Aluminum semiconductor shell easy to assemble

Abstract

The utility model discloses an easy-to-assemble aluminum semiconductor shell, which comprises a shell piece and an assembly piece, when the easy-to-assemble aluminum semiconductor shell is used, a semiconductor main body is arranged in a mounting groove, and a semiconductor pin is arranged on the outer side of the shell main body through a pin groove part, so that the wiring of a semiconductor piece is facilitated, and a cover plate of the assembly piece is aligned with the mounting groove; the semiconductor device can be stably installed in the installation groove through limiting of the cover plate, in the clamping connection process of the clamping plate and the clamping plate groove, the film cutting blade cuts the sealing film and pierces the sealing film into the glue groove, and glue in the glue groove overflows to further bond and fix the clamping plate and the clamping plate groove. The clamping plate and the clamping plate groove are further bonded and fixed through glue, so that the assembling process of the semiconductor shell is very convenient and rapid, and meanwhile, when clamping connection between the clamping plate and the clamping plate groove is loosened due to repeated disassembly and assembly of the shell part and the assembling part, the clamping plate and the clamping plate groove can still be bonded and fixed through glue.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor shells, in particular to an easily assembled aluminum semiconductor shell. Background Art

[0002] When brazing aluminum semiconductor shells, a welding method of placing the solder clamp in the middle is adopted. However, the aluminum semiconductor shells are small in size, highly arrayed, and require high precision positioning, making them difficult to braze. Existing aluminum semiconductor shells cannot be conveniently assembled manually, and the welding equipment required is too cumbersome.

[0003] The Chinese patent with the existing authorization announcement number CN213278064U discloses an aluminum semiconductor shell that is easy to assemble and form, including a shell, a cover plate fixedly connected to the top of the shell, a semiconductor body installed in the inner cavity of the shell, threaded tubes fixedly connected to the four corners of the bottom side of the inner cavity of the shell, a bearing plate fixedly connected to the bottom end of the threaded tube, a placement groove dug on the top side of the bearing plate, pin openings equidistantly dug on the top of both sides of the inner wall of the shell, the pin openings respectively pass through the inner and outer sides of the shell, the two side edges of the bottom of the cover plate are respectively equidistantly connected to limit strips, the limit strips are respectively movably connected to the inner walls of the pin openings, and a sealing block is fixedly connected to the bottom side of the cover plate, which can improve the integrity of the connection between the shell and the cover plate, make the assembly of the shell more accurate and quick, reduce the use of welding equipment, make the shell as a whole convenient for assembly and use, and further improve the sealing of the shell structure.

[0004] The shortcomings of the above-mentioned existing technical solutions are: during assembly, it is necessary to first place the semiconductor body into the supporting plate inside the shell, and then embed the cover plate into the top side of the shell, and insert the pin through the limit bars respectively to install and fix the semiconductor body. The fixing bolts pass through the cover plate and the bottom side of the sealing block, and are respectively connected and fixed with the threaded pipes, thereby reducing the use of welding equipment and assembling the outer shell as a whole. The assembly process has many steps and the bolts need to be tightened. The assembly process is cumbersome and there is room for improvement in terms of ease of use. Utility Model Content

[0005] The purpose of the utility model is to provide an easy-to-assemble aluminum semiconductor housing to solve the technical problems in the prior art that the assembly process has many steps, bolts need to be tightened, the assembly process is cumbersome, and there is a certain room for improvement in ease of use.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] An easily assembled aluminum semiconductor housing comprising:

[0008] The shell part comprises a shell body, a mounting groove is provided in the middle of the shell body, a cardboard groove is symmetrically provided on the shell body, glue grooves are provided at the bottom of the symmetrically provided cardboard grooves, an anti-overflow groove is provided on the cardboard groove, glue is provided in the glue groove, and a sealing film is provided at the notch of the glue groove;

[0009] The assembly comprises a cover plate, with card plates symmetrically arranged on both sides of the cover plate and fixedly connected, an alignment convex plate fixedly connected to the end surface of the card plate, a film cutting blade fixedly connected to the alignment convex plate, the card plate is clamped with the card plate groove, and the film cutting blade penetrates the sealing film and is arranged in the glue groove.

[0010] As a further solution of the utility model: one end of the anti-overflow groove penetrates through the outer side wall of the shell body and is connected to the outside, and the other end of the anti-overflow groove is connected to the glue groove.

[0011] As a further solution of the utility model: a sealing film lap groove is opened around the edge of the notch of the glue groove, and the sealing film is bonded to the edge of the notch of the sealing film lap groove.

[0012] As a further solution of the utility model: a buckle is fixedly connected to the side end of the card plate, a bayonet is provided on the inner side wall of the card plate groove, and the card plate and the card plate groove are mutually clamped by the buckle and the bayonet.

[0013] As a further solution of the utility model: it also includes: a semiconductor component, the semiconductor component includes a semiconductor body and semiconductor pins, the semiconductor pins are symmetrically arranged and evenly distributed on the side ends of the semiconductor body, and pin grooves corresponding to the semiconductor pins are opened on the shell body, and the pin grooves run through the side ends of the shell body.

[0014] As a further solution of the utility model: the semiconductor body is arranged in the installation groove, and the semiconductor pins are arranged on the outside of the shell body through the pin groove part.

[0015] Beneficial effects of the utility model:

[0016] 1. When the utility model is in use, the semiconductor body is arranged in the installation groove, and the semiconductor pin is arranged on the outside of the shell body through the pin groove part, so as to facilitate the wiring of the semiconductor part, and the cover plate of the assembly part is positioned relative to the installation groove, and the semiconductor part can be stably installed in the installation groove through the limit of the cover plate. During the process of clamping the card plate and the card plate groove, the film cutting blade cuts the sealing film and pierces the glue groove, and the glue in the glue groove overflows to further bond and fix the card plate and the card plate groove. The device is preliminarily clamped and fixed by clamping the card plate and the card plate groove, and further bonded and fixed the card plate and the card plate groove by glue, so that the semiconductor shell assembly process is very convenient and fast. At the same time, when the clamping between the card plate and the card plate groove is loosened due to multiple disassembly and assembly of the shell part and the assembly part, the card plate and the card plate groove can still be bonded and fixed by glue;

[0017] 2. The utility model has an anti-overflow groove on the card slot, one end of which penetrates through the outer wall of the shell body and is connected to the outside, and the other end of which is connected to the glue groove. The anti-overflow groove can prevent excessive glue overflow and prevent workers from contacting the glue. The anti-overflow groove allows the glue to contact the air and accelerates the curing of the glue. When it is necessary to remove the assembly from the shell, the assembly can be pried off from the shell by inserting the pry plate into the anti-overflow groove, which is convenient for the staff to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The utility model is further described below in conjunction with the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model Figure 2 ;

[0021] Figure 3 It is a partial cross-sectional structural schematic diagram of the utility model;

[0022] Figure 4 This is a schematic diagram of the three-dimensional structure of the housing of the utility model;

[0023] Figure 5 It is a three-dimensional structural schematic diagram of the assembly of the utility model.

[0024] In the figure: 1. Shell component; 11. Shell body; 12. Pin groove; 13. Cardboard groove; 14. Sealing film groove; 15. Glue groove; 16. Anti-overflow groove; 17. Installation groove; 2. Assembly component; 21. Cover plate; 22. Cardboard; 23. Alignment convex plate; 24. Film cutting blade; 3. Semiconductor component; 31. Semiconductor body; 32. Semiconductor pin. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] like Figure 1-Figure 5As shown, an easily assembled aluminum semiconductor housing includes a housing component 1 and an assembly component 2. The housing component 1 includes a housing body 11, a mounting groove 17 is provided in the middle of the housing body 11, and cardboard grooves 13 are symmetrically provided on the housing body 11. The bottoms of the symmetrically arranged cardboard grooves 13 are all provided with glue grooves 15, and the cardboard grooves 13 are provided with anti-overflow grooves 16. Glue is provided in the glue grooves 15, and a sealing film is provided at the notch of the glue grooves 15. The assembly component 2 includes a cover plate 21, and card plates 22 are symmetrically arranged and fixedly connected on both sides of the cover plate 21. An alignment convex plate 23 is fixedly connected to the end surface of the card plate 22, and a film cutting blade 24 is fixedly connected to the alignment convex plate 23. The card plate 22 is clamped with the card plate groove 13, and the film cutting blade 24 penetrates the sealing film and is arranged in the glue groove 15.

[0027] In some specific embodiments, one end of the anti-overflow groove 16 passes through the outer wall of the shell body 11 and is connected to the outside, and the other end of the anti-overflow groove 16 is connected to the glue groove 15. A sealing film groove 14 is opened around the edge of the groove of the glue groove 15, and the sealing film is bonded to the edge of the groove of the sealing film groove 14.

[0028] In some specific implementation schemes, a buckle is fixedly connected to the side end of the card plate 22, and a snap opening is opened on the inner side wall of the card plate slot 13. The card plate 22 and the card plate slot 13 are snapped together through the buckle and the snap opening.

[0029] An easy-to-assemble aluminum semiconductor housing also includes: a semiconductor component 3, the semiconductor component 3 includes a semiconductor body 31 and semiconductor pins 32, the semiconductor pins 32 are symmetrically arranged and evenly distributed on the side ends of the semiconductor body 31, a housing body 11 is provided with pin grooves 12 corresponding to the semiconductor pins 32, the pin grooves 12 penetrate the side ends of the housing body 11, the semiconductor body 31 is arranged in the installation groove 17, and the semiconductor pins 32 are partially arranged on the outside of the housing body 11 through the pin grooves 12, thereby facilitating the wiring of the semiconductor component 3.

[0030] In order to facilitate the understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution is briefly described in combination with specific application scenarios:

[0031] When in use, the semiconductor body 31 is arranged in the installation groove 17, and the semiconductor pin 32 is arranged on the outer side of the shell body 11 through the pin groove 12 part, so as to facilitate the wiring of the semiconductor component 3, and the cover plate 21 of the assembly 2 is aligned with the installation groove 17, and the semiconductor component 3 can be stably installed in the installation groove 17 through the limit of the cover plate 21. During the process of the card plate 22 and the card plate groove 13 being clamped, the film cutting blade 24 cuts through the sealing film and penetrates into the glue groove 15, and the glue in the glue groove 15 overflows to further bond and fix the card plate 22 and the card plate groove 13. The device is preliminarily clamped and fixed by the card plate 22 and the card plate groove 13, and further bonded and fixed by the glue between the card plate 22 and the card plate groove 13, so that the semiconductor shell assembly process is very convenient and fast. At the same time, when the shell component 1 and the assembly 2 are disassembled and assembled many times so that the clamping between the card plate 22 and the card plate groove 13 is loose, the card plate 22 and the card plate groove 13 can still be bonded and fixed by the glue;

[0032] An anti-overflow groove 16 is provided on the card slot 13, one end of the anti-overflow groove 16 passes through the outer wall of the shell body 11 and is connected to the outside, and the other end of the anti-overflow groove 16 is connected to the glue groove 15. By setting the anti-overflow groove 16, excessive overflow of glue can be prevented to avoid staff contact with the glue. The anti-overflow groove 16 allows the glue to contact with the air to accelerate the curing of the glue. When it is necessary to remove the assembly 2 from the shell 1, the assembly 2 can be pried off from the shell 1 by inserting the pry plate into the anti-overflow groove 16, which is convenient for staff to use.

[0033] Several embodiments of the utility model are described in detail above, but the embodiments of the utility model are not limited thereto and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. An easily assembled aluminum semiconductor housing, characterized in that: include: The housing member (1) comprises a housing body (11), a mounting groove (17) is provided in the middle of the housing body (11), a cardboard groove (13) is symmetrically provided on the housing body (11), a glue groove (15) is provided at the bottom of the symmetrically provided cardboard groove (13), an anti-overflow groove (16) is provided on the cardboard groove (13), glue is provided in the glue groove (15), and a sealing film is provided at the notch of the glue groove (15); The assembly (2) comprises a cover plate (21), and a clamping plate (22) is symmetrically arranged on both sides of the cover plate (21) and fixedly connected. An alignment convex plate (23) is fixedly connected to the end surface of the clamping plate (22), and a film cutting blade (24) is fixedly connected to the alignment convex plate (23). The clamping plate (22) is clamped with the clamping plate groove (13), and the film cutting blade (24) penetrates the sealing film and is arranged in the glue groove (15).

2. The easily assembled aluminum semiconductor housing according to claim 1, characterized in that: One end of the anti-overflow groove (16) penetrates the outer wall of the housing body (11) and is connected to the outside, and the other end of the anti-overflow groove (16) is connected to the glue groove (15).

3. The easily assembled aluminum semiconductor housing according to claim 1, characterized in that: A sealing film lap groove (14) is provided around the notch edge of the glue groove (15), and the sealing film is bonded to the notch edge of the sealing film lap groove (14).

4. The easily assembled aluminum semiconductor housing according to claim 1, characterized in that: A buckle is fixedly connected to the side end of the card plate (22), and a bayonet is provided on the inner side wall of the card plate slot (13). The card plate (22) and the card plate slot (13) are mutually clamped via the buckle and the bayonet.

5. The easily assembled aluminum semiconductor housing according to claim 1, characterized in that: Also includes: A semiconductor component (3), the semiconductor component (3) comprising a semiconductor body (31) and semiconductor pins (32), the semiconductor pins (32) being symmetrically arranged and evenly distributed at the side ends of the semiconductor body (31), a shell body (11) being provided with pin grooves (12) corresponding to the semiconductor pins (32), and the pin grooves (12) penetrating the side ends of the shell body (11).

6. The easily assembled aluminum semiconductor housing according to claim 5, characterized in that: The semiconductor body (31) is arranged in the installation groove (17), and the semiconductor pin (32) is arranged on the outside of the housing body (11) through the pin groove (12) portion.

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