working process of the utility model is as follows: when using a wafer electroplating device with a wafer washable function, first, the placement rack 109 with the wafer plate fixed thereon is moved so that its top end is close to and in contact with the mounting groove 108. When the guide hole 1091 and the guide column 1073 are located on the same straight line, the plum screw 1071 can be driven. Under the threaded cooperation between the plum screw 1071 and the guide plate 1072, the guide plate 1072 drives the guide column 1073 and the guide hole 1091 to gradually move. The mounting block 107 is moved to the top of the plating tank 101 or the rinsing tank 102 under the drive of the electric slider 106, and then the rotating motor 1031 is started. The output end of the rotating motor 1031 drives the transmission screw 1032 to rotate. Under the threaded connection between the transmission screw 1032 and the moving support block 1033, the moving support block 1033 is moved along the U-shaped mounting column. The inner wall of 103 moves downward, and the support plate 104 moves with the movement of the moving support block 1033, so that the placement rack 109 is placed inside the electroplating tank 101 or the rinsing tank 102, thereby completing the electroplating operation and the rinsing operation of the wafer disk. Further, when a vibration force is generated during the movement of the placement rack 109, under the action of the vibration force, the mounting block 107 drives the buffer block 202 to move upward, and the buffer block 202 squeezes the shock absorber 203 and the shock absorber spring 205. And drives the buffer support rod 209 to move upward, wherein the shock absorbing spring 205 begins to shrink and generate elastic potential energy, which can effectively weaken the vibration force, and the buffer support rod 209 drives the limit plate 208 to move upward along the inner wall of the buffer cavity 206 and compresses the rubber buffer ball 207, and then the rubber buffer ball 207 generates a deformation force, which can weaken the vibration force again, thereby improving the buffering effect on the wafer disc and meeting the processing requirements of the wafer disc.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer electroplating device capable of washing wafers, comprising a workbench (1), characterized in that: The top of the workbench (1) is respectively provided with an electroplating tank (101), a rinsing tank (102) and a U-shaped mounting column (103); a rotating motor (1031) is fixedly mounted on the top of the U-shaped mounting column (103); a transmission screw (1032) is movably mounted on the inner side of the U-shaped mounting column (103); a movable support block (1033) is sleeved on the outer side of the transmission screw (1032); a support plate (104) is fixedly mounted on the rear side of the movable support block (1033); an electric slide rail (105) is fixedly mounted on the bottom of the support plate (104); an electric slider (106) is slidably mounted on the outer side of the electric slide rail (105); and the electric slider (106) is A mounting block (107) is provided at the bottom, a buffer mechanism (2) is provided between the mounting block (107) and the electric slider (106), plum blossom screws (1071) are rotatably provided at the front and rear ends of the mounting block (107) via bearings, a guide plate (1072) is provided on the outer thread sleeve of the plum blossom screw (1071), a guide column (1073) is fixedly installed on the side of the guide plate (1072) close to the mounting block (107), a mounting groove (108) is provided on the bottom surface of the mounting block (107), a placement frame (109) is provided inside the mounting groove (108), and guide holes (1091) are provided on the front and rear end surfaces of the placement frame (109); The buffer mechanism (2) comprises a square groove (201) and a buffer block (202); the square groove (201) is provided on the bottom surface of the electric slider (106), and a damper (203) and a buffer support (204) are fixedly mounted on the inner wall of the top end thereof; a damper spring (205) is provided on the outer matching sleeve of the damper (203); a buffer cavity (206) is provided inside the buffer support (204); a rubber buffer ball (207) and a limit plate (208) are respectively arranged inside the buffer cavity (206); a buffer support rod (209) is fixedly mounted on the bottom end of the limit plate (208); and the buffer block (202) is fixedly mounted on the top surface of the mounting block (107).

2. The wafer electroplating equipment with wafer washability according to claim 1, characterized in that: The output end of the rotating motor (1031) passes through the top surface of the U-shaped mounting column (103) and is fixedly connected to the top end of the transmission screw rod (1032).

3. The wafer electroplating equipment with wafer washability according to claim 1, characterized in that: The front side surface of the movable support block (1033) fits the inner side surface of the U-shaped mounting column (103), and the inner wall thereof is threadedly connected to the outer side surface of the transmission screw rod (1032).

4. The wafer electroplating equipment with wafer washability according to claim 1, characterized in that: The electric slide rail (105) is electrically connected to the electric slide block (106) via a wire.

5. The wafer electroplating equipment with wafer washability according to claim 1, characterized in that: The outer top surface of the placement rack (109) is in close contact with the inner wall of the installation groove (108), and the opposite ends of the guide column (1073) are movably inserted through the front and rear end surfaces of the installation block (107) and extend into the interior of the installation groove (108), and are plugged into the guide hole (1091).

6. The wafer electroplating equipment with wafer washability according to claim 1, characterized in that: The cross-sectional shape of the square groove (201) matches that of the buffer block (202).

7. The wafer electroplating equipment with wafer washability according to claim 1, characterized in that: The shock absorber (203) and the buffer support (204) are symmetrically distributed front and back about the inner central axis of the installation groove (108); the outer surface of the limit plate (208) is in close contact with the inner wall of the buffer cavity (206); the bottom end of the buffer support rod (209) passes through the bottom inner wall of the buffer cavity (206) and is fixedly connected to the top surface of the buffer block (202); and the bottom end of the shock absorber (203) is fixedly connected to the top surface of the buffer block (202).

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