Internal heat dissipation structure of IGBT (Insulated Gate Bipolar Translator) module

Abstract

The utility model is suitable for the IGBT module technology field, and provides an IGBT module internal heat radiation structure comprising a base plate, a housing fixedly installed on the base plate, a PCB fixedly installed on the base plate, a plurality of chips arranged on the PCB, a plurality of heat radiation fins fixedly installed on the outer side of the housing, the plurality of heat radiation fins are arranged on the outer side of the housing in an up-down parallel mode, and the plurality of heat radiation fins are arranged on the outer side of the housing in an up-down parallel mode. One side of each heat dissipation fin penetrates into the shell, the ends, located in the shell, of the heat dissipation fins are fixedly connected with built-in heat conduction plates, the chips are provided with installation heat conduction plates, heat conduction strips are fixedly installed on the installation heat conduction plates, and the other ends of the heat conduction strips are fixedly connected with the built-in heat conduction plates. According to the device, the problem that heat cannot be dissipated due to the fact that the chip is located in the closed shell is solved, the service life of the chip is further guaranteed, and meanwhile the protection effect of the shell cannot be affected by the arrangement of the structure.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT modules, and more specifically, to an internal heat dissipation structure of an IGBT module. Background Art

[0002] IGBT, insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of a bipolar transistor and an insulated gate field effect transistor. It has the advantages of both high input impedance of MOSFET and low on-state voltage drop of GTR. IGBT modules are widely used in industrial frequency conversion, smart grid, photovoltaic, electric vehicles and other fields due to their high switching speed, low loss, low on-state voltage drop, high input impedance and resistance to pulse current impact.

[0003] With the development of electronic technology, electronic devices are increasingly developing in the direction of high frequency, high speed and modularization. The widespread application of high-power 6-inch components and high-power IGBT modules has led to an increase in the heat generated by electronic devices. Data show that 55% of electronic equipment errors are caused by overheating, and heat dissipation devices are often required to dissipate heat. The quality of heat dissipation directly affects the cost, reliability, and working performance of electronic products. At present, most of the existing IGBT modules usually use copper plates or aluminum plates to share heat dissipation. This method of sharing heat dissipation has a simple structure and poor heat dissipation effect. The heat generated by the IGBT module cannot be discharged to the outside in time, which easily causes the internal ambient temperature of the IGBT module to be too high. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide an internal heat dissipation structure of an IGBT module which avoids the problem that the chip is in a closed housing and thus cannot dissipate heat, thereby further ensuring the service life of the chip.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The invention discloses an internal heat dissipation structure of an IGBT module, comprising a base plate, a shell is fixedly mounted on the base plate, a PCB is fixedly mounted on the base plate, a plurality of chips are arranged on the PCB, a plurality of heat dissipation fins are fixedly mounted on the outer side of the shell, the plurality of heat dissipation fins are arranged on the outer side of the shell in a vertically parallel manner, one side of the plurality of heat dissipation fins penetrates into the shell, one end of the plurality of heat dissipation fins located in the shell is fixedly connected with a built-in heat conducting plate, a plurality of chips are provided with a mounting heat conducting plate, a heat conducting strip is fixedly mounted on the mounting heat conducting plate, and the other end of the heat conducting strip is fixedly connected with the built-in heat conducting plate.

[0007] The utility model is further configured as follows: the shell is wrapped around the outside of the PCB board.

[0008] The utility model is further configured as follows: a heat-conducting adhesive is provided between the heat-conducting mounting plate and the chip, and the heat-conducting mounting plate and the chip are fixed by the heat-conducting adhesive.

[0009] The utility model is further configured as follows: the shape of the heat dissipation fins is wavy.

[0010] The utility model is further configured as follows: an external plate is fixedly installed on one side of the plurality of heat dissipation fins outside the shell, and an air flow cavity is formed between the heat dissipation fins.

[0011] The utility model is further configured as follows: a mounting plate is fixedly mounted on the front side of a plurality of the heat dissipation fins located outside the shell, and a miniature heat dissipation fan is mounted on the front side of the mounting plate.

[0012] The utility model is further configured as follows: the air outlet of the micro cooling fan extends out of the rear side surface of the mounting plate.

[0013] The utility model is further configured as follows: a filter is fixedly installed on the rear side of the plurality of heat dissipation fins outside the shell.

[0014] The advantage of the utility model is that the heat on the chip is conducted to the installed heat conducting plate, and finally conducted to the built-in heat conducting plate through the heat conducting strips. Since most of the cooling fins are located on the outside of the shell, according to the principle of heat conduction, the heat on the built-in heat conducting plate can be conducted to the outside of the cooling fins, thereby achieving the purpose of chip heat dissipation, and avoiding as much as possible the problem that the chip is in a closed shell and the heat cannot be dissipated, further ensuring the service life of the chip. At the same time, the setting of the above structure will not cause any influence on the protective effect of the shell, and while ensuring the internal heat dissipation efficiency of the IGBT module, the protective effect of the shell on the chip is also guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the internal heat dissipation structure of an IGBT module of the utility model;

[0016] Figure 2 It is a schematic cross-sectional view of the shell of the utility model;

[0017] Figure 3 It is a schematic diagram of the heat dissipation fin structure of the utility model.

[0018] In the figure: 1. Base plate; 2. Shell; 3. PCB board; 4. Chip; 5. Heat sink fins; 6. Built-in heat conduction plate; 7. Install heat conduction plate; 8. Heat conduction strip; 9. External board; 10. Mounting plate; 11. Micro cooling fan; 12. Filter. DETAILED DESCRIPTION

[0019] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0020] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0021] In the present invention, unless otherwise specified, directions such as "up" and "down" are usually used in reference to the directions shown in the drawings, or in reference to the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "left" and "right" are usually used in reference to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directions are not used to limit the present invention.

[0022] See also Figure 1-3 , the utility model provides the following technical solutions:

[0023] Specifically, it refers to an internal heat dissipation structure of an IGBT module, including a base plate 1, a shell 2 is fixedly mounted on the base plate 1, a PCB board 3 is fixedly mounted on the base plate 1, the shell 2 is wrapped around the outside of the PCB board 3, and is used to protect the PCB board 3, so as to prevent the IGBT module from being contacted by external dust and water vapor during use, thereby affecting its service life.

[0024] A plurality of chips 4 are arranged on the PCB board 3, and the plurality of chips 4 can be IGBT chips or FRD chips respectively. A plurality of heat sink fins 5 are fixedly installed on the outer side of the shell 2, and the plurality of heat sink fins 5 are arranged on the outer side of the shell 2 in a manner of being parallel to each other. One side of the plurality of heat sink fins 5 penetrates into the shell 2, and one end of the plurality of heat sink fins 5 located in the shell 2 is fixedly connected with a built-in heat conducting plate 6, and a mounting heat conducting plate 7 is arranged on the plurality of chips 4, and a heat conducting glue is arranged between the mounting heat conducting plate 7 and the chip 4, and the setting of the heat conducting glue can fix the mounting heat conducting plate 7 and the chip 4, and can also conduct the heat emitted by the chip 4 during operation to the mounting heat conducting plate 7, and a heat conducting strip 8 is fixedly installed on the mounting heat conducting plate 7, and the other end of the heat conducting strip 8 is fixedly connected with the built-in heat conducting plate 6;

[0025] When the IGBT runs for a long time, the chip 4 will inevitably generate heat. The heat on the chip 4 is transferred to the installed heat-conducting plate 7, and finally transferred to the built-in heat-conducting plate 6 through the heat-conducting strips 8. Since most of the heat sink fins 5 are located on the outside of the shell 2, according to the principle of heat conduction, the heat on the built-in heat-conducting plate 6 can be transferred to the outside of the heat sink fins 5, thereby achieving the purpose of heat dissipation for the chip 4, and avoiding as much as possible the problem that the chip 4 is in the closed shell 2 and the heat cannot be dissipated, further ensuring the service life of the chip 4. At the same time, the arrangement of the above-mentioned structure will not have any influence on the protective effect of the shell 2. While ensuring the internal heat dissipation efficiency of the IGBT module, the protective effect of the shell 2 on the chip 4 is also guaranteed.

[0026] It is more preferred that the area of ​​the heat conducting plate 7 be smaller than the area of ​​the chip 4. In actual use, the top of the chip 4 needs to be connected to other electronic components through bonding wires. This arrangement avoids as much as possible that the heat conducting plate 7 is installed to block the bonding position on the chip 4, affecting the normal use of the IGBT module.

[0027] More preferably, the heat sink fins 5 , the built-in heat conducting plate 6 , the mounted heat conducting plate 7 and the heat conducting strips 8 are all made of materials with high thermal conductivity, such as copper, etc., thus ensuring the thermal conductivity of the chip 4 .

[0028] More preferably, the shape of the heat sink fin 5 is wavy, which increases the heat dissipation area of ​​the heat sink fin 5 and further improves the heat dissipation efficiency of the IGBT chip or the FRD chip.

[0029] An external plate 9 is fixedly mounted on one side of the multiple heat dissipation fins 5 outside the housing 2, so that the heat dissipation fins 5 are blocked by the external plate 9, so that an air flow cavity is formed between the heat dissipation fins 5, and a mounting plate 10 is fixedly mounted on the front side of the multiple heat dissipation fins 5 outside the housing 2, and a micro heat dissipation fan 11 is mounted on the front side of the mounting plate 10, and the air outlet of the micro heat dissipation fan 11 extends out of the rear side surface of the mounting plate 10;

[0030] When the IGBT module is in use, the micro cooling fan 11 runs and draws air from the air flow cavity. At this time, the heat conducted to the outside of the heat sink fin 5 is drawn away by the air flow. At the same time, since the air pressure in the air flow cavity is reduced, the external cold air enters the air flow cavity through the rear side, thereby achieving the purpose of quickly dissipating the heat of the heat sink fin 5 and further improving the thermal conductivity of the chip 4.

[0031] A plurality of heat sink fins 5 are located on the rear side outside the shell 2 and are fixedly installed with a filter 12, which can filter the cold air entering the air flow cavity, thereby preventing the external cold air from carrying dust when entering the air flow cavity, causing the dust to adhere to the outer surface of the heat sink fins 5 and affect the heat dissipation efficiency of the heat sink fins 5.

[0032] The working principle of the internal heat dissipation structure of the IGBT module provided by the utility model is as follows: when the IGBT is running for a long time, the chip 4 will inevitably generate heat, and the heat on the chip 4 is transferred to the installation heat conducting plate 7, and finally transferred to the built-in heat conducting plate 6 through the heat conducting strip 8. Since most of the heat dissipation fins 5 are located on the outside of the housing 2, it can be known from the heat conduction principle that the heat on the built-in heat conducting plate 6 can be transferred to the outside of the heat dissipation fins 5;

[0033] At the same time, the micro cooling fan 11 is running and draws air from the air flow cavity. At this time, the heat conducted to the outside of the cooling fins 5 is drawn away driven by the air flow. At the same time, since the air pressure in the air flow cavity is reduced, the external cold air enters the air flow cavity through the rear side, thereby achieving the purpose of quickly dissipating heat from the cooling fins 5.

[0034] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0037] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An internal heat dissipation structure of an IGBT module, comprising a base plate (1), a housing (2) fixedly mounted on the base plate (1), a PCB board (3) fixedly mounted on the base plate (1), and a plurality of chips (4) arranged on the PCB board (3), characterized in that: A plurality of heat dissipation fins (5) are fixedly mounted on the outer side of the shell (2); the plurality of heat dissipation fins (5) are arranged on the outer side of the shell (2) in a vertically parallel manner; one side of the plurality of heat dissipation fins (5) penetrates into the shell (2); one end of the plurality of heat dissipation fins (5) located in the shell (2) is fixedly connected to a built-in heat conduction plate (6); a heat conduction plate (7) is mounted on the plurality of chips (4); a heat conduction bar (8) is fixedly mounted on the heat conduction plate (7); and the other end of the heat conduction bar (8) is fixedly connected to the built-in heat conduction plate (6).

2. An internal heat dissipation structure of an IGBT module according to claim 1, characterized in that: The housing (2) is wrapped around the outside of the PCB board (3).

3. An internal heat dissipation structure of an IGBT module according to claim 2, characterized in that: A heat-conducting adhesive is provided between the heat-conducting mounting plate (7) and the chip (4), and the heat-conducting mounting plate (7) and the chip (4) are fixed by the heat-conducting adhesive.

4. The internal heat dissipation structure of an IGBT module according to claim 3, characterized in that: The heat dissipation fins (5) are wavy in shape.

5. The internal heat dissipation structure of an IGBT module according to claim 4, characterized in that: An external plate (9) is fixedly mounted on one side of the plurality of heat dissipation fins (5) located outside the housing (2), and an air flow cavity is formed between each pair of the heat dissipation fins (5).

6. An internal heat dissipation structure of an IGBT module according to claim 5, characterized in that: A mounting plate (10) is fixedly mounted on the front side of the plurality of heat dissipation fins (5) located outside the housing (2), and a micro heat dissipation fan (11) is mounted on the front side of the mounting plate (10).

7. An internal heat dissipation structure of an IGBT module according to claim 6, characterized in that: The air outlet of the micro cooling fan (11) extends out of the rear surface of the mounting plate (10).

8. An internal heat dissipation structure of an IGBT module according to claim 7, characterized in that: A filter screen (12) is fixedly mounted on the rear side of the plurality of heat dissipation fins (5) located outside the housing (2).

Images