Semiconductor wafer corrosion cage

Abstract

The utility model discloses a semiconductor wafer corrosion cage which comprises a left side limiting support plate and a right side sliding support plate, the left side limiting support plate and the right side sliding support plate are fixed into a whole through a limiting step through rod in a penetrating mode, and square rotating shafts are arranged on the outer side of the left side limiting support plate and the outer side of the right side sliding support plate respectively. Limiting stepped flower shafts are further connected to the two sides of the bottom between the left side limiting supporting plate and the right side sliding supporting plate, first arc-shaped sliding grooves are formed in the left side limiting supporting plate and the right side sliding supporting plate correspondingly, and adjusting stepped flower shafts are slidably arranged in the first arc-shaped sliding grooves in the two sides. And a plurality of notches for placing semiconductor silicon wafers are formed in the adjusting stepped flower shaft and the limiting stepped flower shaft. Compared with the prior art, the structure has the advantages that the spline shaft can be accurately positioned and limited, the distance of the clamping grooves in the spline shaft can be adjusted, the framework is firm and durable, silicon wafers are very convenient to assemble and disassemble, and operation is efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor silicon wafer etching and cleaning, in particular to a semiconductor wafer etching cage. Background Art

[0002] In the etching and cleaning process of semiconductor silicon wafers, chemical etching is usually used to eliminate the damage caused by mechanical processing. In order to improve the etching efficiency, multiple semiconductor silicon wafers need to be etched at one time. The more silicon wafers are etched in a batch, the higher the efficiency and the higher the economic benefits. Then, a corrosion cage is needed that can load multiple semiconductor silicon wafers at the same time and can ensure the positioning accuracy of the silicon wafers. When loading and removing silicon wafers, it is necessary to open the corrosion cage very conveniently, otherwise it will affect the efficiency, so the corrosion cage needs to be opened and locked very conveniently. Moreover, the corrosion process requires the silicon wafer to be rotated for corrosion, and after the corrosion is completed, the corrosion cage must be quickly and instantly moved into the water, which requires the corrosion cage to have high structural strength and be easy to rotate.

[0003] Therefore, there is a need for an etching cage that can load a large number of semiconductor silicon wafers at the same time, ensure the positioning accuracy of the silicon wafers, is easy to open and lock, has high structural strength, and is easy to rotate. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the above technical defects and provide a semiconductor wafer corrosion cage.

[0005] In order to solve the above technical problems, the technical solution provided by the utility model is a semiconductor wafer corrosion cage, comprising a left-side limiting support plate and a right-side sliding support plate, the left-side limiting support plate and the right-side sliding support plate are fixed as a whole through a limiting step rod, and the outer sides of the left-side limiting support plate and the right-side sliding support plate are provided with square rotating shafts, and the bottom sides between the left-side limiting support plate and the right-side sliding support plate are also connected with limiting step flower shafts, the left-side limiting support plate and the right-side sliding support plate are provided with first arc-shaped slide grooves, and adjustment step flower shafts are slidably provided in the first arc-shaped slide grooves on both sides, and the adjustment step flower shafts and the limiting step flower shafts are provided with a number of notches for placing semiconductor silicon wafers.

[0006] Preferably, two parallel intermediate connecting cards are provided between the left limit support plate and the right sliding support plate, and the two intermediate connecting cards are fixed as a whole through a limit step through rod, and a second arc-shaped slide groove corresponding to the first arc-shaped slide groove is provided on the intermediate connecting card, and the adjusting step flower shaft can slide in the second arc-shaped slide groove.

[0007] Preferably, the left-side limiting support plate and the right-side sliding support plate are both threadedly connected with limiting pins, and the limiting ends of the limiting pins can extend into the first arc-shaped sliding groove and can limit the position of the adjustable stepped flower axis.

[0008] Preferably, there are four limit step rods which are evenly distributed in an arc shape at the bottom of the semiconductor silicon wafer, and the limit step rods are provided with a first left limit support plate limit step, a first middle connecting card plate limit step A, a first middle connecting card plate limit step B and a first right sliding support plate limit step from left to right, and the cross-sectional diameters of the first left limit support plate limit step, the first middle connecting card plate limit step A and the first middle connecting card plate limit step B increase sequentially.

[0009] Preferably, there are two limit step flower axes, and the limit step flower axes are provided with a second left limit support plate limit step, a second middle connecting card plate limit step A, a second middle connecting card plate limit step B and a second right sliding support plate limit step from left to right, and the cross-sectional diameters of the second left limit support plate limit step, the second middle connecting card plate limit step A and the second middle connecting card plate limit step B increase sequentially.

[0010] Preferably, the adjustment step flower shaft is provided with a third middle connecting card plate limiting step A, a third middle connecting card plate limiting step B and a third right side sliding support plate limiting step from left to right, the cross-sectional diameter of the third middle connecting card plate limiting step A is smaller than the third middle connecting card plate limiting step B, and the outer end of the first arc-shaped slide groove on the right side sliding support plate is also provided with a limiting groove and the depth of the limiting groove is consistent with the third right side sliding support plate limiting step at the end of the rod.

[0011] Preferably, the end of the limiting step flower shaft is provided with a fixed shaft limiting plate located on the outside of the left limiting support plate, and the fixed shaft limiting plate is fixed to the left limiting support plate by screws, and the end of the adjusting step flower shaft is provided with a movable shaft limiting plate located on the outside of the left limiting support plate, and the movable shaft limiting plate is fixed to the adjusting step flower shaft by screws.

[0012] Preferably, the fixed shaft limiting plate and the movable shaft limiting plate are both circular plates with notches.

[0013] Compared with the prior art, the utility model has the following advantages: the corrosion cage is designed with a left-side limit support plate and a right-side sliding support plate, which are fixed through a limit step rod, effectively ensuring the limit accuracy of the silicon wafer. Secondly, the bottom of the cage is connected to a limit step flower axis and an adjustment step flower axis, and semiconductor silicon wafers are placed through the notch, which improves the loading efficiency of silicon wafers. In addition, the introduction of the middle connecting card plate further enhances the strength and carrying capacity of the entire corrosion cage.

[0014] In terms of operation, the threaded limit pin and the adjustable stepped flower shaft make it very convenient to open and lock the corrosion cage, which helps to improve the operating efficiency. In particular, the adjustable opening size of the corrosion cage makes it more convenient to load and remove semiconductor silicon wafers. In addition, the structural strength of the corrosion cage has been improved, and it is easy to rotate, which meets the requirement of rotating the silicon wafer for corrosion during the corrosion process.

[0015] Overall, the semiconductor wafer etching cage of the present invention has an innovative design, can load a large number of semiconductor silicon wafers at the same time, ensures the limiting accuracy of the silicon wafers, is easy to open and lock, has high structural strength and is easy to rotate, thereby improving efficiency during the semiconductor silicon wafer etching process and maximizing economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a semiconductor wafer etching cage of the present application.

[0017] Figure 2 This is the overall schematic diagram of the front view of the application:

[0018] Figure 3 This is the AA direction diagram:

[0019] Figure 4 The diagram on the right is:

[0020] Figure 5 It is a schematic diagram of the invention when the stepped flower axis is adjusted to slide to the bottom of the corrosion cage before loading;

[0021] Figure 6 It is a schematic diagram of a limit step through rod;

[0022] Figure 7 This is a schematic diagram of a limited stepped flower axis;

[0023] Figure 8 This is a schematic diagram of adjusting the stepped flower axis;

[0024] As shown in the figure: 1. Middle connecting card plate, 2. Right sliding support plate, 3. Left limit support plate, 4. Limiting ladder through rod, 401. First left limit support plate limiting step, 402. First middle connecting card plate limiting step A, 403. First middle connecting card plate limiting step B, 404. First right sliding support plate limiting step, 5. Limiting ladder flower axis, 501. Second left limit support plate limiting step, 502. Second middle connecting card plate limiting step A, 503. Second middle connecting card plate limiting step B, 504. Second right sliding support plate limiting step, 6. Adjusting ladder flower axis, 601. Third middle connecting card plate limiting step A, 602. Third middle connecting card plate limiting step B , 603, the third right sliding support plate limiting step, 7, square rotating shaft, 8, limiting pin, 9, fixed shaft limiting piece, 10, movable shaft limiting piece, 11, semiconductor silicon wafer, 12, first arc-shaped slide groove, 13, second arc-shaped slide groove. DETAILED DESCRIPTION

[0025] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0026] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.

[0027] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0028] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0029] Combined with Figure 1 -Attached Figure 8 A semiconductor wafer corrosion cage comprises a left-side limiting support plate 3 and a right-side sliding support plate 2, wherein the left-side limiting support plate 3 and the right-side sliding support plate 2 are fixed as a whole through a limiting step rod 4, and the outer sides of the left-side limiting support plate 3 and the right-side sliding support plate 2 are provided with square rotating shafts 7, and the bottom sides between the left-side limiting support plate 3 and the right-side sliding support plate 2 are also connected with limiting step flower shafts 5, and the left-side limiting support plate 3 and the right-side sliding support plate 2 are both provided with first arc-shaped slide grooves 12, and adjustment step flower shafts 6 are slidably provided in the first arc-shaped slide grooves 12 on both sides, and the adjustment step flower shafts 6 and the limiting step flower shafts 5 are both provided with a plurality of notches for placing semiconductor silicon wafers 11.

[0030] In one embodiment, two parallel intermediate connecting cards 1 are provided between the left limit support plate 3 and the right sliding support plate 2. The two intermediate connecting cards 1 are both fixed as a whole through the limit step rod 4. The intermediate connecting card 1 is provided with a second arcuate slot 13 corresponding to the first arcuate slot 12, and the adjustment step flower shaft 6 can slide in the second arcuate slot 13. The two parallel intermediate connecting cards 1 can improve the overall strength of the entire corrosion cage, thereby improving the bearing capacity of the corrosion cage.

[0031] In one embodiment, in order to adjust the opening size of the corrosion cage, the left limiting support plate 3 and the right sliding support plate 2 are both threadedly connected with limiting pins 8, and the limiting end of the limiting pins 8 can extend into the first arc-shaped slide groove 12 and can limit the position of the adjustable step flower shaft 6. Remove the limiting pins 8, and then slide the adjustable step flower shaft 6 to the bottom of the corrosion cage slide groove to maximize the opening of the corrosion cage, thereby facilitating the placement and removal of the semiconductor silicon wafer 11.

[0032] In one embodiment, there are four limit step rods 4 which are evenly distributed in an arc shape at the bottom of the semiconductor silicon wafer 11, and the limit step rods 4 are provided with a first left limit support plate limit step 401, a first middle connecting card plate limit step A402, a first middle connecting card plate limit step B403 and a first right sliding support plate limit step 404 from left to right, and the cross-sectional diameters of the first left limit support plate limit step 401, the first middle connecting card plate limit step A402 and the first middle connecting card plate limit step B403 increase sequentially. The limit step rod 4 is made of corrosion-resistant material; the number of the limit step flower axis 5 is set to two, and the limit step flower axis 5 is provided with a second left limit support plate limit step 501, a second middle connecting card plate limit step A502, a second middle connecting card plate limit step B503 and a second right sliding support plate limit step 504 from left to right, and the cross-section of the second left limit support plate limit step 501, the second middle connecting card plate limit step A502, and the second middle connecting card plate limit step B503 is The diameter increases successively; the third middle connecting card plate limiting step A601, the third middle connecting card plate limiting step B602 and the third right sliding support plate limiting step 603 are successively provided on the adjusting step flower axis 6 from left to right, the cross-sectional diameter of the third middle connecting card plate limiting step A601 is smaller than the third middle connecting card plate limiting step B602, and the outer end of the first arc-shaped slide groove 12 on the right sliding support plate 2 is also provided with a limiting groove and the depth of the limiting groove is consistent with the third right sliding support plate limiting step 603 at the end of the rod. During the specific installation process, first insert the limit step rod 4, the limit step flower axis 5, and the adjustment step flower axis 6 into the right sliding support plate 2 in sequence, wherein the limit step rod 4 and the limit step flower axis 5 are inserted into the right sliding support plate 2 from the left, and the adjustment step flower axis 6 is inserted into the first arc-shaped slide groove 12 of the right sliding support plate 2 from the right side through the third right sliding support plate limit step 603 to limit the assembly, and then the two middle connecting card plates 1 are sequentially inserted into the limit step rod from the left side. 4, and the first middle connecting card plate limiting step B403 and the first middle connecting card plate limiting step A402, and the corresponding through holes of the middle connecting card plate 1 are clamped and matched with the limiting step flower axis 5 and the adjusting step flower axis 6, and then the left limiting support plate 3 is sleeved on the first left limiting support plate limiting step 401 of the limiting step ladder through rod 4 from the left side, and the corresponding through holes of the left limiting support plate 3 are clamped and matched with the limiting step flower axis 5 and the adjusting step flower axis 6, and after fixed assembly, welding is performed.

[0033] In one embodiment, the end of the position-limiting step flower shaft 5 is provided with a fixed shaft position-limiting piece 9 located outside the left position-limiting support plate 3, and the fixed shaft position-limiting piece 9 is fixed to the left position-limiting support plate 3 by screws, and the end of the adjustable step flower shaft 6 is provided with a movable shaft position-limiting piece 10 located outside the left position-limiting support plate 3, and the movable shaft position-limiting piece 10 is fixed to the adjustable step flower shaft 6 by screws. The fixed shaft position-limiting piece 9 is a circular plate with a notch, which is clamped at the end of the position-limiting step flower shaft 5 and fixed to the left position-limiting support plate 3 by screws, so that the left position-limiting support plate 3 and the position-limiting step flower shaft 5 are relatively fixed; the movable shaft position-limiting piece 10 is a circular plate with a notch, which is clamped at the end of the adjustable step flower shaft 6, and the movable shaft position-limiting piece 10 and the adjustable step flower shaft 6 are fixed by fixing screws, so that the movable shaft position-limiting piece 10 and the adjustable step flower shaft 6 are relatively fixed, so that the adjustable step flower shaft 6 and the left position-limiting support plate 3 can slide freely.

[0034] Specific working principle: Figure 2 As shown, remove the limit pin 8, and then slide the adjustment step flower shaft 6 to the bottom of the corrosion cage slide slot to maximize the opening of the corrosion cage;

[0035] Because the limiting step flower axis 5 adjusts the step flower axis 6 to limit the position through the steps on multiple axes, it can be ensured that the corresponding positions of the limiting step flower axis 5 and the adjusting step flower axis 6 are a plane that can carry the corroded semiconductor silicon wafer 11 in the linear direction;

[0036] Placing the semiconductor silicon wafer 11 to be etched on the plurality of notches inside the etching cage, so that only the outer edge of the semiconductor silicon wafer 11 is placed in the corresponding notches;

[0037] After all the semiconductor silicon wafers 11 are loaded into the corrosion cage, slide the adjustable step flower shaft 6 to the top of the first arc-shaped slide groove 12 of the corrosion cage, screw the limit pin 8 into the threaded holes on the right sliding support plate 2 and the left limit support plate 3, and limit and fix the adjustable step flower shaft 6;

[0038] Then you can proceed to the next step of corrosion work;

[0039] After the etching work is completed, the limit pin 8 is removed, and then the adjustment step flower shaft 6 is slid to the bottom of the first arc-shaped slide groove 12 of the etching cage to maximize the opening of the etching cage, and then all the semiconductor silicon wafers 11 that have been completed with the etching operation are taken out;

[0040] The present invention has the advantages that only a very small point on the side wall of the semiconductor silicon wafer 11 contacts the limiting step flower axis 5 and the adjusting step flower axis 6, which can maximize the contact area between the silicon wafer and the etching solution, and during the etching process, the etching uniformity of the surface of the semiconductor silicon wafer 11 can be ensured to be excellent;

[0041] The present invention uses multiple stepped shafts for limiting and fixing, which can effectively ensure that the spacing between the grooves on the limiting stepped flower shaft 5 and the adjusting stepped flower shaft 6 is precise and consistent; the adjusting stepped flower shaft 6 can be movable, which is convenient for placing and removing the semiconductor silicon wafer 11; the central axis used for rotation of the invention uses a square rotating shaft 7, which can effectively perform self-limiting and prevent the invention from rotating on its own; this structure can accurately locate the distance between the card slots on the limiting stepped flower shaft 5 and the adjusting stepped flower shaft 6, the structure is sturdy and durable, and it is very convenient to install and remove the semiconductor silicon wafer 11, and the operation is efficient.

[0042] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A semiconductor wafer etching cage, characterized in that: The invention comprises a left-side limit support plate (3) and a right-side sliding support plate (2), wherein the left-side limit support plate (3) and the right-side sliding support plate (2) are fixed as a whole through a limit step rod (4), and the outer sides of the left-side limit support plate (3) and the right-side sliding support plate (2) are provided with square rotating shafts (7), and the bottom sides between the left-side limit support plate (3) and the right-side sliding support plate (2) are also connected with limit step flower shafts (5), and the left-side limit support plate (3) and the right-side sliding support plate (2) are both provided with first arc-shaped sliding grooves (12), and adjustment step flower shafts (6) are slidably provided in the first arc-shaped sliding grooves (12) on both sides, and the adjustment step flower shafts (6) and the limit step flower shafts (5) are both provided with a plurality of notches for placing semiconductor silicon wafers (11).

2. A semiconductor wafer etching cage according to claim 1, characterized in that: Two parallel intermediate connecting clamps (1) are provided between the left limit support plate (3) and the right sliding support plate (2); the two intermediate connecting clamps (1) are both fixed as a whole through a limit step rod (4); a second arcuate slide groove (13) corresponding to the first arcuate slide groove (12) is provided on the intermediate connecting clamp (1), and the adjusting step flower shaft (6) can slide in the second arcuate slide groove (13).

3. A semiconductor wafer etching cage according to claim 1, characterized in that: The left-side limiting support plate (3) and the right-side sliding support plate (2) are both threadedly connected with a limiting pin (8), and the limiting end of the limiting pin (8) can extend into the first arc-shaped sliding groove (12) and can limit the position of the adjustable stepped flower shaft (6).

4. A semiconductor wafer etching cage according to claim 1, characterized in that: The number of the limit step rods (4) is four and they are evenly distributed in an arc shape at the bottom of the semiconductor silicon wafer (11). The limit step rods (4) are provided with a first left limit support plate limit step (401), a first middle connection card plate limit step A (402), a first middle connection card plate limit step B (403) and a first right sliding support plate limit step (404) from left to right in sequence, and the cross-sectional diameters of the first left limit support plate limit step (401), the first middle connection card plate limit step A (402) and the first middle connection card plate limit step B (403) are increased in sequence.

5. A semiconductor wafer etching cage according to claim 1, characterized in that: The number of the position-limiting step flower shaft (5) is set to two, and the position-limiting step flower shaft (5) is provided with a second left position-limiting support plate position-limiting step (501), a second middle connecting card plate position-limiting step A (502), a second middle connecting card plate position-limiting step B (503) and a second right sliding support plate position-limiting step (504) in sequence from left to right, and the cross-sectional diameters of the second left position-limiting support plate position-limiting step (501), the second middle connecting card plate position-limiting step A (502) and the second middle connecting card plate position-limiting step B (503) are increased in sequence.

6. A semiconductor wafer etching cage according to claim 1, characterized in that: The adjusting step flower shaft (6) is provided with a third middle connecting card plate limiting step A (601), a third middle connecting card plate limiting step B (602) and a third right side sliding support plate limiting step (603) from left to right in sequence, the cross-sectional diameter of the third middle connecting card plate limiting step A (601) being smaller than the third middle connecting card plate limiting step B (602), and the outer end of the first arc-shaped slide groove (12) on the right side sliding support plate (2) is also provided with a limiting groove, and the depth of the limiting groove is consistent with the third right side sliding support plate limiting step (603) at the end of the rod.

7. A semiconductor wafer etching cage according to claim 1, characterized in that: The end of the limiting stepped flower shaft (5) is provided with a fixed shaft limiting piece (9) located outside the left limiting support plate (3), and the fixed shaft limiting piece (9) is fixed to the left limiting support plate (3) by means of screws. The end of the adjusting stepped flower shaft (6) is provided with a movable shaft limiting piece (10) located outside the left limiting support plate (3), and the movable shaft limiting piece (10) is fixed to the adjusting stepped flower shaft (6) by means of screws.

8. A semiconductor wafer etching cage according to claim 7, characterized in that: The fixed shaft limiting plate (9) and the movable shaft limiting plate (10) are both circular plates with notches.

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