Integrated calculation unit for vehicle-mounted cabin driving

Abstract

According to the integrated calculation unit for the vehicle-mounted cabin driving, the two independent function modules are integrated into the calculation unit module through the liquid cooling plate for connection, the principle that double-face heat dissipation can be achieved through one liquid cooling plate based on one liquid cooling flow channel is utilized, and the heat conduction bosses are arranged on the two sides of the liquid cooling plate respectively; and cooling the chips of the two independent computing module mainboards. Mainboards of different functional modules are integrated on the same structure, and compared with an original design mode of independent functional modules, a set of heat dissipation structural parts and carrier structural parts can be saved; for the whole vehicle design, on one hand, the number of electric appliance parts can be reduced, on the other hand, whole vehicle water path branches in a vehicle system can be reduced, water path connectors are reduced, the whole vehicle space layout is reduced, and meanwhile the cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of intelligent automobile hardware, in particular to an integrated computing unit for driving in a vehicle cabin. Background Art

[0002] At present, the intelligentization of automobiles is developing rapidly, and there are many kinds of electrical appliances in automobiles. The cockpit domain control, intelligent driving module controller, and automatic driving controller are all independent functional modules. Due to their high computing power and high power, liquid cooling technology is required; the electrical connection harnesses between these functional modules and the system are also intricate, and the heat dissipation components are also scattered; as the number of electrical appliances in the whole vehicle increases, not only is it costly to design independent control modules for individual functional modules, but it also requires more space to layout these electrical appliances. Summary of the invention

[0003] In order to solve the problem that the existing independent functional modules are designed with heat dissipation components separately, which leads to increased control occupancy and increased costs, the utility model provides an integrated computing unit for vehicle cabin driving, which can reduce the number of electrical components, reduce the water path branches of the vehicle heat pump management, and save costs while reducing the space layout of the vehicle.

[0004] The structure of the utility model is as follows: an integrated computing unit for driving in a vehicle cabin, comprising: a computing module mainboard, characterized in that it also comprises: a liquid cooling plate for connection;

[0005] There is one connecting liquid cooling plate and two computing module mainboards;

[0006] The connecting liquid cooling plate comprises: a shell, a grounding copper bar and a liquid cooling channel;

[0007] The shell is a tank structure, and the liquid cooling channel is arranged in the inner cavity of the shell;

[0008] A partition plate is provided in the middle of the inner cavity of the shell to divide the interior of the shell into two slot spaces, and the liquid cooling channel exists in the slot spaces on both sides of the partition plate at the same time; in each of the slot spaces, the grounding copper bar is arranged on the inner side of the shell, and the shape of the grounding copper bar is adapted to the shape of the computing module motherboard;

[0009] The liquid cooling channel comprises: a speed reduction rib, a bottom plate and a channel cover plate;

[0010] The speed reduction ribs are arranged in the inner cavity of the liquid cooling channel, and the distribution position of the speed reduction ribs corresponds to the position of the chip with the highest power on the mainboard of the computing module;

[0011] A boss structure is respectively provided on one side of the bottom plate and the flow channel cover plate away from the partition plate; the boss structure comprises: a plurality of heat-conducting bosses, and the positions of the heat-conducting bosses distributed on the bottom plate and the flow channel cover plate are adapted to the shapes of the chips on the corresponding computing module mainboard;

[0012] The main chips of the two computing module mainboards are both facing the connecting liquid cooling plate and are respectively arranged on both sides of the connecting liquid cooling plate.

[0013] It is further characterized by:

[0014] It also includes: a cover body, one of which is disposed on a side of each computing module mainboard away from the liquid cooling plate, the cover body is fixedly connected to the shell, and a concave structure adapted to the grounding copper bar structure is disposed on the cover body;

[0015] A heat-conducting layer is provided between the heat-conducting boss and the chip of the computing module mainboard;

[0016] The heat-conducting layer includes: heat-conducting gel, heat-conducting silica gel, heat-conducting silicone grease or heat-conducting phase change material;

[0017] A liquid cooling water inlet and a liquid cooling water outlet are provided on the side of the shell, and the liquid cooling water inlet and the liquid cooling water outlet are connected to the liquid cooling flow channel;

[0018] The computing module mainboard includes: an intelligent driving mainboard and a cockpit mainboard;

[0019] On the intelligent driving main board and the cockpit main board, the high-power chip and the connector are arranged on the same surface.

[0020] The utility model provides an integrated computing unit for vehicle cabin driving, which integrates two independent functional modules into one computing unit module through a connecting liquid cooling plate, and uses a liquid cooling plate based on a set of liquid cooling channels to achieve double-sided heat dissipation. Heat-conducting bosses are respectively arranged on both sides of the liquid cooling plate to dissipate heat for the chips of the two independent computing module mainboards. Integrating the mainboards of different functional modules into the same structure can save a set of heat dissipation structural parts and carrier structural parts compared with the original design of independent functional modules; for the whole vehicle design, on the one hand, it can reduce the number of electrical components, and on the other hand, it can reduce the whole vehicle water channel branches in the vehicle system, reduce water channel joints, reduce the whole vehicle space layout and save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of the mainframe of the integrated computing unit for driving in the vehicle cabin on the A side;

[0022] Figure 2 It is a schematic diagram of the structure of the mainframe of the integrated computing unit for driving in the vehicle cabin on the B side;

[0023] Figure 3 This is an exploded diagram of the mainframe structure of the integrated computing unit for vehicle-mounted cabin driving;

[0024] Figure 4 This is an example of the relationship between the cockpit mainboard and the slot space where it is located;

[0025] Figure 5 This is an example of the comparison between the intelligent driving mainboard and the slot space where it is located;

[0026] Figure 6 Examples of liquid cooling runners and runner covers;

[0027] Figure 7 Schematic diagram of the structure of the liquid cooling channel. DETAILED DESCRIPTION

[0028] like Figure 1 to Figure 7 As shown, the utility model includes an integrated computing unit for vehicle-mounted cabin driving, which includes: a computing module mainboard, a connecting liquid cooling plate and a cover body 2. There is one connecting liquid cooling plate and two computing module mainboards. The connecting liquid cooling plate serves as the whole machine carrier of the integrated computing unit, carries two computing module mainboards, and locally cools and dissipates the high-power chips on the two mainboards. In actual application, any two mainboards can be set for the computing module mainboard according to actual needs. In this embodiment, the computing module mainboards arranged on both sides of the connecting liquid cooling plate are: intelligent driving mainboard 3 and cockpit mainboard 4. The two functional module mainboards of the original independent cockpit domain control and intelligent driving computing unit on the vehicle are placed on the front and back sides of the connecting liquid cooling plate respectively using the principle of double-sided cooling and heat dissipation of the liquid cooling plate. The liquid cooling water pipeline path is distributed on the high-power chips on the two functional module mainboards, so that the same liquid cooling channel can cool and dissipate the high-power chips on the two mainboards at the same time, realizing the integration of the cabin-driving integrated computing unit.

[0029] The connection liquid cooling plate includes: a shell 1, a grounding copper bar 5 and a liquid cooling channel 6. The shell 1 is a tank structure, and the liquid cooling channel 6 is arranged in the inner cavity of the shell 1. A partition plate 1-3 is arranged in the middle of the shell 1, dividing the inside of the shell 1 into two tank spaces, forming an H-shaped tank structure. The liquid cooling channel includes: a speed reduction rib 9, a bottom plate 6-2 and a channel cover plate 7; the speed reduction rib 9 is arranged in the inner cavity of the liquid cooling channel 6.

[0030] During the specific manufacturing process, the housing 1, the liquid cooling channel 6, the partition plate 1-3, the speed reduction rib 9, and the bottom plate 6-2 of the liquid cooling channel 6 are integrally formed. A channel cover plate 7 is provided at the open end of the liquid cooling channel 6 to form a sealed liquid cooling channel. The liquid cooling channel 6 and the channel cover plate 7 are formed by stir friction welding.

[0031] After the two computing module motherboards are respectively installed on both sides of the liquid cooling channel 6 by fasteners such as screws 2-1, the cover body 2 is respectively installed on both sides of the shell 1 to form a closed integrated computing unit. The liquid cooling plate is generally formed by friction welding or brazing a stamped cover plate and a die-cast machine shell to form a component with a closed cavity. In this solution, since both sides of the liquid cooling plate need to have a boss structure, both the cover plate 2 and the shell 1 need to be made of die-cast parts, so that the coolant in the liquid cooling channel has a small flow resistance and good fluidity, which is conducive to heat dissipation.

[0032] The liquid cooling channel 6 is simultaneously present in the slot space on both sides of the partition plate 1-3, and can dissipate heat for the computing module mainboards on both sides of the partition plate 1-3. In each slot space, a grounding copper busbar 5 is arranged on the inner side of the shell 1. The shape of the grounding copper busbar 5 is adapted to the shape of the computing module mainboard to ensure safe use. A cover body 2 is provided on the side of each computing module mainboard away from the liquid cooling plate. The two cover bodies 2 are respectively connected to the shell 1 by screws and other connectors. A concave structure 2-2 adapted to the structure of the grounding copper busbar 5 is provided on the cover body 2, which is beneficial to improving the reliability of the EMC of the whole machine.

[0033] A liquid cooling water inlet 1-1 and a liquid cooling water outlet 1-2 are arranged on the side of the housing 1, and the liquid cooling water inlet 1-1 and the liquid cooling water outlet 1-2 are connected to the inner cavity of the liquid cooling channel 6. In the inner cavity of the liquid cooling channel 6, a guide plate 6-1 is arranged at a position between the liquid cooling water inlet 1-1 and the liquid cooling water outlet 1-2, and the guide plate 6-1 separates the liquid cooling water inlet 1-1 and the liquid cooling water outlet 1-2, and guides the coolant entering from the liquid cooling water inlet 1-1 to the area where the speed reduction rib 9 is located.

[0034] In order to effectively dissipate the heat of the main chip on the computing module motherboard, a cooling liquid deceleration channel for reducing the flow rate is set at the position of the main chip on the computing module motherboard. In actual application, the deceleration channel can be realized based on the existing liquid cooling plate channel structure. In this embodiment, the cooling liquid deceleration channel is formed based on discontinuous deceleration ribs 9, which can reduce the weight of the overall integrated computing unit on the basis of realizing the deceleration of the cooling liquid. Figure 7 As shown, the rib position layout of the speed reduction ribs in the speed reduction channel 9-1 corresponds to the shape of the high-power chip of the cockpit mainboard 4, and the rib position layout of the speed reduction ribs in the speed reduction channel 9-2 corresponds to the shape of the high-power chip of the intelligent driving mainboard 3.

[0035] A boss structure is respectively arranged on the side of the base plate 6-2 and the flow channel cover plate 7 away from the partition plate 1-3; the boss structure includes: a plurality of heat-conducting bosses 8, and the shape of the heat-conducting bosses 8 and their distribution positions on the base plate 6-2 and the flow channel cover plate 7 are adapted to the shape and position of the chip on the corresponding computing module mainboard.

[0036] The main chips of the two computing module motherboards are facing the flow channel cover plate 7 and are respectively arranged on both sides of the connecting liquid cooling plate. A heat-conducting layer 10 is arranged between the heat-conducting boss 8 of the flow channel cover plate 7 and the chip of the computing module motherboard. The heat-conducting layer 10 is arranged one-to-one with the heat-conducting boss 8. The heat-conducting layer 10 includes: heat-conducting gel, heat-conducting silica gel, heat-conducting silicone grease or heat-conducting phase change material. In this embodiment, the heat-conducting boss 8 is in contact with the intelligent driving motherboard 4 and dissipates heat through the heat-conducting gel.

[0037] Reference Figure 3~Figure 5 In this embodiment, the layout of the mainboard electronic components of the two computing module mainboards is to design the connector and the high-power chip that requires strong heat dissipation on the same surface, such as Figure 4 As shown, on the cockpit mainboard 4, the cockpit mainboard high-power chip 4-1 and the cockpit mainboard connector 4-2 are both arranged on the same side of the PCB board. Figure 5 As shown, on the intelligent driving mainboard 3, the intelligent driving mainboard high-power chip 3-1 and the intelligent driving mainboard connector 3-2 are both arranged on the same side of the PCB board. The reason for this design is that, on the one hand, the liquid cooling plate assembly in the middle is a die-casting part, which can be molded and grounded with the exposed copper of the mainboard; on the other hand, if the connector and the main chip are on different surfaces, the front and rear covers 2 cannot be stamped parts, and a die-casting shell is required to be well grounded. Therefore, this design is conducive to minimizing the weight of the whole machine and optimizing the cost.

[0038] In this solution, the mainboards of the two computing modules are fixed on both sides of the liquid cooling plate respectively. The liquid cooling plate is partially designed with a speed reduction channel around the high-power chips on the mainboards of the two computing modules. The speed reduction channel is designed with a thermal conductive boss 8 at the position where the high-power chip is passed for contact heat conduction. Thermal conductive gel is coated on the thermal conductive boss 8 to fill the gap between the chip and the liquid cooling plate to ensure sufficient heat dissipation.

[0039] After using the technical solution of the utility model, an integrated module solution of a vehicle-mounted cabin-driver integrated computing unit is formed through a structural design solution, and the liquid cooling plate is used to dissipate heat on both sides to dissipate the chips of two independent functional module mainboards; this solution is highly adaptable in the field of vehicle-mounted applications, can integrate more electrical functional modules, and has high vehicle-mounted adaptability. For the whole vehicle, it saves layout space, reduces the number of parts and accessories of the whole vehicle, reduces costs, has a simple structure, and has strong vehicle-mounted versatility and adaptability.

Claims

1. An integrated computing unit for vehicle cabin driving, comprising: a computing module mainboard, characterized in that: It also includes: a liquid cooling plate for connection; There is one connecting liquid cooling plate and two computing module mainboards; The connecting liquid cooling plate comprises: a shell, a grounding copper bar and a liquid cooling channel; The shell is a tank structure, and the liquid cooling channel is arranged in the inner cavity of the shell; A partition plate is provided in the middle of the inner cavity of the shell to divide the interior of the shell into two slot spaces, and the liquid cooling channel exists in the slot spaces on both sides of the partition plate at the same time; in each of the slot spaces, the grounding copper bar is arranged on the inner side of the shell, and the shape of the grounding copper bar is adapted to the shape of the computing module motherboard; The liquid cooling channel comprises: a speed reduction rib, a bottom plate and a channel cover plate; The speed reduction ribs are arranged in the inner cavity of the liquid cooling channel, and the distribution position of the speed reduction ribs corresponds to the position of the chip with the highest power on the mainboard of the computing module; A boss structure is respectively provided on one side of the bottom plate and the flow channel cover plate away from the partition plate; the boss structure comprises: a plurality of heat-conducting bosses, and the positions of the heat-conducting bosses distributed on the bottom plate and the flow channel cover plate are adapted to the shapes of the chips on the corresponding computing module mainboard; The main chips of the two computing module mainboards are both facing the connecting liquid cooling plate and are respectively arranged on both sides of the connecting liquid cooling plate.

2. The vehicle-mounted cabin driving integrated computing unit according to claim 1, characterized in that: It also includes: a cover body, one of which is disposed on the side of each computing module mainboard away from the liquid cooling plate, the cover body is fixedly connected to the shell, and a concave structure adapted to the grounding copper bar structure is disposed on the cover body.

3. The vehicle-mounted cabin driving integrated computing unit according to claim 1, characterized in that: A heat-conducting layer is arranged between the heat-conducting boss and the chip of the computing module mainboard.

4. The vehicle-mounted cabin driving integrated computing unit according to claim 3, characterized in that: The heat-conducting layer includes: heat-conducting gel, heat-conducting silicone grease or heat-conducting phase change material.

5. The vehicle-mounted cabin driving integrated computing unit according to claim 1, characterized in that: A liquid cooling water inlet and a liquid cooling water outlet are arranged on the side of the shell, and the liquid cooling water inlet and the liquid cooling water outlet are connected to the liquid cooling flow channel.

6. The vehicle-mounted cabin driving integrated computing unit according to claim 1, characterized in that: The computing module mainboard includes: an intelligent driving mainboard and a cockpit mainboard.

7. The vehicle-mounted cabin driving integrated computing unit according to claim 1, characterized in that: On the computing module mainboard, the high-power chip and the connector are arranged on the same surface.

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