High-heat-dissipation panel lamp

Abstract

The utility model relates to the technical field of lighting lamps, in particular to a high-heat-dissipation panel lamp which is characterized by comprising a base plate, a mounting plate, a printed circuit board (PCB), a lens and a fixing frame. Wherein the base plate is arranged in an opening mode, the installation plate is arranged at the bottom of the base plate, the PCB is provided with LED lamp beads used for emitting light, the PCB is bonded to the installation plate through silica gel, the lens is installed at the opening of the base plate, shields the PCB and the LED lamp beads in the base plate and protects the PCB and the LED lamp beads, the fixing frame is installed at the opening of the base plate, and the lens is fixed to the base plate. When the lamp is used, heat emitted by the LED lamp beads is transmitted to the base plate through the silica gel, the heat dissipation effect is improved, and the service life of the lamp is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting fixtures, and more specifically, to a high heat dissipation panel lamp. Background Art

[0002] LED high heat dissipation panel light is a lighting fixture and one of the products widely circulated on the market. According to the light-emitting mode, high heat dissipation panel lights are divided into side-emitting and direct-emitting. Among them, the direct-emitting high heat dissipation panel light is mainly composed of a chassis, LED lamp beads, lenses, PCB boards, power supplies, diffusion plates, outer frames and screw accessories. The PCB boards are fixed by rivets or metal sheets. This mechanical fixing method is not conducive to the heat dissipation of the lamp and is likely to increase the mass and volume of the high heat dissipation panel light. Utility Model Content

[0003] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a high heat dissipation panel lamp, which has the advantages of improving the heat dissipation capacity of the lamp and the manufacturing efficiency.

[0004] The above technical purpose of the utility model is achieved through the following technical solutions: a high heat dissipation panel lamp, comprising

[0005] The chassis, in an open configuration, serves as a mounting base;

[0006] A mounting plate, arranged at the bottom of the chassis;

[0007] A PCB board is provided with LED lamp beads, and the PCB board is arranged on the mounting plate;

[0008] A lens is arranged at the opening of the chassis and is used to shield the LED lamp beads;

[0009] A fixing frame, arranged at the opening of the chassis, for fixing the lens;

[0010] Wherein, silicone bonding is arranged between the PCB board and the mounting plate.

[0011] In one of the embodiments, the side surfaces of the chassis are inclined outward.

[0012] In one embodiment, a plurality of PCB boards are provided, and the plurality of PCB boards are spaced apart and arranged on the mounting board.

[0013] In one of the embodiments, a diffusion plate is disposed on the lens.

[0014] In one embodiment, the fixing frame and the chassis are fixed with screws.

[0015] In one of the embodiments, the fixing frame is provided with a mounting groove adapted to the screw.

[0016] The above-mentioned high heat dissipation panel light has the following beneficial effects:

[0017] First, when a high heat dissipation panel light is in use, the heat emitted by the LED lamp beads is transferred to the chassis through the silica gel, which improves the heat dissipation effect and increases the service life of the lamp;

[0018] Secondly, silicone is used to fix the PCB board and the mounting plate, which reduces the number of parts assembled in the lamp, reduces the volume and weight of the lamp, and improves the safety of the lamp when used; at the same time, it reduces the process of lamp assembly and improves the efficiency of lamp manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the explosion structure of this embodiment;

[0020] Figure 2 Schematic diagram of the assembly structure of this embodiment;

[0021] Figure 3 Schematic diagram of the cutaway view of the present embodiment;

[0022] Figure 4 yes Figure 3 Enlarged view of point A in the middle.

[0023] In the figure: 1. chassis; 2. mounting plate; 3. PCB board; 4. lens; 5. fixing frame; 51. mounting slot; 6. screws. DETAILED DESCRIPTION

[0024] The utility model is described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] A high heat dissipation panel light, such as Figure 1 , Figure 2 As shown, it includes a chassis 1, a mounting plate 2, a PCB board 3, a lens 4 and a fixing frame 5; wherein the chassis 1 is open, the mounting plate 2 is arranged at the bottom of the chassis 1, the PCB board 3 is provided with LED lamp beads for emitting light, the PCB board 3 is bonded to the mounting plate 2 by silicone, the lens 4 is installed at the opening of the chassis 1, shielding the PCB board 3 and the LED lamp beads in the chassis 1, and protecting the PCB board 3 and the LED lamp beads, and the fixing frame 5 is installed at the opening of the chassis 1 to fix the lens 4 on the chassis 1;

[0026] When the lamp is in use, the heat emitted by the LED lamp beads is transferred to the chassis 1 through the silica gel, thereby improving the heat dissipation effect and extending the service life of the lamp;

[0027] The PCB board 3 and the mounting plate 2 are fixed with silicone, which reduces the number of parts assembled in the lamp, reduces the volume and weight of the lamp, and improves the safety of the lamp when used; at the same time, it reduces the process of lamp assembly and improves the efficiency of lamp manufacturing.

[0028] Further, such as Figure 3 As shown, the side surfaces of the chassis 1 are arranged outwards, thereby increasing the irradiation area of ​​the lamp.

[0029] Preferably, if Figure 1 , Figure 3 As shown, a plurality of PCB boards 3 are provided, and the plurality of PCB boards 3 are arranged at intervals on the mounting plate 2, thereby improving the brightness of the lamp.

[0030] Furthermore, a diffusion plate is provided on the lens 4, so that the light emitted by the lamp is softer, the brightness of the lamp is further improved, and the energy consumption is reduced.

[0031] Specifically, Figure 4 As shown, the fixing frame 5 and the chassis 1 are fixed by screws 6 , and the fixing frame 5 is provided with mounting grooves 51 matched with the screws 6 . The mounting grooves 51 are arranged along the periphery of the lamp to facilitate the matching with the screws 6 .

[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A high heat dissipation panel light, characterized in that: include The chassis, in an open configuration, serves as a mounting base; A mounting plate, arranged at the bottom of the chassis; A PCB board is provided with LED lamp beads, and the PCB board is arranged on the mounting plate; A lens is arranged at the opening of the chassis and is used to shield the LED lamp beads; A fixing frame, arranged at the opening of the chassis, for fixing the lens; Wherein, silicone bonding is arranged between the PCB board and the mounting plate.

2. The high heat dissipation panel light according to claim 1, characterized in that: The side surfaces of the chassis are arranged to be inclined outward.

3. The high heat dissipation panel light according to claim 1, characterized in that: A plurality of PCB boards are provided, and the plurality of PCB boards are arranged on the mounting plate at intervals.

4. The high heat dissipation panel light according to claim 1, characterized in that: A diffusion plate is arranged on the lens.

5. The high heat dissipation panel light according to claim 1, characterized in that: The fixing frame and the chassis are fixed with screws.

6. The high heat dissipation panel light according to claim 5, characterized in that: The fixing frame is provided with mounting grooves matched with the screws.

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