Desktop computer mainboard structure without south bridge chipset
By removing the South Bridge chipset from the desktop motherboard, using a design that is directly connected to the CPU and optimizing the heat dissipation structure, the problems of high weight and cost of traditional motherboards are solved, and a lighter and more stable desktop motherboard structure is achieved.
Patent Information
- Application Number
- CN202420921294.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-29
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-29
AI Technical Summary
Traditional desktop motherboards have many and heavy electronic components due to the integrated South Bridge chipset, and the South Bridge chipset is prone to damage and has high installation costs.
By removing the South Bridge chipset from the desktop motherboard, using BIOS storage module and IO control module directly electrically connect to the CPU unit, combining the metal guide module and radiator buckle, the heat dissipation effect is good and the communication is stable, and the motherboard is reduced. Weight and cost.
Effectively reduce the number of electronic components on the motherboard and the overall structural weight, improve heat dissipation performance and communication stability, reduce costs, and ensure safety.
Smart Images
Figure CN222281224U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of desktop mainboards, in particular to a desktop mainboard structure with a south bridge chipset removed. Background Art
[0002] The motherboard, also called mainboard, systemboard, or motherboard, is one of the most basic and important components of a computer. The main circuit system and heat dissipation components (devices) that make up the computer are installed on the motherboard. The main circuit system generally includes BIOS chip, I / O control chip, keyboard and panel control switch interface, indicator light connector, expansion card slot, DC power supply connector of the motherboard and plug-in card, etc.
[0003] At present, traditional desktop motherboards generally integrate south bridge chipsets, which often have the problem of more and heavier electronic components. In addition, the south bridge chipset is easily damaged when exposed, and the installation of the south bridge chipset also requires additional costs. Utility Model Content
[0004] In view of this, the purpose of the present invention is to provide a desktop mainboard structure without the south bridge chipset.
[0005] To achieve the above objectives, the utility model discloses a desktop motherboard structure without a south bridge chipset, comprising:
[0006] A circuit substrate, used as a circuit carrier for each electronic component of the desktop motherboard;
[0007] A CPU unit, located in the middle of the circuit substrate, is used as a computing and control module of the desktop computer;
[0008] A card slot, used for inserting a memory card, located on one side of the CPU unit;
[0009] An IO control module, located on a side of the CPU unit adjacent to the card slot, and used to execute instructions of the CPU unit to control the IO devices of the desktop computer;
[0010] A BIOS storage module, used as the most basic input / output system of the desktop motherboard, located on one side of the IO control module;
[0011] Wherein, the BIOS storage module and the IO control module are both directly electrically connected to the CPU unit.
[0012] Preferably, the desktop mainboard structure further includes a metal guide module, including a snap-fit component and a metal guide respectively abutting against an external heat sink and the CPU unit, and the metal guide is arranged on the circuit substrate through the snap-fit component.
[0013] Preferably, the desktop motherboard structure further includes a heat collecting plate group and a radiator clip, the radiator clips are symmetrically distributed on both sides of the CPU unit, the external radiator is buckled and connected to the radiator clips, and the heat collecting plate group abuts against the external radiator.
[0014] Preferably, the heat sink clip is fixed on the circuit substrate by threaded connection.
[0015] Preferably, it also includes a power connection port, a PCIE port and a data transmission port.
[0016] Preferably, the CPU unit is a BGA CPU unit.
[0017] Preferably, the card slot is a dual DDR5 UDIMM card slot.
[0018] Preferably, the desktop motherboard structure also includes an audio connection port.
[0019] Preferably, the desktop mainboard structure also includes a hard disk socket.
[0020] Preferably, the hard disk socket is an M.2 hard disk socket, and the circuit substrate is arranged in a rectangular structure.
[0021] Preferably, the desktop mainboard structure further includes a tantalum capacitor module which is evenly distributed in a linear manner at intervals on a side of the CPU unit away from the card slot.
[0022] In summary, compared with the prior art, the utility model provides a desktop motherboard structure that removes the south bridge chipset, and directly transmits data with the CPU unit through integrated chips such as the BIOS storage module and the IO control module. There is no need to install the south bridge chipset as a communication bridge, which can effectively reduce the number of electronic components on the motherboard and reduce the weight of the overall structure of the motherboard, and has beneficial effects such as good heat dissipation, stable and secure communication, and low cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 This is a three-dimensional schematic diagram of a desktop motherboard structure without the south bridge chipset provided in this embodiment. Figure 1 ;
[0025] Figure 2 This is a three-dimensional schematic diagram of a desktop motherboard structure without the south bridge chipset provided in this embodiment. Figure 2 ;
[0026] Figure 3 It is a rear view schematic diagram of a desktop mainboard structure without a south bridge chipset provided by this embodiment.
[0027] Figure numerals: 1. Circuit substrate; 2. CPU unit; 3. Card slot; 4. IO control module; 5. BIOS storage module; 6. Tantalum capacitor module; 7. Heat collector group; 8. Radiator fastener; 9. Power connection port; 10. PCIE port; 11. Data transmission port; 12. Audio connection port; 13. Hard disk socket; 14. Fastener; 15. Metal guide. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0029] In the description of the present invention, it should be noted that the terms "front", "rear", "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0030] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0031] In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.
[0032] A desktop motherboard structure without the south bridge chipset, such as Figures 1 to 3 As shown, including:
[0033] The circuit substrate 1 is used as a circuit carrier for various electronic components of the desktop motherboard;
[0034] The CPU unit 2 is located in the middle of the circuit substrate 1 and is used as a computing and control module of the desktop computer;
[0035] In this embodiment, the CPU unit 2 is a BGA CPU unit.
[0036] A card slot 3, used for inserting a memory card, is located on one side of the CPU unit 2;
[0037] In this embodiment, the card slot 3 is a dual DDR5 UDIMM card slot.
[0038] It should be noted that UDIMM, the full name of which is Unbuffered DIMM, means that the address and control signals directly reach the DRAM chip on the DIMM without passing through a buffer or making any timing adjustments. Since UDIMM does not have any cache between the CPU and the memory, the latency is smaller at the same frequency.
[0039] It should be further explained that, in some embodiments, the size specifications and the limiting method of the card slot 3 can be selectively set according to actual conditions and are not specifically limited here.
[0040] The IO control module 4 is located on a side of the CPU unit 2 adjacent to the card slot 3 and is used to execute instructions of the CPU unit 2 to control the IO devices of the desktop computer;
[0041] The BIOS storage module 5 is used as the most basic input / output system of the desktop motherboard and is located on one side of the IO control module 4;
[0042] In this embodiment, the BIOS storage module 5 is a QFN packaged BIOS storage module.
[0043] It should be noted that compared with the SOP packaged chip used in the traditional motherboard structure, the QFN packaged BIOS storage module used in this motherboard structure has the physical advantages of small size, light weight and large storage capacity, and has the quality advantages of strong heat dissipation, good electrical performance and high reliability, which can make the data transmission between the BGA CPU unit and the dual DDR5 UDIMM card slot more efficient and stable.
[0044] The BIOS storage module 5 and the IO control module 4 are both directly electrically connected to the CPU unit 2 .
[0045] It should be noted that the present embodiment directly transmits data with the CPU unit 2 through integrated chips such as the BIOS storage module 5 and the IO control module 4, and there is no need to install a south bridge chipset as a communication bridge. This can effectively reduce the number of electronic components on the motherboard and reduce the weight of the overall structure of the motherboard, and has beneficial effects such as safety and low cost.
[0046] The metal guide module includes a buckle 14 and a metal guide 15 abutting against the CPU unit 2 . The metal guide 15 is arranged on the circuit substrate 1 through the buckle 14 . The buckle 14 is buckled and connected to the circuit substrate 1 .
[0047] It should be noted that, compared with the setting mode in which the external heat sink (not shown) on the traditional motherboard cannot directly contact the CPU unit 2, the present embodiment uses the metal guide plate to abut the CPU unit 2 and the external heat sink respectively, so that the heat generated by the CPU unit 2 during operation can be quickly transferred to the external heat sink, and finally quickly dissipated to the outside through the external heat sink, thereby enhancing the heat dissipation performance of the motherboard and improving the stability and reliability of the CPU unit operation.
[0048] It should be noted that, in some embodiments, in order to further enhance the heat dissipation effect, the mainboard may further include a heat collecting plate group 7 and a radiator clamp 8, the radiator clamp 8 is symmetrically distributed on both sides of the CPU unit 2, the external radiator is buckled and connected to the radiator clamp 8, and the heat collecting plate group 7 is abutted against the external radiator; the heat collecting plate group 7 efficiently concentrates most of the heat generated by other electronic components on the mainboard during operation, and then quickly dissipates the heat to the outside through the external radiator.
[0049] It should be noted that compared with the traditional motherboard structure that directly fixes the external radiator on the circuit substrate 1 with screws, the present motherboard structure, through the setting of a pair of radiator clips 8 on both sides of the CPU unit 2, and then by connecting the external radiator clips to the radiator clips 8, can achieve rapid installation or removal of the external radiator, which is beneficial for the staff to efficiently assemble or repair the motherboard. At the same time, since the radiator clips 8 can support larger external radiators, the overall heat dissipation effect of the motherboard can be effectively improved.
[0050] In this embodiment, the heat sink clip 8 is fixed on the circuit substrate 1 by threaded connection.
[0051] It should be noted that, in some embodiments, the connection and fixing method between the heat sink clip 8 and the circuit substrate 1 can be selectively set according to actual needs, and is not limited to the threaded connection method, and is not specifically limited here.
[0052] Furthermore, the present embodiment also includes a power connection port 9 , a PCIE port 10 , a data transmission port 11 , an audio connection port 12 and a hard disk socket 13 .
[0053] It should be noted that, in the specific implementation process, the power connection port 9 is used to electrically connect to an external power source, the data transmission port 11 is used to transmit data to an external electronic device, the audio connection port 12 is used to connect to an audio device, and the hard disk socket 13 is used to connect to a hard disk; wherein, the full name of PCIE is Peripheral Component Interconnect Express, which is a high-speed serial computer expansion bus standard. PCIE belongs to high-speed serial point-to-point dual-channel high-bandwidth transmission, and the connected devices are allocated exclusive channel bandwidth and do not share bus bandwidth. It mainly supports active power management, error reporting, end-to-end reliability transmission, hot plugging, and quality of service functions.
[0054] In this embodiment, the hard disk socket 13 is an M.2 hard disk socket.
[0055] It should be noted that, in some embodiments, the model of the hard disk socket 13 can also be selectively set according to actual needs, and is not specifically limited here.
[0056] In this embodiment, the circuit substrate 1 is arranged in a rectangular structure.
[0057] It should be noted that, in some embodiments, the structural shape of the circuit substrate 1 can also be set according to actual needs, such as a circle, an irregular polygon, etc., which is not specifically limited here.
[0058] In the specific implementation process, this embodiment further includes a tantalum capacitor module 6 which is evenly distributed in a linear manner at intervals on a side of the CPU unit 2 away from the card slot 3 .
[0059] It should be noted that compared with the aluminum electrolytic capacitors used on traditional motherboards, the tantalum capacitors on this motherboard structure have the advantages of high energy density, high reliability, high stability of electrical properties and a wider operating temperature range, which can make the data transmission and line current between the BGACPU unit and the dual DDR5 UDIMM card slots more stable.
[0060] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. A desktop motherboard structure without a south bridge chipset, characterized in that: include: A circuit substrate (1) used as a circuit carrier for each electronic component of the desktop motherboard; A CPU unit (2), located in the middle of the circuit substrate (1), and used as a computing and control module of the desktop computer; A card slot (3), used for inserting a memory card, located on one side of the CPU unit (2); An IO control module (4), located on a side of the CPU unit (2) adjacent to the card slot (3), and used for executing instructions of the CPU unit (2) to control the IO device of the desktop computer; A BIOS storage module (5), used as the most basic input / output system of the desktop motherboard, located on one side of the IO control module (4); Wherein, the BIOS storage module (5) and the IO control module (4) are both directly electrically connected to the CPU unit (2).
2. The desktop motherboard structure without the south bridge chipset as claimed in claim 1, characterized in that: The desktop motherboard structure also includes: The metal guide module comprises a buckle (14) and a metal guide (15) respectively abutting against an external heat sink and the CPU unit (2); the metal guide (15) is arranged on the circuit substrate (1) via the buckle (14).
3. The desktop motherboard structure without the south bridge chipset as claimed in claim 2, characterized in that: It also includes a heat collecting sheet group (7) and a heat sink fastener (8), wherein the heat sink fastener (8) is symmetrically distributed on both sides of the CPU unit (2), and the external heat sink is clipped and connected to the heat sink fastener (8). The heat collecting sheet group (7) is in contact with the external heat sink, and the heat sink fastener (8) is connected via a thread. The circuit board (1) is fixedly arranged on the circuit board (1).
4. The desktop motherboard structure without the south bridge chipset as claimed in claim 1 or 3, characterized in that: It also includes a power connection port (9), a PCIE port (10) and a data transmission port (11).
5. The desktop motherboard structure without the south bridge chipset as claimed in claim 1, characterized in that: The CPU unit (2) is a BGA CPU unit.
6. The desktop motherboard structure without the south bridge chipset as claimed in claim 1 or 5, characterized in that: The card slot (3) is a dual DDR5 UDIMM card slot.
7. The desktop motherboard structure without the south bridge chipset as claimed in claim 1, characterized in that: An audio connection port (12) is also included.
8. The desktop motherboard structure without the south bridge chipset as claimed in claim 1 or 7, characterized in that: It also includes a hard disk socket (13).
9. The desktop motherboard structure without the south bridge chipset as claimed in claim 8, characterized in that: The hard disk socket (13) is an M.2 hard disk socket, and the circuit substrate (1) is arranged in a rectangular structure.
10. The desktop motherboard structure without the south bridge chipset as claimed in claim 1 or 9, characterized in that: Also includes: Tantalum capacitor modules (6) are evenly distributed in a linear pattern on the CPU unit (2) away from the card one side of the groove (3).