Server group with multiple servers and hyper-converged all-in-one machine
By using partitions in the server group to form a heat exchange gap and communicate with the radiator and air outlet, combined with the liquid cooling pump group, the problem of insufficient heat dissipation effect when reducing the server layout space is solved, efficient heat export is achieved, and the server is operated stably .
Patent Information
- Application Number
- CN202420501003.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-11
- Filing Date
- 2024-03-14
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-03-14
AI Technical Summary
The prior art is difficult to improve the heat dissipation effect of the server while reducing the server layout space, resulting in an increase in the internal temperature of the server, affecting stable operation and posing a fire hazard.
Design a multi-server server group. By integrating multiple servers in the rack and using partitions to form a heat exchange gap, it communicates with the radiator and air outlet, it uses hot and cold air to dissipate heat, and optionally a liquid cooling pump Set to enhance heat dissipation.
Effectively reduce server temperature in a compact server layout, improve cooling effect, and avoid system crashes and fire risks.
Smart Images

Figure CN222281154U_ABST
Abstract
Description
[0001] This application claims the priority of the Chinese patent application filed with the China Patent Office on January 11, 2024, with application number 202420073590.X and invention name “A server group of multiple servers”, the entire contents of which are incorporated by reference in this application. Technical Field
[0002] The utility model relates to the technical field of servers, and in particular to a server group of multiple servers and a hyper-converged all-in-one machine. Background Art
[0003] In today's production activities, servers are increasingly used. However, when the server is working, the heat generated by the internal components of the server will increase the internal temperature of the server, affecting the stable operation of the server, resulting in unexpected system crashes or shutdowns, and in serious cases, causing fire hazards.
[0004] In the prior art, servers are usually placed in a server room in large numbers for unified management, and the heat dissipation method used is usually to increase the distance between servers or to set large fans next to the servers for heat dissipation.
[0005] However, increasing the distance between servers requires sufficient physical space in the computer room, and large fans can only dissipate heat for all servers in the entire computer room, but not for specific servers. Therefore, how to reduce the server layout space while improving the server's heat dissipation effect has become a technical problem to be solved. Utility Model Content
[0006] The utility model provides a server group of multiple servers to solve the technical problem that the prior art cannot improve the heat dissipation effect of the servers while reducing the layout space of the servers.
[0007] The embodiment of the present application provides a server group of multiple servers, including: a rack, a first server node group, a second server node group and a first radiator;
[0008] The first server node group includes a first server and a second server, and the second server node group includes a third server and a fourth server; a first heat exchange gap is separated between the first server and the third server by a partition; a second heat exchange gap is separated between the second server and the fourth server by a partition;
[0009] The rack includes a first side wall and a second side wall that are opposite to each other; a first radiator is provided on the first side wall, and an air outlet opposite to the first radiator is provided on the second side wall, and a heat dissipation space is formed between the first radiator and the air outlet; the heat dissipation space is located between the first server node group and the second server node group, and the heat dissipation space is communicated with the first heat exchange gap and the second heat exchange gap respectively, so that the hot air in the heat dissipation space can be blown out from the air outlet through the first radiator.
[0010] Optionally, the server group further includes: a liquid cooling pump group;
[0011] The liquid cooling pump group is arranged in the first heat exchange gap, the second heat exchange gap and the heat dissipation space, and is used to dissipate heat for the servers in the first server node group and the second server node group.
[0012] Optionally, the coolant pump group includes a heat exchange tube; the heat exchange tube is laid in the first heat exchange gap, the second heat exchange gap and the heat dissipation space, so as to guide the heat in the first heat exchange gap and the second heat exchange gap to the heat dissipation space through the coolant in the heat exchange tube.
[0013] Optionally, the liquid cooling pump set further comprises a cooling pump and a liquid collecting pipe;
[0014] The outlet of the cooling pump is connected to the first end of the heat exchange tube, the second end of the heat exchange tube is connected to the collecting pipe, and the collecting pipe is connected to the inlet of the cooling pump; when the cooling pump is started, the coolant circulates in the liquid cooling pump group under the action of the cooling pump.
[0015] Optionally, a plurality of heat exchange tubes are arranged axially along the collecting tube; each heat exchange tube is arranged in a winding manner as a multi-layer pipeline, so that the coolant can be circulated in the heat exchange tube in reverse directions for multiple times.
[0016] Optionally, a plurality of heat dissipation plates extending into the first heat exchange gap or the second heat exchange gap are arranged on the partition, and the plurality of heat exchange tubes and the plurality of heat dissipation plates are arranged alternately.
[0017] Optionally, a second radiator is provided on a side wall of the rack adjacent to the first heat exchange gap to blow hot air in the first heat exchange gap to the heat dissipation space;
[0018] A third radiator is arranged on the side wall of the rack adjacent to the second heat exchange gap to blow the hot air in the second heat exchange gap to the heat dissipation space.
[0019] Optionally, a plurality of heat dissipation plates extending into the first heat exchange gap are arranged on the partition, and the arrangement direction of the plurality of heat dissipation plates is consistent with the direction in which the air in the first heat exchange gap flows toward the heat dissipation space;
[0020] And / or, a plurality of heat dissipating plates extending into the second heat exchange gap are arranged on the partition, and an arrangement direction of the plurality of heat dissipating plates is consistent with a direction in which air in the second heat exchange gap flows toward the heat dissipating space.
[0021] Optionally, the server group further includes a power supply group, which is located between the first control node group and the second server node group and is used to supply power to the first control node group, the second server node and the first radiator.
[0022] Optionally, the server group further includes: a heat dissipation level selector;
[0023] The heat dissipation level selector is arranged on the outer surface of the rack; the heat dissipation level selector is connected to the first heat sink and is used to adjust the heat dissipation level for the first server node group and the second server node group.
[0024] The embodiment of the present application also provides a hyper-converged all-in-one machine, the hyper-converged all-in-one machine comprising: a rack, a first server node group, a second server node group and a first radiator;
[0025] The first server node group includes a first server and a second server, and the second server node group includes a third server and a fourth server; a first heat exchange gap is separated between the first server and the third server by a partition, and a second heat exchange gap is separated between the second server and the fourth server by a partition;
[0026] The rack includes a first side wall and a second side wall that are opposite to each other; a first radiator is provided on the first side wall, and an air outlet opposite to the first radiator is provided on the second side wall, and a heat dissipation space is formed between the first radiator and the air outlet; the heat dissipation space is located between the first server node group and the second server node group, and the heat dissipation space is communicated with the first heat exchange gap and the second heat exchange gap respectively, so that the hot air in the heat dissipation space can be blown out from the air outlet through the first radiator.
[0027] Compared with the prior art, this application has the following advantages:
[0028] The server group of multiple servers provided in the embodiment of the present application includes: a rack, a first server node group, a second server node group and a first radiator; the first server node group includes a first server and a second server, and the second server node group includes a third server and a fourth server; a first heat exchange gap is separated from the first server and the third server by a partition; a second heat exchange gap is separated from the second server and the fourth server by a partition; the rack includes a first side wall and a second side wall opposite to each other; the first side wall is provided with a first radiator, and the second side wall is provided with an air outlet opposite to the first radiator, and a heat dissipation space is formed between the first radiator and the air outlet; the heat dissipation space is located between the first server node group and the second server node group, and the heat dissipation space is communicated with the first heat exchange gap and the second heat exchange gap respectively, so that the hot air in the heat dissipation space can be blown out from the air outlet through the first radiator.
[0029] In this server group, multiple servers are integrated in one rack, and heat exchange gaps are formed between different server nodes through partitions, and the heat exchange gaps are connected to the heat dissipation space between the first radiator and the air outlet. When the first radiator is started, the hot air in the heat dissipation space will be blown out to make the heat dissipation space cold air, and the temperature difference between the heat exchange gap and the heat dissipation space will cause convection between the heat exchange gap and the heat dissipation space, thereby continuously guiding the heat in the heat exchange gap to the heat dissipation space, so as to ensure the heat dissipation effect of each server while making the layout of each server compact. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 It is a structural diagram of a server group provided in an embodiment of the present application.
[0031] Figure 2 It is a cross-sectional view of a server group involved in an embodiment of the present application.
[0032] Figure 3 It is a structural schematic diagram of a server group provided with a liquid cooling pump group provided in an embodiment of the present application.
[0033] Figure 4 It is a cross-sectional view of a server group provided with a liquid cooling pump group according to an embodiment of the present application.
[0034] Figure 5 It is a structural schematic diagram of a liquid cooling pump group involved in an embodiment of the present application.
[0035] The reference numerals in the drawings are:
[0036] A first server 11; a second server 12; a third server 13; a fourth server 14; a first heat exchange gap 15; a second heat exchange gap 16;
[0037] Rack 20; first side wall 21; second side wall 22; air outlet 23; heat dissipation space 24;
[0038] A first radiator 31;
[0039] Heat exchange tube 41; cooling pump 42; liquid collecting pipe 43;
[0040] Partition plate 51; heat sink 52;
[0041] Power supply group 61. DETAILED DESCRIPTION
[0042] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is described clearly and completely below in conjunction with the drawings in the embodiments of the present application. However, the present application can be implemented in many other ways different from the following description. Therefore, based on the embodiments provided by the present application, all other embodiments obtained by those of ordinary skill in the art without creative work should fall within the scope of protection of the present application.
[0043] It should be noted that the terms "first", "second", "third", etc. in the claims, description and drawings of the present application are used to distinguish similar objects and are not used to describe a specific order or sequence. The data used in this way are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including", "having" and their variants are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0045] The first embodiment of the present application provides a multi-server server group. The structure and working principle of the multi-server server group of this embodiment are described below using a specific embodiment. It should be noted that the embodiments described below are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application. The multi-server server group involved in this application is described in detail below.
[0046] In today's production activities, servers are increasingly used. However, when the server is working, the heat generated by the internal components of the server will increase the internal temperature of the server, affecting the stable operation of the server, resulting in unexpected system crashes or shutdowns, and in serious cases, causing fire hazards.
[0047] In the prior art, servers are usually placed in a server room in large numbers for unified management, and the heat dissipation method used is usually to increase the distance between servers or to set large fans next to the servers for heat dissipation.
[0048] However, increasing the distance between servers requires sufficient physical space in the computer room, and large fans can only dissipate heat for all servers in the entire computer room, but not for specific servers. Therefore, how to reduce the server layout space while improving the server's heat dissipation effect has become a technical problem to be solved.
[0049] In order to solve the above problems, the embodiment of the present application provides a server group of multiple servers, which integrates multiple servers in one rack, and forms a heat exchange gap between different server nodes through a partition, and the heat exchange gap is connected to the heat dissipation space between the first radiator and the air outlet. When the first radiator is started, the hot air in the heat dissipation space will be blown out to make the heat dissipation space cold air, and the temperature difference between the heat exchange gap and the heat dissipation space will cause the heat exchange gap and the heat dissipation space to form convection, thereby continuously guiding the heat in the heat exchange gap to the heat dissipation space, so as to ensure the heat dissipation effect of each server while making the layout of each server compact.
[0050] The ground wire hanging device provided in the embodiment of the present application is specifically as follows: Figure 1 and Figure 2 As shown, Figure 1 A schematic diagram of the structure of a server group provided in an embodiment of the present application, Figure 2 This is a cross-sectional view of a server group involved in an embodiment of the present application, wherein: Figure 1 and Figure 2 The structure shown corresponds to .
[0051] The multi-server server group provided in this embodiment includes: a rack 20, a first server node group, a second server node group and a first radiator 31;
[0052] The first server node group includes a first server 11 and a second server 12, and the second server node group includes a third server 13 and a fourth server 14; a first heat exchange gap 15 is separated from the first server 11 and the third server 13 by a partition 51; a second heat exchange gap 16 is separated from the second server 12 and the fourth server 14 by a partition 51;
[0053] The rack 20 includes a first side wall 21 and a second side wall 22 that are opposite to each other; the first side wall 21 is provided with a first radiator 31, and the second side wall 22 is provided with an air outlet 23 that is opposite to the first radiator 31, and a heat dissipation space 24 is formed between the first radiator 31 and the air outlet 23; the heat dissipation space 24 is located between the first server node group and the second server node group, and the heat dissipation space 24 is respectively communicated with the first heat exchange gap 15 and the second heat exchange gap 16, so that the hot air in the heat dissipation space 24 can be blown out from the air outlet 23 through the first radiator 31.
[0054] In this embodiment, the rack 20 can be configured as a hollow box to serve as a base structure for mounting components such as various servers and the first radiator 31. The rack 20 is provided with a preset mounting position and mounting structure for each component so that each component can be accurately mounted at each mounting position to form a reasonable layout.
[0055] The specific installation method and installation position of each component can be adaptively set according to the number of servers, the installation method of the radiator, the connection method between the heat exchange gap and the heat dissipation space, etc. Among them, each component can be fixedly installed at the corresponding installation position by welding, threaded connection, etc., or detachably installed at the corresponding installation position by plugging, clamping, etc., without limitation here.
[0056] The first server node group and the second server node group are groups of servers at different service nodes. The servers of a server node group are installed adjacently on the rack 20, so that operators can uniformly wire and manage the servers of the same server node group. The servers in a server node can be installed in rows or columns on the rack 20, or can be installed overlappingly along the gravity direction, without specific restrictions.
[0057] After the first server node group and the second server node group are installed on the rack 20, the servers of the first server node group and the second server node group are arranged in a regular pattern, and a heat exchange gap is reserved between the first server node group and the second server node group, so that the heat of each server is transferred to the air in the heat exchange gap, and then the heat is discharged through the flow of air in the heat exchange gap.
[0058] In this embodiment, the heat exchange gap is formed by the partition 51. The partition 51 forming the heat exchange gap is adjacent to the server, or can be directly connected to the server, so that the heat on the server can be transferred to the surface of the partition 51, and the partition 51 will exchange heat with the air in the heat exchange gap, thereby conducting away the heat generated by the server.
[0059] Among them, the first server node group includes the first server 11 and the second server 12, and the second server node group includes the third server 13 and the fourth server 14. The first server 11, the second server 12, the third server 13 and the fourth server 14 are arranged in a regular pattern on the rack 20. In addition, the first server 11 and the third server 13 are adjacent, and a first heat exchange gap 15 is separated from the first server 11 and the third server 13 by a partition 51, and the second server 12 and the fourth server 14 are adjacent, and a second heat exchange gap 16 is separated from the second server 12 and the fourth server 14 by a partition 51. Of course, if the first server node group and the second server node group include more servers, they can continue to be arranged according to the arrangement of the servers in the first server node group and the second server node group, and a new heat exchange gap can be formed by the partition.
[0060] In this embodiment, the first heat exchange gap 15 and the second heat exchange gap 16 are part of the heat exchange gap reserved between the first server node group and the second server node group, and are respectively connected to the heat dissipation space 24. In specific implementation, the heat dissipation space 24 can be located between the first heat exchange gap 15 and the second heat exchange gap 16, or the first heat exchange gap 15 and the second heat exchange gap 16 can be connected, and then the heat dissipation space 24 is connected to one of the first heat exchange gap 15 and the second heat exchange gap 16.
[0061] The heat dissipation space 24 is located between the first server node group and the second server node group, and between the first side wall 21 and the second side wall 22 , thereby separating the first heat sink 31 provided on the first side wall 21 and the air outlet 23 on the second side wall 22 .
[0062] When the first radiator 31 is working, the first radiator 31 will suck in the cold air from the outside, and blow the air in the heat dissipation space 24 out of the air outlet 23, thereby forming an air duct of "outside - first radiator 31 - heat dissipation space 24 - air outlet 23 - outside", so that the heat dissipation space 24 is always filled with cold air. When each server is working, the heat of each server is guided to the heat exchange gap by the partition 51, so that the air in the heat exchange gap is hot air, and the hot air in the heat exchange gap and the cold air in the heat dissipation space 24 form a temperature difference, thereby forming air convection. The hot air in the heat exchange gap will be guided to the heat dissipation space 24 by the partition 51 under the action of air convection and the flow wind pressure of the air duct, and blown to the outside from the air outlet 23, thereby completing the heat dissipation process.
[0063] In this embodiment, the first radiator 31 has many configuration modes. For example, Figure 1As shown, the first radiator 31 can be configured as a fan structure between the outside and the heat dissipation space 24, so as to draw the outside air into the heat dissipation space 24 and blow the air in the heat dissipation space 24 outward. Alternatively, the first radiator 31 can also be configured as a cooling device, so as to continuously inject the prepared cooling air into the heat dissipation space 24, thereby achieving heat dissipation.
[0064] In order to further improve the heat exchange effect, in a feasible implementation mode, the server group also includes: a liquid cooling pump group; the liquid cooling pump group is arranged in the first heat exchange gap 15, the second heat exchange gap 16 and the heat dissipation space 24, and is used to dissipate heat for the servers in the first server node group and the second server node group.
[0065] Among them, the liquid cooling pump group is a heat exchange structure provided with a coolant, which brings the heat of the first heat exchange gap 15 and the second heat exchange gap 16 to the heat dissipation space 24 through the coolant, so as to increase the heat exchange process through the coolant on the basis of air circulation heat dissipation, thereby improving the heat dissipation efficiency.
[0066] There are many specific implementations of the liquid cooling pump set. One feasible implementation is as follows Figure 3 and Figure 4 As shown, Figure 3 is a structural schematic diagram of a server group provided with a liquid cooling pump group provided in this embodiment, Figure 4 is a cross-sectional view of a server group provided with a liquid cooling pump group according to this embodiment, wherein: Figure 3 and Figure 4 The structure shown corresponds to .
[0067] like Figure 3 and Figure 4 As shown, the coolant pump group includes a heat exchange tube 41; the heat exchange tube 41 is laid in the first heat exchange gap 15, the second heat exchange gap 16 and the heat dissipation space 24, so as to guide the heat in the first heat exchange gap 15 and the second heat exchange gap 16 to the heat dissipation space 24 through the coolant in the heat exchange tube 41.
[0068] In this embodiment, the heat exchange tube 41 is laid in the first heat exchange gap 15, the second heat exchange gap 16 and the heat dissipation space 24, and the coolant flows from the heat exchange gap to the heat dissipation space 24 in the heat exchange tube 41. For example, the coolant flows from the first heat exchange gap 15 to the heat dissipation space 24, or the coolant flows from the second heat exchange gap 16 to the heat dissipation space 24. When the coolant is in the first heat exchange gap 15 or the second heat exchange gap 16, the coolant absorbs the heat in the heat exchange gap, and when the coolant flows to the heat dissipation space 24, the coolant exchanges heat with the cold air in the heat dissipation space 24, thereby releasing the heat to the air, completing the heat dissipation process.
[0069] There are many ways to lay the heat exchange tube 41, for example, Figure 4 As shown, when the heat dissipation space 24 is located between the first heat exchange gap 15 and the second heat exchange gap 16, the heat exchange tube 41 can directly penetrate the first heat exchange gap 15, the second heat exchange gap 16 and the heat dissipation space 24, so that the coolant circulates in the order of "first heat exchange gap 15-heat exchange space 24-second heat exchange gap 16-heat dissipation space 24-first heat exchange gap 15".
[0070] In addition, when the heat dissipation space 24 is located between the first heat exchange gap 15 and the second heat exchange gap 16, heat exchange tubes 41 can also be laid for the first heat exchange gap 15 and the second heat exchange gap 16, that is, two groups of heat exchange tubes 41 are provided, one group of heat exchange tubes 41 penetrates the first heat exchange gap 15 and the heat dissipation space 24, so that the coolant circulates in the first heat exchange gap 15 and the heat dissipation space 24. Another group of heat exchange tubes 41 penetrates the second heat exchange gap 16 and the heat dissipation space 24, so that the coolant circulates in the second heat exchange gap 16 and the heat dissipation space 24. That is to say, in this embodiment, the heat in the first heat exchange gap 15 and the second heat exchange gap 16 is directed to the heat dissipation space 24 by the two groups of heat exchange tubes 41, respectively.
[0071] In order to realize the circulation flow of the coolant, the heat exchange tube 41 needs to be connected as a closed loop path, and the cooling pump 42 can provide the coolant with the power to flow.
[0072] A specific implementation method is as follows Figure 4 and Figure 5 As shown, specifically, the liquid cooling pump group also includes a cooling pump 42 and a collecting pipe 43; the outlet of the cooling pump 42 is connected to the first end of the heat exchange tube 41, the second end of the heat exchange tube 41 is connected to the collecting pipe 43, and the collecting pipe 43 is connected to the inlet of the cooling pump 42; when the cooling pump 42 is started, the coolant circulates in the liquid cooling pump group under the action of the cooling pump 42.
[0073] In addition, in this embodiment, the heat exchange tube 41 can be laid as a single heat exchange tube 41 to save space, or multiple heat exchange tubes 41 can be set at the same time to improve the heat exchange effect. When multiple heat exchange tubes 41 are set, a feasible implementation method can be that multiple heat exchange tubes 41 are arranged along the axial direction of the collecting pipe 43; each heat exchange tube 41 is arranged in a winding manner as a multi-layer pipeline, so that the coolant can be circulated in the heat exchange tube 41 for multiple times.
[0074] In this embodiment, among the multiple heat exchange tubes 41 arranged axially along the collecting pipe 43, each heat exchange tube 41 is windingly arranged as a multi-layer pipe, that is, multiple rows of "S"-shaped heat exchange tubes are arranged, so that when the coolant flows in the heat exchange tubes 41, it can reciprocate to guide the heat in the heat exchange gap to the heat dissipation space 24, thereby improving the heat exchange effect while keeping the result simple.
[0075] In a further embodiment, it is also possible to Figure 4 As shown, a plurality of heat dissipation plates 52 extending into the first heat exchange gap 15 or the second heat exchange gap 16 are arranged on the partition plate 51 , and the plurality of heat exchange tubes 41 and the plurality of heat dissipation plates 52 are arranged alternately.
[0076] The heat sink 52 provided on the partition 51 can increase the contact area between the partition 51 and the air in the heat exchange gap, so that the heat of the partition 51 can be fully transferred to the air in the heat exchange gap. In addition, the heat sink 52 and the heat exchange tube 41 are arranged in a staggered manner, so that the heat sink 52 is adjacent to the heat exchange tube 41. When the heat is very high, the heat on the heat sink 52 will radiate to the heat exchange tube 41, so that the heat exchange tube 41 directly absorbs the heat on the heat sink 52, further enhancing the heat exchange effect.
[0077] In this embodiment, more heat sinks may be provided according to the connection mode between the first heat exchange gap 15 and the second heat exchange gap 16 and the heat dissipation space 24 to blow the hot air in the first heat exchange gap 15 and the second heat exchange gap 16 toward the heat dissipation space 24 .
[0078] A specific implementation may be that a second radiator is provided on the side wall of the rack 20 adjacent to the first heat exchange gap 15 to blow the hot air in the first heat exchange gap 15 toward the heat dissipation space 24; and / or, a second radiator is provided on the side wall of the rack 20 adjacent to the second heat exchange gap 16 to blow the hot air in the second heat exchange gap 16 toward the heat dissipation space 24.
[0079] In this embodiment, the second radiator and the second radiator enable the first heat exchange gap 15 and the second heat exchange gap 16 to also form a ventilation channel, thereby blowing the hot air in the first heat exchange gap 15 and the second heat exchange gap 16 to the heat dissipation space 24, and then the first radiator 31 blows the hot air to the outside.
[0080] In order to ensure the air circulation effect, the power of the first radiator 31, the second radiator and the second radiator can also be set to avoid the repulsion effect when the first radiator 31, the second radiator and the second radiator blow the air.
[0081] Exemplarily, when the heat dissipation space 24 is located between the first heat exchange gap and the second heat exchange gap and a second radiator and a second radiator are provided at the same time, the second radiator and the second radiator can be arranged so that the air ducts of the first radiator 31, the second radiator and the second radiator form a T-shape, and the wind forces of the second radiator and the second radiator are the same, and the wind forces of the second radiator and the second radiator are smaller than the wind force of the first radiator 31, thereby avoiding the wind force difference causing the hot air to flow back to the first heat exchange gap or the second heat exchange gap.
[0082] Furthermore, in this embodiment, if a heat sink 52 is provided on the partition 51, the arrangement direction of the heat sink 52 needs to be set to be consistent with the wind direction. Specifically, the partition 51 is provided with a plurality of heat sinks 52 extending into the first heat exchange gap 15, and the arrangement direction of the plurality of heat sinks 52 is consistent with the direction in which the air from the first heat exchange gap 15 flows toward the heat dissipation space 24; and / or, the partition 51 is provided with a plurality of heat sinks 52 extending into the second heat exchange gap 16, and the arrangement direction of the plurality of heat sinks 52 is consistent with the direction in which the air from the second heat exchange gap 16 flows toward the heat dissipation space 24.
[0083] In addition, more components can be set in this server group to bring more functions to the server group.
[0084] For example, the power supplies of the servers may be concentrated on the same power supply group 61 for unified power supply.
[0085] A possible implementation method can be as follows Figure 2 As shown, the server group further includes a power supply group 61 , which is located between the first control node group and the second server node group and is used to supply power to the first control node group, the second server node group and the first radiator 31 .
[0086] In addition, a heat dissipation level selector may also be provided to select a heat dissipation level according to heat dissipation requirements, thereby reducing energy consumption.
[0087] A feasible implementation method may be that the server group also includes: a heat dissipation level selector; the heat dissipation level selector is arranged on the outer surface of the rack 20; the heat dissipation level selector is connected to the first radiator 31, and is used to adjust the heat dissipation level for the first server node group and the second server node group.
[0088] In addition, temperature sensors may be further provided in the first heat exchange gap 15 and the second heat exchange gap 16, and a visual window may be provided on the rack 20, etc., which are not specifically limited here.
[0089] In the server group provided above, multiple servers are integrated in one rack, and heat exchange gaps are formed between different server nodes through partitions, and the heat exchange gaps are connected to the heat dissipation space between the first radiator and the air outlet. When the first radiator is started, the hot air in the heat dissipation space will be blown out to make the heat dissipation space cold air, and the temperature difference between the heat exchange gap and the heat dissipation space will cause the heat exchange gap and the heat dissipation space to form convection, thereby continuously guiding the heat in the heat exchange gap to the heat dissipation space, so as to ensure the heat dissipation effect of each server while making the layout of each server compact.
[0090] The first embodiment above provides a server group of multiple servers. Corresponding to the first embodiment above, the second embodiment of the present application also provides a hyper-converged all-in-one machine.
[0091] The hyper-converged all-in-one machine includes: a rack, a first server node group, a second server node group and a first radiator; the first server node group includes a first server and a second server, and the second server node group includes a third server and a fourth server; a first heat exchange gap is separated from the first server and the third server by a partition, and a second heat exchange gap is separated from the second server and the fourth server by a partition; the rack includes a first side wall and a second side wall opposite to each other; the first side wall is provided with a first radiator, and the second side wall is provided with an air outlet opposite to the first radiator, and a heat dissipation space is formed between the first radiator and the air outlet; the heat dissipation space is located between the first server node group and the second server node group, and the heat dissipation space is communicated with the first heat exchange gap and the second heat exchange gap respectively, so that the hot air in the heat dissipation space can be blown out from the air outlet through the first radiator.
[0092] The hyper-converged all-in-one machine may have more specific implementation modes, please refer to the first embodiment for details, and no unnecessary details will be given here.
[0093] It should be noted that, although several structures, components or units for realizing related functions are mentioned in the above detailed description, such division is not mandatory. In fact, according to the specific implementation of the present application, the features and functions of two or more structures, components or units described above can be concretized in one structure, component or unit. Conversely, the features and functions of one structure, component or unit described above can be further divided into multiple components, structures or units to be concretized.
[0094] In addition, although the components and the installation methods of the components or devices in the present application are described in a specific order in the drawings, this does not require or imply that the components or devices must be designed according to the specific components or the installation methods of the components, or that all the components shown must be included to achieve the desired results. Additionally or alternatively, some components can be omitted, multiple components can be combined into one component to achieve corresponding functions, and / or one component can be decomposed into multiple components to achieve corresponding functions, etc.
[0095] Although the present application is disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field may make possible changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims of the present application.
Claims
1. A server group of multiple servers, characterized in that: include: A rack, a first server node group, a second server node group, and a first radiator; The first server node group includes a first server and a second server, and the second server node group includes a third server and a fourth server; a first heat exchange gap is separated between the first server and the third server by a partition, and a second heat exchange gap is separated between the second server and the fourth server by a partition; The rack includes a first side wall and a second side wall that are opposite to each other; the first side wall is provided with the first radiator, and the second side wall is provided with an air outlet opposite to the first radiator, and a heat dissipation space is formed between the first radiator and the air outlet; the heat dissipation space is located between the first server node group and the second server node group, and the heat dissipation space is respectively communicated with the first heat exchange gap and the second heat exchange gap, so that the hot air in the heat dissipation space can be blown out from the air outlet through the first radiator.
2. The server group of multiple servers according to claim 1, characterized in that: The server group also includes: a liquid cooling pump group; The liquid cooling pump group is arranged in the first heat exchange gap, the second heat exchange gap and the heat dissipation space, and is used to dissipate heat for the servers in the first server node group and the second server node group.
3. The server group of multiple servers according to claim 2, characterized in that: The liquid cooling pump group includes a heat exchange tube; the heat exchange tube is laid in the first heat exchange gap, the second heat exchange gap and the heat dissipation space to guide the heat in the first heat exchange gap and the second heat exchange gap to the heat dissipation space through the coolant in the heat exchange tube.
4. The server group of multiple servers according to claim 3, characterized in that: The liquid cooling pump set also includes a cooling pump and a liquid collecting pipe; The outlet of the cooling pump is connected to the first end of the heat exchange tube, the second end of the heat exchange tube is connected to the collecting pipe, and the collecting pipe is connected to the inlet of the cooling pump; when the cooling pump is started, the coolant circulates in the liquid cooling pump group under the action of the cooling pump.
5. The server group of multiple servers according to claim 4, characterized in that: A plurality of heat exchange tubes are arranged along the axial direction of the collecting tube; each heat exchange tube is arranged in a winding manner as a multi-layer pipeline, so that the coolant can be circulated in the heat exchange tube in reverse directions for multiple times.
6. The server group of multiple servers according to claim 5, characterized in that: The partition is provided with a plurality of heat dissipation plates extending into the first heat exchange gap or the second heat exchange gap, and the plurality of heat exchange tubes are arranged alternately with the plurality of heat dissipation plates.
7. The server group of multiple servers according to claim 1, characterized in that: A second radiator is provided on the side wall of the rack adjacent to the first heat exchange gap to blow the hot air in the first heat exchange gap to the heat dissipation space; A third radiator is arranged on the side wall of the rack adjacent to the second heat exchange gap to blow the hot air in the second heat exchange gap toward the heat dissipation space.
8. The server group of multiple servers according to claim 7, characterized in that: The partition is provided with a plurality of heat dissipating plates extending into the first heat exchange gap, and the arrangement direction of the plurality of heat dissipating plates is consistent with the direction in which the air in the first heat exchange gap flows toward the heat dissipating space; And / or, a plurality of heat dissipating plates extending into the second heat exchange gap are arranged on the partition, and an arrangement direction of the plurality of heat dissipating plates is consistent with a direction in which air in the second heat exchange gap flows toward the heat dissipating space.
9. The server group of multiple servers according to claim 1, characterized in that: The server group further includes: a heat dissipation level selector; The heat dissipation level selector is disposed on the outer surface of the rack; the heat dissipation level selector is connected to the first radiator and is used to adjust the heat dissipation level for the first server node group and the second server node group.
10. A hyper-converged all-in-one machine, characterized in that: include: A rack, a first server node group, a second server node group, and a first radiator; The first server node group includes a first server and a second server, and the second server node group includes a third server and a fourth server; a first heat exchange gap is separated between the first server and the third server by a partition, and a second heat exchange gap is separated between the second server and the fourth server by a partition; The rack includes a first side wall and a second side wall that are opposite to each other; the first side wall is provided with the first radiator, and the second side wall is provided with an air outlet opposite to the first radiator, and a heat dissipation space is formed between the first radiator and the air outlet; the heat dissipation space is located between the first server node group and the second server node group, and the heat dissipation space is respectively communicated with the first heat exchange gap and the second heat exchange gap, so that the hot air in the heat dissipation space can be blown out from the air outlet through the first radiator.
