Radiator and light source module
By using a sheet heat pipe and a fan module design in the radiator, combined with the compact arrangement of the heat sink fins, the problem of large volume of the existing radiator is solved, and efficient heat dissipation and miniaturization design is achieved.
Patent Information
- Application Number
- CN202420747719.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-11
AI Technical Summary
The existing radiators are large in size and are difficult to meet the miniaturized design needs of electronic products.
A radiator including a heat transfer module, a sheet heat pipe, a fan module and a heat sink fin is designed. The heat pipe is mounted on one side surface of the heat transfer module, and the air is emitted from the side of the fan module, and the heat sink fins surround the fan module. It realizes efficient conduction and dispersion of heat, reducing the volume of the radiator.
By improving the heat conduction area and heat dissipation efficiency, the rapid cooling and heat dissipation of the heat transfer module are achieved, reducing the volume of the radiator, which is suitable for the miniaturization design of electronic products.
Smart Images
Figure CN222278499U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of optoelectronic devices, in particular to a radiator and a light source module. Background Art
[0002] With the booming development of the electronics industry, electronic products require miniaturized design. The existing radiator includes a heat transfer module and a heat pipe. One end of the heat pipe is connected to the heat transfer module, and the other end of the heat pipe is bent away from the heat transfer module to transfer the heat of the heat transfer module to a certain distance, which is conducive to reducing the temperature of the heat transfer module. However, the existing radiator has a large volume, which is not conducive to the miniaturization design of electronic products. Utility Model Content
[0003] The utility model aims to provide a radiator and a light source module, aiming to solve the technical problem that the existing radiator has a large volume.
[0004] In a first aspect, the present application provides a heat sink, comprising:
[0005] Heat transfer module;
[0006] A sheet-shaped heat pipe, the heat pipe is fitted and installed on one side surface of the heat transfer module;
[0007] A fan module, wherein one end of the fan module has an air inlet, the other end of the fan module is mounted on the heat transfer module, and the side of the fan module has an air outlet;
[0008] A plurality of heat dissipation fins are arranged around the side of the fan module at intervals and in contact with the heat transfer module.
[0009] In one of the embodiments, a mounting groove is provided on one side surface of the heat transfer module, and the heat pipe is installed in the mounting groove.
[0010] In one of the embodiments, the bottom wall of the heat pipe is in contact with the bottom of the mounting groove.
[0011] In one embodiment, two opposite sides of the heat pipe are attached to the groove wall of the installation groove.
[0012] In one of the embodiments, the top surface of the heat pipe is flush with the notch of the mounting slot.
[0013] In one of the embodiments, the number of the heat pipes is at least two, and at least two of the heat pipes are spaced apart and distributed along the circumference of the heat transfer module.
[0014] In one embodiment, the first end of the heat pipe is located at the center of the heat transfer module, and the second end of the heat pipe extends to the edge of the heat transfer module.
[0015] In one of the embodiments, the second end of the heat pipe is extended along the circumference of the heat transfer module.
[0016] In one of the embodiments, the middle portion of the heat pipe is arranged in an arc shape.
[0017] In one embodiment, two opposite sides of the heat pipe in the thickness direction of the heat transfer module are both planes, one side plane of the heat pipe is in contact with the heat transfer module, and the other side plane of the heat pipe is in contact with the heat dissipation fins.
[0018] In one of the embodiments, in the projection along the thickness direction of the heat transfer module, the projection of the heat pipe overlaps with the projection of the fan module and the projection of the heat dissipation fins respectively.
[0019] In one of the embodiments, the heat sink further includes an air guide ring, one end of the heat dissipation fin away from the heat transfer module is connected to the air guide ring, and the air guide ring is arranged around the fan module.
[0020] In a second aspect, the present application provides a light source module, comprising a heating module and any one of the above-mentioned heat sinks, wherein the heating module is mounted on a side surface of the heat transfer module away from the heat pipe.
[0021] The beneficial effects of the radiator and the light source module provided by the utility model are as follows: the heat pipe absorbs the heat of the heat transfer module and conducts it to the heat dissipation fins in contact with it, and the fan module drives the air flow from the air outlet to the heat dissipation fins to take away the heat of the heat pipe and the heat dissipation fins, thereby realizing the heat dissipation and temperature reduction of the heat transfer module; wherein the heat pipe is a sheet-like structure, and the heat pipe is fitted on one side surface of the heat transfer module, on the one hand, the heat conduction area between the heat pipe and the heat transfer module is increased, and the heat conduction efficiency is improved; on the other hand, the sheet-like heat pipe is fitted on the heat transfer module instead of being bent, thereby reducing the height and occupied space of the heat pipe; and the fan module is installed on the heat transfer module, and the air is discharged from the side, so there is no need to leave an air outlet space between the fan module and the heat transfer module, and the heat dissipation fins are compactly arranged around the fan module, which is conducive to reducing the volume of the radiator, solving the technical problem of the large volume of the existing radiator, thereby facilitating the miniaturization design of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0023] Figure 1 A schematic diagram of the structure of a radiator provided in an embodiment of the utility model;
[0024] Figure 2 An exploded view of the heat sink provided for this embodiment;
[0025] Figure 3 A schematic diagram of the installation of the heat transfer module and the heat pipe provided in this embodiment;
[0026] Figure 4 A schematic diagram of the structure of the light source module provided in this embodiment;
[0027] Figure 5 This is another structural schematic diagram of the light source module provided in this embodiment.
[0028] Among them, the reference numerals in the figure are:
[0029] 10. Heating module; 20. Lampshade;
[0030] 100. heat transfer module; 101. mounting slot;
[0031] 200, heat pipe; 201, first end; 202, second end;
[0032] 300, fan module; 301, air inlet; 302, air outlet;
[0033] 400, cooling fins;
[0034] 500. Air guide ring. DETAILED DESCRIPTION
[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0036] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.
[0037] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.
[0039] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0040] Embodiment 1
[0041] Combination Figure 1 and Figure 2 The heat sink provided in the present application includes a heat transfer module 100, a heat pipe 200, a fan module 300 and a plurality of heat dissipation fins 400. The heat pipe 200 is a sheet structure, and the sheet heat pipe 200 is fitted and installed on a side surface of the heat transfer module 100. One end of the fan module 300 has an air inlet 301, and the other end of the fan module 300 is installed on the heat transfer module 100. The side of the fan module 300 has an air outlet 302. The plurality of heat dissipation fins 400 are spaced around the side of the fan module 300 and are in contact with the heat transfer module 100.
[0042] In this embodiment, the heat pipe 200 absorbs the heat of the heat transfer module 100 and conducts it to the multiple heat dissipation fins 400 in contact with it. The fan module 300 drives the airflow to discharge air from the air outlet 302 directly facing the multiple heat dissipation fins 400, so as to quickly and efficiently remove the heat on the heat dissipation fins 400 and achieve heat dissipation and cooling of the heat transfer module 100. Among them, the heat pipe 200 is a sheet structure, and the heat pipe 200 is installed on one side surface of the heat transfer module 100. On the one hand, the heat conduction area between the heat pipe 200 and the heat transfer module 100 is increased, and the heat conduction efficiency is improved. On the other hand, the sheet-shaped heat pipe 200 is attached to the heat transfer module 100 instead of being bent, which reduces the height and occupied space of the heat pipe 200. In addition, the fan module 300 is installed on the heat transfer module 100, and the air is discharged from the side instead of the axial direction. There is no need to leave an air outlet space between the fan module 300 and the heat transfer module 100. The heat dissipation fins 400 are compactly arranged around the fan module 300, which is beneficial to reducing the volume of the radiator and facilitating the miniaturization design of the radiator.
[0043] In some embodiments, in combination Figure 1 and Figure 2 The fan module 300 is a centrifugal fan, and the end of the fan module 300 away from the air inlet 301 is attached to the heat transfer module 100. The centrifugal fan can achieve air intake at one end and air discharge at the side, and the other end can be closely attached to the heat transfer module 100, so that the fan module 300 and the heat transfer module 100 can be arranged compactly, which minimizes the thickness of the radiator and helps to reduce the overall volume of the radiator.
[0044] In addition, the centrifugal fan attached to the heat transfer module 100 can drive the airflow to blow more directly through the surface of the heat transfer module 100, and at the same time can take away the heat of the heat transfer module 100 and the heat pipe 200 attached to the heat transfer module 100, thereby reducing the resistance and heat loss during heat dissipation and improving the heat dissipation efficiency.
[0045] In some embodiments, in combination Figure 2 , a heating module 10 is installed on the side of the heat transfer module 100 away from the heat pipe 200. The heating module 10 can be a light source, a chip or a sensor, etc., which is not limited here. The heating module 10 and the heat pipe 200 are directly in contact with the opposite sides of the heat transfer module 100 respectively, shortening the heat conduction distance, realizing rapid conduction and rapid dissipation of heat, and helping to improve the thermal conductivity efficiency. It can be understood that in other embodiments, the heat transfer module 100 may not be in direct contact with the heating module 10. For example, the heat transfer module 100 realizes heat transfer of the heating module 10 through a heat conductive block or air, thereby realizing heat dissipation, which is not limited here.
[0046] In some embodiments, in combination Figure 2The heat transfer module 100 is a heat-conducting substrate, and the heat pipe 200 is disposed on one side of the heat transfer module 100 in the thickness direction, which is conducive to shortening the heat conduction path and realizing rapid heat conduction and rapid heat dissipation. Specifically, the heat transfer module 100 is a heat-conducting copper plate, a heat-conducting aluminum plate, a heat-conducting steel plate, or a heat-conducting graphite plate, which is not limited here.
[0047] In some embodiments, in combination Figure 2 and Figure 3 A mounting groove 101 is provided on one side surface of the heat transfer module 100, and the heat pipe 200 is installed in the mounting groove 101. The installation of the mounting groove 101, on the one hand, improves the installation accuracy and installation stability of the heat pipe 200, and prevents the heat pipe 200 from moving or shaking during use; on the other hand, it increases the contact area between the heat pipe 200 and the heat transfer module 100, reduces the heat transfer impedance between the two, and enables the heat transfer module 100 to transfer heat to the heat pipe 200 more effectively, thereby improving the heat dissipation efficiency; on the other hand, the mounting groove 101 can accommodate the heat pipe 200, so that the heat pipe 200 does not protrude from the surface of the heat transfer module 100, or reduces the height of the heat pipe 200 protruding from the surface of the heat transfer module 100, thereby reducing the overall height of the heat pipe 200 and the heat transfer module 100, reducing the height size of the radiator, and facilitating the miniaturization design of the radiator.
[0048] In one embodiment, in combination Figure 3 The bottom wall of the heat pipe 200 is attached to the bottom of the mounting groove 101, so that the heat pipe 200 is in plane contact with the bottom of the mounting groove 101, and the contact area between the heat pipe 200 and the bottom of the mounting groove 101 is increased, thereby effectively increasing the heat transfer channel and improving the heat transfer efficiency. At the same time, the bottom of the heat pipe 200 directly abuts against the bottom of the mounting groove 101, making full use of the height space of the mounting groove 101 for storage, so that the heat pipe 200 does not protrude from the surface of the heat transfer module 100, or reduces the height of the heat pipe 200 protruding from the surface of the heat transfer module 100, which is conducive to the miniaturization design of the radiator.
[0049] In one embodiment, in combination Figure 3 The opposite sides of the heat pipe 200 are in contact with the groove wall of the mounting groove 101. On the one hand, the opposite sides of the heat pipe 200 are limited against the groove wall of the mounting groove 101, so that the heat pipe 200 is more stably fixed in the mounting groove 101, avoiding the shaking of the heat pipe 200 during operation. On the other hand, the opposite sides of the heat pipe 200 are in contact with the groove wall of the mounting groove 101, which can ensure that the heat is evenly transferred to the heat pipe 200, avoiding local overheating or uneven cooling, and increasing the heat conduction area, thereby improving the overall heat transfer efficiency.
[0050] In one embodiment, in combination Figure 3The top surface of the heat pipe 200 is flush with the notch of the mounting groove 101. On the one hand, the heat pipe 200 does not protrude from the surface of the heat transfer module 100, which is beneficial to the miniaturization design of the radiator. On the other hand, the depth of the mounting groove 101 is adapted to the height of the heat pipe 200, so that the depth of the mounting groove 101 can be minimized, which is beneficial to reducing the amount of grooving processing of the heat transfer module 100 and ensuring that the heat transfer module 100 has good structural strength.
[0051] In some embodiments, in combination Figure 2 and Figure 3 The heat pipe 200 is pressed and embedded in the mounting groove 101, which improves the tightness of the connection between the heat pipe 200 and the mounting groove 101, reduces the contact resistance between the heat pipe 200 and the heat transfer module 100, increases the contact area between the heat pipe 200 and the heat transfer module 100, and improves the heat dissipation effect. At the same time, compared with welding, fastener connection, clamping and other connection methods, the heat pipe 200 and the mounting groove 101 are pressed and installed. The heat pipe 200 and the mounting groove 101 do not need to be additionally provided with auxiliary connection structures such as clamping blocks, clamping grooves, fasteners, etc., and there is no need to use complex welding equipment, which simplifies the structure of the heat pipe 200 and the mounting groove 101, improves the connection efficiency of the heat pipe 200 and the mounting groove 101, and thus improves the assembly efficiency of the radiator and reduces the assembly difficulty of the radiator.
[0052] In some embodiments, in combination Figure 2 and Figure 3 The two opposite sides of the sheet-like heat pipe 200 in the thickness direction of the heat transfer module 100 are both flat. One side plane of the heat pipe 200 is in contact with the heat transfer module 100. The flat contact is conducive to increasing the heat conduction area between the heat transfer module 100 and the heat pipe 200. The other side plane of the heat pipe 200 is in contact with the heat dissipation fin 400. The flat surface is conducive to the installation and contact of the heat dissipation fin 400. The flat contact is conducive to increasing the heat conduction area between the heat pipe 200 and the heat dissipation fin 400, which can increase the heat dissipation area and facilitate the rapid dissipation of heat from the heat pipe 200.
[0053] In some embodiments, in combination Figure 2 and Figure 3 The number of heat pipes 200 is at least two, and at least two heat pipes 200 are distributed at intervals along the circumference of the heat transfer module 100, so as to achieve more uniform heat transfer between the heat transfer module 100 and the heat pipe 200, and avoid local overheating or insufficient cooling. The distribution of multiple heat pipes 200 can increase the overall heat conduction area, effectively improve the heat absorption and transfer capabilities, and thus improve the heat transfer efficiency of the radiator.
[0054] In some embodiments, in combination Figure 3, the first end 201 of the heat pipe 200 is located at the center of the heat transfer module 100, and the second end 202 of the heat pipe 200 extends to the edge of the heat transfer module 100. The center temperature of the heat transfer module 100 is high, and the edge temperature of the heat transfer module 100 is low. The heat pipe 200 extends from the center of the heat transfer module 100 to the edge of the heat transfer module 100. First, it absorbs heat from the center of the heat transfer module more effectively. At the same time, the extension of the second end 202 to the edge can evenly distribute the heat to the entire heat transfer module 100, reducing the hot spot concentration phenomenon; second, the heat pipe 200 can maximize the use of the surface area of the heat transfer module 100 by extending, increase the heat conduction area, and is conducive to improving the overall heat dissipation effect of the radiator.
[0055] In one embodiment, in combination Figure 3 The second end 202 of the heat pipe 200 is extended along the circumference of the heat transfer module 100. The center area of the heat transfer module 100 is small, and the circumferential size of the edge of the heat transfer module 100 is large. The second end 202 of the heat pipe 200 fully utilizes the edge size of the heat transfer module 100 and increases its extension length. On the one hand, the heat pipe 200 distributes heat more evenly on the heat transfer module 100 to avoid the generation of local high temperature areas. On the other hand, the heat conduction area of heat conduction is increased, the heat conduction power is improved, and it is conducive to accelerating the transfer and dissipation of heat.
[0056] In one embodiment, in combination Figure 3 The heat pipe 200 is provided with a central arc. The heat pipe 200 increases its length through the central arc shape, fully occupies the surface space of the heat transfer module 100, and then increases the heat conduction area of the heat pipe 200, improves the heat conduction power, is beneficial to accelerate the transfer and dissipation of heat, and is beneficial to improve the heat transfer efficiency.
[0057] In one embodiment, in combination Figure 2 The plurality of heat dissipating fins 400 are in contact with the fan module 300 in the radial direction of the fan module 300 or there is a gap of no more than 3 mm, which is conducive to the compact fit between the heat dissipating fins 400 and the fan module 300, reduces the outer diameter, and is conducive to the miniaturized design of the radiator.
[0058] Specifically, the heat pipe 200 is installed in the mounting groove 101 and is flush with the groove of the mounting groove 101, so that the heat pipe 200 and the side of the heat transfer module 100 close to the heat dissipation fin 400 are located in the same plane, and the heat dissipation fin 400 contacts the heat pipe 200 and the side of the heat transfer module 100 close to the heat dissipation fin 400 at the same time, which is beneficial for the heat dissipation fin 400 to directly take away the heat of the heat transfer module 100 at the same time, which is beneficial for reducing thermal resistance and improving heat dissipation effect.
[0059] Specifically, one end of the heat dissipation fin 400 away from the fan module 300 is flush with the heat transfer module 100, which prevents the heat transfer module 100 from protruding radially from the heat dissipation fin 400, and also prevents the heat dissipation fin 400 from protruding radially from the heat transfer module 100, which is beneficial to reducing the outer diameter of the radiator and facilitating the miniaturization design of the radiator.
[0060] In one embodiment, in combination Figure 2 and Figure 3 In the projection along the thickness direction of the heat transfer module 100, the projection of the heat pipe 200 overlaps with the projection of the fan module 300 and the projection of the heat dissipation fin 400. In this way, the heat pipe 200 is more evenly distributed on the entire surface of the heat transfer module 100, avoiding local overheating or insufficient cooling, and making full use of the surface area of the heat transfer module 100 to increase its heat conduction area. At the same time, the projection of the heat pipe 200 partially overlaps with the projection of the fan module 300 and partially overlaps with the projection of the heat dissipation fin 400, which is conducive to maximizing heat transfer with the heat dissipation fin 400 and the fan, and realizing rapid heat dissipation of the heat pipe 200 and the heat transfer module 100.
[0061] Specifically, combined Figure 1 and Figure 2 The heat sink further includes an air guide ring 500, and one end of the heat sink fin 400 away from the heat transfer module 100 is connected to the air guide ring 500. The air guide ring 500 is arranged around the fan module 300, does not block the air intake of the fan module 300, and guides the air to flow to the fan module 300, optimizes the air flow channel, and reduces turbulence and resistance in the air flow. In addition, the air guide ring 500 is connected to the heat sink fin 400, improves the position stability of the two ends of the heat sink fin 400, and supports the heat sink fin 400.
[0062] Embodiment 2
[0063] Combination Figure 4 The light source module provided in the present application includes a heating module 10 and any one of the heat sinks in the first embodiment. The heating module 10 is installed on a side surface of the heat transfer module 100 away from the heat pipe 200. The heating module 10 generates heat, which is directly transferred to the heat transfer module 100 connected thereto. The fan module 300 drives the external airflow to take away the heat of the heat pipe 200 and the heat transfer module 100, thereby achieving heat dissipation and temperature reduction of the heating module 10.
[0064] In addition, the heating module 10 and the heat pipe 200 are in direct contact with opposite sides of the heat transfer module 100 respectively, and the heat conduction distance is short, so that the heat can be quickly conducted and dissipated, which is beneficial to improve the heat conduction efficiency.
[0065] In some embodiments, in combination Figure 5The heating module 10 is a light-emitting chip, and the light source module further includes a lampshade 20. The lampshade 20 and the heating module 10 are installed on the same side of the heat transfer module 100. The lampshade 20 surrounds the heating module 10, which can reduce the impact of the external environment on the light source module and improve the stability and life of the light source module. The lampshade 20 has a focusing effect on the light emitted by the heating module 10, reduces the scattering of light, and improves the brightness and uniformity of the lighting.
[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A radiator, characterized in that: The radiator comprises: Heat transfer module (100); A sheet-shaped heat pipe (200), the heat pipe (200) being mounted in close contact with a side surface of the heat transfer module (100); A fan module (300), wherein one end of the fan module (300) has an air inlet (301), the other end of the fan module (300) is mounted on the heat transfer module (100), and the side of the fan module (300) has an air outlet (302); A plurality of heat dissipation fins (400) are provided, and the plurality of heat dissipation fins (400) are spaced around the side of the fan module (300) and are in contact with the heat transfer module (100).
2. The heat sink according to claim 1, characterized in that: A mounting groove (101) is provided on one side surface of the heat transfer module (100), and the heat pipe (200) is installed in the mounting groove (101).
3. The radiator according to claim 2, characterized in that: The bottom wall of the heat pipe (200) is in contact with the bottom of the installation groove (101); the opposite sides of the heat pipe (200) are in contact with the groove walls of the installation groove (101); and the top surface of the heat pipe (200) is flush with the groove opening of the installation groove (101).
4. The heat sink according to claim 1, characterized in that: The number of the heat pipes (200) is at least two, and the at least two heat pipes (200) are distributed at intervals along the circumference of the heat transfer module (100).
5. The heat sink according to claim 1, characterized in that: The first end (201) of the heat pipe (200) is located at the center of the heat transfer module (100), and the second end (202) of the heat pipe (200) extends to the edge of the heat transfer module (100).
6. The heat sink according to claim 5, characterized in that: The second end (202) of the heat pipe (200) is arranged to extend along the circumference of the heat transfer module (100); and / or the middle arc of the heat pipe (200) is arranged.
7. The heat sink according to claim 1, characterized in that: The heat pipe (200) is plane on both opposite sides in the thickness direction of the heat transfer module (100); one side plane of the heat pipe (200) is in contact with the heat transfer module (100); and the other side plane of the heat pipe (200) is in contact with the heat dissipation fin (400).
8. The heat sink according to claim 1, characterized in that: In the projection along the thickness direction of the heat transfer module (100), the projection of the heat pipe (200) overlaps with the projection of the fan module (300) and the projection of the heat dissipation fin (400).
9. The radiator according to any one of claims 1 to 8, characterized in that: The heat sink further comprises an air guide ring (500), one end of the heat dissipation fin (400) away from the heat transfer module (100) is connected to the air guide ring (500), and the air guide ring (500) is arranged around the fan module (300).
10. A light source module, characterized in that: The light source module comprises a heating module (10) and a heat sink according to any one of claims 1 to 9, wherein the heating module (10) is mounted on a side surface of the heat transfer module (100) away from the heat pipe (200).